Surface Mount PIN Diodes
Technical Data
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion
Switching
Microwave Frequency
Operation
• Surface Mount SOT-23 and
SOT-143 Packages
Single and Dual Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate[1]
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
HSMP-38XX and
HSMP-48XX Series
Package Lead Code
Identification
COMMON
CATHODE
#4
UNCONNECTED
PAIR
#5
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
DUAL ANODE
#A
DUAL CATHODE
#B
required. The HSMP-48XX series
are special products featuring
ultra low parasitic inductance in
the SOT-23 package, specifically
designed for use at frequencies
which are much higher than the
upper limit for conventional
SOT-23 PIN diodes. The
HSMP-4810 diode is a low distor-
tion attenuating PIN designed for
operation to 3 GHz. The
HSMP-4820 diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-4890 is
optimized for low current switch-
ing applications up to 3 GHz.
The HSMP-386X series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low cost is the driving
issue for the designer.
The HSMP-386X series Total
Capacitance (CT) and Total
Resistance (RT) are typical
specifications. For applications
that require guaranteed perfor-
mance, the general purpose
HSMP-383X series is recom-
mended. For low distortion
Description/Applications
The HSMP-380X and HSMP-381X
series are specifically designed for
low distortion attenuator applica-
tions. The HSMP-382X series is
optimized for switching applica-
tions where ultra-low resistance is
required. The HSMP-3880 switch-
ing diode is an ultra low distortion
device optimized for higher power
applications from 50 MHz to
1.5 GHz. The HSMP-389X series is
optimized for switching applica-
tions where low resistance at low
current and low capacitance are
attenuators, the HSMP-380X or
-381X series are recommended.
For high performance switching
applications, the HSMP-389X
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
2
Absolute Maximum Ratings[1] TA = 25°C
Symbol Parameter Units Absolute Maximum
IfForward Current (1 ms Pulse) Amp 1
PtTotal Device Dissipation mW[2] 250
Piv Peak Inverse Voltage — Same as VBR
TjJunction Temperature °C 150
TSTG Storage Temperature °C -65 to 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
this device.
2. CW Power Dissipation at TLEAD = 25°C. Derate to zero at maximum rated temperature.
PIN Switching Diodes
Electrical Specifications TA = 25°C
Nearest Maximum
Equivalent Minimum Maximum Maximum Shunt Mode
Part Package Axial Lead Breakdown Series Total Harmonic
Number Marking Lead Part No. Voltage Resistance Capacitance Distortion
HSMP- Code[1] Code Configuration 5082- VBR (V) RS (Ω)C
T (pF) Hmd (dBc)
3820 F0 0 Single 3188 50 0.6* 0.8* —
3822 F2 2 Series
3823 F3 3 Common Anode
3824 F4 4 Common Cathode
3880 S0 0 Single — 100 6.5 0.40 –55
3890 G0 0 Single — 100 2.5 0.30** —
3892 G2 2 Series
3893 G3 3 Common Anode
3894 G4 4 Common Cathode
3895 G5 5 Unconnected Pair
Test Conditions VR = VBR IF = 5 mA VR = 50 V 2 fo, Zo = 50 W
Measure f = 100 MHz f = 1 MHz fo = 400 MHz
IR ≤ 10 µAI
F = 10 mA* VR = 20 V* Pin = +30 dBm
VR = 5 V** 0 V bias
Note:
