Features
l For surface mount applications in in order to optimize
board space
l Low profile package
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Low inductance
Mechanical Data
l CASE: JEDEC DO-214AB
l Terminals: solderable per MIL-STD-750, Method 2026
l Polarity: Color band denotes positive end (cathode)
except Bidirectional
l Maximum soldering temperature: 250oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform IPP See Table 1 Note: 1
Peak Pulse Power
Dissipation PPP 1500W Note: 1,
Peak Forward Surge
Current IFSM) 200A Note: 3
Operation And Storage
Temperature Range TJ, TSTG-55oC to
+150oC
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above
TA=25oC per Fig.2.
2. Mounted on 8.0mm2 copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
1.5SMCJ
6.8(C)A
THRU
1.5SMCJ550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
1500 Watt
www.mccsemi.com
l Excellent clamping capability
omponents
20736 Marilla Street Chatsworth
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MCC
Revision: 1 2004/06/24
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .079 .103 2.00 2.62
B .108 .128 2.75 3.25
C .002 .008 0.051 0.203
D .006 .012 0.152 0.305
E .030 .050 0.76 1.27
F ..305 .320 7.75 8.13
G .260 .280 6.60 7.11
H .220 .245 5.59 6.22
0.060
0.185
0.121
SUGGESTED SOLDER
PAD LAYOUT
G
H
E
D
F
A
B
C
DO-214AB
(SMCJ) (LEAD FRAME)