LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
www.ti.com
SNOSBR8K –JULY 1999–REVISED APRIL 2013
LM79LXXAC Series 3-Terminal Negative Regulators
Check for Samples: LM79L05,LM79L12,LM79L12AC,LM79L15,LM79L15AC
1FEATURES DESCRIPTION
The LM79LXXAC series of 3-terminal negative
2• Preset Output Voltage Error is Less than ±5% voltage regulators features fixed output voltages of
Over Load, Line and Temperature −5V, −12V, and −15V with output current capabilities
• Specified at an Output Current of 100mA in excess of 100mA. These devices were designed
• Easily Compensated with a Small 0.1μF Output using the latest computer techniques for optimizing
the packaged IC thermal/electrical performance. The
Capacitor LM79LXXAC series, when combined with a minimum
• Internal Short-Circuit, Thermal and Safe output capacitor of 0.1μF, exhibits an excellent
Operating Area Protection transient response, a maximum line regulation of
• Easily Adjustable to Higher Output Voltages 0.07% VO/V, and a maximum load regulation of
0.01% VO/mA.
• Maximum Line Regulation Less than 0.07%
VOUT/V The LM79LXXAC series also includes, as self-
• Maximum Load Regulation Less than 0.01% protection circuitry: safe operating area circuitry for
output transistor power dissipation limiting, a
VOUT/mA temperature independent short circuit current limit for
• See AN-1112 (SNVA009) for DSBGA peak output current limiting, and a thermal shutdown
Considerations circuit to prevent excessive junction temperature.
Although designed primarily as fixed voltage
regulators, these devices may be combined with
simple external circuitry for boosted and/or adjustable
voltages and currents. The LM79LXXAC series is
available in the 3-lead TO package, the 8-lead SOIC
package, and the 6-Bump DSBGA package.
For output voltages other than the pre-set -5V, -12V
and -15V, the LM137L series provides an adjustable
output voltage range from -1.2V to -47V.
Typical Applications
*Required if the regulator is located far from the power supply filter.
A 1μF aluminum electrolytic may be substituted. −V0=−5V −(5V/R1 + IQ) • R2,
**Required for stability. A 1μF aluminum electrolytic may be 5V/R1 > 3 IQ
substituted. Figure 1. Fixed Output Regulator Figure 2. Adjustable Output Regulator
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
A2
-VOUT -VIN
GND -VIN
B2 C2
A1 B1 C1
-VOUT
GND
-VOUT
-VIN
-VIN
NC
NC
-VIN
-VIN
GND
1
2
3
4
8
7
6
5
LM79LXXACM
LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
SNOSBR8K –JULY 1999–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Connection Diagram
Pins labeled 'NC' on LM79LXXACM 8-Lead SOIC (pin 4 and pin 8) are Open, no internal connection.
Figure 3. 8-Lead SOIC Narrow (D)
Top View
Figure 4. 3–Lead TO-226 (LP)
Bottom View
Figure 5. 6-Bump DSBGA
Top View (Bump Side Down)
2Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
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LM79L05AC is OBSOLETE
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LM79L15, LM79L15AC
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SNOSBR8K –JULY 1999–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)
Input Voltage
VO=−5V, −12V, −15V −35V
Internal Power Dissipation (3) Internally Limited
Operating Temperature Range 0°C to +70°C
Maximum Junction Temperature +125°C
Storage Temperature Range −55°C to +150°C
Lead Temperature
(Soldering, 10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Thermal resistance of TO-226 (LP) package is 60°C/W θJC, 232°C/W θJA at still air, and 88°C/W at 400 ft/min of air. The θJA of the
LM78LXX in the 6-Bump DSBGA package is 114°C/W when mounted on a 4-Layer JEDEC test board (JESD 51-7). The θJA of the
LM78LXX in the SOIC-8 (D) package is 180°C/W in still air. The maximum junction temperature shall not exceed 125°C on electrical
parameters.
Electrical Characteristics (1)
TA= 0°C to +70°C unless otherwise noted.
