TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 DUAL PROCESSOR SUPERVISORS FEATURES DESCRIPTION 1 * Dual Supervisory Circuits for DSP- and Processor-Based Systems * Power-On Reset Generator with Fixed Delay Time of 200ms; no External Capacitor Needed * Watchdog Timer Retriggers the RESET Output at SENSEn VIT+ * Temperature-Compensated Voltage Reference * Maximum Supply Current of 40A * Supply Voltage Range: 2.7V to 6V * Defined RESET Output From VDD 1.1V * MSOP-8 and SO-8 Packages * Temperature Range: -40C to +85C 2 APPLICATIONS * * * * * * Processor Supply Monitoring Industrial Equipment Automotive Systems Portable/Battery-Powered Equipment Wireless Communication Systems Notebook/Desktop Computers The TPS3305 family is a series of micropower supply voltage supervisors designed for circuit initialization. Its dual monitor topology is well-suited to use in DSP and processor-based systems, which often require two supply voltages, core and I/O. RESET is asserted when the voltage at either SENSEn pin falls below its threshold voltage, VIT. When both SENSEn pins are again above their respective threshold voltages, RESET is held low for the factory-programmed delay time (200ms typ). RESET is also asserted if the watchdog input (WDI) is not toggled for more than 1.6s typ. The TPS3305-xx devices are available in either 8-pin MSOP or SO packages, and are specified for operation over a temperature range of -40C to +85C. 5V TPS73233 VIN GND 3.3V VOUT GND VIN D OR DGN PACKAGE (TOP VIEW) SENSE1 VDD SENSE2 MR WDI GND RESET RESET External Reset Source TPS73618 VOUT VDD SENSE1 MR SENSE2 1.8V DSP VI/O VCORE TPS3305-18 RESET WDI GND RESET WDO GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1998-2008, Texas Instruments Incorporated TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) NOMINAL SUPERVISED VOLTAGE (1) THRESHOLD VOLTAGE (TYP) DEVICE SENSE1 SENSE2 SENSE1 SENSE2 TPS3305-18 3.3 V 1.8 V 2.93 V 1.68 V TPS3305-25 3.3 V 2.5 V 2.93 V 2.25 V TPS3305-33 5.0 V 3.3 V 4.55 V 2.93 V For the most current specifications and package information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating junction temperature range (unless otherwise noted). UNIT Supply voltage range, VDD -0.3V to +7V VMR, VWDI -0.3V to VDD + 0.3V Input voltage at SENSE1 and SENSE2, VI (VDD + 0.3)VIT / 1.25V VRESET, VRESET -0.3V to +7V Maximum low output current, IOL 5mA Maximum high output current, IOH -5mA Input clamp current, IIK (VI < 0 or VI > VDD) 20mA Output clamp current, IOK (VO < 0 or VO > VDD) 20mA Continuous total power dissipation See Dissipation Ratings Table Operating junction temperature range, TJ -40C to +85C Storage temperature range, Tstg -65C to +150C Soldering temperature (1) (2) +260C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. DISSIPATION RATINGS TABLE TA +25C POWER RATING DERATING FACTOR ABOVE TA = +25C DGN 2.14W 17.1mW/C 1.37W 1.11W D 725mW 5.8mW/C 464mW 377mW PACKAGE 2 Submit Documentation Feedback TA = +70C POWER RATING TA = +85C POWER RATING Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 ELECTRICAL CHARACTERISTICS Over operating junction temperature range (unless otherwise noted). TPS3305-xx PARAMETER TEST CONDITIONS VDD Input supply range TJ Operating junction temperature range VOH High-level output voltage VOL Low-level output voltage Power-up reset voltage (1) VSENSE1, VSENSE2 VSENSE1, VSENSE2 Vhys Hysteresis at VSENSEn input V V VDD = 2.7V to 6V, IOL = 20A 0.2 V VDD = 3.3V, IOL = 2mA 0.4 V VDD = 6V, IOL = 3mA 0.4 V VDD 1.1V, IOL = 20A 0.4 V VDD = 2.7V to 6V, TA = 0C to +85C VDD = 2.7V to 6V, TA = -40C to +85C V 2.30 V 2.86 2.93 3.0 V 4.46 4.55 4.64 V 1.64 1.68 1.73 V 2.20 2.25 2.32 V 2.86 2.93 3.02 V 4.46 4.55 4.67 V VIT- = 2.25V 20 mV VIT- = 2.93V 30 mV VIT- = 4.55V 40 mV Low-level input voltage at