M TC4431/TC4432 1.5A High-Speed 30V MOSFET Drivers Features General Description * High Peak Output Current - 1.5A * Wide Input Supply Voltage Operating Range: - 4.5V to 30V * High Capacitive Load Drive Capability: - 1000 pF in 25 nsec * Short Delay Times - <78 nsec Typ. * Low Supply Current: - With Logic `1' Input - 2.5 mA - With Logic `0' Input - 300 A * Low Output Impedance - 7 * Latch-Up Protected: Will Withstand >300 mA Reverse Current * ESD Protected - 4 kV The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch-up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Undervoltage lockout circuitry forces the output to a `low' state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 should be left floating. The under-voltage lockout and start-up circuit gives brownout protection when driving MOSFETS. Applications * Small Motor Drive * Power MOSFET Driver * Driving Bipolar Transistors Package Types 8-Pin PDIP/SOIC/CERDIP VDD 1 8 VDD IN 2 7 OUT TC4431 LOCK DIS 3 6 OUT GND 4 5 GND 7 2 Inverting 6 VDD 1 8 VDD IN 2 7 OUT TC4432 LOCK DIS 3 6 OUT GND 4 5 GND 2 7 6 Non Inverting 2003 Microchip Technology Inc. DS21424C-page 1 TC4431/TC4432 Functional Block Diagram 8 V DD 3 LOCK DIS UV LOCK 2 mA Inverting TC4431 7 OUT OUT 6 2 Input 4, 5 GND 250 mV Non-Inverting TC4432 TC4431/TC4432 Inverting/Non Inverting Effective Input C = 10 pF DS21424C-page 2 2003 Microchip Technology Inc. TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Supply Voltage ....................................................... 36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA 70C) PDIP ............................................................ 730 mW CERDIP ....................................................... 800 mW SOIC............................................................ 470 mW Maximum Junction Temperature, TJ ................ +150C Storage Temperature Range.............. -65C to +150C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25C with 4.5V VDD 30V. Parameters Sym Min Typ Max Units Conditions Input Logic `1', High Input Voltage VIH 2.4 -- -- V Logic `0', Low Input Voltage VIL -- -- 0.8 V Input Current (Note 1) IIN -1 -- 1 A 0V VIN 12V IOUT = 100 mA Output High Output Voltage VOH VDD - 1.0 VDD - 0.8 -- V Low Output Voltage VOL -- -- 0.025 V Output Resistance RO -- 7 10 IOUT = 10 mA, VDD = 30V Peak Output Current IPK -- -- 3.0 1.5 -- -- A Source: VDD = 30V Sink: VDD = 30V Latch-Up Protection Withstand Reverse Current IREV -- 0.3 -- A Duty cycle 2%, t 300 sec tR -- 25 40 nsec Figure 4-1 Fall Time tF -- 33 50 nsec Figure 4-1 Delay Time tD1 -- 62 80 nsec Figure 4-1 Delay Time tD2 -- 78 90 nsec Figure 4-1 Power Supply Current IS -- -- 2.5 0.3 4 0.4 mA Start-up Threshold VS -- 8.4 10 V Drop-out Threshold VDO 7 7.7 -- V Switching Time (Note 2) Rise Time Power Supply Note 1: 2: 3: VIN = 3V VIN = 0V Note 3 For inputs >12V, add a 1 k resistor in series with the input. See "Typical Characteristics" graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. 2003 Microchip Technology Inc. DS21424C-page 3 TC4431/TC4432 DC CHARACTERISTICS (Continued) Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V VDD 30V. Parameters Sym Min Typ Max Units Conditions Logic `1', High Input Voltage VIH 2.4 -- -- V Logic `0', Low Input Voltage VIL -- -- 0.8 V IIN -10 -- 10 A 0V VIN 12V IOUT = 100 mA Input Input Current (Note 1) Output High Output Voltage VOH VDD - 1.2 -- -- V Low Output Voltage VOL -- -- 0.025 V Output Resistance RO -- -- 12 Rise Time tR -- -- 60 nsec Figure 4-1 Fall Time tF -- -- 70 nsec Figure 4-1 Delay Time tD1 -- -- 100 nsec Figure 4-1 Delay Time tD2 -- -- 110 nsec Figure 4-1 Power Supply Current IS -- -- -- -- 6 0.7 mA Start-up Threshold VS -- 8.4 10 V Drop-out Threshold VDO 7 7.7 -- V IOUT = 10 mA, VDD = 30V Switching Time (Note 2) Power Supply Note 1: 2: 3: VIN = 3V VIN = 0V Note 3 For inputs >12V, add a 1 k resistor in series with the input. See "Typical Characteristics" graph for input current. Switching times are ensured by design. For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 30V. Parameters Sym Min Typ Max Units Specified Temperature Range (C) TA 0 -- +70 C Conditions Temperature Ranges Specified Temperature Range (E) TA -40 -- +85 C Maximum Junction Temperature TJ -- -- +150 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 8L-SOIC JA -- 155 -- C/W Thermal Resistance, 8L-PDIP JA -- 125 -- C/W Thermal Resistance, 8L-CERDIP JA -- 150 -- C/W Package Thermal Resistances DS21424C-page 4 2003 Microchip Technology Inc. TC4431/TC4432 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C with 4.5V V DD 30V. 60 150 50 125 40 100 Time (nsec) ISUPPLY (mA) CLOAD = 1000 pF TA = +25C 2 MHz VDD = 12V 30 900 kHz 20 600 kHz 10 tFALL 75 50 tRISE 25 200 kHz 20 kHz 0 100 0 1000 CLOAD (pF) FIGURE 2-1: Capacitive Load. 3 10,000 Supply Current vs. 6 9 15 18 VDD (V) 24 27 30 300 CLOAD = 1000 pF TA = +25C 45 250 tD1 40 35 TIME (nsec) INPUT CURRENT (mA) 21 Rise/Fall Time vs. VDD. FIGURE 2-3: 50 12 30 25 20 WITHOUT 1 K RES. 200 150 tD2 100 15 10 50 WITH 1 K RES. 5 0 0 3 FIGURE 2-2: Voltage. 6 9 12 15 18 21 24 INPUT VOLTAGE (VIN) 27 30 Input Current vs. Input 2003 Microchip Technology Inc. 3 FIGURE 2-4: 6 9 12 15 18 VDD (V) 21 24 27 30 tD1 and tD2 Delay vs. VDD. DS21424C-page 5 TC4431/TC4432 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol 1 VDD 2 IN TTL/CMOS Compatible Input 3 LOCK DIS Input Pin, Enable/Disable for UV Lockout 4 GND Ground 5 GND Ground 6 OUT Drive Output, Pull Down 7 OUT Drive Output, Pull Up 8 VDD Supply Input, 4.5V to 30V 3.1 Description Supply Input, 4.5V to 30V Supply Input (VDD) The V DD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven. 3.2 Control Input (IN) 3.3 Lockout Disable (LOCK DIS) The lockout pin enables/disables the undervoltage lock-out feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return. 3.5 Drive Output (OUT) The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5A peak currents from a capacitive load. The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended. DS21424C-page 6 2003 Microchip Technology Inc. TC4431/TC4432 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 30V 0V 4.7 F 1, 8 Input 2 0.1 F 10% tD1 VDD tD2 tF 90% 90% Output 7 Output 6 10% 10% 0V Inverting Driver C L= 1000 pF +5V LOCK DIS tR 3 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec 0V VDD 10% tD1 90% Output 0V 10% tR 90% tD2 tF 10% Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit. 2003 Microchip Technology Inc. DS21424C-page 7 TC4431/TC4432 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN 8-Lead CERDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Legend: Note: * XX...X YY WW NNN Example: TC4431 CPA256 0302 Example: TC4431 COA0302 256 Example: TC4431 EJA256 0302 Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21424C-page 8 2003 Microchip Technology Inc. TC4431/TC4432 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B1 B eB MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2003 Microchip Technology Inc. DS21424C-page 9 TC4431/TC4432 8-Lead Ceramic Dual In-line (JA) - 300 mil (CERDIP) E1 2 1 n D E A2 A c L B1 eB B A1 Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030 A A1 E E1 D L c B1 B eB p MIN .160 .020 .290 .230 .370 .125 .008 .045 .016 .320 INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360 MAX .200 .040 .320 .300 .400 .200 .015 .065 .020 .400 MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15 MIN MAX 5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16 Drawing No. C04-010 DS21424C-page 10 2003 Microchip Technology Inc. TC4431/TC4432 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2003 Microchip Technology Inc. DS21424C-page 11 TC4431/TC4432 NOTES: DS21424C-page 12 2003 Microchip Technology Inc. TC4431/TC4432 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: X /XX Temperature Range TC4431: TC4432: Package 1.5A High-Speed 30V MOSFET Driver, Inverting 1.5A High-Speed 30V MOSFET Driver, Non Inverting Examples: a) b) a) b) Temperature Range: C E = = 0C to +70C -40C to +85C Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead TC4431COA: 1.5A MOSFET driver, SOIC package, 0C to +70C. TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40C to +85C. TC4432CPA: 1.5A MOSFET driver, PDIP package, 0C to +70C. TC4432EPA: 1.5A MOSFET driver, PDIP package, -40C to +85C. * Offered in E-temp range only. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21424C-page 13 TC4431/TC4432 NOTES: DS21424C-page 14 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2003 Microchip Technology Inc. DS21424C-page 15 DSTEMP DS21424C-page 16 2003 Microchip Technology Inc. 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