Output Voltage −5V −12V −15V
Input Voltage (unless otherwise noted) −10V −17V −20V
Symbol Parameter Conditions Min Typ Max Min Typ Max Min Typ Max Units
TJ= 25°C, IO= 100mA −5.2 −5−4.8 −12.5 −12 −11.5 −15.6 −15 −14.4
−15.7
1mA ≤IO≤100mA −5.25 −4.75 −12.6 −11.4 −14.25
5
Output
VOVMIN ≤VIN ≤VMAX (−20 ≤VIN ≤ −7.5) (−27 ≤VIN ≤ −14.8) (−30 ≤VIN ≤ −18) V
Voltage −15.7
1mA ≤IO≤40mA −5.25 −4.75 −12.6 −11.4 −14.25
5
VMIN ≤VIN ≤VMAX (−20 ≤VIN ≤ −7) (−27 ≤VIN ≤ −14.5) (−30 ≤VIN ≤ −17.5)
TJ= 25°C, IO= 100mA 60 45 45 mV
VMIN ≤VIN ≤VMAX (−20 ≤VIN ≤ −7.3) (−27 ≤VIN ≤ −14.6) (−30 ≤VIN ≤ −17.7) V
Line
ΔVORegulation TJ= 25°C, IO= 40mA 60 45 45 mV
VMIN ≤VIN ≤VMAX (−20 ≤VIN ≤ −7) (−27 ≤VIN ≤ −14.5) (−30 ≤VIN ≤ −17.5) V
TJ= 25°C 50 100 125 mV
Load
ΔVORegulation 1mA ≤IO≤100mA
Long Term mV/kh
ΔVOIO= 100mA 20 48 60
Stability rs
Quiescent
IQIO= 100mA 2 6 2 6 2 6 mA
Current 1mA ≤IO≤100mA 0.3 0.3 0.3
Quiescent 1mA ≤IO≤40mA 0.1 0.1 0.1 mA
ΔIQCurrent IO= 100mA 0.25 0.25 0.25 mA
Change VMIN ≤VIN ≤VMAX (−20 ≤VIN ≤ −7.5) (−27 ≤VIN ≤ −14.8) (−30 ≤VIN ≤ −18) V
Output Noise TJ= 25°C, IO= 100mA
Vn40 96 120 μV
Voltage f = 10Hz −10kHz
Ripple TJ= 25°C, IO= 100mA
ΔVIN/ΔVO50 52 50 dB
Rejection f = 120Hz
Input Voltage TJ= 25°C, IO= 100mA −7.3 −14.6 −17.7 V
Required to
Maintain Line IO= 40mA −7.0 −14.5 −17.5 V
Regulation
(1) To ensure constant junction temperature, low duty cycle pulse testing is used.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
SNOSBR8K –JULY 1999–REVISED APRIL 2013
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Typical Performance Characteristics
Maximum Average Power Dissipation (TO-226) Peak Output Current
Figure 6. Figure 7.
Short Circuit Output Current Dropout Voltage
Figure 8. Figure 9.
Output Voltage vs. Temperature
Ripple Rejection (Normalized to 1V @ 25°C)
Figure 10. Figure 11.
4Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
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LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
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SNOSBR8K –JULY 1999–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Quiescent Current Output Impedance
Figure 12. Figure 13.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
SNOSBR8K –JULY 1999–REVISED APRIL 2013
www.ti.com
TYPICAL APPLICATIONS
Figure 14. ±15V, 100mA Dual Power Supply
Schematic Diagrams
Figure 15. −5V Schematic Diagram
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Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
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SNOSBR8K –JULY 1999–REVISED APRIL 2013
Figure 16. −12V and −15V Schematic Diagram
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
LM79L05AC is OBSOLETE
LM79L05, LM79L12, LM79L12AC
LM79L15, LM79L15AC
SNOSBR8K –JULY 1999–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision J (April 2013) to Revision K Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM79L05ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM79L
05ACM
LM79L05ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
05ACM
LM79L05ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
05ACM
LM79L05ACTL/NOPB ACTIVE DSBGA YZR 6 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM 0 to 70 P
B
LM79L05ACTLX/NOPB ACTIVE DSBGA YZR 6 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM 0 to 70 P
B
LM79L05ACZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS
& no Sb/Br) SN N / A for Pkg Type 320L
79L05
LM79L05ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN N / A for Pkg Type 0 to 70 320L
79L05
LM79L12ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM79L
12ACM
LM79L12ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
12ACM
LM79L12ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
12ACM
LM79L12ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS
& no Sb/Br) SN N / A for Pkg Type 320L
79L12
LM79L12ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN N / A for Pkg Type 0 to 70 320L
79L12
LM79L15ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM79L
15ACM
LM79L15ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
15ACM
LM79L15ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM79L
15ACM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM79L05ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM79L05ACTL/NOPB DSBGA YZR 6 250 178.0 8.4 1.09 1.88 0.76 4.0 8.0 Q1
LM79L05ACTLX/NOPB DSBGA YZR 6 3000 178.0 8.4 1.09 1.88 0.76 4.0 8.0 Q1
LM79L12ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM79L15ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM79L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM79L05ACTL/NOPB DSBGA YZR 6 250 210.0 185.0 35.0
LM79L05ACTLX/NOPB DSBGA YZR 6 3000 210.0 185.0 35.0
LM79L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM79L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 2
MECHANICAL DATA
YZR0006xxx
www.ti.com
TLA06XXX (Rev C)
0.600±0.075 D
E
NOTES:
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
4215044/A 12/12
D: Max =
E: Max =
1.845 mm, Min =
1.057 mm, Min =
1.784 mm
0.996 mm
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
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TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
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