1. General description
The TFF1015HN/N1 is an integrated downconverter for use in Low Noise Block (LNB)
convertors in a 10 .7 GHz to 12.75 GHz Ku band satellite receiver system.
2. Features and benefits
Low current consumption integrated pre-amplifier, mixer, buffer amplifier and
PLL synthesizer
Flat gain over frequency
Single 5 V supply pin
Low cost 25 MHz crystal
Crystal controlled LO frequency generation
Switched LO frequency (9.75 GHz and 10.6 GHz)
Low phase noise
Low spurious
Low external com p on e nt count
Alignment-free concept
ESD protection on all pins
3. Applications
Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2)
4. Quick reference data
TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
Rev. 1 — 12 September 2011 Product data sheet
Table 1. Quick reference data
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 5 5.5 V
ICC supply current RF input and IF output AC coupled - 52 - mA
NFSSB single sideband noise figure measured at low band fIF = 1450 MHz and
high band fIF =1625MHz -7- dB
fi(RF) RF input frequency low band 10.7 - 11.7 GHz
high band 11.7 - 12.75 GHz
Gconv conversion gain measured at low band fIF = 1450 MHz and
high band fIF =1625MHz -39- dB
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 2 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
5. Ordering information
6. Block diagram
s11 input reflection coefficient fRF = 10.7 GHz to 12.7 GHz - 10 - dB
s22 output reflection coefficient fIF_OUT = 950 MHz to 2150 MHz; Z0=75-10 - dB
IP3Ooutput third-order intercept point carrier power is 10 dBm (measured at output) - 15 - dBm
Table 1. Quick reference data …continued
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TFF1015HN/N1 DHVQFN16 plastic dual in-line compatible thermal enhanced ve ry thin quad flat
package; no leads; 16 terminals; body 2.5 3.5 0.85 mm SOT763-1
Fig 1. TFF1015HN/N1 block diag ram
aaa-000007
IF
14
3
2
4
5
1
16
6
7
9
8
12
10
HB
11
15
13
IF_GND
RF_GND1
n.c.
RF
RF_GND2
RF_GND3
V
CC
GND1
n.c.
VREG
LF
XO1
XO2
GND2
DIVIDER
PFD
CHARGE
PUMP
ON-CHIP
REGULATOR
internal
supplies
and bias
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 3 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
7. Functional diagram
8. Pinning information
8.1 Pinning
8.2 Pin description
Fig 2. Functional diagram
PLL
HB
XO2
XO1
RF
VCC
I
9.75 GHz/10.6 GHz
aaa-00000
Fig 3. Pin configurat io n
aaa-000009
n.c. HB
GND1 XO2
RF_GND2 XO1
RF GND2
n.c. IF
RF_GND1 IF_GND
LF
VREG
RF_GND3
V
CC
Transparent top view
710
611
512
413
314
215
8
9
1
16
terminal 1
index area
Table 3. Pin description
Symbol Pin Description
GND 0 ground (exposed die pad)
RF_GND3 1 RF ground. Connect this pin to the exposed die pad landing.
RF_GND1 2 RF ground. Connect this pin to the exposed die pad landing and the RF inpu t CPW line.
n.c. 3 not connected. Connect to RF on PCB. [1]
RF 4 RF input.
RF_GND2 5 RF ground. Connect this pin to the exposed die pad landing and the RF inpu t CPW line.
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 4 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
[1] The distance between the outer edges of pin 2 and pin 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50 line
on RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1015HN/N1.
9. Limiting values
10. Recommended operating conditions
[1] For a 10.75 GHz LO frequency, select high band and use a crystal with frequency 10.75 GHz / 424 = 25.353774 MHz.
GND1 6 Ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
n.c. 7 not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.
LF 8 Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).
VREG 9 Regulated output voltage for PLL loop filter . Connect loop filter to this pin. Decouple against die pad via pin
7.
HB 10 High band / low band selection. Connect this pin to the tone detector or to a logic signal.
XO2 11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).
XO1 12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).
GND2 13 Ground. Connect this pin to the exposed die pad landing.
IF 14 IF output
IF_GND 15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.