MR and WDI t / V Input transition rise and fall rate at MR (1) (2) 1.72 2.25 mV VIL Input capacitance 1.68 2.20 15 High-level input voltage at MR and WDI CI 1.64 VIT-= 1.68V VIH Supply current C VDD - 0.4V WDI = 0V, VDD = 6V Time average (dc = 12%) IDD +85 VDD - 0.4V Average low-level input current Low-level input current -40 VDD = 6V, IOH = -3mA IL(AV) IL V VDD = 3.3V, IOH = -2mA Average high-level input current WDI High-level input current UNIT 6.0 V IH(AV) IH MAX VDD - 0.2V WDI = VDD = 6V Time average (dc = 88%) WDI TYP 2.7 VDD = 2.7V to 6V, IOH = -20A Negative-going input threshold voltage (2) VIT- MIN 100 150 A -15 -20 A 0.7 x VDD V 0.3 x VDD V 50 ns/V 120 170 A WDI WDI = VDD = 6V MR MR = 0.7 x VDD, VDD = 6V -130 -180 A SENSE1 VSENSE1 = VDD = 6V 5 8 A SENSE2 VSENSE2 = VDD = 6V 6 9 A WDI WDI = 0V, VDD = 6V -120 -170 A MR MR = 0V, VDD = 6V -430 -600 A SENSEn VSENSE1,2 = 0V 1 A 40 A VI = 0V to VDD -1 10 pF The lowest supply voltage at which RESET becomes active. tr, VDD 15 s/V. To ensure best stability of the threshold voltage, a bypass capacitor (0.1 F ceramic) should be placed close to the supply terminals. Submit Documentation Feedback Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 3 TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 TIMING DIAGRAM SENSEn V(nom) VIT- t MR 1 t 0 tt(out) WDI 1 t 0 RESET 1 t 0 td td td td RESET because of SENSE below VIT- RESET because of WDI RESET because of MR RESET because of SENSE below VIT- RESET because of SENSE below VIT- TIMING REQUIREMENTS At VDD = 2.7V to 6V, RL = 1M, CL = 50pF, and TJ = +25C. PARAMETER TEST CONDITIONS SENSEn tw Pulse width MR WDI MIN VIH = 0.7 x VDD, VIL = 0.3 x VDD TYP MAX UNIT 6 s 100 ns 100 ns VSENSEnL = VIT- -0.2V, VSENSEnH = VIT+ +0.2V SWITCHING CHARACTERISTICS At VDD = 2.7V to 6V, RL = 1M, CL = 50pF, and TJ = +25C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 1.1 1.6 2.3 s 140 200 280 ms tt(out) Watchdog time-out VI(SENSEn) VIT+ +0.2V, MR 0.7 x VDD See Timing Diagram td Delay time VI(SENSEn) VIT+ +0.2V, MR 0.7 x VDD See Timing Diagram tPHL Propagation (delay) time, high-to-low level output MR to RESET, MR to RESET VI(SENSEn) VIT+ +0.2V, VIH = 0.7 x VDD, VIL = 0.3 x VDD 200 500 ns tPLH Propagation (delay) time, low-to-high level output MR to RESET, MR to RESET VI(SENSEn) VIT+ +0.2V, VIH = 0.7 x VDD, VIL = 0.3 x VDD 200 500 ns tPHL Propagation (delay) time, high-to-low level output SENSEn to RESET, SENSEn to RESET VIH = VIT+ +0.2V, VIL = VIT- -0.2V, MR 0.7 x VDD 1 5 s tPLH Propagation (delay) time, low-to-high level output SENSEn to RESET, SENSEn to RESET VIH = VIT+ +0.2V, VIL = VIT- -0.2V, MR 0.7 x VDD 1 5 s 4 Submit Documentation Feedback Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 DEVICE INFORMATION FUNCTION/TRUTH TABLE (1) (1) MR SENSE1 > VIT1 SENSE2 > VIT2 RESET RESET L X X L H H 0 0 L H H 0 1 L H H 1 0 L H H 1 1 H L X = Don't care FUNCTIONAL BLOCK DIAGRAM VDD TPS3305 14kW MR R1 SENSE1 RESET R2 RESET Logic + Timer R3 SENSE2 RESET R4 GND Reference Voltage of 1.25V Transition Detection WDI Oscillator Watchdog Logic + Timer 40kW TERMINAL FUNCTIONS TERMINAL NAME NO. DESCRIPTION GND 4 Ground MR 7 Manual reset RESET 5 Active-low reset output RESET 6 Active-high reset output SENSE1 1 Sense voltage input 1 SENSE2 2 Sense voltage input 2 WDI 3 Watchdog timer input VDD 8 Supply voltage Submit Documentation Feedback Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 5 TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 TYPICAL CHARACTERISTICS NORMALIZED SENSE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE AT VDD SUPPLY CURRENT vs SUPPLY VOLTAGE 18 VDD = 6V 16 MR = Open 1.004 14 TPS3305-33 1.003 12 1.002 IDD - Supply Current - mA Normalized Input Threshold Voltage - VIT(TA), VIT(+25C) 1.005 1.001 1 0.999 0.998 0.997 0.996 