[ /Title (CD74 HC161 , CD74 HCT16 1, CD74 HC163 , CD74 HCT16 3) /Subject (High Speed CMOS Logic Presettable Counte rs) /Autho r () /Keywords (High Speed CMOS Logic Presettable Counte rs, High Speed The CD54HCT161 is obsolete and no longer is supplied. CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Data sheet acquired from Harris Semiconductor SCHS154D High-Speed CMOS Logic Presettable Counters February 1998 - Revised October 2003 Features Two count enables, PE and TE, in each counter are provided for n-bit cascading. In all counters reset action occurs regardless of the level of the SPE, PE and TE inputs (and the clock input, CP, in the 'HC161 and 'HCT161 types). * 'HC161, 'HCT161 4-Bit Binary Counter, Asynchronous Reset * 'HC163, 'HCT163 4-Bit Binary Counter, Synchronous Reset If a decade counter is preset to an illegal state or assumes an illegal state when power is applied, it will return to the normal sequence in one count as shown in state diagram. * Synchronous Counting and Loading * Two Count Enable Inputs for n-Bit Cascading The look-ahead carry feature simplifies serial cascading of the counters. Both count enable inputs (PE and TE) must be high to count. The TE input is gated with the Q outputs of all four stages so that at the maximum count the terminal count (TC) output goes high for one clock period. This TC pulse is used to enable the next cascaded stage. * Look-Ahead Carry for High-Speed Counting * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times Ordering Information * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V PART NUMBER TEMP. RANGE (oC) PACKAGE CD54HC161F3A -55 to 125 16 Ld CERDIP CD54HC163F3A -55 to 125 16 Ld CERDIP * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH CD54HCT163F3A -55 to 125 16 Ld CERDIP CD74HC161E -55 to 125 16 Ld PDIP CD74HC161M -55 to 125 16 Ld SOIC CD74HC161MT -55 to 125 16 Ld SOIC Description CD74HC161M96 -55 to 125 16 Ld SOIC The 'HC161, 'HCT161, 'HC163, and 'HCT163 are presettable synchronous counters that feature look-ahead carry logic for use in high-speed counting applications. The 'HC161 and 'HCT161 are asynchronous reset decade and binary counters, respectively; the 'HC163 and 'HCT163 devices are decade and binary counters, respectively, that are reset synchronously with the clock. Counting and parallel presetting are both accomplished synchronously with the negative-to-positive transition of the clock. CD74HC163E -55 to 125 16 Ld PDIP CD74HC163M -55 to 125 16 Ld SOIC CD74HC163MT -55 to 125 16 Ld SOIC CD74HC163M96 -55 to 125 16 Ld SOIC CD74HCT161E -55 to 125 16 Ld PDIP CD74HCT161M -55 to 125 16 Ld SOIC A low level on the synchronous parallel enable input, SPE, disables counting operation and allows data at the P0 to P3 inputs to be loaded into the counter (provided that the setup and hold requirements for SPE are met). CD74HCT161MT -55 to 125 16 Ld SOIC CD74HCT161M96 -55 to 125 16 Ld SOIC CD74HCT163E -55 to 125 16 Ld PDIP CD74HCT163M -55 to 125 16 Ld SOIC CD74HCT163MT -55 to 125 16 Ld SOIC CD74HCT163M96 -55 to 125 16 Ld SOIC All counters are reset with a low level on the Master Reset input, MR. In the 'HC163 and 'HCT163 counters (synchronous reset types), the requirements for setup and hold time with respect to the clock must be met. NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2003, Texas Instruments Incorporated 1 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Pinout CD54HC161, CD54HCT161, CD54HC163, CD54HCT163 (CERDIP) CD74HC161, CD74HCT161, CD74HC163, CD74HCT163 (PDIP, SOIC) TOP VIEW MR 1 16 VCC CP 2 15 TC P0 3 14 Q0 P1 4 13 Q1 P2 5 12 Q2 P3 6 11 Q3 PE 7 10 TE 9 SPE GND 8 Functional Diagram P0 3 SPE CP MR PE TE P1 4 P2 5 P3 6 9 14 2 13 1 12 7 11 10 15 2 Q0 Q1 Q2 Q3 TC CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 MODE SELECT - FUNCTION TABLE FOR 'HC161 AND 'HCT161 INPUTS OPERATING MODE OUTPUTS MR CP PE TE SPE Pn Qn TC Reset (Clear) L X X X X X L L Parallel Load H X X l l L L H X X l h H (Note 1) Count H h h h (Note 3) X Count (Note 1) Inhibit H X I (Note 2) X h (Note 3) X qn (Note 1) H X X I (Note 2) h (Note 3) X qn L MODE SELECT - FUNCTION TABLE FOR 'HC163 AND 'HCT163 INPUTS OPERATING MODE OUTPUTS MR CP PE TE SPE Pn Qn TC Reset (Clear) l X X X X L L Parallel Load h (Note 3) X X l l L L h (Note 3) X X l h H (Note 1) Count h (Note 3) h h h (Note 3) X Count (Note 1) Inhibit h (Note 3) X I (Note 2) X h (Note 3) X qn (Note 1) h (Note 3) X X I (Note 2) h (Note 3) X qn L H = High voltage level steady state; L = Low voltage level steady state; h = High voltage level one setup time prior to the Low-to-High clock transition; l = Low voltage level one setup time prior to the Low-to-High clock transition; X = Don't Care; q = Lower case letters indicate the state of the referenced output prior to the Low-to-High clock transition; = Low-to-High clock transition. NOTES: 1. The TC output is High when TE is High and the counter is at Terminal Count (HHHH for HC/HCT161 and 'HC/HCT163). 