INTEGRATED CIRCUITS DATA SHEET TDA8551 1 W BTL audio amplifier with digital volume control Product specification Supersedes data of 1997 May 07 1998 Feb 23 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 FEATURES GENERAL DESCRIPTION * One pin digital volume control The TDA8551; TDA8551T is a one channel 1 W Bridge-Tied Load (BTL) audio power amplifier capable of delivering 1 W output power to an 8 load at THD = 10% using a 5 V power supply. The circuit contains a BTL power amplifier, a digital volume control and standby/mute logic. The TDA8551T comes in an 8 pin SO package and the TDA8551 in a 8 pin DIP package. * Volume setting with UP/DOWN pulses * Flexibility in use * Few external components * Low saturation voltage of output stage * Standby mode controlled by CMOS compatible levels * Low standby current APPLICATIONS * No switch-on/switch-off plops * Portable consumer products * High supply voltage ripple rejection * Personal computers * Protected against electrostatic discharge * Telephony. * Outputs short circuit safe to ground, VP and across the load * Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage Iq quiescent current Istb standby current Po output power Gv voltage gain nvol number of volume steps THD total harmonic distortion SVRR supply voltage ripple rejection CONDITIONS MIN. TYP. MAX. UNIT 2.7 5 5.5 V VP = 5 V - 6 10 mA - - 10 A THD = 10%; RL = 8 ; VP = 5 V 1 1.4 - W -60 - +20 dB - 64 - - 0.15 - % 48 - - dB Po = 0.5 W ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA8551T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 1998 Feb 23 2 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 BLOCK DIAGRAM VP handbook, full pagewidth 6 UP/DOWN 1 INTERFACE up down TDA8551 UP/DOWN COUNTER MASTER IN 4 VOLUME CONTROL 8 OUT+ VP 20 k 15 k SVR 5 k R 3 R STANDBY/ MUTE/ OPERATING 15 k 7 2 5 OUT- SLAVE MGK363 MODE GND Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION UP/DOWN 1 digital trinary input for volume control MODE 2 digital trinary input for mode selection (standby, mute, operating) SVR 3 half supply voltage, decoupling ripple rejection IN 4 audio input OUT- 5 negative loudspeaker output terminal VP 6 supply voltage GND 7 ground OUT+ 8 positive loudspeaker output terminal 1998 Feb 23 handbook, halfpage UP/DOWN 1 8 OUT+ MODE 2 7 GND TDA8551 SVR 3 6 VP IN 4 5 OUT- MGK362 Fig.2 Pin configuration. 3 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control FUNCTIONAL DESCRIPTION Each pulse on the UP/DOWN pin results in a change in gain of 80/64 = 1.25 dB (typical value). In the basic application the UP/DOWN pin is switched to ground or VP by a double push-button. When the supply voltage is initially connected, after a complete removal of the supply, the initial state of the volume control is an attenuation of 40 dB (low volume), so the gain of the total amplifier is -20 dB. After powering-up, some positive pulses have to be applied to the UP/DOWN pin for turning up to listening volume. When the device is switched with the MODE select pin to the mute or the standby condition, the volume control attenuation setting remains on its value, assumed that the voltage on pin VP does not fall below the minimum supply voltage. After switching the device back to the operation mode, the previous volume setting is maintained. The TDA8551; TDA8551T is a 1 W BTL audio power amplifier capable of delivering 1 W output power to an 8 load at THD = 10% using a 5 V power supply. The gain of the amplifier can be set by the digital volume control. In the maximum volume setting the gain is 20 dB. Using the MODE pin the device can be switched to the standby condition, the mute condition and the normal operating condition. The device is protected by an internal thermal shutdown protection mechanism. Power amplifier The power amplifier is a Bridge Tied Load (BTL) amplifier with a complementary CMOS output stage. The total voltage loss for both output power MOS transistors is within 1 V and with a 5 V supply and an 8 loudspeaker an output power of 1 W can be delivered. The total gain of this power amplifier is internally fixed at 20 dB. Mode select pin The device is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is between VP and VP - 0.5 V. At a mode select voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1 V and VP - 1.4 V the amplifier is in the mute condition. The mute condition is useful for using it as a `fast mute'; in this mode output signal is suppressed, while the volume setting remains at its value. It is advised to keep the device in the mute condition while the input capacitor is being charged. This can be done by holding the MODE pin at a level of 0.5VP, or by waiting approximately 100 ms before giving the first volume-UP pulses. Volume control The volume control operates as a digital controlled attenuator between the audio input pin and the power amplifier. In the maximum volume control setting the attenuation is 0 dB and in the minimum volume control setting the typical attenuation is 80 dB. The attenuation can be set in 64 steps by the UP/DOWN pin. This UP/DOWN pin is a trinary input: * Floating UP/DOWN pin: volume remains unchanged * Negative pulses: setting volume towards minimum * Positive pulses: setting volume towards maximum. 