10 8 6 4 2 0 -2 -4 SENSEn = VDD -6 MR = Open TJ = +25C -8 0.995 -40 -15 10 35 60 -10 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 85 VDD - Supply Voltage - V TJ - Junction Temperature - C Figure 1. Figure 2. INPUT CURRENT vs INPUT VOLTAGE AT MR MINIMUM PULSE DURATION AT SENSE vs THRESHOLD OVERDRIVE 100 10 VDD = 6V VDD = 6V TJ = +25C -100 -200 II - Input Current - mA MR = Open 9 tW - Minimum Pulse Duration at Vsense - ms 0 -300 -400 -500 -600 -700 -800 8 7 6 5 4 3 2 1 -900 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 VI - Input Voltage at MR - V 0 5 5.5 6 6.5 0 100 300 400 500 600 700 800 900 1000 SENSE - Threshold Overdrive - mV Figure 3. 6 200 Figure 4. Submit Documentation Feedback Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 TPS3305 www.ti.com SLVS198C - DECEMBER 1998 - REVISED MARCH 2008 TYPICAL CHARACTERISTICS (continued) HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 2.5 6.5 VDD = 2V VDD = 6V 6 MR = Open MR = Open 2 VOH - High-Level Output Voltage - V VOH - High-Level Output Voltage - V 5.5 1.5 -40C 1 +85C 5 4.5 4 -40C 3.5 3 +85C 2.5 2 1.5 0.5 1 0.5 0 0 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4 -4.5 -5 -5.5 -6 0 -5 -10 -15 -20 IOH - High-Level Output Current - mA -25 -30 -35 -40 -45 -50 IOH - High-Level Output Current - mA Figure 5. Figure 6. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 6.5 2.5 VDD = 2V VDD = 6V 6 MR = Open MR = Open VOL - Low-Level Output Voltage - V VOL - Low-Level Output Voltage - V 5.5 2 1.5 1 +85C 0.5 5 4.5 4 3.5 3 2.5 +85C 2 1.5 -40C -40C 1 0.5 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0 5 10 15 20 25 30 35 40 45 IOL - Low-Level Output Current - mA IOL - Low-Level Output Current - mA Figure 7. Figure 8. 50 55 Submit Documentation Feedback Copyright (c) 1998-2008, Texas Instruments Incorporated Product Folder Link(s): TPS3305 60 7 PACKAGE OPTION ADDENDUM www.ti.com 20-Mar-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS3305-18D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DGN ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DGNG4 ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DGNR ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DGNRG4 ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-18DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DGN ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DGNG4 ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DGNR ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DGNRG4 ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-25DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DGN ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DGNG4 ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DGNR ACTIVE MSOP- DGN 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 20-Mar-2008 Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Power PAD Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) TPS3305-33DGNRG4 ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3305-33DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS3305-18DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-18DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3305-25DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-25DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3305-33DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3305-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3305-18DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3305-18DR SOIC D 8 2500 367.0 367.0 35.0 TPS3305-25DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3305-25DR SOIC D 8 2500 367.0 367.0 35.0 TPS3305-33DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3305-33DR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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