1. Package marking code is white.
PIN Attenuator Diodes
Electrical Specifications TA = 25°C (Each Diode)
Nearest
Equivalent Minimum Maximum Maximum Minimum Maximum
Part Package Axial Lead Breakdown Series Total High Low
Number Marking Lead Part No. Voltage Resistance Capacitance Resistance Resistance
HSMP- Code[1] Code Configuration 5082- VBR (V) RS (Ω)C
T (pF) RH (Ω)R
L (Ω)
3800 D0 0 Single 3080 100 2.0 0.37 1000 8
3802 D2 2 Series
3804 D4 4 Common Cathode
3810 E0 0 Single 3081 100 3.0 0.35 1500 10
3812 E2 2 Series
3813 E3 3 Common Anode
3814 E4 4 Common Cathode
Test Conditions VR = VBR IF = 100 mA VR = 50 V IF = 0.01 mA IF = 20 mA
Measure f = 100 MHz f = 1 MHz f = 100 MHz f= 100 MHz
IR ≤ 10 µA
3
PIN General Purpose Diodes, Electrical Specifications T
A
= 25°C
Nearest
Equivalent Minimum Maximum Maximum
Part Package Axial Lead Breakdown Series Total
Number Marking Lead Part No. Voltage Resistance Capacitance
HSMP- Code[1] Code Configuration 5082- VBR (V) RS (Ω)C
T (pF)
3830 K0 0 Single 3077 200 1.5 0.3
3832 K2 2 Series
3833 K3 3 Common Anode
3834 K4 4 Common Cathode
Test Conditions VR = VBR IF = 100 mA VR = 50 V
Measure f = 100 MHz f = 1 MHz
IR ≤ 10 mA
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes, Electrical Specifications T
A
= 25°C
Minimum Maximum Typical Maximum Typical
Break- Series Total Total Total
Part Package down Resis- Capaci- Capaci- Induc-
Number Marking Lead Config- Voltage tance tance tance tance Appli-
HSMP- Code Code uration VBR (V) RS (Ω)C
T (pF) CT (pF) LT (nH) cation
4810 EB B Dual 100 3.0 0.35 0.4 1.0 Attenu-
Cathode ator
4820 FA A Dual Anode 50 0.6* 0.75* 1.0 1.0* Limiter
4890 GA A Dual Anode 100 2.5** 0.33 0.375 1.0 Switch
VR = VBR IF = 100 mA VR = 50 V VR = 50 V f = 500 MHz –
Measure IF = 10 mA* f = 1 MHz f = 1 MHz 3 GHz
IR ≤ 10 µAI
F = 5 mA** VR = 20 V* VR = 0 V VR = 20 V*
PIN General Purpose Diodes, Typical Specifications T
A
= 25°C
Code Minimum Typical Series Typical Total
Part Number Marking Lead Breakdown Resistance Capacitance
HSMP- Code[1] Code Configuration Voltage VBR (V) RS (Ω)C
T (pF)
3860 L0 0 Single 50 3.0/1.5* 0.20
3862 L2 2 Series
3863 L3 3 Common Anode
3864 L4 4 Common Cathode
Test Conditions VR = VBR IF = 10 mA VR = 50 V
Measure f = 100 MHz f = 1 MHz
IR ≤ 10 µA*IF = 100 mA
Typical Parameters at T
A
= 25°C
Part Number Series Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance
HSMP- RS (Ω)τ (ns) Trr (ns) CT (pF)
380X 55 1800 500 0.32 @ 50 V
381X 75 1500 300 0.27 @ 50 V
382X 1.5 70* 7 0.60 @ 20 V
383X 20 500 80 0.20 @ 50 V
388X 3.8 2500 550 0.30 @ 50 V
389X 3.8 200* – 0.20 @ 5 V
Test Conditions IF = 1 mA IF = 50 mA VR = 10 V
f = 100 MHz IR = 250 mA IF = 20 mA
IF = 10 mA* IF = 10 mA* 90% Recovery
IR = 6 mA*
Note:
1. Package marking code is white.
4
Typical Parameters at TA = 25°C (unless otherwise noted), Single Diode
Figure 2. RF Capacitance vs. Reverse
Bias, HSMP-3830 Series.
0.15
0.30
0.25
0.20
0.35
0.40
0.45
02 64101281614 18 20
TOTAL CAPACITANCE (pF)
REVERSE VOLTAGE (V)
Figure 1. RF Capacitance vs. Reverse
Bias, HSMP-3810 Series. Figure 3. Resistance at 25°C vs.
