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D/CRCW
Vishay
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
FEATURES
•Stability ΔR/R = 1 % for 1000 h at 70 °C
•Lead (Pb)-bearing termination plating on Ni barrier layer
•Metal glaze on high quality ceramic
•Halogen-free according to IEC 61249-2-21 definiton
•AEC-Q200 qualified, rev. C compliant
Notes
•These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
•Marking: See datasheet “Surface Mount Resistor Marking” (document number 20020).
•Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE RA TED DISSIPATION
P70
W
LIMITING
ELEMENT
VOLTAGE
Umax. AC/DC
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
ΩSERIES
INCH METRIC
D10/CRCW0402 0402 RR 1005M 0.063 50 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 1.5 A
D11/CRCW0603 0603 RR 1608M 0.10 75 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 2.0 A
D12/CRCW0805 0805 RR 2012M 0.125 150 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 2.5 A
D25/CRCW1206 1206 RR 3216M 0.25 200 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 3.5 A
CRCW1210 1210 RR 3225M 0.50 200 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 5.0 A
CRCW1218 1218 RR 3246M 1.0 200 ± 100
± 200 ± 1
± 5 1R0 to 2M2 E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 7.0 A
CRCW2010 2010 RR 5025M 0.75 400 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 6.0 A
CRCW2512 2512 RR 6332M 1.0 500 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 mΩ, Imax. = 7.0 A
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Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors Vishay
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Note
(2) Preferred way for ordering products is by use of the PART NUMBER.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT D10/
CRCW0402 D11/
CRCW0603 D12/
CRCW0805 D25/
CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512
Rated dissipation at 70 °C
(1)
W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0
Limiting element voltage
UMAX. AC/DC
V 50 75 150 200 200 200 400 500
Insulation voltage
U
INS.
(1 min) V > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300
Insulation resistance
Ω
> 10
9
Category temperature range °C - 55 to + 155
Failure rate h
-1
< 0.1 x 10-9
Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW0805562RFKTA (2)
MODEL VALUE TOLERANCE TCR PACKAGING SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = Decimal
K = Thousand
M = Million
0000 = Jumper
F = ± 1 %
J = ± 5 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
S = Jumper or
special
TA
TB
TC
TD
TE
TF
TG
TH
TK
Up to 2 digits
Product Description: CRCW0805 100 562R 1 % RT1
CRCW0805 100 562R 1 % RT1
MODEL TCR RESISTANCE VALUE TOLERANCE PACKAGING
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
± 100 ppm/K
± 200 ppm/K 10R = 10 Ω
562R = 562 Ω
10K = 10.0 kΩ
1M = 1 MΩ
0R0 = Jumper
± 1 %
± 5 % RT1
RT5
RT6
RT7
RF4
R02
R67
R82
RT9
C R C W 0 8 0 5 5 6 2 R F K T A
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D/CRCW
Vishay Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
DIMENSIONS
PACKAGING
MODEL UNIT PAPER TAPE
ACC. IEC 60286-3, TYPE I BLISTER TAPE
ACC. IEC 60286-3, TYPE II
QUANTITY PART NUMBER PRODUCT DESC. QUANTITY PART NUMBER PRODUCT DESC.
D10/CRCW0402 180 mm/7" 10 000 TD RT7
330 mm/13" 50 000 TE RF4
D11/CRCW0603 180 mm/7" 5000 TA RT1
285 mm/11.25" 10 000 TB RT5
330 mm/13" 20 000 TC RT6
D12/CRCW0805 180 mm/7" 5000 TA RT1
285 mm/11.25" 10 000 TB RT5
330 mm/13" 20 000 TC RT6
D25/CRCW1206 180 mm/7" 5000 TA RT1
285 mm/11.25" 10 000 TB RT5
330 mm/13" 20 000 TC RT6
CRCW1210 180 mm/7" 5000 TA RT1
285 mm/11.25" 10 000 TB RT5
330 mm/13" 20 000 TC RT6
CRCW1218 180 mm/7" 4000 TK RT9
CRCW2010 180 mm/7" 4000 TF R02
CRCW2512 180 mm/7" 2000 TG R67
4000 TH R82
SIZE DIMENSIONS in millimeters SOLDER PAD DIMENSIONS in millimeters
REFLOW SOLDERING WAVE SOLDERING
INCH METRIC L W H T1 T2 ablabl
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5
0603 1608 1.55 + 0.10
- 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 2.0 + 0.20
- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20
- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 3.2 + 0.10
- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3
1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2
1218 3246 3.2 + 0.10
- 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9
2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9
2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2
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FUNCTIONAL PERFORMANCE
1000
100
10
1
0.1
0.01
Single Pulse
Pulse Load max. (W)
P
2512
1218
2010
1210
1206
0805
0603
0402
10
-6
Pulse Duration
i
(s)
t
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û ≤ Ûmax.;
for permissible resistance change equivalent to 8000 h operation
1000
10
1
0.1
0.01
10
-6
Continuous Pulse
Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Û ≤ Ûmax.;
for permissible resistance change equivalent to 8000 h operation
Pulse Duration i (s)
Continuous Pulse Load
max.