VCC 16 Supply voltage
Table 3. Pin description continued
Symbol Pin Description
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +6 V
VI(HB) input voltage on pin HB 0.5 +6 V
Tstg storage temperature 40 +125 C
Table 5. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 5 5.5 V
VI(HB) input voltage on pin HB 0 - 5.5 V
Tamb ambient temperature 40 +25 +85 C
Z0characteristic impedance - 50 -
fi(RF) RF input frequency low band 10.7 - 11.7 GHz
high band 11.7 - 12.75 GHz
fLO LO frequency low band - 9.75 - GHz
high band [1] -10.6- GHz
fo(IF) IF output frequency low band 0.95 - 1.95 GHz
high band 1.1 - 2.15 GHz
CL(xtal) crystal load capacitance - 10 - pF
ESR equivalent series resistance - - 40
fxtal crystal frequency - 25 - MH z
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 5 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
11. Thermal characteristics
12. Characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case 35 K/W
Table 7. Characteristics
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICC supply current RF input and IF output AC coupled - 52 - mA
n(itg) integrated phase noise density integration offset frequency =
10kHzto13MHz;
loop bandwidth = crossover bandwidth
-1.5- RMS
NFSSB single sideband noise figure measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz -7- dB
Gconv conversion gain measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz -39- dB
Gconv conversion gain variation over whole IF band - 2.0 - dB
in every 36 MHz band - 0.5 - dB
s11 input reflection coefficient fRF = 10.7 GHz to 12.7 GHz - 10 - dB
s22 output reflection coefficient fIF_OUT = 950 MHz to 2150 MHz;
Z0=75
-10 - dB
IP3Ooutput third-order intercept point carrier power is 10 dBm (measured at
the output) -15- dBm
PL(1dB) output power at 1 dB gain
compression -6- dBm
VIL(HB) low level input voltage on pin HB - - 0.8 V
VIH(HB) high level input voltage on pin HB 2.0 - - V
Rpd(HB) pull down resistance on pin HB 80 110 140 k
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 6 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
13. Application information
Fig 4. Application diagram of TFF1015HN/N1
5 V LINEAR
REGULATOR
9 V ~ 21 V5 V
pHemt bias
V/T detector
LB
HB
D2
G2
DV
GV
RF_GND1 IF_GND
IF
GND2
XO1
25 MHz
crystal
IF
XO2
HB
RF_GND3
LF
VREG VCC
n.c.
2
116
89
3
4
5
6
7
15
14
13
12
11
10
DH
GH
aaa-000010
GH
H
V
DH
GV DV
G2 D2
RF
RF_GND2
GND1
n.c.
1 μF
1 μF
100 nF
100 pF
220 pF
330 Ω
Table 8. List of netnames
See Figure 4.
Netname Description
GH Gate voltage of 1st stage LNA. Horizontal polarization
DH Drain voltage of 1st stage LNA. Horizontal polarization
GV Gate voltage of 1st stage LNA. Vertical polarization
DV Drain voltage of 1st stage LNA. Vertical polarization
G2 Gate voltage of 2nd stage LNA
D2 Drain voltage of 2nd stage LNA
HB High band oscillator supply control
LB Low band oscillator supply control
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 7 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
Fig 5. LNB system block diagram with TFF1015HN/N1
SUPPLY AND
BAND/POLARIZATION SWITCHING 5 V
REGULATOR
V
CC
HB
RF gain
image
reject filter
horizontal
polarization
vertical
polarization
mixer lF gain
PLL
9.75 GHz/10.6 GHz
1st STAGE LNA
1st STAGE LNA
2nd STAGE LNA
aaa-000011
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 8 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
14. Package outline
Fig 6. Package outline SOT763-1
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.6
3.4
Dh
2.15
1.85
y1
2.6
2.4 1.15
0.85
e1
2.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT763-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT763-1
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
27
15 10
9
8
1
16
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 9 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
15. Abbreviations
16. Revision history
Table 9. Abbreviations
Acronym Description
CPW CoPlanar Waveguide
DVB-S Digital Video Broadcasting by Satellite
DVB-S2 Digital Video Broadcasting - Satellite - Second generation
ESD ElectroStatic Discharge
IF Intermediate Frequency
Ku band K-under band
LO Local Oscillator
PFD Phase Frequency Detector
pHemt pseudomorphic High electron mobility transistor
PLL Phase-Locked Loop
RF Radio Frequency
VCO Voltage-Controlled Oscillator
V/T Voltage / Tone
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TFF1015HN_N1 v.1 20110912 Product data sheet - -
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 10 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental ,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-crit ical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liabili ty related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specificati on for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specificatio n.
TFF1015HN_N1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 12 September 2011 11 of 12
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omo tive use. It i s neit her qua lif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specif ications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
17.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors TFF1015HN/N1
Integrated mixer oscillator PLL for satellite LNB
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 September 2011
Document identifier: TFF1015HN_N1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
8 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
8.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Recommended operating conditions. . . . . . . . 4
11 Thermal characteristics . . . . . . . . . . . . . . . . . . 5
12 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
13 Application information. . . . . . . . . . . . . . . . . . . 6
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
18 Contact information. . . . . . . . . . . . . . . . . . . . . 11
19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12