Forward Bias Current.
1 MHz
30 MHz
frequency>100 MHz
0.15
0.30
0.25
0.20
0.35
02 64101281614 18 20
TOTAL CAPACITANCE (pF)
REVERSE VOLTAGE (V)
1 GHz
100 MHz
1 MHz
10000
1000
100
10
1
0.1
RESISTANCE (OHMS)
I
F
– FORWARD BIAS CURRENT (mA)
0.01 0.1 1 10 100
3000
1000
100
10
1
0.01 0.1 1 10 100
RF RESISTANCE (OHMS)
I
F
– FORWARD BIAS CURRENT (mA)
T
A
= +85°C
T
A
= +25°C
T
A
= –55°C
10000
1000
100
10
1
RF RESISTANCE (OHMS)
0.01 0.1 1 10 100
I
F
– FORWARD BIAS CURRENT (mA)
T
A
= +85°C
T
A
= +25°C
T
A
= –55°C
Figure 5. RF Resistance vs. Forward
Bias Current for HSMP-3810/
HSMP-4810.
1.4
1.2
1
0.8
0.6
0.4
0.2
001020304050
V
R
– REVERSE VOLTAGE (V)
CAPACITANCE (pF)
HSMP-382X
HSMP-3880
HSMP-3800
HSMP-3890
HSMP-381X
HSMP-3830
Figure 6. Capacitance vs. Reverse
Voltage.
Figure 4. RF Resistance vs. Forward
Bias Current for HSMP-3800.
120
110
100
90
80
70
60
50
40
1000 100 10
Diode Mounted as a
Series Attenuator
in a 50 Ohm Microstrip
and Tested at 123 MHz
DIODE RF RESISTANCE (OHMS)
Figure 7. 2nd Harmonic Input
Intercept Point vs. Diode RF
Resistance for Attenuator Diodes.
INPUT INTERCEPT POINT (dBm)
HSMP-3810
HSMP-3830
HSMP-3830
120
115
110
105
100
95
90
8511030
I
F
– FORWARD BIAS CURRENT (mA)
Figure 8. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
INPUT INTERCEPT POINT (dBm)
HSMP-3880
HSMP-3820
HSMP-3880
HSMP-3830
HSMP-3890
Diode Mounted as a
Series Attenuator in a
50 Ohm Microstrip and
Tested at 123 MHz
FORWARD CURRENT (mA)
Figure 9. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-3820 Series.
T
rr
– REVERSE RECOVERY TIME (ns)
1
10
100
10 20 30
V
R
= 2V
V
R
= 5V
V
R
= 10V
HSMP-382X
HSMP-381x, /HSMP-4810
HSMP-382x, -4820
HSMP-383x, -386x
5
Typical Parameters (continued)
1000
100
1010 20 30
T
rr
- REVERSE RECOVERY TIME (nS)
FORWARD CURRENT (mA)
Figure 10. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltage. HSMP-3830 Series.
HSMP-3830
V
R
= 5V
V
R
= 10V
V
R
= 20V
1000
900
800
400
10010 20 2515 30
REVERSE RECOVERY TIME (nS)
FORWARD CURRENT (mA)
Figure 11. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3880
Series.
700
600
500
200
300
V
R
= 5V
V
R
= 10V
V
R
= 20V
200
160
120
80
40
010 2015 25 30
T
RR
- REVERSE RECOVERY TIME (nS)
FORWARD CURRENT (mA)
Figure 12. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3890
Series.
V
R
= –2V
V
R
= –5V
V
R
= –10V
100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (mA)
Figure 13. Forward Current vs.
Forward Voltage. HSMP-3800 Series.
125°C25°C–50°C
HSMP-3800 100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (mA)
Figure 14. Forward Current vs.
Forward Voltage. HSMP-3810 and
HSMP-4810 Series.
