
Jersey City, NJ 07302 USA
Environmental Specifications
IR Reflow Profile (IPC/JEDEC J
free Wave Soldering Profile
Heating rate during preheat
Final preheat temperature
202G, Method 213B, Test Condition 1
(100 G's peak for 6 milliseconds; Sawtooth
202G, Method 101E, Test Condition B
202G, Method 302, Test Condition A
(After Opening) 10,000 ohms minimum.
Resistance to solder Heat
202G, Method 210F, Test Condition C.
202G, Method 107G, Test Condition B
Moisture Sensitivity Level
202 Method 103, 85C/85% RH with
10% operating power for 1000 hrs.
202 Method 108, Test Condition D
202 Method 213,Test Condition C
202 Method 210,Test condition B
Electrical characterization
cifications subject to change without notice