T4-LDS-0037, Rev 2 (111456) ©2011 Microsemi Corporation Page 1 of 6
1N5518BUR-1 thru 1N5546BUR-1
Availa ble on
commercial
versions
500 mW Zener Diodes
Qualified per MIL-PRF-19500/437
JAN, JANTX and
JANTXV
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface mount Zener voltage
regulators provides a selection from 3.3 to 33 volts with tolerances ranging from plus/minus
1% to 20%. The standard tolerance is plus/minus 5% with the B suf f ix unless ordered
otherwise. These glass surface mount devices are available with an internal metallurgical
bond option. This type of bonded Zener package construction is also in JAN, JANTX, and
JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet
higher and lower power applications.
DO-213AA MELF
Package
Also available in:
DO-35 (DO-204AH)
(axial-leaded)
1N5518B-1 thru 1N5546B-1
Important: For the latest information, visit our website http://www.microsemi.com.
• JEDEC registered 1N5518 thru 1N5546.
• Voltage tolerances of plus/minus 20%, 10%, 5%, 2%, and 1% available. See Note 1 on page 3.
• Interna l meta llurg ic al bond.
• JAN, JANTX, and JANTXV qualification per MIL-PRF-19500/437 available.
• RoHS compliant versions available (commercial grade only).
• Regulates voltage over a broad operating current and temperature range.
• Extensive selection from 3.3 to 33 V.
• Hermetically sealed surface mount package.
• Nonsensitive to ESD per MIL-STD-750 Method 1020.
• Minimal capacitance (see Figure 3).
• Inherently radiation hard as described in Microsemi ’s “MicroNote 050” which is available at
Microsemi.com.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Junction and Storage Temperature
Steady-State Power
(Also see derating in Figure 2)
PD 0.5 W
Thermal Resi stan ce Jun cti on-to-End Cap (Note 2)
Thermal Resi stan ce Jun cti on-to-Ambient (Note 2)
Solder Pad Temperature @ 10 s
Notes: 1. At end cap temperature TEC < 125 oC or at ambient TA < 50 ºC when mounted on FR4 PC board as
described for thermal resist ance above (see Figure 2 for derating). Derate to 0 at +175 oC.
2. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).