HSMP-3810
HSMP-4810
125°C25°C–50°C
100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (mA)
Figure 15. Forward Current vs.
Forward Voltage. HSMP-3820 and
HSMP-4820 Series.
HSMP-382X
HSMP-482X
125°C25°C–50°C
100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (mA)
Figure 16. Forward Current vs.
Forward Voltage. HSMP-3830 Series.
HSMP-3830
125°C 25°C–50°C
100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD CURRENT (mA)
Figure 17. Forward Current vs.
Forward Voltage. HSMP-3880 Series.
125°C25°C–55°C
100
10
1
0.1
0.010 0.2 0.4 0.6 0.8 1.0 1.2
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (mA)
Figure 18. Forward Current vs.
Forward Voltage. HSMP-3890 and
HSMP-4890 Series.
25°C
125°C–55°C
6
Typical Parameters (continued)
Figure 19. Typical RF Resistance vs.
Forward Bias Current for HSMP-3860. Figure 20. Forward Current vs.
Forward Voltage for HSMP-3860. Figure 21. Typical Capacitance vs.
Reverse Bias for HSMP-3860.
0.01 100
1000
110
RESISTANCE (OHMS)
BIAS CURRENT (mA)
10
100
10.1 0 1.2
100
0.01 1.0
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (V)
1
10
0.60.2 0.4 0.8
0.1
020
0.5
015
C
T
– CAPACITANCE (pF)
V
R
– REVERSE VOLTAGE (V)
0.2
0.4
105
0.1
0.3
T
A
= +125°C
T
A
= +25°C
T
A
= –50°C
T
A
= +85°C
T
A
= +25°C
T
A
= –55°C
0.12 pF*
* Measured at -20 V
1.5 Ω
R
j
R
s
L
p
C
p
0.08 pF
C
j
2.0 nH
R
j
= 12 Ω
I
0.9
R
T
= 1.5 + R
j
C
T
= C
P
+ C
j
I
= Forward Bias Current in mA
Equivalent Circuit Model
HSMS-3860
7
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1
BIAS 1 BIAS BIAS
RF 2
BIAS 2
Figure 22. Simple SPDT Switch, Using Only Positive Current.
RF COMMON
RF 1 RF 2
BIAS
Figure 24. Switch Using Both Positive and Negative Bias
Current. Figure 25. Very High Isolation SPDT Switch, Dual Bias.
Figure 23. High Isolation SPDT Switch, Dual Bias.
RF 2
RF 1
RF COMMON
RF 2
RF 1
BIAS
8
Typical Applications for Multiple Diode Products (continued)
INPUT RF IN/OUT
Figure 26. Four Diode π Attenuator.
Figure 27. High Isolation SPST Switch
(Repeat Cells as Required).
FIXED
BIAS
VOLTAGE
VARIABLE BIAS
BIAS
Figure 28. Power Limiter Using HSMP-3822
Diode Pair.
9
Typical Applications for HSMP-48XX Low Inductance Series
12 12
3
12
3
Figure 29. Internal Connections.
HSMP-4820 & HSMP-4890HSMP-4810
3
0.5 nH 0.5 nH
0.3 pF*
0.5nH
*0.8pF TYPICAL FOR HSMP-3820
Figure 30. Equivalent Circuit.
*0.8 pF TYPICAL FOR HSMP-3820
Figure 32. Equivalent Circuit.
Figure 31. Circuit Layout.
0.25 nH 0.5 nH
0.3 pF*
Microstrip Series
Connection for HSMP-48XX Series
In order to take full advantage
of the low inductance of the
HSMP-48XX series when using
them in series application,
both lead 1 and lead 2 should be
connected together, as shown above.
10
Microstrip Shunt
Connections for
HSMP-48XX Series
In the diagram above, the
center conductor of the
microstrip line is interrupted
and leads 1 and 2 of the
HSMP-38XX series diode are
placed across the resulting gap.
