SHARP
ELECTRONIC COMPONENTS
GROUP SHARP CORPORATIO
SPECIFICATION
OlT’O-ELECI’RONIC D
/ DEVICE SPECIFICATION FOR Applied model name
VOLTAGE REGIJIX-OR
MODEL No.
PQ***EZO 12
1. These spectication sheets include materials protected under copyright of Sharp Corporation Wharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructtons for use
outlined
in these specitkation sheets, as well as the precautions mentioned below. Sharp assumes no responsibthty
for any damage resulting from use of the product which does not comply with the absolute mardmum ratings
and the instructions included in these speciflcatton sheets, and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas :
[
l
OA equipment . Audio visual equipment
l
Home appliances
* TelecommuntcaUon equipment (Terminal)
l
Measuring equipment
l
Tooling machines
l
Computers
1
If the use of the product tn the above application areas is for equipment h&d in paragraphs
(2) or [3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment whtch demands htgh relfabtltty and
safety in functfon and precision, such as :
[
l
Transportation control and safety equipment (atrcraft, tram, automobile etc.)
l Traffic signals l
Gas leakage sensor breakers
l
Rescue and securlly equipment
l
Other safety equipment
1
13) Please do not use this product for equipment which require extremely high relfabthty
and safety in function and precision. such as : .
[ * Space equipment
l
TelecommunicaUon equipment (for trunk lines>
* Nuclear power control equipment *
Medical
equipment
1
i
,
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL DATE
PRESENTED
BY
DATE
BY
K. Hachimura,
Department
General Manager of
Engineering Dept..11
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION
1. AppIication
This specification appkes to the outbne and characteristics of
tape packing type series regulator (linear type), Model No. PQ***EZOlZ.
AppIied Model name
PQO15EZOlZZ. PQO18EZOlZZ. PQO25EZOlZZ. PQO3OEZOlZZ. PQO33EzolZZ
PQO15EZOlZP. PQO18EZOlZP, PQO25EZOlZP, PQO3OEZOlZP, PQO33EZOlZP
usage
PQ++*EZOlZ are the device for stabikzation of DC positive output voltage
with built-in ON/OFF function, the over current protection function, the overheat
protection function and low consumpUon current at OFF-state (stand-by).
These devices are possible to use in power supply circuit up to current capacity IA.
Block diagram
DC input 0 (
SHARP CORPORATION
. . . ..-..______....1.-.-...-
DC output (‘Vo) ,
ON/OFF control (‘Vcl
. . . ..~~~~.I
GND
2. Outline : Refer to the attached sheet, Page 3.
3. Ratings and characteristics : Refer to the attached sheet, Page 4 to 7.
3.1 Absolute maximum ratings a
3.2 Electrical characteristics
3.3 Electrical characterisUcs measuring circuit
3.4 Pd-Ta rating (Typical valuel
(, i
4. ReIiability : Refer to the attached sheet, Page 8.9.
5. Outgoing inspection : Refer to the attached sheet, Page 9.
SHRRP CORPORATION
6. Supplement : Refer to the attached sheet, Page 10 to 15.
6.1 Example of application
6.2 Taping and reel packaging (PQ***EZOlZP)
6.3 Sleeve packaging (PQ***EZO 122)
6.4 ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process
for this product.
Materials for ODS : CFC,. Halon. Carbon tetrachloride,
1.1.1 -‘Mchloroethane (Methylchloroform
6.5 Brominated flame retardants
Specitk brominated flame retardants such as the PBBOs and PBB, are not used
in this device at all.
6.6 This product is not designed as electromagnetic and ionized-particle radiation resistant.
7. Notes : Refer to the attached sheet, Page 16 to 18.
7.1 External connection
7.2 Thermal protection design
7.3 Static electricity
7.4 Soldering
7.5 For cleaning
I
(.
SHARP CORPORATlON
2. Outline
6.6 i’4AX ;,!. _.”
. I
52~0.5
I
/- I /
-#I
Model No.%
I
/ Lot No.
/(DIN standard)
2.3to.s
. (. i
I
Applied
I model No. 1 Marked I
I model No. I
V~
t W030EZOlZZ 1 030E:
t Pii015E20127 I Ol!
