TDA8551T/N1,112 - NXP - Datasheet.Wiki

DATA SH EET

Product specification

Supersedes data of 1997 May 07 1998 Feb 23

INTEGRATED CIRCUITS

TDA8551

1 W BTL audio amplifier with digital

volume control

1998 Feb 23 2

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

FEATURES

•One pin digital volume contro l

•Volume setting with UP/DOWN pulses

•Flexibility in use

•Few external components

•Low saturation voltage of output stage

•Standby mode controlled by CMOS compatible levels

•Low standby current

•No switch-on/switch-off plops

•High supply voltage ripple rejection

•Protected against electrostatic discharge

•Outputs short circuit safe to ground, VP and across the

load

•Thermally protected.

GENERAL DESCRIPTION

The TDA8551; TDA8551T is a one channel 1 W

Bridge-Tied Lo ad (BTL) audio power amplifier capable of

delivering 1 W output power to an 8 Ω load at THD = 10%

using a 5 V power supply. The circuit contains a BTL

power amplifier, a digital volume control and standby/mute

logic. The TDA85 51 T co mes in an 8 pin SO package and

the TDA8551 in a 8 pin DIP package.

APPLICATIONS

•Portable consumer prod ucts

•Personal computers

•Telephony.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage 2.7 5 5.5 V

Iqquiescent current VP=5V −610mA

Istb standby current −−10 μA

Pooutput power THD = 10 %; RL=8Ω; VP=5V 1 1.4 −W

Gvvoltage gain −60 −+20 dB

nvol number of volume steps −64 −

THD total harmonic distortion Po=0.5W −0.15 −%

SVRR supply voltage ripple rejection 48 −−dB

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8551T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Feb 23 3

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGK363

20 kΩ

TDA8551

5 kΩ

15 kΩ

STANDBY/

MUTE/

OPERATING

VOLUME

CONTROL

UP/DOWN

COUNTER

INTERFACE

downup

SLAVE

MASTER

OUT+

GND

MODE

OUT−

SVR

UP/DOWN

PINNING

SYMBOL PIN DESCRIPTION

UP/DOWN 1 digital trinary input for volume

control

MODE 2 digital trinary input for mode

selection (st andb y, mute, oper ating)

SVR 3 half supply voltage, decoupling

ripple rejection

IN 4 audio input

OUT−5 negative loudspeaker output

terminal

VP6 supply voltage

GND 7 ground

OUT+ 8 positive loudspeaker output

terminal Fig.2 Pin configuration.

handbook, halfpage 1

MGK362

TDA8551

OUT+

GNDMODE

OUT−

SVR

UP/DOWN

1998 Feb 23 4

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

FUNCTIONAL DESCRIPTION

The TDA8551; TDA8551T is a 1 W BTL audio power

amplifier capable of delivering 1 W output power to an 8 Ω

load at THD = 10% using a 5 V power supply. The gain of

the amplifier can be set by the digital volume control. In the

maximum volume setting the gain is 20 dB. Using the

MODE pin the device can be switched to the standby

condition, the mute con dition and the normal operating

condition. The device is protected by an internal thermal

shutdown protec tion mechanism.

Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier

with a complementary CMOS output stage. The total

voltage loss for both output power MOS transistors is

within 1 V and with a 5 V supply and an 8 Ω loudspeaker

an output power of 1 W can be delivered. The total gain of

this power amplifier is internally fixed at 20 dB.

Volume control

The volume control operates as a digital controlled

attenuator betwee n the audio input pin and the power

amplifier. In the maximum volume control setting the

attenuation is 0 dB and in the minimum v olume control

setting the typical attenuation is 80 dB. The attenuation

can be set in 64 steps by the UP/DOWN pin.

This UP/DOWN pin is a trinary input:

•Floating UP/DOWN pin: volume remains unchanged

•Negative pulses: setting volume towards minimum

•Positive pulses: setting volume towards maximum.

Each pulse on the UP/DOWN pin results in a change in

gain of 80/64 = 1.25 dB (typical value). In the basic

application the UP/DOWN pin is switched to ground or VP

by a double push-button. When the supply voltag e is

initially connected, after a complete removal of the supply,

the initial state of the volume c ontrol is an attenuation of

40 dB (low volume), so the gain of the total amplifier is

−20 d B . After powering-up, some positive pulses have to

be applied to th e UP/D OWN p in f or tur ning up to li ste ning

volume. When the device is switched with the MODE

select pin to the mute or the standby co ndition, the volume

control attenuation setting rema in s on its value , ass ume d

that the voltage on pin VP does not fall below the minimum

supply voltage. Afte r switching the device ba ck to the

operation mode, the previous volume setting is

maintained.

