BFS17N
Document Number DS32160 Rev. 2 - 2 1 of 6
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BFS17N
NEW PRODUCT
NPN RF TRANSISTOR IN SOT-23
Features
• Lead, Halogen, and Antimony Free/RoHS Compliant (No te 1)
• "Green" Device (Note 2)
Applications
• RF Switch
Mechanical Data
• Case: SOT-23
• Case material: molded Plastic. “Green” molding Compound.
• UL Flammability Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish
• Weight: 0.008 grams (approximate)
Ordering Information (Note 3)
Product Case Reel size (inches) Tape width (mm) Quantity per reel
BFS17NTA SOT-23 7 8mm 3000
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
2. Diodes Inc.‘s “Green” Policy can be found on our website at http://www.diodes.com
3. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
E1N = Product type Marking Code
Top View Device symbol Top View
Pin Out
E1N
SOT-23
BFS17N
Document Number DS32160 Rev. 2 - 2 2 of 6
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BFS17N
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Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 20 V
Collector-Emitter Voltage VCEO 11 V
Emitter-Base Voltage VEBO 3 V
Continuous Collector Current IC 50 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation at TA = 25°C (Note 4) PD 330 mW
Thermal Resistance, Junction to Ambient (Note 4) @ TA = 25°C R
θ
JA 380 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Notes: 4. For a device surface mounted on 15mm X 15mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions
Thermal Characteristics and Derating information
100µ 1m 10m 100m 1 10 100 1k
0
50
100
150
200
250
300
350
Single Pulse
D=0.05
D=0.1
D=0.2
D=0.5
Transient Thermal Impedance
The rmal Re si stance (°C/W)
Pu lse Width (s) 0 20 40 60 80 100 120 140 160
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
Derating Cu rv e
Temperatu re (°C)
Max Po wer Dissip a t ion (W )
BFS17N
Document Number DS32160 Rev. 2 - 2 3 of 6
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Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage V
(
BR
)
CBO 20 − − V IC = 10µA
Collector-Emitter Breakdown Voltage (Note 5) V
(
BR
)
CEO 11 − − V IC = 1mA
Emitter-Base Breakdown Voltage V
(
BR
)
EBO 3 − − V IE = 10µA
Collector Cutoff Current ICBO − − 0.5 µA
VCB = 10V
Emitter Cutoff Current IEBO − − 0.5 µA
VEB = 2V
Static Forward Current Transfer Ratio (Note 5) hFE 56 − 180 − I
C = 5mA, VCE = 10V
Collector-Emitter Saturation Voltage (Note 5) VCE
(
sat
)
− − 0.5 V
IC = 25mA, IB = 5mA
Transition Frequency (Note 5) fT 1.4 3.2 − GHz IE = 25mA, VCE = 5V,
f = 500MHz
Collector Output Capacitance (Note 5) Cob − 0.8 1.5 pF
VCB = 10V, f = 1MHz
Notes: 5. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%
BFS17N
Document Number DS32160 Rev. 2 - 2 4 of 6
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Typical Characteristics
0.1 1 10 100
400
500
600
700
800
900
1000
1100
0.0 5.0 10.0 15.0 20.0 25.0 30.0
0
1
2
3
4
0 5 10 15 20
0.6
0.8
1.0
1.2
1.4
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
012345678910
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.1 1 10 100
0
50
100
150
200
T=-55°C
T=25°C
T=85°C
T=150°C VCE=5V
VBE(ON) (V)
IC Coll e cto r Current (mA)
VCE=10V
VCE=5V
VCE=2V
Tamb=25°C
f=500MHz
fT (MHz)
IC Coll ec tor Current (mA)
VCE=1V
Ta=25°C
f=1MHz
CCB Capacita nce (pF )
VCB Collector-Base Voltage (V)
Ta=25°C
f=1MHz
CEB Capacitance (pF)
VEB Emitte r- Ba se Volta g e (V)
Ten base steps
100μA per step
IC Coll ecto r Current (A)
VCE (V)
T=-55°C
T=25°C
T=85°C
T=150°C
VCE=5V
hFE Gain
I C Collec tor Current (mA)
BFS17N
Document Number DS32160 Rev. 2 - 2 5 of 6
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Package Outline Dimensions
Suggested Pad Layout
SOT-23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
α 0° 8° -
All Dimensions in mm
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C 2.0
E 1.35
A
M
JL
D
F
BC
H
K
G
K1
XE
Y
C
Z
BFS17N
Document Number DS32160 Rev. 2 - 2 6 of 6
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Cus tomer or user of this document or prod ucts described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the e xpress
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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