PQO15EZOlZZ 015EZO1
PQ018E20122 018EzOl
WO25EzO1ZZ 025EZO 1
zol
1 P6033EZOlZZ 1 033EZOl
SE20 1
PQ018EzOIzz 018EZ01
PQ025EZO 1 ZZ 025EZO I
PQO3OEzO 1ZZ 030EZO I
. PQC----- _--
x33E7fi
172 I 033EZOl
1
I --~~ I
0 DC input (Vinl
@I ON/OFF control (Vc)
0 DC output (Vo)
@I NC
(3 GND
*( ) :TYP.
l
Unit : mm
-Scale: 5/l
l
Lead finish : Solder plating
l
Lead material : Cu
- Product mass : 0.3g
% (Example of the marking in case of the PQ***EZO 12)
SHARP CORPORflTION
3. Ratings and characteristics
3.1 Absolute maximum ratings Ta=25C
Parameter Symbol R-x! unit Conditions
Input voltage (‘1) Vin 10 V
Output control voltage
VC
10 V
(‘1)
Output current 10 1 A
Power dissipation (*2) Pd 8 W Refer to Fig. 1
Junction temperature (*3) T1 150 c
Operating temperature Topr -40 to +85 c
Storage temperature Tstg -40 to +150 c
Soldering temperature Tsol 260 c For 10 s
(+l) All are open except GND and applicable terminals.
(*2) Pd : With infinite heat sink
(*3) There is case that over heat protection operates at the condition Tj= 125% to 15OC
Fig. I Pd - Ta rating
Power
dissipation
Pd WI
10
8
Ambient temperature Ta (C)
i
Pd : With infinite heat sink
(Note) There is case that over heat protection function operates at oblique
line
portion.
SHflRP CORPORATION
Fig. 3 Standard measuring circuit of critkal rate of ripple rejection
f=lZOHz sine wave
ei(rms)=0.5V
vin=vo(TYFq+ 1v
10=0.3A
RR=20 log (ei(rms)/eo(rmsll
3.3 Electrical characteristics measuring circuit
Fig. 2 Standard measuring circuit of Regulator portion
3.4 Pd - Ta rating (Typical value)
Power
dissipation
Pd WI
1
SHflRP CORPORfiTION
0 20 40
Ambient temperature Ta (C)
60
(,
Mounting PCB
I I
=-T
PCB
Copper foil
Material : Glass-cloth epoxy resin
Size: 5OX50X1.6mm
Thickness of copper : 35 p m
80
i
,
SHfiRP CORPOMTION
The reliability of products shall satisfy items listed below.
Confidence level : 90%
LTPD : 10%/20%
Test Items Test Conditions Failure Judgement
Criteria
Temperature
cycung 1 cycle -4OC to +15OC
(3(hninl (3Omfm
20 cycles test Vo<LXO.8 n=22. C=O
Humidity +6OC .9O%RH. lOOOh
(Steady State) vo>UX1.2 n=22, C=O
Damp Heat cyclic
1 cycle : -20C to 7OC
(2hl (2h)
Transfer time between high
and low temp. is 1 h.
40 cycles test, 9O%RH
RegLxJx 1.2
RegI>UX 1.2 n=22. C=O
High temp. storage +150%. lOOOh RKLXO.8 n=22, C=O
Low temp. storage -40-C, lOOOh n=22, C=O
- vi-o>UX1.2 ‘4
Operation life Ta=25C, Pd=0.8W. lOOOh n=22. C=O
Mechanical shock 15km/s*. 0.5ms
3 times/ *X *Y. *Z n=ll. C=O
Vibration
[variable
frequency)
Electrostatic
discharge
Soldering heat
200m/s2
100 to 2000 to lOOHz/4 mm
4 times/ X. Y. 2 directton
-+25OV. 2OOpF. 00
Between GND and each
tee/ 3 times
260%. 10 s. Dip up to
0.5mm from resin portion
l
l
U: Upper n=ll, C=O
spe&catton
limit
L: Lower n=ll. C=O
specffication i
limit . ’ ’ n=ll. C=O
Robustness of
Termination
(Tensile test)
Robustness of
Termination
(Bending test]
Weight: 1ON
10 s/ each terminal
l
2
Weight: 2.5N
0’ -go= -0’ --go= -0’
each terminal
l
3
n=ll, C=O
Failure if it has
breakdown and ’
loosened pin.
5 n=ll. C=O
Solderablllty 230+5C. 5+0.5 s
Userogtnflux
l
1
Failure if solder
shall not be adhere
at the area of 95% n=l1. C=O
or more dipped
portion. +6
l 1 Soldering area is shown
below.
O.Smm
*3 Terminal bending direction
is shown below.
/p\
CI
’ i
c
’ !
