BSS138
Document number: DS30144 Rev. 22 - 2
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October 2019
© Diodes Incorporated
BSS138
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The BSS138Q is suitable for automotive applications
requiring specific change control; this part is AEC-Q101
qualified, PPAP capable, and manufactured in IATF 16949
certified facilities.
https://www.diodes.com/quality/product-definitions/
Mechanical Data
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.008 grams (Approximate)
Ordering Information (Note 4)
Part Number
Qualification
Case
BSS138-7-F
Commercial
SOT23
BSS138-13-F
Commercial
SOT23
BSS138Q-7-F
Automotive
SOT23
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
Date Code Key
Year
1998
1999
2000
2002
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
Code
J
K
L
N
D
E
F
G
H
I
J
K
L
M
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
SOT23
Top View
Equivalent Circuit
Top View
D
GS
K38 = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test Site)
 M = Date Code Marking for CAT (Chengdu Assembly/ Test Site)
Y  = Year (ex: G = 2019)
M = Month (ex: 9 = September)
Source
Gate
Drain
Shanghai A/T Site
Chengdu A/T Site
e3
BSS138
Document number: DS30144 Rev. 22 - 2
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© Diodes Incorporated
BSS138
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
50
V
Drain-Gate Voltage RGS 20K
VDGR
50
V
Gate-Source Voltage Continuous
VGSS
20
V
Gate-Source Voltage Non Repetitive, Pulse Width<50s
40
V
Drain Current Continuous
ID
200
mA
Pulsed Drain Current (Pulse Duty Cycle = 1%)
IDM
1
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 5)
PD
300
mW
Thermal Resistance, Junction to Ambient (Note 5)
RJA
417
C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BVDSS
50
75
V
VGS = 0V, ID = 250A
Zero Gate Voltage Drain Current
IDSS
0.5
µA
VDS = 50V, VGS = 0V
Gate-Body Leakage
IGSS
100
nA
VGS = 20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
VGS(TH)
0.5
1.2
1.5
V
VDS = VGS, ID = 250A
Static Drain-Source On-Resistance
RDS(ON)
1.4
3.5
VGS = 10V, ID = 0.22A
Forward Transconductance
gFS
100
mS
VDS = 25V, ID = 0.2A, f = 1.0KHz
DYNAMIC CHARACTERISTICS
Input Capacitance
Ciss
50
pF
VDS = 10V, VGS = 0V, f = 1.0MHz
Output Capacitance
Coss
25
pF
Reverse Transfer Capacitance
Crss
8.0
pF
SWITCHING CHARACTERISTICS
Turn-On Delay Time
tD(ON)
20
ns
VDD = 30V, ID = 0.2A, RGEN = 50
Turn-Off Delay Time
tD(OFF)
20
ns
Notes: 5. Device mounted on FR-4 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on  suggested pad layout, which can be found on our
website at http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
0
0.1
0.2
0.3
0.4
0.5
0.6
010
91 23 4 5 6 7 8
I , DRAIN-SOURCE CURRENT (A)
D
V , DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Drain-Source Current vs. Drain-Source Voltage
DS
T = 25 C
j°V = 3.5V
GS
V = 3.25V
GS
V = 3.0V
GS
V = 2.75V
GS
V = 2.5V
GS
0
V , GATE-SOURCE VOLTAGE (V)
Fig. 2 Transfer Characteristics
GS
0.1
0.2
0.3
0.5
0.4
0.6
0.7
0.8
01 1.5
0.5 2 3.5 44.5
2.5 3
I , DRAIN-SOURCE CURRENT (A)
D
-55 C
°
150 C
°
25 C
°
V = 1V
DS
TJ = 25°C
BSS138
Document number: DS30144 Rev. 22 - 2
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BSS138
0.65
T, JUNCTION TEMPERATURE (
)
Fig. 3 Drain-Source On-Resistance vs. Junction Temperature
j
0.85
1.05
1.25
1.65
1.45
1.85
2.05
2.25
2.45
-55 -5 45 95 145
V = 10V
GS
V = 4.5V
GS
I = 0.5A
D
I = 0.075A
D
R , NORMALIZED DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
V , GATE THRESHOLD VOLTAGE (V)
GS(th)
T, JUNCTION TEMPERATURE (
)
Fig. 4 Gate Threshold Variation vs. Ambient Temperature
j
0
0.4
0.8
1.2
1.6
2.0
2.4
-50 -25 0 25 50 75 100 125 150
I = 1mA
D
I = 250
D
0
I , DRAIN-CURRENT (A)
Fig. 5 Drain-Source On-Resistance vs. Drain-Current
D
1
2
3
4
5
6
7
8
00.02 0.04 0.06 0.08 0.160.140.12
0.1
150 C°
25 C°
V = 2.5V
GS
-55 C°
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
0
I , DRAIN-CURRENT (A)
Fig. 6 Drain-Source On-Resistance vs. Drain-Current
D
1
2
3
5
4
6
7
8
9
00.05 0.1 0.2
0.15 0.25
150 C°
-55 C°
25 C°
V = 2.75V
GS
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
0
1
2
3
4
5
6
00.1 0.2 0.3 0.4 0.5
I , DRAIN-CURRENT (A)
Fig. 7 Drain-Source On-Resistance vs. Drain-Current
D
150 C°
-55 C°
25 C°
V = 4.5V
GS
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
0
0.5
1
1.5
2
2.5
3
3.5
00.1 0.2 0.3 0.4 0.5
I , DRAIN-CURRENT (A)
Fig. 8 Drain-Source On Resistance vs. Drain-Current
D
150 C°
-55 C°
25 C°
V = 10V
GS
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
Junction Temperature
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
ID = 250µA
BSS138
Document number: DS30144 Rev. 22 - 2
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BSS138
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03
0.915
F
0.45
0.60
0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013
0.10
0.05
K
0.890
1.00
0.975
K1
0.903
1.10
1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085
0.150
0.110
a
--
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
Dimensions
Value (in mm)
C
2.0
X
0.8
X1
1.35
Y
0.9
Y1
2.9
I , DIODE CURRENT (A)
D
0.001
0.01
0.1
1
V , DIODE FORWARD VOLTAGE (V)
Fig. 9 Body Diode Current vs. Body Diode Voltage
SD
0 0.2 0.4 0.6 0.8 1 1.2
150 C°
-55 C°
25 C°
C, CAPACITANCE (pF)
1
10
100
V , DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Capacitance vs. Drain-Source Voltage
DS
0 5 10 15 20 25 30
V = 0V
f = 1MHz
GS
CrSS
COSS
CiSS
J
K1 K
L1
GAUGE PLANE
0.25
H
L
M
All 7°
A
CB
D
G
F
a
X
Y
Y1 C
X1
Ciss
Crss
Coss
BSS138
Document number: DS30144 Rev. 22 - 2
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October 2019
© Diodes Incorporated
BSS138
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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