This forces the 0.5 nH lead
inductance of leads 1 and 2 to
appear as part of a low pass
filter, reducing the shunt
parasitic inductance and
increasing the maximum
available attenuation. The 0.3 nH
of shunt inductance external
to the diode is created by the via
holes, and is a good estimate for
0.032" thick material.
Co-Planar Waveguide
Shunt Connection for
HSMP-48XX Series
Co-Planar waveguide, with
ground on the top side of the
printed circuit board, is shown
in the diagram above. Since it
eliminates the need for via holes
to ground, it offers lower shunt
parasitic inductance and higher
maximum attenuation when
compared to a microstrip circuit.
50 OHM MICROSTRIP LINES
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
0.3 nH
0.3 nH
0.3 pF*
1.5 nH 1.5 nH
*0.8 pF TYPICAL FOR HSMP-4820
Figure 34. Equivalent Circuit.Figure 33. Circuit Layout.
*0.8 pF TYPICAL FOR HSMP-4820
Figure 36. Equivalent Circuit.Figure 35. Circuit Layout.
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane
0.3 pF*
0.75 nH
11
Package Dimensions
Outline 23 (SOT-23) PC Board Footprints
SOT-23
0.037
0.95
0.037
0.95
0.079
2.0
0.031
0.8
DIMENSIONS IN inches
mm
0.035
0.9
Package Characteristics
Lead Material......................................................................................Alloy 42
Lead Finish............................................................................Tin-Lead 85-15%
Maximum Soldering Temperature.............................. 260°C for 5 seconds
Minimum Lead Strength.......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance ..............................0.08 pF (opposite leads)
SOT-143
DIMENSIONS IN
inches
mm
0.075
1.9 0.071
1.8
0.112
2.85
0.079
20.033
0.85
0.041
1.05 0.108
2.75
0.033
0.85
0.047
1.2 0.031
0.8 0.033
0.85
Outline 143 (SOT-143)
3
12
SIDE VIEW
TOP VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
1.02 (0.040)
0.89 (0.035)
0.50 (0.024)
0.45 (0.018)
1.40 (0.055)
1.20 (0.047) 2.65 (0.104)
2.10 (0.083)
3.06 (0.120)
2.80 (0.110)
2.04 (0.080)
1.78 (0.070)
1.02 (0.041)
0.85 (0.033)
0.152 (0.006)
0.066 (0.003)
0.10 (0.004)
0.013 (0.0005) 0.69 (0.027)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
X X X
PACKAGE
MARKING
CODE (XX)
DATE CODE (X)
0.69 (0.027)
0.45 (0.018)
1.40 (0.055)
1.20 (0.047) 2.65 (0.104)
2.10 (0.083)
0.60 (0.024)
0.45 (0.018) 0.54 (0.021)
0.37 (0.015)
0.10 (0.004)
0.013 (0.0005)
1.04 (0.041)
0.85 (0.033)
0.92 (0.036)
0.78 (0.031)
2.04 (0.080)
1.78 (0.070)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.15 (0.006)
0.09 (0.003)
3.06 (0.120)
2.80 (0.110)
PACKAGE
MARKING
CODE (XX)
BE
CE
X X X
DATE CODE (X)
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales
office, distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1999 Hewlett-Packard Co.
Obsoletes 5968-3435E 5968-5439E (6/99)
Profile Option Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel, Device Orientation; See Figures 37 and 38
-TR2 = 10K pc. Tape and Reel, Device Orientation; See Figures 37 and 38
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
Ordering Information
Specify part number followed by option under. For example:
HSMP - 38XX - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount PIN Diode
Hewlett-Packard
USER
FEED
DIRECTION COVER TAPE
CARRIER
TAPE
REEL
END VIEW
8 mm
4 mm
TOP VIEW
Figure 37. Options -TR1, -TR2 for SOT-23 Packages.
Figure 38. Options -TR1, -TR2 for SOT-143 Packages.
END VIEW
8 mm
4 mm
TOP VIEW
