HLMP-Nxxx T-1 (3 mm) Auto Insertable LED Lamps Data Sheet HLMP-N305, HLMP-N405, HLMP-NG0x, HLMP-NL06, HLMP-NH04 Description Features This family of 3 mm LED Lamps is capable of withstanding automatic insertion and wave soldering processes. * T-1 (3 mm) auto insertable package Designed with a thick epoxy flange and soft leadframe material, it is ideal for clinch and cut operations. * High light output Applications * Wide viewing angle * General purpose * Variety of colors * High volume manufacturing * Available with straight or formed lead tape and reel options * AlInGaP SunPower intensity * Tinted diffused and tinted non-diffused lens options Device Selection Guides High Brightness Lamps Package Viewing Angle, Package Min. Iv @ 20 mA 21/2 Outline Color Part Number Tinted Red HLMP-NG05 90.2 45 A HLMP-NG07 90.2 60 B Amber HLMP-NL06 96.2 60 B Red Orange HLMP-NH04 90.2 60 B Luminous Intensity, Viewing Angle, Package Min. Iv @ 10 mA 21/2 Outline High Efficiency Lamps Diffused Luminous Intensity, Package Color Part Number Tinted Diffused GaP Yellow HLMP-N305 X 14.7 45 A GaP Orange HLMP-N405 X 13.8 45 A Note: 1. 21/2 is the off axis angle where the luminous intensity is 1/2 the on axis intensity. Package Dimensions Package Outline "A" SEATING PLANE 5.9 0.5 (0.23 0.02) 1.0 0.5 (0.04 0.02) 23.0 (0.91) 3.5 0.3 (0.14 0.01) CATHODE MARKS 0.65 (0.03) MAX. 0.4 0.2 (0.02 0.01) 4.4 0.3 3.1 0.2 (0.17 0.01) (0.12 0.01) 2.5 0.3 (0.10 0.01) 0.4 0.2 (0.01 0.01) + 0.1 0 + 0.00 (0.2 - 0.00 ) 0.45 0.10 (0.02 0.007) 0.4 2.0 (0.08) REF. 3.4 0.2 (0.13 0.01) Package Outline "B" 5.70 0.5 23.0 MIN. 1.0 MIN. 3.50 0.30 CATHODE FLAT 0.65 MAX. CATHODE LEAD 0.44 0.2 3.80 0.30 3.10 0.20 2.54 0.3 0.8 MAX. EPOXY MENISCUS + 0.1 0.4 - 0 2.0 3.60 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. LEADS ARE MILD STEEL. SOLDER COATED. 3. EPOXY MENISCUS OF 0.8 mm (0.03 in.) MAXIMUM MAY EXTEND TO THE LEADS. Part Numbering System H L M P - N x x x # x x x Mechanical Option 002: Tape & Reel, Straight Leads Viewing Angle Options 01: 45 Degree 05: 45 Degree 04, 06, 07: 60 Degree Color Options 3: GaP Yellow 4: GaP Orange G: AlInGaP Red L: AlInGaP Amber H: AlInGaP Red Orange Absolute Maximum Ratings at TA = 25 C Parameter Orange Yellow AlInGaP Red Orange, Amber & Red Units DC Forward Current[1] 30[2,3] mA 30 20 Reverse Voltage (Ir = 100 A) 5 V Junction Temperature, Tjmax 110 C Storage Temperature Range -40 to +85 C Operating Temperature Range -20 to +85 Notes: 1. See Figure 4 for maximum current derating vs. ambient temperature. 2. Suggested minimum DC current: 10 mA. 3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average. -40 to +85 C Electrical Characteristics at TA = 25C Forward Voltage Vf (Volts) Capacitance C (pF) , Vf = 0, f = 1 MHz Thermal Resistance RJ-PIN Speed of Response s (ns) Time Constant e-t/s Part Number Typ. Max. If (mA) Typ. (C/W) Typ. HLMP-N30x 2.00 2.6 10 15 290 90 HLMP-N40x 1.90 2.6 10 4 290 280 HLMP-NL06[1] 2.02 2.4 20 40 240 20 HLMP-NG0x[1] 1.90 2.4 20 40 240 20 HLMP-NH04 1.94 2.4 20 40 250 20 Note: 1. Please contact your Avago Sales Representative about operating currents below 10 mA. Optical Characteristics at TA = 25 C Typ. Dominant Luminous Intensity Typ. Peak Wavelength Typ. Spectral