Mode select pin

The device is in the standby mode (with a very low current

consumption) if the voltage at the MODE pin is between VP

and VP−0.5 V. At a mode select voltage level of less than

0.5 V the amplifier is fully operational. In the range

between 1 V and VP−1.4 V the amplifier is in the mute

condition. The mute condition is useful for using it as a ‘fast

mute’; in this mode output signal is suppressed, while the

volume setting remains at its value. It is advised to keep

the device in the mute co ndition while the input capacitor

is being charged. This can be done by holding the MODE

pin at a level of 0.5VP, or by waiting approximately 100 ms

before giving the first volume-UP pulses.

1998 Feb 23 5

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

LIMITING VALUES

In accordance with th e Absolute Ma ximum Ratin g System (IEC 1 34).

QUALITY SPECIFICATION

Quality according to “SNW-FQ-611 part E”, if this type is used as an audio amplifier. Quality specifications are listed in

the “Quality refe rence handbook”, order number 9397 750 00192.

THERMAL CHARACTE RISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage −0.3 +5.5 V

VIinput voltage −0.3 VP+0.3 V

IORM repetitive peak output current −1A

Tstg storage temperature −55 +150 °C

Tamb operating temperature −40 +85 °C

Vsc AC and DC short-circuit safe voltage −5.5 V

Ptot maximum power dissipation SO8 −0.8 W

DIP8 −1.2 W

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

SO8 160 K/W

DIP8 100 K/W

1998 Feb 23 6

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

CHARACTERISTICS

VP=5V; T

amb =25°C; RL=8Ω; VMODE = 0 V; total gain setting at +7 dB (unles s otherwise specified); measur ed in

test circuit of Fig.4.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DC characteristics

VPsupply voltage 2.7 5 5.5 V

Iqquiescent current RL=∞; note 1 −610 mA

Istb standby current VMODE =V

P−−10 μA

VODC output voltage note 2 −2.5 −V

⎪VOUT+ −VOUT−⎪differential output offset −−50 mV

Mode select pin

VMODE input voltage standby mode VP−0.5 −VPV

mute mode 1 −VP−1.4 V

operating mode 0 −0.5 V

IMODE input current 0 < VMODE <V

P−−100 nA

αmute attenuation note 3 80 90 −dB

Volume control

trep pulse repetition time 100 −− ns

Vth(UP) UP/DOWN pin up threshold level 4.2 −VPV

Vfloat(max) UP/DOWN pin floating high level −−3.4 V

Vfloat(min) UP/DOWN pin floating low level 1.0 −− V

Vth(DOWN) UP/DOWN pin down threshold level 0 −0.6 V

IUP/DOWN input current UP/DOWN pin 0 < VUP/DOWN <V

P−−200 μA

Gv(max) maximum voltage gain (including

power amplifier) 19 20 21 dB

Gv(min) minimum voltage gain (including

power amplifier) −62 −60 −58 dB

nvol number of volume steps −64 −

ΔGvvoltage gain variation per step −1.25 −dB

Ziinput impedance 14 20 −kΩ

Vi(rms)(max) maximum input voltage (RMS value) −−2.0 V

AC characteristics (f = 1 kHz)

Pooutput power THD = 1 0% 1 1.4 −W

THD = 0.5% 0.6 1.0 −W

THD total harmonic distortion Po= 0.5 W; note 4 −0.15 0.5 %

Vn(o) noise output voltage note 5 −60 100 μV

SVRR supply voltage ripple rejection note 6 48 53 −dB

Vi(IN)(max) maximum input voltage on pin IN THD = 1%;

Gv=−50 dB

to0dB

−−2.0 V

1998 Feb 23 7

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

Notes to the Characteristics

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by RL.

2. The DC output vo ltage with respect to ground is approximate l y 0.5VP.

3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a ban dwidth of 20 kHz.

4. Total gain settin g at +20 dB.

5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input

source impedance R source =0Ω.

6. Supply voltage ripp le rejection is measured at th e output, with a source impedance of Rsource =0Ω at the input.

The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive

supply rail.

