IS25WP064A
Integrated Silicon Solution, Inc.- www.issi.com 5
Rev. A4
02/15/2018
8.21 PROGRAM/ERASE SUSPEND & RESUME ........................................................................................ 57
8.22 ENTER DEEP POWER DOWN (DP, B9h) ........................................................................................... 59
8.23 RELEASE DEEP POWER DOWN (RDPD, ABh) ................................................................................. 60
8.24 SET READ PARAMETERS OPERATION (SRPNV: 65h, SRPV: C0h/63h) ........................................ 61
8.25 SET EXTENDED READ PARAMETERS OPERATION (SERPNV: 85h, SERPV: 83h) ...................... 63
8.26 READ READ PARAMETERS OPERATION (RDRP, 61h) ................................................................... 64
8.27 READ EXTENDED READ PARAMETERS OPERATION (RDERP, 81h) ............................................ 65
8.28 CLEAR EXTENDED READ REGISTER OPERATION (CLERP, 82h) ................................................. 66
8.29 READ PRODUCT IDENTIFICATION (RDID, ABh) .............................................................................. 67
8.30 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh; RDJDIDQ, AFh) .. 69
8.31 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) .......................... 70
8.32 READ UNIQUE ID NUMBER (RDUID, 4Bh) ........................................................................................ 71
8.33 READ SFDP OPERATION (RDSFDP, 5Ah) ........................................................................................ 72
8.34 NO OPERATION (NOP, 00h) ............................................................................................................... 72
8.35 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h)) AND HARDWARE
RESET .......................................................................................................................................................... 73
8.36 SECURITY INFORMATION ROW ........................................................................................................ 74
8.37 INFORMATION ROW ERASE OPERATION (IRER, 64h) ................................................................... 75
8.38 INFORMATION ROW PROGRAM OPERATION (IRP, 62h) ............................................................... 76
8.39 INFORMATION ROW READ OPERATION (IRRD, 68h) ..................................................................... 77
8.40 FAST READ DTR MODE OPERATION In SPI MODE (FRDTR, 0Dh) ................................................ 78
8.41 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh) .................................................... 80
8.42 FAST READ QUAD IO DTR MODE OPERATION (FRQDTR, EDh) ................................................... 83
8.43 SECTOR LOCK/UNLOCK FUNCTIONS .............................................................................................. 87
8.44 AUTOBOOT .......................................................................................................................................... 89
9. ELECTRICAL CHARACTERISTICS ............................................................................................................. 93
9.1 ABSOLUTE MAXIMUM RATINGS (1) ..................................................................................................... 93
9.2 OPERATING RANGE ............................................................................................................................. 93
9.3 DC CHARACTERISTICS ........................................................................................................................ 94
9.4 AC MEASUREMENT CONDITIONS ...................................................................................................... 95
9.5 PIN CAPACITANCE (TA = 25°C, VCC=1.8V, 1MHz) ............................................................................ 95
9.6 AC CHARACTERISTICS ........................................................................................................................ 96
9.7 SERIAL INPUT/OUTPUT TIMING .......................................................................................................... 98
9.8 POWER-UP AND POWER-DOWN ...................................................................................................... 100
9.9 PROGRAM/ERASE PERFORMANCE ................................................................................................. 101
9.10 RELIABILITY CHARACTERISTICS ................................................................................................... 101
10. PACKAGE TYPE INFORMATION ......................................................................................................... 102
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (B) ............................ 102
10.2 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (K)...................................... 103
10.3 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 8x6mm (L) ...................................... 104