?I
1
Weight
5. Outgoing inspecti on
is shown below.
SHRRP CORPORfllION
‘2 Terminal tensile direction
Weight
l 4 Applied to PQO3OEZO 12 and PQ033EZO 12.
l 5 Except for the bending of terminal.
*6 Except for the portion within 0.5mm
from the interface between the heat
sink and the resin portion, and
the side surface of heat sink.
. ; i
TABLE II-A single sampling plans for normal inspection based on IS0 2859 is applied.
The AQL according to the inspection items are shown below.
Defect Inspection items AQL (OhI Judgement
criteria
Major
defect
Minor
defect
Electrical characteristics
Unreadable marking
Appearance
Dimensions
0.1
0.4
Depend on the
spectication
6. Supplement
6.1 Example of application
\rb
T
1
I
CO+
47 I-
+ 1
SHflRP CORPORATION
ON-OFF s@nal High : Output ON
or Open : Output OFF I
i T’
i
SHARP CORPORflTION
6.2 Packing specifications (PQ**+EZOlEP)
6.2.1 Packing conditions
( 1) Tape structure and Dimensions (Refer to Fig. A)
The tape shall have a structure in whtch a cover tape is sealed heat-
pressed on the carrier tape of polystyrene emboss protect against
static electricity. Dimensions are shown Fig. A
(2) Reel structure and Dimensions (Refer to Fig.B)
The reel shall be made of polystyrene. Dimensions are shown Fig. B.
(3) Direction of product insertton (Refer to Fig. C)
Product direction in carrier tape shall direct to the radiate fin of product at
the hole side on the tape.
6.2.2 Tape characteristics
(1) Adhesiveness of cover tape
The peel-back force between carrier tape and cover tape shaU be
O.lN to 0.8N for the angle from 160’ to 180’ . (Tape speed : 5mm/s)
(2) Bending strength
Sealed tape : Bended tape radius shall be more than 30mm.
if bended tape radius is less than 3Omm.
there is case that cover tape come off carrier tape.
Carrier tape : Bended tape radius &all be more than 15mm.
6.2.3 Rolling method and quantity
(1) Rolling method (. i I
Wind the tape back on the reel so that the cover tape will be outside the tape.
Attach more than 20 pitch of empty cavities to the trailer and attach more than
10 pitch of empty cavities to the leader of the tape and fix the both ends with
adhesive tape.
One reel shall‘contain 3000 PCS.
The reel shall be pasted label with following information.
l
Model No.
l
Number of pieces contained
l
Production date
(2) Package case
The outer packaging case shall be marked with following information.
l
Model No.
l
Number of pieces contained
l
Inspection date
6.2.5 Storage condition
Taped products shall be stored at the temperature lo&r than 5 to 30’6
and the humidities lower than 7O%RH. If taped products aren’t used
longer than for lodays, Please rewind the tape pulled out and storage.
6.2.6 Others
(1) joint of tape
The cover tape and carrier tape in one reel shall be jointless.
(2) The way to repair taped failure devices
The way to repair taped failure devices cut a bottom of carrier tape
with a cutter, and after replacing to good devices, the cutting portion
shall be sealed with adhesive tape.
Fig. A Tape structure and Dimensions
SHARP CORPORflTION
6.2.4 Indication
(1) -1
Dimensions : WP. value
Unit : mm
SHARP CORPORflTION
Fig. B Reel structure and Dimensions
Dimensions : TYP. value
Unit : mm
Fig. C Direction of product insertion
li
;.
i
Pull-out direction
SHARP CORPORRTION
6.3 Sleeve packaging (PQ’+*Eu)lZ)
6.3.1 Packing conditions
(1) Sleeve structure and Dimensions (Refer to Fig. D)
The sleeve shall be made of high inpuct polethylene
(Plastics with preventing static electricity).
Dimensions are shown Fig. D.
(2) The packfng case shall be made of corrugated cardboard.
Dimensions are shown Fig. F.
(3) Stopper structure
The stopper shall be made of styrene butadiene rubber.
6.3.2 Packaging method and quantity
(1) Packaging method
Max. 75pcs. of products shaIl be packaged in a sleeve and both of
sleeve edges shall be fixed by stoppers. Fix the packing case by kraft tape.
(2) Quantity (Refer to Fig. E)
One package shall contain 3OOOpcs./package.
6.3.3 Indication
(1) Packing case
The packing case shall be marked with following information.
l
Model No.
l
Number of pieces contained
l
Inspection date
1 (. i
1
.
