2004 Microchip Technology Inc. DS21376C-page 1
TC1265
Features
• Very Low Dropout Voltage
• 800 mA Output Current
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Overcurrent and Overtemperature Protection
• SHDN Input for Active Power Management
• ERROR Output Can Be Used as a Low Battery
Detector (SOIC only)
Applications
• Battery-op erat ed System s
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Typical Applicat ion
Description
The TC1265 is a fixed-output, high-accuracy (typic ally
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1265’ s
CMOS construction eliminates wasted ground current,
signific antly extending battery life. Total supply current
is typic all y 80 µA at full load (20 to 60 tim es lower tha n
in bipolar regulators).
Key features of the TC1265 include ultra low noise
operation, very low dropout voltage (typically 450 mV
at full load) and fast response to step changes in load.
The TC1265 incorporates both overtemperature and
overcurrent protection. The TC1265 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 800 mA. It is available in 8-Pin SOIC,
5-Pin TO-220 and 5-Pin DDPAK pack ages.
Package Type
TC1265
VIN VOUT
C1
1µF
GND
VOUT
VIN
SHDN SHDN
+
VIN
GND
VOUT
Front View
123
Tab Is GND
TC1265
1
2
3
4
8
7
6
5
TC1265 NC
SHDN
8-Pin SOIC
GND
NC
BYPASS
VOUT VIN
VIN
VOUT
TC1265
5-Pin TO-220
Tab Is GND
5-Pin DDPAK
123
GND
SHDN
45
BYP
BYP
4
SHDN
5
ERROR
800 mA Fixed-Output CMOS LDO with Shutdown
TC1265
DS21376C-page 2 2004 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage......... ...... ...(VSS – 0.3V) to (VIN + 0.3V)
Power Dissi pation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of th e device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Input Operating Voltage VIN 2.7 —6.0 VNote 2
Maximum Outpu t Current IOUTMAX 800 ——mA
Output Voltage VOUT VR – 2.5% VR ± 0.5% VR + 2.5% VV
R ≥ 2.5V
VR – 2% VR ± 0.5% VR + 3% VR = 1.8V
VOUT Temperature Coefficient ∆VOUT/∆T — 40 — ppm/°C Note 3
Line Regulation ∆VOUT/∆VIN — 0.007 0.35 %(V
R + 1V) ≤ VIN ≤ 6V
Load Regulation (Note 4) ∆VOUT/VOUT -0.01 0.002 +0.01 %/mA IL = 0. 1 mA to IOUTMAX
Dropout Voltage (Note 5) VIN–VOUT —2030 mV VR ≥ 2.5V, IL = 100 µA
—50160 IL = 100 mA
— 150 480 IL = 300 mA
— 260 800 IL = 500 mA
— 450 1300 IL = 800 mA
— 700 1000 VR = 1.8V, IL = 500 mA
— 890 1400 IL = 800 mA
Supply Current IDD —80130 µA SHDN = VIH, IL = 0
Shutdown Supply Current ISHDN —0.051µA SHDN = 0V
Power Supply Rejection Ratio PSRR — 64 — db F ≤ 1kHz
Output Short Circuit Current IOUTSC — 1200 1400 mA VOUT = 0V
Thermal Regulation ∆VOUT/∆PD—0.04—V/WNote 6
Output Noise eN — 260 — nV/√Hz IL = IOUTMAX, F = 10 kHZ
Note 1: VR is the regulator output voltage set ting.
2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4: Regulation is measured at a constant ju nction temperature using low duty cycle pulse testing. Load regulation is t est ed
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which t he output voltage drops 2% below its nominal value
measured at a 1.5V diff erentia l.
6: Thermal regulation is defined as the change in out put voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Ther m al Consid e r a tions” for more details.
8: Hysteresis voltage is referenced to VR.
TCVOUT VOUTMAX VOUTMIN
–()106
–
VOUT T∆×
-------------------------------------------------------------------------
=
2004 Microchip Technology Inc. DS21376C-page 3
TC1265
SHDN Input
SHDN Input High Threshold VIH 45 ——%V
IN
SHDN Input Low Threshold VIL ——15 %VIN
ERROR Output (SOIC Only)
Minimum Operating Voltage VMIN 1.0 — — V
Output Logic Low Voltage VOL ——400 mV 1 mA Flows to ERROR
ERROR Threshold Voltage VTH — 0.95 x VR—V
ERROR Positive Hysteresis VHYS —50—mVNote 8
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: VR is the regulator output voltage set ting.