Fig.3 Timing UP/DOWN pin.

The rise time (tr) and the width of the pulse (tw) are not cr itical.

handbook, full pagewidth

MGK365

VUP/DOWN

Vth(UP)

Vth(DOWN)

Vfloat(max)

Vfloat(min)

increasing volume

decreasing volume

floating

trep

ttw

trep

1998 Feb 23 8

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

TEST AND APPLICATION INFORMATION

Fig.4 Test and applicatio n c i rc uit.

handbook, full pagewidth

MGM560

20 kΩ

TDA8551 5 kΩ

8 Ω

15 kΩ

100

μF

220

μF

330 nF

C5 100 nF

100

2.2 kΩ

STANDBY/

MUTE/

OPERATING

VOLUME

CONTROL

operating

standby

mute

DOWN

volume

control

VPVP = 5 V

SLAVE

MASTER

OUT+

GND

MODE

OUT−

SVR

UP/DOWN

Reduction of the value of capacitor C2 results in a

decrease of the SVRR performance at low frequencies

(see Fig.9).

The UP/DOWN pin can be driven by a 3-state logic output

stage (microcontroller) without extra external components.

If the UP/DOWN pin is driven by push-buttons, then it is

advised to have an RC filte r between the buttons and the

UP/DOWN pin. Advised values fo r the RC filter are 2.2 kΩ

and 100 nF.

The volume control circuit responds to the trailing edge of

the pulse on the volume pin; connecting to VP results in a

one step (1.25 dB) high er gain; connecting to gr ound

results in a one step lower gain.

To avoid audible plops while switching the supply voltage

on and off pin MODE has to be connected to VP (standby

condition) during charge or discharge of the input and

SVRR capacitors.

The measured thermal resistance of the IC package is

highly depende nt on the configuration and size of the

application board. Data may not be comparable between

different semiconductor manufacturers because the

application boards and test me thods are not st andardized

yet. In addition, the thermal performance of packages for a

specific application may be different than presented here,

because the configuration of the application boards

(copper area) may be different. NXP Semiconductors uses

FR-4 type application boards with 1 oz. copper traces with

solder coating . The measur ements ha ve been carr ied out

with vertical placed bo ar ds.

1998 Feb 23 9

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

When a practical PCB layout is used with wider copper

tracks and some extra copper added both to the IC pin

connections and underneath the IC, the thermal resistance

from junction to ambient can be reduced. Without these

measures Rth j-a = 160 K/W for the SO8 package; see

Chapter “Ther m al characteristic s”. The power dissipatio n

can be calculated as follows:

For a maximum ambient temperature of 50 °C, VP=5V

and RL=8Ω this results in a worst case sin e wave

dissipatio n of 0.63 W.

Figures 5 to 15 represent test results obtained while using

the test circuit given in Fig.4. The following test conditions

apply: Tamb =25°C; VP=5V; f=1kHz; R

L=8Ω;

Gv= 20 dB; audio b an dwidth from 22 Hz to 22 kHz

(except for Fig s 8 and 9); un less otherwise specified.

PTamb

Rth j-a

--------------

Fig.5 Supply current as a function of supply

voltage.

handbook, halfpage

0246

MGM554

VP (V)

(mA)

Fig.6 Total harmonic distortion as a function of

output power at different frequencies.

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 Hz.

handbook, halfpage

−1

−2

MGM551

−2

−1

110

Po (W)

THD

(%)

(3)

(2)

(1)

Fig.7 Total harmonic distortion as a function of

output power at different gains.

f=1kHz.

(1) Gv=0dB.

(2) Gv=7dB.

(3) Gv=20dB.

handbook, halfpage

−1

−2

MGM552

−2

−1

110

(W)

THD

(%)

(1)

(2)

(3)

1998 Feb 23 10

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

Fig.8 Total harmonic distortion as a function of

frequency at different ga ins .

Po=0.1W.

(1) Gv=0dB. (2) Gv=7dB.

(3) Gv=20dB.

handbook, halfpage

10−1

10−2

MGM550

10 102103104105

(3)

(2)

(1)

f (Hz)

THD

(%)

Fig.9 Supply voltage ripple rejection as a function

of frequency.

(3) C2 = 100 μF; Gv=20dB.

(4) C2 = 10 μF; Gv=−10 dB.