(W)
t
P
100
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
2512
1218
2010
1210
1206
0805
0603
0402
2000
200
0
10
- 6
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
110
Pulse V oltage
Maximum pulse voltage, single and continuous pulses; applicable if
P ≤ P
max.
; for permissible resistance change equivalent to 8000 h operation
Pulse Duration
i
(s)
400
600
800
1000
1200
1400
1600
1800
Pulse Voltage max. (V)
2512
2010
1206/1210/1218
0805 0603
0402
t
Û
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Vishay Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70
Derating
Ambient Temperature in °C
Fraction of Rated Dissipation in %
10
120
Resistance Value R in Ω
Attenuation of 3rd Harmonic A3 in dB
Non-Linearity
100
80
40
60
20
0100 1K 10K 100K 1M 10M
1206, 2010
0805
0603
0402
100 1K 10K 100K 1M 10M
100
10
1
0.1
0.01
Current Noise A1 in µV/V
Current Noise
2010
1206
0805
0603
0402
Resistance Value R in Ω
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TEST PROCEDUR ES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60082-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1
OR BETTER STABILITY CLASS 2
OR BETTER
Stability for product types: 1Ωto 10 MΩ1Ωto 10 MΩ
D/CRCW
4.5 - Resistance - ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 · Uins; 60 s No flashover or breakdown
4.13 - Short time overload U= 2.5 x ≤ 2 x Umax.;
duration: Acc. to style ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.17.2 58 (Td) Solderability Solder bath method; Sn60Pb40;
non-activated flux;
(235 ± 5) °C, (2 ± 0.2) s
Good tinning (≥ 95 %
covered);
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and
(20/125/20) °C ± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu3) Shear (adhesion) RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N No visible damage
4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C;
30 min. at 125°C
5 cycles
1000 cycles ± (0.25 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.23 - Climatic sequence: -
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U=
4.25.1 - Endurance at 70 °C
U = √(P70 x R) ≤ Umax.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h ± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
4.18.2 58 (Td) Resistance to soldering heat Solder bath method
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.35 - Flamability, needle flame test IEC 60695-11-5;
10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C;
(93 ± 3) % RH; 56 days ± (1 % R + 0.05 Ω)
4.25.3 - Endurance at upper
category temperature 155 °C; 1000 h ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.40 - Electrostatic discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size ± (1 % R + 0.05 Ω)
4.29 45 (XA) Component solvent resistance Isopropyl alcohol;
50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol;
50 °C; method 1, toothbrush Marking legible,
no visible damage
P70 x R
P70 x R
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D/CRCW
Vishay Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, envi ronmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
4.22 6 (Fc) Vibration, endurance by
sweeping
f = 10 Hz to 2000 Hz;
x, y, z ≤ 1.5 mm;
A ≤ 200 m/s2;
10 sweeps per axis
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.37 - Periodic electric overload U= ≤ 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles ± (1 % R + 0.05 Ω)
4.27 - Single pulse high voltage
overload, 10 µs/700 µs Û= 10 x ≤ 2 x Umax.;
10 pulses ± (1 % R + 0,05 Ω)
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60082-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1
OR BETTER STABILITY CLASS 2
OR BETTER
Stability for product types: 1Ωto 10 MΩ1Ωto 10 MΩ
D/CRCW
15 x P70 x R
P70 x R