2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4: Regulation is measured at a constant ju nction temperature using low duty cycle pulse testing. Load regulation is t est ed
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value
measured at a 1.5V diff erentia l.
6: Thermal regulation is defined as the change in out put voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Ther m al Consid e r a tions” for more details.
8: Hysteresis voltage is referenced to VR.
TCVOUT VOUTMAX VOUTMIN
–()106
–
VOUT T∆×
-------------------------------------------------------------------------
=
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 — +125 °C (Note 1)
Operating Tem perature R ange TJ-40 — +125 °C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-DDPA K θJA —57—°C/W
Thermal Resistance, 5L-TO-220 θJA —71—°C/W
Thermal Resistance, 8L-SOIC θJA — 163 — °C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C ).
TC1265
DS21376C-page 4 2004 Microchip Technology Inc.
2.0 TYPICAL PERFORM ANCE CURVES
FIGURE 2-1: Line Regulation vs.
Temperature.
FIGURE 2-2: Output Noise vs. Frequency.
FIGURE 2-3: Load Regulation vs.
Temperature.
FIGURE 2-4: IDD vs. Temperature.
FIGURE 2-5: 3.0V Dropout Voltage vs.
ILOAD.
FIGURE 2-6: 3.0V VOUT vs.Temperature.
Note: The g r ap hs and t ables provid ed fol lowing this note are a statistical s umm ar y b as ed on a limited n umber of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data pres ented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
.
020
0
.
018
0
.
016
0
.
012
0
.
010
0
.
008
0
.
006
0
.
004
0
.
002
0
.
000
0
.
014
TE
M
PE
RA
T
UR
E
(
°
C
)
LI
N
E
R
EG
U
L
A
TIO
N
(
%
)
-
40
°
C0
°
C25
°
C70
°
C85
°
C 125
°
C
FREQUENCY (kHz)
NOISE (
µ
V/√Hz)
10.0
1.0
0.01 0.01 1 10 100 1000
0.1
0.0
RLOAD = 50
Ω
COUT = 1
µ
F
-40°C 0°C 25°C 70°C 85°C 125°C
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0.0020
0.0010
0.0100
TEMPERATURE (°C)
LOAD REGULATION (%/mA)
1 mA to 800 mA
V
OUT =
3V
TEMPERATURE (°C)
IDD
(µA)
150
135
120
105
90
75
60
45
30
15
0
-40°C 0°C 25°C 70°C 85°C
VOUT
=
3V
125°C
0.600
0.550
0.500
0.450
0.400
0.350
0.300
0.250
0.200
0.150
0.100
0.050
0.000
0100 200 300 400 500 600 700 800
I
LOAD
(mA)
DROPOUT VOLTAGE (V)
85
°
C125
°
C
-40
°
C
0
°
C
25
°
C
70
°
C
3
.
030
3
.
020
3
.
010
3
.
000
2
.
990
2
.
980
2
.
970
2
.
960
2
.
950
2
.
940
2
.
930
2
.
920
TE
M
PE
RA
T
UR
E
(
°
C
)
VO
U
T
(
V
)
ILO
AD
=
0
.
1
m
A
ILO
AD
=
300
m
A
ILO
AD
=
500
m
A
ILO
AD
=
800
m
A
-
40
°
C0
°
C25
°
C70
°
C85
°
C 125
°
C
2004 Microchip Technology Inc. DS21376C-page 5
TC1265
2.0 TYPICAL PERFORMANCE CURVES (CONT)
FIGURE 2-1: ISHDN vs. Temperature.
0.090
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
TEMPERATURE (°C)
ISHDN (µA)
-40°C 0°C 25°C 70°C 85°C 125°C
TC1265
DS21376C-page 6 2004 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Regulated Output Volt age (V OUT)
Regulated voltage output.
3.2 Ground (GND)
Ground terminal.
3.3 Reference Bypass (BYPASS)
Reference bypass input. Connecting a 470 pF to this
input further reduces output noise.
3.4 Out-of-Regul ation Flag (ERROR)
Out-of-regulation flag (open-drain output). This output
goes low when VOUT is out-of-tolerance by
approxim ately -5%.