Luminous Efficacy Width Part Number Min. If (mA) Wavelength (nm) (nm) Half Width (lm/W) HLMP-NG05 90.2 20 635 626 17 150 HLMP-NG07 90.2 20 635 626 17 150 HLMP-NL06 96.2 20 592 590 17 480 HLMP-N305 14.7 10 583 585 36 500 HLMP-N405 13.8 10 600 602 37 380 HLMP-NH04 90.2 20 621 615 17 235 Notes: 1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/hv, where lv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. HIGH BRIGHTNESS LAMPS 1.0 AMBER RELATIVE INTENSITY ORANGE AlInGaP RED DH AlGaAs RED RED-ORANGE 0.5 0 550 600 650 700 WAVELENGTH - nm HIGH EFFICIENCY LAMPS RELATIVE INTENSITY 1.0 ORANGE HLMP-N20X fig 1a EMERALD GREEN HIGH PERFORMANCE GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH - nm Figure 1. Relative intensity vs. peak wavelength. HLMP-N20X fig 1b HIGH EFFICIENCY LAMPS HIGH BRIGHTNESS LAMPS 90 60 50 40 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 70 AlInGaP RED/REDORANGE DH AsAlGaAs RED AMBER 30 20 10 0 1.0 1.5 2.0 2.5 3.0 VF - FORWARD VOLTAGE - V 80 GREEN, EMERALD GREEN 70 60 50 HIGH EFFICIENCY RED/ORANGE 40 30 YELLOW 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. HLMP-N20X fig 2a HLMP-N20X fig 2b HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN 4.0 HIGH BRIGHTNESS LAMPS 1.5 AlInGaP DH As AlGaAs 1.0 0.5 0 0 10 20 30 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.0 40 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 IF - DC FORWARD CURRENT - mA 5 10 15 20 25 30 IDC - DC CURRENT PER LED - mA Figure 3. Relative luminous intensity vs. forward current. HLMP-N20X fig 3a AlInGaP 35 30 25 RJA = 500 C/W 20 RJA = 650 C/W RJA = 750 C/W 15 10 5 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward DC current vs. ambient temperature. HLMP-N20X fig 4a-new 35 30 25 RJA = 559 C/W 20 RJA = 689 C/W 15 10 5 0 0 DH As AlGaAs RED 40 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 40 0 HLMP-N20X fig 3b 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C HLMP-N20X fig 4b 1 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES Figure 5. Representative spatial radiation pattern for 45 viewing angle. HLMP-N20X fig 5 1 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES Figure 6. Representative spatial radiation pattern for HLMP-N20X fig 60 6 viewing angle. Intensity Bin Limits Amber Color Bin Limits Bin Intensity Range (mcd) Min. Max. (nm at 20 mA) H 13.8 27.6 Bin Name Min. Max. 1 584.5 587.0 I 22.0 44.0 2 587.0 589.5 J 35.2 70.4 4 589.5 592.0 K 56.4 112.8 6 592.0 594.5 L 90.2 180.4 M 138.0 276.0 N 200.0 400.0 O 290.0 580.0 Red/Orange P 500.0 1000.0 /Red-Orange Q 700.0 1400.0 R 1000.0 2000.0 S 1400.0 2800.0 T 2000.0 4000.0 U 2900.0 5800.0 V 4200.0 8400.0 W 6000.0 12000.0 X 8700.0 17400.0 Y 12600.0 25200.0 Z 18200.0 36400.0 G 14.7 29.4 H 23.5 47.0 I 37.6 75.2 J 60.1 120.2 K 96.2 192.4 L 147.0 294.0 M 212.0 424.0 N 300.0 600.0 O 450.0 900.0 P 700.0 1400.0 Q 1000.0 2000.0 R 1600.0 3200.0 S 2600.0 5200.0 T 4000.0 8000.0 U 6500.0 13000.0 V 10000.0 20000.0 W 16000.0 30000.0 Color Yellow/Amber Maximum tolerance for each bin limit is 18%. Tolerance for each bin limit is 0.5 nm. Color Categories Color Yellow Orange Category # Lambda (nm) Min. Max. 