SHHHY CUHPUHHI IUN
Fig. D
GKtnnnor
@See ye
w”.“~~r.
(Without pulled potion)
@Stopper (With pulled portion)
4 0 sleeves ( 1 0 IineX 4 stairs)
Fig. F
case:
1.6kg TYP
():Typ.
unit: mm
Mass per packaged
Inspection date
SHARP CORPORfiTION
7. Notes
7.1 External connection
C-MOS or TIL
(1) Please perform shortest wiring for connection between Cm, Co and the
individual terminal. There is case that oscillation occurs easily by kinds
of capacitor and capacity. Before you use this device, you should confirm
output voltage on your use mounting state.
(2) The input terminal for ON/OFF output control ; @ is compatible with IS-‘ITI+
and direct driving by ‘ITL or C-MOS standard logic (RCA 4000 series) is
also available. In case that ON/OFF terminal is not used, we recommend
to connect the ON/OFF terminal dire&Q to the input terminal ; @ input voltage.
(3) As voltage application under conditions that the device pin is inserted divergently or
reversely, may occur the degradation of characteristics or breakdown of the device.
please avoid it absolutely.
7.2 Thermal protection design I (.
i \
Internal power dissipation (Pd) of device is obtained by the
following equation.
Pd=IoX(Vin-Vo)+VinXIq
If the maximum operating temperature and Pd (MAX.) when the device is
operating are determined. use such a heat sink as allows the device to
operate within the safety operation area specified by the derating curve
in para. 3.4. Insufhcient radiation gives an unfavorable infIuence
to the normal operation and reliabihty of the device. In the case of no
passage within the safety operational territory fflustrated by the derating
curve, the overheat protectton circuit operates to let output fall down, please
avoid keeping such condition for a long time.
SHARP CORPORATION
7.3 Static electricity
Good caution must be exercised against static electricity since this device
consists of a bipolar IC. Following are some examples of preventive measures
against excessive voltages such as caused by static electricity.
(al frytibody must be grounded to discharge the static electricity from the body
.
(b) Anything that is in contact with the device such as workbench,
inserter, or measuring instrument must be grounded.
(cl Use a solder dip basin with a minimum leak current (isolation
resistance 10MQ or more] from the commercial power supply.
Also the solder dip basin must be grounded.
7.4 Soldering
(1) Reflow soldering
It is recommended that within two times soldering be done at the temperature
and the time within the temperature profile as shown in the figure.
(The temperature shown in the figure is fin portion temperature of the device.)
It is recommended that the second reflow become at the device which is the
room temperature.
(a) An infrared lamp used to heat up for soldering may cause a
localized temperature rise in the resin. The temperature of
resin portion should be with in the temperature proffle below.
(bl The temperature sloping when soldering-reflow is 4E/s or less.
240.X
200°C
180°C
25X,
< > <
2 min 1 min ’ !+-iGiPd
< 80s ‘i
SHARP CORPORATION
(2) Dip soldering
We recommend that solder dip should be 260F or less (Solder temp.) within 10s
and 1 time only. Please obey the note items below concerning solder reflow.
(a) Atter solder dip, please do cooling naturally.
(b) Please shall not give the mechanical stress or the impact stress to the device.
In advance, please confirm fully the dip soldering conditions etc. in the actual application
in order to avoid any soldering bridge.
(3) Hand soldering
This device is basically designed for the soldering such as reflow soldering or dip soldering.
In case when hand soldering is reluctantly needed for m-cation etc.,
it is recommended that only one hand soldering should be done at 26O’c or less
of soldering iron edge temperature, for 10s or less. Please be careful not to touch
soldering iron edge to leads directly etc. in order not to give any stress to the leads.
Even within the above conditfons regarding solder reflow, solder dip or hand soldering
there is the possibility that the stress given to the terminals by the deformation of PCB makes
the wire in the device package cut. In advance, please con&m fully at the actual application.
7.5 For cleaning
(1) Solvent cleaning : Solvent temperature 45C or less
Immersion for 3 mm or less
(2) Ultrasonic cleaning : The effect to device byL ultrasonic cleaning differs
by cleaning bath size, ultrasonic power
output, cleaning time. PCB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn‘t occur any defect before starting
the ultrasonic cleaning.
(3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
.
In case when the other solvent is used, there are cases’&
i
p
.
the packaging resin is eroded. Please use the other solvent
after thorough con&nation is performed in actual using condition.