3.5 Shutdown Control (SHDN)
Shutdown control input. The regulator is fully enabled
when a logi c -h igh is applied t o th is in pu t. The regulator
enters shutdown when a logic-low is applied to this
input. D urin g sh ut down, the output vol t ag e fal ls to ze ro
and the supply current is reduced to 0.05 µA (typical).
3.6 Unregulated Su pply (VIN)
Unregulated supply input.
Pin No.
(8-Pin SOIC)
Pin No.
(5-Pin DDPAK)
(5-Pin TO-220) Symbol Description
15V
OUT Regu lat ed vol t age outp ut
2 3 GND Ground terminal
3 — NC No connect
4 1 BYPASS Reference bypass input
5 — ERROR Out-of-Regulation Flag (open drain output)
6 2 SHDN Shutdown control input
7 — NC No connect
84V
IN Unr egulated suppl y input
2004 Microchip Technology Inc. DS21376C-page 7
TC1265
4.0 DETAILED DESCRIPTION
The TC1265 is a precision, fixed-output LDO. Unlike
bipolar regulators, the TC1265’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to I
LOADMAX load current range (an important
consid eration in RTC and CM OS R AM batt ery bac k-up
applications).
Figure 4-1 shows a typical application circuit.
FIGURE 4-1: Typic al App li ca tio n Circui t.
4.1 Output Capacitor
A 1 µF (min.) capacitor from VOUT to ground is
required. The output capacitor should have an Effective
Series Resistance (ESR) greater than 0.1Ω and less
than 5Ω. A 1 µF capacitor should be connected from
VIN to GND if there is more than 10 inches of wire
betwee n the regu lator and t he AC fil ter cap acitor, or if a
battery is use d as the power source. Aluminum elect ro-
lytic or tantalum capacitor types can be used. Since
many aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are recom-
mended for applications operating below -25°C. When
operating from sources other than batteries, supply-
noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors, and by employing passive filtering
techniques.
4.2 ERROR Output
ERROR is driven low whenever VOUT falls out of
regulati on by more than – 5% (typ.). This condition may
be caused by low input voltage, output current limiting,
or thermal limiting. The ERROR threshold is 5% below
rated VOUT regardless of the programmed output
voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a
5.0V regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
Note that ERROR is active when VOUT is at or below
VTH and inactive when VOUT is above VTH + VH.
As shown in Figure 4-1, ERROR can be used as a
battery low flag or as a proces sor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maint ain ERR OR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
FIGURE 4-2: ERROR Output Operation.
C1
R1
1M
V+
TC1265
VIN
Battery
VOUT
ERRORSHDN
GND
VOUT
1µF
++
Shutdown Control
(to CMOS Logic or Tie
to VIN, if unused)
C2
1µF
+
C3 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text) C3
0.2 µF
+BATTLOW
or RESET VOUT
VTH
VIH
Hysteresis (VH)
VOL
ERROR
TC1265
DS21376C-page 8 2004 Microchip Technology Inc.
5.0 THERMAL CONSIDERATIONS
5.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2 Power Dissipation
The amount of power the regulator dissipates is
primaril y a fu nction of i npu t voltag e, ou tput vo lta ge an d
output current. The following equation is used to
calc ulat e worst-case actual power dissipation:
EQUATION 5-1:
The maximum allowable power dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (θJA).
EQUATION 5-2:
Table 5-1 and Table 5-2 show various values of θJA
for
the TC1265 package types.
TABLE 5-1: THERMAL RESISTANCE
GUIDELINES FOR TC1265 IN
8-PIN SOIC PACKAGE
TABLE 5-2: THERMAL RESISTANCE
GUIDELINES FOR TC1265 IN
5-PIN DDPAK/TO-220
PACKAGE
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Find:
1. Actual po wer dissipa tion
2. Maximum allowable dissipation
Actual power dissipation:
Maximu m allowable power dissipation:
In this example, the TC1265 diss ipates a maximum of
260 mW, below the allowable limit of 500 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 500 mW into Equation 5-1, from
which VINMAX = 4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq mm 2500 sq mm 60°C/W
1000 sq mm 2500 sq mm 2500 sq mm 60°C/W
225 sq mm 2500 sq mm 2500 sq mm 68°C/W
100 sq mm 2500 sq mm 2500 sq mm 74°C/W
* Pin 2 is ground. Device is mounted on the top-side.