1998 Feb 23 TDA8551 4 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage -0.3 +5.5 V VI input voltage -0.3 VP + 0.3 V IORM repetitive peak output current - 1 A Tstg storage temperature -55 +150 C Tamb operating temperature -40 +85 C Vsc AC and DC short-circuit safe voltage - 5.5 V Ptot maximum power dissipation SO8 - 0.8 W DIP8 - 1.2 W QUALITY SPECIFICATION Quality according to "SNW-FQ-611 part E", if this type is used as an audio amplifier. Quality specifications are listed in the "Quality reference handbook", order number 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL Rth j-a 1998 Feb 23 PARAMETER CONDITIONS VALUE UNIT SO8 160 K/W DIP8 100 K/W thermal resistance from junction to ambient in free air 5 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 CHARACTERISTICS VP = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; total gain setting at +7 dB (unless otherwise specified); measured in test circuit of Fig.4. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT DC characteristics VP supply voltage 2.7 5 5.5 V Iq quiescent current RL = ; note 1 - 6 10 mA Istb standby current VMODE = VP - - 10 A VO DC output voltage note 2 - 2.5 - V VOUT+ - VOUT- differential output offset - - 50 mV VP - 0.5 - VP V Mode select pin VMODE input voltage standby mode mute mode 1 - VP - 1.4 V operating mode 0 - 0.5 V IMODE input current 0 < VMODE < VP - - 100 nA mute attenuation note 3 80 90 - dB 100 - - ns Volume control trep pulse repetition time Vth(UP) UP/DOWN pin up threshold level 4.2 - VP V Vfloat(max) UP/DOWN pin floating high level - - 3.4 V Vfloat(min) UP/DOWN pin floating low level 1.0 - - V Vth(DOWN) UP/DOWN pin down threshold level 0 - 0.6 V IUP/DOWN input current UP/DOWN pin - - 200 A Gv(max) maximum voltage gain (including power amplifier) 19 20 21 dB Gv(min) minimum voltage gain (including power amplifier) -62 -60 -58 dB nvol number of volume steps - 64 - Gv voltage gain variation per step - 1.25 - Zi input impedance 14 20 - k Vi(rms)(max) maximum input voltage (RMS value) - - 2.0 V 0 < VUP/DOWN < VP dB AC characteristics (f = 1 kHz) Po THD output power total harmonic distortion THD = 10% 1 1.4 - W THD = 0.5% 0.6 1.0 - W Po = 0.5 W; note 4 - 0.15 0.5 % Vn(o) noise output voltage note 5 - 60 100 V SVRR supply voltage ripple rejection note 6 48 53 - dB Vi(IN)(max) maximum input voltage on pin IN THD = 1%; Gv = -50 dB to 0 dB - - 2.0 V 1998 Feb 23 6 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 Notes to the Characteristics 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. 2. The DC output voltage with respect to ground is approximately 0.5VP. 3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz. 4. Total gain setting at +20 dB. 5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input source impedance Rsource = 0 . 6. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail. handbook, full pagewidth tr trep tw VP increasing volume Vth(UP) Vfloat(max) floating VUP/DOWN Vfloat(min) Vth(DOWN) 0 decreasing volume t tr trep tw MGK365 The rise time (tr) and the width of the pulse (tw) are not critical. Fig.3 Timing UP/DOWN pin. 1998 Feb 23 7 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 TEST AND APPLICATION INFORMATION VP handbook, full pagewidth UP R1 volume control 2.2 k DOWN C5 C1 100 nF IN 4 330 nF UP/DOWN VP 1 6 C3 100 nF MASTER VOLUME CONTROL C4 220 F VP = 5 V 8 OUT+ VP 20 k Vi TDA8551 15 k 5 k R SVR 3 8 R C2 100 F VP standby STANDBY/ MUTE/ OPERATING 15 k 2 7 MODE GND 5 OUT- SLAVE mute operating MGM560 Fig.4 Test and application circuit. The measured thermal resistance of the IC package is highly dependent on the configuration and size of the application board. Data may not be comparable between different semiconductor manufacturers because the application boards and test methods are not standardized yet. In addition, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area) may be different. NXP Semiconductors uses FR-4 type application boards with 1 oz. copper traces with solder coating. The measurements have been carried out with vertical placed boards. Reduction of the value of capacitor C2 results in a decrease of the SVRR performance at low frequencies (see Fig.9). The UP/DOWN pin can be driven by a 3-state logic output stage (microcontroller) without extra external components. If the UP/DOWN pin is driven by push-buttons, then it is advised to have an RC filter between the buttons and the UP/DOWN pin. Advised values for the RC filter are 2.2 k and 100 nF. The volume control circuit responds to the trailing edge of the pulse on the volume pin; connecting to VP results in a one step (1.25 dB) higher gain; connecting to ground results in a one step lower gain. To avoid audible plops while switching the supply voltage on and off pin MODE has to be connected to VP (standby condition) during charge or discharge of the input and SVRR capacitors. 