Description
These white ChipLEDs come in unique shades of white
and provide product dierentiation for backlighting
application. They are designed in industry standard
package for ease of handling and use.
These chipLEDs come in either a side emitting package
(HSMW-C120) or in top emitting packages (HSMW-
C130, C191, C197 and C265).
The packages all compatible with IR reow soldering
process and come in 8 mm tape on 7" diameter reel.
They are compatible with automatic placement equip-
ment.
In order to facilitate pick and place operation, these chi-
pLEDs are shipped in tape and reel with 4000 units per
reel for HSMW-C120, C130, C191 and C197 packages,
and 3000 units per reel for HSMW-C265 package.
Features
x White color
x Small size
x Industry standard footprint
x Compatible with reow soldering
x Compatible with automatic placement equipment
x Operating temperature range –40qC to +85qC
x Come in 8 mm tape on 7" diameter reels
Applications
x LCD backlighting
x Keypad backlighting
x Pushbutton backlighting
x Symbol backlighting
HSMW-C120, HSMW-C130, HSMW-C191,
HSMW-C197, HSMW-C265
White ChipLEDs
Data Sheet
CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
2
Package Dimensions
HSMW-C191 HSMW-C197
HSMW-C120 HSMW-C130
1.6 (0.063)
0.5 (0.020)
POLARITY
1.0 (0.039)
3 Ð 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
DIFFUSED
EPOXY
1.6
(0.063 )
0.3 (0.012)
0.30 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.30 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
1.6
(0.063 )
0.3 ± 0.15
(0.012 ± 0.006)
POLARITY
0.4 (0.016)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
0.4 (0.016)
0.16 (0.006)
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED.
LED Die CATHODE
MARK
DIFFUSED EPOXY
PCB BOARD
SOLDERING
TERMINAL
CATHODE
LINE
Polarity
(0.80)
0.031
0.8
0.063
1.6
0.045
1.15
0.014
0.35
0.005
0.12
0.009
0.23
0.012
±
.006
0.3
±
0.15
0.028
0.7 MIN.
0.012
±
.006
0.3
±
0.15
3
Package Dimensions, continued
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED.
HSMW-C265
3.4 (0.134 )
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
CATHODE LINE
4
Device Selection Guide
Package Dimension (mm) White Package Description
1.6 (L) x 0.6 (W) x 1.0 (H) HSMW-C120 Untinted, Diused
1.6 (L) x 0.8 (W) x 0.35 (H) HSMW-C130 Untinted, Diused
1.6 (L) x 0.8 (W) x 0.6 (H) HSMW-C191 Untinted, Diused
1.6 (L) x 0.8 (W) x 0.4 (H) HSMW-C197 Untinted, Diused
3.4 (L) x 1.25 (W) x 1.1 (H)[2] HSMW-C265 Untinted, Diused
Notes:
1. Right angle package.
2. Reverse mount package.
Absolute Maximum Ratings at TA = 25˚C
Parameter HSMW-Cxxx Units
DC Forward Current[1] 20 mA
Power Dissipation 78 mW
Reverse Voltage (IR = 100 μA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reow soldering prole (Figures 10 & 11)
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25˚C
Reverse
Forward Voltage Breakdown Capacitance C Thermal
V
F (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA[1] @ IR = 100 μA f = 1 MHz RTJ-PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMW-Cxxx 3.6 3.9 5 55 450
Note:
1. VF tolerance: ± 0.1 V.
Optical Characteristics at TA = 25˚C
Luminous
Intensity Chromaticity Luminous
I
v (mcd) Coordinates[2] Viewing Angle Ecacy
@ 20 mA[1, 4] Typ. 2 T1/2 Degrees[3] Kv (lm/w)
Part Number Min. Typ. x y Typ. Typ.
HSMW-C120 45 160 0.29 0.27 155 240
HSMW-C130 45 150 0.29 0.27 145 240
HSMW-C191 71.5 200 0.29 0.27 140 240
HSMW-C197 45 160 0.29 0.27 130 240
HSMW-C265 71.5 180 0.29 0.27 150 240
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the o-axis angle where the luminous intensity is 1/2 the peak intensity.