Where:
VINMAX
VOUTMIN
ILOADMAX
PD = Worst-ca se actual power diss ipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDVINMAX VOUTMIN
–()ILOADMAX
=
Where:
VINMAX
VOUTMIN
ILOADMAX
PD = Worst-case actual power diss ipatio n
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX TJMAX TAMAX
–
θJA
---------------------------------------
=
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq m m 2500 sq mm 25°C/W
1000 sq mm 2500 sq m m 2500 sq mm 27°C/W
125 sq mm 2500 sq mm 2500 sq mm 35°C / W
* Tab of device attached to top-side copper
Given: VINMAX = 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX =275mA
TJMAX = 125°C
TAMAX =95°C
θJA = 60°C/W (SOIC)
PDVINMAX VOUTMIN
–()ILOADMAX
≈
PD3.3 1.1×()2.7 .995×()–275 10 3–
×=
PD260 mW=
PDMAX TJMAX TAMAX
–
θJA
---------------------------------------
=
PDMAX 125 95–()
60
-------------------------
=
PDMAX 500 mW=
2004 Microchip Technology Inc. DS21376C-page 9
TC1265
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Legend: XX...X Customer sp ecific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Mi crochi p pa rt numbe r cannot be marke d on on e line, it will
be carried ov er to the ne xt li ne thus lim iti ng th e nu mb er of av ai lab le c hara ct ers
for customer specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
XXXXXXXXX
XXXXXXXXX
YYWWNNN
5-Lead DDPAK
TC1265
3.3VET
Example
5-Lead TO-220
XXXXXXXXX
XXXXXXXXX
YYWWNNN
Example:
TC1265-
3.3VATX
0430256
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
1265-3.3
VOA0430
256
0430256
TC1265
DS21376C-page 10 2004 Microchip Technology Inc.
5-Lead Plastic (ET) (DDPAK)
BOTTOM VIEW
TOP VIEW
E
D
b
E1
D2
A
A1
c2
c L
D1
e
θ1
θ
(5X)
L3
1
§ Significant Characteristic
Drawing No. C04-012
Notes:
Mold Draft Angle
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
θ1 7°
Pitch
Number of Pins
Overall Width
Standoff §
Molded Package Length
Exposed Pad Width
Overall Height
MAX
Units
Dimension Limits
A1
E1
D
E
e
A
.398
.000
.256 REF
INCHES*
.067 BSC
MIN
5
NOM MAX
.010 0.00
10.11
6.50 REF
MILLIMETERS
.183
MIN
5
1.70 BSC
NOM
0.25
4.65
JEDEC equivalent: TO-252
4.50.170
.005 0.13
Foot Length L .068 .089 .110 1.73 2.26 2.79
Foot Angle θ-- -- 8°
.177
*Controlling Parameter
4.32
.385 .410 9.78 10.41
.330 .350 .370 8.38 8.89 9.40
Overall Length D1 .549 .577 .605 13.94 14.66 15.37
Lead Thickness c.014 .020 .026 0.36 0.51 0.66
Pad Thickness c2 .045 -- .055 1.14 -- 1.40
Lead Width .037
b.026 .032 0.66 0.81 0.94
3° --
8°
7°3°
--
--
--
Exposed Pad Length D2 .303 REF 7.75 REF
Pad Length L3 .045 -- .067 1.14 -- 1.70
2004 Microchip Technology Inc. DS21376C-page 11
TC1265
5-Lead Plastic Transistor Outline (AT) (TO-220)
L H1
Q
E
b
e1
e
C1
J1
F
A
D
a
(5X)
ØP
EJECTOR PIN
e3
Drawing No. C04-036
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
*Controlling Parameter
Mold Draft Angle
Lead Width
Lead Thickness
a
C1
b
.014
Dimension Limits
Overall Height
Lead Length
Overall Width
Lead Pitch
A
L
E
.540
MIN
e
Units
.060
INCHES*
.022 0.36 0.56
MILLIMETERS
.190
.560 13.72
MINMAX
4.83
14.22
MAX
.160 4.06
3° 7° 3° 7°
Overall Length D
1.020.64.040.025
Overall Lead Centers e1 .263
.385
.560
.273 6.68 6.93
.072 1.52 1.83
.415 9.78 10.54
.590 14.22 14.99
Through Hole Diameter P .146 .156 3.71 3.96
J1Base to Bottom of Lead .090 2.29.115 2.92
Through Hole Center Q.103 2.87.113 2.62
Flag Thickness F .045 1.40.055 1.14
Flag Length H1 .234 6.55.258 5.94
Space Between Leads e3 .030 1.02.040 0.76
TC1265
DS21376C-page 12 2004 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146E1Molded Pa ckag e Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff § 1.551.421.32.061.056.052A2Molded Pa ckag e Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 88
n
Numb er of Pin s MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
2004 Microchip Technology Inc. DS21376C-page 13
TC1265
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
PART NO. X.XX XX
PackageVoltage
Option
Device
Devi ce TC1265 Fixed Output CMOS LDO with Shutdown
Voltage Option:* 1.8V = 1.8V
2.5V = 2.5V
3.0V = 3.0V
3.3V = 3.3V
* Other output voltages are available. Please contact your
local Microchip sales office for details.
