CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Super fast recovery time for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
Trr ns
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1405037 Version: H14
ES2A thru ES2J
Surface Mount Su
er Fast Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
Taiwan Semiconductor
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AA (SMB) DO-214AA (SMB)
Polarity: Indicated by cathode band
Weight: 0.09 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL ES
2A
ES
2B
ES
2C
ES
2D
ES
2F
ES
2G
ES
2H
ES
2J Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 2
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
50 A
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
μA
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Maximum instantaneous forward voltage (Note 1)
@ 2 A V
F
1.7
O
C/W
Operating junction temperature range
Storage temperature range - 55 to +150
Maximum reverse recovery time (Note 2) 35
Typical thermal resistance R
θJL
R
θJA
20
75
Note 1: Pulse test with PW=300μs, 1% duty cycle
0.95 1.3
10
350
Typical junction capacitance (Note 3) 25 20
- 55 to +150