1998 Feb 23 8 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control When a practical PCB layout is used with wider copper tracks and some extra copper added both to the IC pin connections and underneath the IC, the thermal resistance from junction to ambient can be reduced. Without these measures Rth j-a = 160 K/W for the SO8 package; see Chapter "Thermal characteristics". The power dissipation can be calculated as follows: T amb P = ------------R th j-a TDA8551 MGM554 10 handbook, halfpage IP (mA) 8 For a maximum ambient temperature of 50 C, VP = 5 V and RL = 8 this results in a worst case sine wave dissipation of 0.63 W. 6 4 Figures 5 to 15 represent test results obtained while using the test circuit given in Fig.4. The following test conditions apply: Tamb = 25 C; VP = 5 V; f = 1 kHz; RL = 8 ; Gv = 20 dB; audio bandwidth from 22 Hz to 22 kHz (except for Figs 8 and 9); unless otherwise specified. 2 0 0 Fig.5 MGM551 10 2 4 VP (V) 6 Supply current as a function of supply voltage. MGM552 10 handbook, halfpage handbook, halfpage THD (%) THD (%) (1) 1 1 (1) (2) (2) 10-1 (3) 10-1 (3) 10-2 10-2 10-1 1 Po (W) 10-2 10-2 10 Po (W) 10 (3) Gv = 20 dB. Total harmonic distortion as a function of output power at different frequencies. 1998 Feb 23 1 f = 1 kHz. (1) Gv = 0 dB. (2) Gv = 7 dB. (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz. Fig.6 10-1 Fig.7 9 Total harmonic distortion as a function of output power at different gains. NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 MGM550 10 MGM549 0 handbook, halfpage handbook, halfpage SVRR (dB) THD (%) (1) -20 1 (2) (1) 10-1 (3) -40 (2) (4) (3) (5) (6) 10-2 102 10 103 Po = 0.1 W. (1) Gv = 0 dB. Fig.8 -60 10 104 f (Hz) 105 103 Vripple = 100 mV. Rsource = 0 . (1) C2 = 10 F; Gv = 20 dB. (2) C2 = 10 F; Gv = 7 dB. (2) Gv = 7 dB. (3) Gv = 20 dB. Total harmonic distortion as a function of frequency at different gains. Fig.9 MGM559 2.4 102 104 f (Hz) 105 (3) C2 = 100 F; Gv = 20 dB. (4) C2 = 10 F; Gv = -10 dB. (5) C2 = 100 F; Gv = 7 dB. (6) C2 = 100 F; Gv = -10 dB. Supply voltage ripple rejection as a function of frequency. MGM555 1 handbook, halfpage handbook, halfpage Vo (V) Vi (V) 2.0 10-1 1.6 10-2 1.2 10-3 0.8 10-4 0.4 0 -60 -40 -20 0 Gv (dB) 10-5 20 0 1 2 (2) 3 4 VMODE 5 (1) VP = 3 V. (2) VP = 5 V. THD = 1 %. Fig.10 Input voltage as a function of voltage gain. 1998 Feb 23 (1) Fig.11 Output voltage as a function of mode select input voltage at different supply voltages. 10 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 MGM553 20 Gv MGM558 3 handbook, halfpage handbook, halfpage (dB) Po (W) 0 2 -20 (1) -40 (2) 1 -60 -80 0 0 20 40 60 nvol 80 0 2 4 6 Po(max) is limited by Ptot and a maximum available repetitive peak output current of 1 A. THD = 10 %. (1) RL = 4 . (2) RL = 8 . Fig.12 Volume gain as a function of volume steps. VP (V) Fig.13 Output power as a function of supply voltage. MGM556 1.5 MGM557 1.5 handbook, halfpage handbook, halfpage P (W) P (W) (1) (1) 1 1 (2) (2) 0.5 (3) 0.5 (4) (3) (5) 0 0 2 4 VP (V) 0 6 0 0.4 0.8 1.2 1.6 2.0 Po (W) (1) RL = 4 . (2) RL = 8 . (3) RL = 16 . (1) VP = 5 V; RL = 4 . (2) VP = 5 V; RL = 8 . (3) VP = 3.3 V; RL = 4 . Fig.14 Power dissipation as a function of supply voltage. Fig.15 Power dissipation as a function of output power. 1998 Feb 23 11 (4) VP = 5 V; RL = 16 . (5) VP = 3.3 V; RL = 8 . NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 51.2 handbook, full pagewidth 51.1 top view bottom view +VP VOLUME CONTROL DOWN UP S1 S2 GND C4 C3 R1 C5 1 8 C2 OUT+ TDA8551 OUT- Vi C1 TDA 8551 AUDIO POWER CIC NIJMEGEN J1 stand-by mute operating MGM561 Dimensions in mm. Fig.16 Layout of printed-circuit board. 1998 Feb 23 12 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 1998 Feb 23 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 13 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 1998 Feb 23 14 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control SOLDERING Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE * The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Feb 23 TDA8551 15 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control TDA8551 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 1998 Feb 23 16 NXP Semiconductors Product specification 1 W BTL audio amplifier with digital volume control Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 1998 Feb 23 TDA8551 17 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/25/02/pp18 Date of release: 1998 Feb 23 Document order number: 9397 750 03173