Packag e AT = P lastic (TO-2 20) , 5-Le ad
ET = Plastic Transistor Outline (DDPAK), 5-Lead
ETTR = Plastic Transistor Outline (DDPAK), 5-Lead,
Tape and Reel
OA = Plastic SOIC, (150 mil Body), 8-lead
OATR = Plastic SOIC, (150 mil Body), 8-lead,
Tape and Reel
Examples:
a) TC1265-1.8VAT 1.8V LDO, TO-220-5 pkg.
b) TC1265-2.5VAT 2.5V LDO, TO-220-5 pkg.
c) TC1265-3.0VAT 3.0V LDO, TO-220-5 pkg.
d) TC1265-3.3VAT 3.3V LDO, TO-220-5 pkg.
a) TC1265- 1. 8 VE TT R 1 .8V L DO , DD PAK-5 p k g. ,
Tape and Reel
b) TC1265- 2. 5 VE TT R 2 .5V L DO , DD PAK-5 p k g. ,
Tape and Reel
c) TC1265 - 3. 0 VE TT R 3. 0V LD O , DD PAK-5 p k g.,
Tape and Reel
d) TC1265- 3. 3 VE TT R 3 .3V L DO , DD PAK-5 p k g. ,
Tape and Reel
a) TC1265-1.8VOA 1.8V LDO, SOIC-8 pkg.
b) TC1265-1.8VOATR 1.8V LDO, SOIC-8 pkg.,
Tape and Reel
c) TC1265-2.5VOA 2.5V LDO, SOIC-8 pkg.
d) TC1265-2.5VOATR 2.5V LDO, SOIC-8 pkg.,
Tape and Reel
e) TC1265-3.0VOA 3.0V LDO, SOIC-8 pkg.
f) TC1265-3.0VOATR 3.0V LDO, SOIC-8 pkg.,
Tape and Reel
g) TC1265-3.3VOA 3.3V LDO, SOIC-8 pkg.
h) TC1265-3.3VOATR 3.3V LDO, SOIC-8 pkg.,
Tape and Reel
XX
Tape and
Reel
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational diff erences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Wor ldw ide Site (www.micr ochip.com)
Please specify which device, revision of silicon and Dat a Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com) to receive the most current information on our products.
TC1265
DS21376C-page 14 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS21376C-page 15
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIN D WHETHER EXPRESS OR IMPLIED ,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. U se of Microc hip’s products as critical com ponents in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, micro ID, MPLAB, PIC, PICmicro,
PICSTA RT, PRO MATE, PowerSm a rt , rfPIC, and
SmartShunt are registered trademark s of Microchip
Tec hnolo gy Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MX DE V, MXLAB, PICMASTER, SEEV AL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Tec hnolo gy Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Te chnology Incorporat ed, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that it s f amily of products is one of t he most secure famili es of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellec tual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving t he c ode protect ion f eatures of our
products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21376C-page 16 2004 Microchip Technology Inc.
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WORLDWIDE SALES AND SERVICE
10/20/04
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Microchip:
TC1265-2.5VOA TC1265-2.5VAT TC1265-2.5VETTR TC1265-3.3VAT TC1265-3.0VAT TC1265-1.8VAT TC1265-
1.8VOA TC1265-1.8VETTR TC1265-3.3VOATR TC1265-1.8VOATR TC1265-3.0VETTR TC1265-3.3VOA TC1265-
2.5VOATR TC1265-3.0VOA TC1265-3.0VOATR TC1265-3.3VETTR