(5) C2 = 100 μF; Gv=7dB.

(6) C2 = 100 μF; Gv=−10 dB.

Vripple =100mV.

Rsource =0Ω.

(1) C2 = 10 μF; Gv=20dB.

(2) C2 = 10 μF; Gv=7dB.

handbook, halfpage

−60

−40

−20

0MGM549

10 102103104105

f (Hz)

SVRR

(dB) (1)

(2)

(3)

(4)

(5)

(6)

Fig.10 Input voltage as a function of voltage gain.

THD = 1 %.

handbook, halfpage

−60 0−20 20

2.4

0.8

1.6

2.0

0.4

1.2

MGM559

Gv (dB)

(V)

−40

Fig.11 Output voltage as a function of mode select

input voltage at different supply volta ge s.

(1) VP=3V.

(2) VP=5V.

handbook, halfpage

513240

10−1

10−2

10−3

10−4

10−5

MGM555

VMODE

(V)

(1) (2)

1998 Feb 23 11

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

Fig.14 Power diss ipation as a function of supply

voltage.

(1) RL=4Ω.

(2) RL=8Ω.

(3) RL=16Ω.

handbook, halfpage

002 6

1.5

0.5

MGM556

(W)

VP (V)

(1)

(2)

(3)

Fig.15 Power diss ipation as a function of output

power.

(1) VP=5V; R

L=4Ω.

(2) VP=5V; R

L=8Ω.

(3) VP= 3.3 V; RL=4Ω.

(4) VP=5V; R

L=16Ω.

(5) VP= 3.3 V; RL=8Ω.

handbook, halfpage

0 2.0

1.5

0.5

0.4 0.8 1.2 1.6

MGM557

(W)

Po (W)

(5)

(4)

(3)

(2)

(1)

Fig.12 Volume gain as a function of volume steps .

handbook, halfpage

02040 80

nvol

(dB)

−80

−20

−40

−60

MGM553

Fig.13 Outp ut power as a functio n of supply

voltage.

THD = 10 %.

(1) RL=4Ω.

(2) RL=8Ω.

handbook, halfpage

0264

MGM558

(W)

VP (V)

(1)

(2)

Po(max) is limited by Ptot and a

maximum available repetitive

peak output current of 1 A.

1998 Feb 23 12

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

Fig.16 Layout of printed-circuit board.

Dimensions in mm.

handbook, full pagewidth

bottom viewtop view

MGM561

OUT−

OUT+

+VPGND

51.2

51.1

UPDOWN

VOLUME

CONTROL

S1 S2

stand-by operating

mute

TDA

8551

AUDIO POWER

CIC NIJMEGEN

TDA8551

1998 Feb 23 13

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

1998 Feb 23 14

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

1998 Feb 23 15

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order code 93 98 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic bod y mus t not ex ceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature with in the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperature s range from

215to250°C.

Preheating is necessary to dry the paste and evap orate

the binding agent. Preheating duration: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

techniqu e sh ould be used.

•The longitudinal ax is of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive c an be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temp erature is 260 °C, and

maximum duration of pack age immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 sec onds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first so ldering two diagonally -

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limit ed to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operatio n wi th in 2 to 5 seconds between

270 and 320 °C.

1998 Feb 23 16

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

DATA SHEET STATUS

Notes

1. Please consult the most rec en tly issued document before initiating or completing a design.

2. The product s tatus of device(s) described in this document may ha ve changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This doc ument contains data from the objective specificatio n for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and re liable.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or cons equential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towa rds customer for

the products described herein shall be limited in

accordance with the Terms and conditions of comme rcial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reas onably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equipment or

application s and therefore such inc l us ion and/or use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of custo m er’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications an d products.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors produc ts in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

1998 Feb 23 17

NXP Semiconductors Product specification

1 W BTL audio amplifier with digital volume

control TDA8551

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold s ubject to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall app ly. NXP

Semiconductors hereby expressly objects to a pplying the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual proper ty rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export contro l

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive equipment or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive applications, use an d

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be so lely at

customer’s own ris k, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warran ty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document does not fo rm p ar t o f an y q uot ation or co ntract, is believed to be accurate a nd reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, exc ept for package outline

drawings which were updated to the latest version.

Printed in The Netherlands 545102/25/02/pp18 Date of release: 1998 Feb 23 Document order number: 9397 750 03173