4. Luminous intensity (Iv) tolerance: ± 15%.
5
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Note:
1. Bin categories are established for classi-
cation of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
Tolerance: ± 15%
Bin
Limits (Chromaticity
Coordinate)
xy
A1 0.270 0.246
0.270 0.278
0.250 0.250
0.250 0.218
A2 0.270 0.246
0.270 0.213
0.250 0.185
0.250 0.218
B1 0.270 0.246
0.270 0.278
0.290 0.306
0.290 0.274
B2 0.270 0.246
0.270 0.213
0.290 0.241
0.290 0.274
C1 0.290 0.306
0.310 0.336
0.310 0.303
0.290 0.274
C2 0.290 0.241
0.310 0.271
0.310 0.303
0.290 0.274
D1 0.310 0.303
0.310 0.336
0.330 0.365
0.330 0.333
D2 0.310 0.303
0.310 0.271
0.330 0.300
0.330 0.333
Figure 1. Color bin limits (CIE 1931 Chromaticity
Diagram) [Tolerance: ± 0.02].
Figure 2. Forward current vs. forward voltage.
05 15
I
F
- FORWARD CURRENT - mA
0
0.4
1.0
1.2
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
25
0.6
0.2
0.8
10 20
0
25
020 60 80 100
5
I
F MAX.
- MAXIMUM FORWARD CURRENT - mA
T
A
- AMBIENT TEMPERATURE - oC
40
15
20
10
10 30 50 70 90
6
Figure 4. Maximum forward current vs. ambient
temperature.
Figure 3. Luminous intensity vs. forward current.
100
10
1
0.12.0 3.0 4.0
V
F
- FORWARD VOLTAGE - V
I
F
- FORWARD CURRENT - mA
2.5 3.5
0.40
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.24 0.26 0.28 0.30 0.32 0.34
Y-COORDINATE
X-COORDINATE
0.36
0.38
A1
A2
B1
B2
C2
C1 D2
D1
SMT WHITE COLOR BIN STRUCTURES
Figure 5. Relative intensity vs. angle for HSMW-C120.
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
7
Figure 9. Relative intensity vs. angle for HSMW-C265.
Figure 8. Relative intensity vs. angle for HSMW-C197.
RELATIVE INTENSITY - %
100
0
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY - %
100
0
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 7. Relative intensity vs. angle for HSMW-C191.
RELATIVE INTENSITY - %
100
0
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Relative intensity vs. angle for HSMW-C130.
RELATIVE INTENSITY - %
100
0
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
8
Figure 10. Recommended reow soldering prole.
Figure 13. Recommended soldering pattern
for HSMW-C130, HSMW-C191, and HSMW-C197.
Figure 14. Recommended soldering pad pattern for HSMW-C265.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 12. Recommended soldering pad pattern for HSMW-C120.
Figure 11. Recommended Pb-free reow soldering prole.
230 C MAX.
10 SEC. MAX.
4 C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4 C/SEC. MAX.
140-160 C
3 C/SEC. MAX.
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
3 C/SEC. MAX.
150 C
255 - 260 C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE
9
Figure 15. Reeling orientation.
Figure 16. Reel dimensions.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
10
Figure 17. Tape dimensions.
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
HSMx-C120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
0.80 (0.031)
0.50 (0.020)
0.88 (0.035)
0.60 (0.024)
0.23 ± 0.05
(0.009 ± 0.002)
FOR HSMR-C130
FOR HSMx-C120
R 0.5 ± 0.05
(0.020 ± 0.002)
HSMx-C120 SERIES
HSMx-C130 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
1.90 (0.075)
1.75 (0.069)
1.85 (0.073)
1.75 (0.069)
1.15 (0.045)
0.88 (0.035)
0.88 (0.035)
0.95 (0.037)
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
Figure 18. Tape leader and trailer dimensions.
Convective IR Reow Soldering
For more information on IR reow soldering, refer to
Application Note 1060, Surface Mounting SMT LED Indi-
cator Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the condition:
1. Humidity Indicator Card is > 10% when read at
23±5°C.
2. Device expose to factory conditions < 30°C/60% RH
more than 672 hours.
Baking recommended condition: 60 ± 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0685EN
AV02-0186EN - May 5, 2010
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.