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is 0.5 nm. Taping Options Straight Lead Option #002 #2CA #2CD Dimension "B" - - - Dimension "H" 20.5 1.0 (0.81 0.04) 18.0 1.0 (0.71 0.04) 20.5 1.0 (0.81 0.04) Formed Lead Option #2UK #2UL #2UM #2UN #2UP #2UQ #2UR Dimension "B" 12.0 1.0 (0.47 0.04) 9.0 1.0 (0.35 0.04) 10.0 1.0 (0.39 0.04) 11.0 1.0 (0.43 0.04) 13.0 1.0 (0.51 0.04) 14.0 1.0 (0.55 0.04) 15.0 1.0 (0.59 0.04) Dimension "H" Units: mm (inches) 16.0 1.0 (0.63 0.04) Tape Outline Drawing 6.4 1.3 (0.25 0.05) 0.0 1.0 (0.00 0.04) 12.7 1.0 (0.50 0.04) CATHODE LEAD 5.1 0.7 (0.20 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 1.0 (0.71 0.04) 14.0 1.7 (0.55 0.07) 11.0 MAX. (0.43) 9.1 0.6 (0.36 0.03) 2.5 0.3 (0.10 0.01) 12.7 0.3 (0.50 0.01) A A 4.0 0.2 TYP. (0.16 0.01) VIEW A-A 0.7 0.2 (0.03 0.01) STRAIGHT LEAD HLMP-N20X Tape Outline - Straight Lead 6.4 1.3 (0.25 0.05) 0.0 1.0 (0.00 0.04) 12.7 1.0 (0.50 0.04) CATHODE LEAD DIMENSION "B" (SEE TABLE) 3.9 0.7 (0.15 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 1.0 (0.71 0.04) 14.0 1.7 (0.55 0.07) 11.0 MAX. (0.43) 9.1 0.6 (0.36 0.03) 2.5 0.3 (0.10 0.01) 12.7 0.3 (0.50 0.01) 0.7 0.2 (0.03 0.01) FORMED LEAD HLMP-N20X Tape Outline - Formed Lead 10 A A VIEW A-A 4.0 0.2 TYP. (0.16 0.01) Recommended Assembly Condition Package Options Lead Option Ammo Pack (1000 pcs.) Tape & Reel (2000 pcs.) Straight Lead #2C -- #002 Formed Lead #2U -- - * A single-sided phenolic printed circuit board (PCB) is preferred. Double-sided PCB and other materials may cause greater lead stress. Recommended throughhole diameter is 0.93 to 1.03 mm. Leadlength below the PCB should be 1.5 to 2.0 mm, and the clinching angle (angle between the lead and PCB) should be 30 10 degrees. AMMO PACK (for All options except #002) * If SMT devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are auto-inserted. If curing must be done after lamp insertion, the cure temperature and time should not exceed 140C, 100 seconds. This is the temperature of the surface normal to the IR source. .... .... . R . ..... TO ..... .. RA T # ...... . E OP PARODE E .... . HP TE C DAT ....... . . DAPING........ .... S . TA ..... GAP ........ . BIN. OF TY . I NOANT QU FROM LEFT SIDE OF BOX, ADHESIVE TAPE IS FACING UPWARD. A + E OD AN DS LE DE MA ANODE LEAD LEAVES THE BOX FIRST. IA YS LA A NM 140 (5.51) I E - OD TH CA C 336 (13.23) 52 (2.05) DIMENSIONS IN MILLIMETERS (INCHES). TAPE & REEL (for option #002 only) REELING ORIENTATION CLOCKWISE ADHESIVE TAPE MUST BE FACING TOWARDS THE OUTSIDE OF THE REEL. ANODE LEAD LEAVES THE REEL FIRST. 110 (4.33) DIA. 336 (13.23) DIA. DIMENSIONS IN MILLIMETERS (INCHES). PROTECTIVE CARDBOARD Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: Manual Solder LED Component Lead Size Diagonal Plated Through Hole Diameter Pre-heat Temperature 105 C Max. - 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) Pre-heat Time 30 sec Max. - Peak Temperature 250 C Max. 260 C Max. 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Dwell Time 3 sec Max. 5 sec Max. Wave Soldering Dipping LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE - C Note: Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 90 100 TIME - SECONDS Figure 7. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4257EN AV02-1014EN - January 23, 2008