2. The High-to-Low transition of PE or TE on the 'HC/HCT161 and the 'HC/HCT163 should only occur while CP is HIGH for conventional operation. 3. The Low-to-High transition of SPE on the 'HC/HCT161 and SPE or MR on the 'HC/HCT163 should only occur while CP is HIGH for conventional operation. 3 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .50mA Thermal Resistance (Typical, Note 4) JA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - 0.1 - 1 - 1 A 4 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) ICC VCC or GND 0 6 - - 8 - 80 - 160 A High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 0.1 - 1 - 1 A PARAMETER Quiescent Device Current MIN TYP MAX MIN MAX MIN MAX UNITS HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 A ICC (Note 5) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 A NOTE: 5. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS P0 - P3 0.25 PE 0.65 CP 1.05 MR 0.8 SPE 0.5 TE 1.05 NOTE: Unit Load is ICC limit specified in DC Electrical Table, e.g., 360A max at 25oC. 5 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS fMAX - 2 6 - - 5 - 4 - MHz 4.5 30 - - 24 - 20 - MHz 6 35 - - 28 - 24 - MHz 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns HC TYPES Maximum CP Frequency (Note 6) CP Width (Low) MR Pulse Width (161) Setup Time, Pn to CP Setup Time, PE or TE to CP Setup Time, SPE to CP Setup Time, MR to CP (163) Hold Time, PN to CP Hold Time, TE or PE to CP Hold Time, SPE to CP Recovery Time, MR to CP (161) tW(L) tW tSU tSU tSU tSU tH tH tH tREC - - - - - - - - - - 2 100 - - 125 - 150 - ns 4.5 20 - - 25 - 30 - ns 6 17 - - 21 - 26 - ns 2 60 - - 75 - 90 - ns 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 11 - 13 - ns 2 60 - - 75 - 90 - ns 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 2 65 - - 80 - 100 - ns 4.5 13 - - 16 - 20 - ns 6 11 - - 14 - 17 - ns 2 3 - - 3 - 3 - ns 4.5 3 - - 3 - 3 - ns 6 3 - - 3 - 3 - ns 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns 6 0 - - 0 - 0 - ns 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns 6 0 - - 0 - 0 - ns 2 75 - - 95 - 110 - ns 4.5 15 - - 19 - 22 - ns 6 13 - - 16 - 19 - ns 6 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Prerequisite For Switching Specifications (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS Maximum CP Frequency fMAX - 4.5 30 - - 24 - 20 - MHz CP Width (Low) (Note 6) tW(L) - 4.5 16 - - 20 - 24 - ns MR Pulse Width (161) tW - 4.5 20 - - 25 - 30 - ns Setup Time, Pn to CP tSU - 4.5 10 - - 13 - 15 - ns Setup Time, PE or TE to CP tSU - 4.5 13 - - 16 - 20 - ns Setup Time, SPE to CP tSU - 4.5 12 - - 15 - 18 - ns Setup Time, MR to CP (163) tSU - 4.5 13 - - 16 - 20 - ns Hold Time, PN to CP tH - 4.5 5 - - 5 - 5 - ns Hold Time, TE or PE to CP tH - 4.5 3 - - 3 - 3 - ns Hold Time, SPE to CP tH - 4.5 3 - - 3 - 3 - ns tREC - 4.5 15 - - 19 - 22 - ns PARAMETER HCT TYPES Recovery Time, MR to CP (161) NOTE: 6. Applies to non-cascaded operation only. With cascaded counters clock to terminal count propagation delays, count enables (PE or TE)to-clock setup times, and count enables (PE or TE)-to-clock hold times determine maximum clock frequency. For example with these HC devices: 1 1 f MAX (CP) = ----------------------------------------------------------------------------------------------------------------------------------------------------- = ----------------------------- 21MHz ( min ) CP-to-TC prop. delay + TE-to-CP setup + TE-to-CP Hold 37 + 10 + 0 Switching Specifications CL = 50pF, Input tr, tf = 6ns -40oC TO 85oC 25oC PARAMETER SYMBOL TEST CONDITIONS tPHL, tPLH CL = 50pF -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 185 - 230 - 280 ns 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 31 - 39 - 48 ns CL = 50pF 2 - - 185 - 230 - 280 ns 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 31 - 39 - 48 ns CL = 50pF 2 - - 120 - 150 - 180 ns 4.5 - - 24 - 30 - 36 ns CL = 15pF 5 - 9 - - - - - ns CL = 50pF 6 - - 20 - 26 - 31 ns HC TYPES Propagation Delay CP to TC CP to Qn TE to TC tPHL, tPLH tPHL, tPLH 7 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Switching Specifications CL = 50pF, Input tr, tf = 6ns (Continued) -40oC TO 85oC 25oC PARAMETER MR to Qn (161) MR to TC (161) Output Transition Time -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPHL CL = 50pF 2 - - 210 - 265 - 315 ns 4.5 - - 42 - 53 - 63 ns CL = 15pF 5 - 18 - - - - - ns CL = 50pF 6 - - 36 - 45 - 54 ns CL = 50pF 2 - - 210 - 265 - 315 ns 4.5 - - 42 - 53 - 63 ns CL = 50pF 6 - - 36 - 45 - 54 ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns tPHL tTHL, tTLH Power Dissipation Capacitance (Notes 7, 8) CPD - 5 - 60 - - - - - pF Input Capacitance CIN CL = 50pF - 10 - 10 - 10 - 10 pF tPHL, tPLH CL = 50pF 4.5 - - 42 - 53 - 63 ns CL = 15pF 5 - 18 - - - - - ns CL = 50pF 4.5 - - 39 - 49 - 59 ns CL = 15pF 5 - 16 - - - - - ns CL = 50pF 4.5 - - 32 - 40 - 48 ns CL = 15pF 5 - 13 - - - - - ns CL = 50pF 4.5 - - 50 - 63 - 75 ns CL = 15pF 5 - 21 - - - - - ns HCT TYPES Propagation Delay CP to TC CP to Qn TE to TC MR to Qn (161) tPHL, tPLH tPHL, tPLH tPHL MR to TC (161) tPHL CL = 50pF 4.5 - - 50 - 63 - 75 ns Output Transition Time tTHL, tTLH CL = 50pF 4.5 - - 15 - 19 - 22 ns Power Dissipation Capacitance (Notes 7, 8) CPD - 5 - 63 - - - - - pF Input Capacitance CIN CL = 50pF - 10 - 10 - 10 - 10 pF NOTES: 7. CPD is used to determine the dynamic power consumption, per package. 8. PD = CPD VCC2 fi + (CL VCC2 fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 8 CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Timing Diagram MASTER RESET (161) (ASYNCHRONOUS) MASTER RESET (163) (SYNCHRONOUS) SPE P0 PRESET DATA INPUTS P1 P2 P3 CP (161) CP (163) COUNT ENABLES PE TE Q0 Q1 OUTPUTS Q2 Q3 TC 12 RESET 13 14 15 0 COUNT PRESET Sequence illustrated on waveforms: 1. Reset outputs to zero. 2. Preset to binary twelve. 3. Count to thirteen, fourteen, fifteen, zero, one, and two. 4. Inhibit. 9 1 2 INHIBIT CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163 Test Circuits and Waveforms tWL + tWH = tfCL trCL 50% 10% 10% tf = 6ns tr = 6ns tTLH 1.3V 10% INVERTING OUTPUT tPHL FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL tfCL VCC tfCL GND 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT 3V 2.7V CLOCK INPUT 50% tH(H) tTLH 90% tPLH 10% GND tTHL 90% 50% 10% 90% 3V 2.7V 1.3V 0.3V GND tTHL trCL tWH FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT INVERTING OUTPUT GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. VCC 90% 50% 10% 1.3V 1.3V tWL tf = 6ns tPHL 1.3V 0.3V 0.3V FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT 2.7V tWH tr = 6ns DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH I fCL 3V GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tREM VCC SET, RESET OR PRESET tfCL = 6ns CLOCK 50% 50% tWL CLOCK INPUT tWL + tWH = trCL = 6ns VCC 90% CLOCK I fCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 10 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD54HC161F ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD54HC161F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 1 TBD A42 N / A for Pkg Type TBD Call TI TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HC163F3A ACTIVE CDIP J 16 CD54HCT161F3A OBSOLETE CDIP J 16 CD54HCT163F ACTIVE CDIP J 16 CD54HCT163F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74HC161E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC161EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC161M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC161MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC163EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC163M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC163MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 1 Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HC163MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT161EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT161M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT161MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT163EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT163M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT163MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) Lead/Ball Finish MSL Peak Temp (3) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC161M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HC163M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT161M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT163M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC161M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HC163M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT161M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT163M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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