HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761-B
Issued Date : 1994.10.06
Revised Date : 2000. 10.01
Page No. : 1/3
HSMC Product Specifi cation
HTIP50D
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP50 is designed for line operated audio output amplifier
switch-mode power supply drivers and other switching applications.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature........................................................................................... -50 to +150 °C
Junction Temperatur e................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 40 W
Total Power Dissipation (Ta=25°C)...................................................................................... 2 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... 500 V
BVCEO Collector to Emitter Voltage................................................................................. 400 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current.............................................................................................................. 1 A
Electrical Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 500 - - V IC=1mA, IE= 0
BVCEO 400 - - V IC=30mA, IB=0
BVEBO 5 - - V IE=0.1mA, IC=0
IEBO - - 1 mA VEB=5V, IC=0
ICEO - - 1 mA VCE=300V, IB=0
ICES - - 1 mA VCE=500V, VEB=0
*VCE(sat) - - 1 V IC=1A, IB=0.2A
*VBE(on) - - 1.5 V IC=1A, VCE=10V
*hFE1 30 - 150 IC=0.3A, VCE= 10V
*hFE2 10 - - IC=1A, VCE=10V
fT 10 - - MHz IC=0.2A, VCB= 10V, f=2MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761-B
Issued Date : 1994.10.06
Revised Date : 2000. 10.01
Page No. : 2/3
HSMC Product Specifi cation
Characteristics Curve
Current Gain & Collector Current
10
100
10 100 1000
Collector Curren t (mA)
hFE
VCE=10V
Saturation Voltage & Collector Current
1
10
100
1000
110 100 1000
Collector Curren t (mA)
Satu ration Voltage (mV)
VCE(sat) @ IC=5IB
On Voltage & Collector Curr ent
0.1
1
1 10 100 1000
Collector Curren t (mA)
On Voltage (mV)
VBE(on) @ VCE=10V
Cutoff Frequency & Collector Current
10
100
1 10 100 1000
Collector Curren t (mA)
Cutoff Frequency (MHz )
VCE=10V
Capacit an ce & Reverse-Biased Voltage
1
10
100
1 10 100
R everse Biased Vol t a ge ( V)
Cap a c ita nce (pF)
Cob
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761-B
Issued Date : 1994.10.06
Revised Date : 2000. 10.01
Page No. : 3/3
HSMC Product Specifi cation
TO-126ML Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56
B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84
C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00
D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62
E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12
G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14
H 0.0462 0.0562 1.17 1.42
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controll i ng dimens ion : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thick ness of base material .
4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC sal es office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin famil y, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liabilit y for any cons equence of customer product design, infringem ent of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerit y Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
N
D
E
M L K
F
I
AB
C
H
J
3
2
1
O
G
Style : Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package
HSMC Packa
g
e Code : D
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Marking
