QFET TM FQPF27P06 60V P-Channel MOSFET General Description Features These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. These devices are well suited for low voltage applications such as automotive, DC/DC converters, and high efficiency switching for power management in portable and battery operated products. * * * * * * * -17A, -60V, RDS(on) = 0.07 @VGS = -10 V Low gate charge ( typical 33 nC) Low Crss ( typical 120 pF) Fast switching 100% avalanche tested Improved dv/dt capability 175C maximum junction temperature rating S ! G! GD S TO-220F ! D FQPF Series Absolute Maximum Ratings Symbol VDSS ID TC = 25C unless otherwise noted Parameter Drain-Source Voltage - Continuous (TC = 25C) Drain Current - Continuous (TC = 100C) IDM Drain Current VGSS Gate-Source Voltage EAS Single Pulsed Avalanche Energy IAR Avalanche Current EAR Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25C) dv/dt PD TJ, TSTG TL - Pulsed FQPF27P06 -60 Units V -17 A -12 A -68 A 25 V (Note 2) 560 mJ (Note 1) -17 A (Note 1) 4.7 -7.0 47 0.31 -55 to +175 mJ V/ns W W/C C 300 C (Note 1) (Note 3) - Derate above 25C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Characteristics Symbol RJC Parameter Thermal Resistance, Junction-to-Case RJA Thermal Resistance, Junction-to-Ambient (c)2001 Fairchild Semiconductor Corporation Typ -- Max 3.19 Units C/W -- 62.5 C/W Rev. A2. May 2001 http://store.iiic.cc/ FQPF27P06 May 2001 Symbol TC = 25C unless otherwise noted Parameter Test Conditions Min Typ Max Units -60 -- -- V -- -0.06 -- V/C Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 A BVDSS / TJ Breakdown Voltage Temperature Coefficient ID = -250 A, Referenced to 25C IDSS IGSSF IGSSR VDS = -60 V, VGS = 0 V -- -- -1 A VDS = -48 V, TC = 150C -- -- -10 A Gate-Body Leakage Current, Forward VGS = -25 V, VDS = 0 V -- -- -100 nA Gate-Body Leakage Current, Reverse VGS = 25 V, VDS = 0 V -- -- 100 nA Zero Gate Voltage Drain Current On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 A -2.0 -- -4.0 V RDS(on) Static Drain-Source On-Resistance VGS = -10 V, ID = -8.5 A -- 0.055 0.07 gFS Forward Transconductance VDS = -30 V, ID = -8.5 A -- 12 -- S -- 1100 1400 pF -- 510 660 pF -- 120 155 pF ns (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = -25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge VDD = -30 V, ID = -13.5 A, RG = 25 (Note 4, 5) VDS = -48 V, ID = -27 A, VGS = -10 V (Note 4, 5) -- 18 45 -- 185 380 ns -- 30 70 ns -- 90 190 ns -- 33 43 nC -- 6.8 -- nC -- 18 -- nC A Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- -17 ISM -- -- -68 A VSD Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = -17 A Drain-Source Diode Forward Voltage -- -- -4.0 V trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = -27 A, dIF / dt = 100 A/s (Note 4) -- 105 -- ns -- 0.41 -- C Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 2.25mH, IAS = -17A, VDD = -25V, RG = 25 , Starting TJ = 25C 3. ISD -27A, di/dt 300A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test : Pulse width 300s, Duty cycle 2% 5. Essentially independent of operating temperature (c)2001 Fairchild Semiconductor Corporation Rev. A2. May 2001 http://store.iiic.cc/ FQPF27P06 Elerical Characteristics FQPF27P06 Typical Characteristics VGS - 15.0 V - 10.0 V - 8.0 V - 7.0 V - 6.0 V - 5.5 V - 5.0 V Bottom : - 4.5 V 1 10 1 10 -I D , Drain Current [A] -I D, Drain Current [A] Top : 0 10 175 0 25 10 -55 Notes : 1. VDS = -30V 2. 250 s Pulse Test Notes : 1. 250 s Pulse Test 2. TC = 25 -1 -1 0 10 10 1 10 2 10 4 6 8 10 -VGS , Gate-Source Voltage [V] -VDS, Drain-Source Voltage [V] Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics 0.24 0.16 VGS = - 10V 0.12 VGS = - 20V 0.08 0.04 Note : TJ = 25 0.00 -I DR , Reverse Drain Current [A] RDS(on) [ ], Drain-Source On-Resistance 0.20 1 10 0 10 175 Notes : 1. VGS = 0V 2. 250 s Pulse Test -1 0 10 20 30 40 50 60 70 80 90 100 110 120 130 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 -ID , Drain Current [A] -VSD , Source-Drain Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 12 3000 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd Coss 2000 Ciss Notes : 1. VGS = 0 V 2. f = 1 MHz 1500 1000 Crss 500 0 -1 10 10 -V GS , Gate-Source Voltage [V] 2500 Capacitance [pF] 25 VDS = -30V 8 VDS = -48V 6 4 2 Note : ID = -27 A 0 0 10 1 0 10 5 10 15 20 25 30 35 QG, Total Gate Charge [nC] VDS, Drain-Source Voltage [V] Figure 5. Capacitance Characteristics (c)2001 Fairchild Semiconductor Corporation Figure 6. Gate Charge Characteristics Rev. A2. May 2001 http://store.iiic.cc/ (Continued) 2.5 1.2 2.0 1.1 RDS(ON) , (Normalized) Drain-Source On-Resistance -BV DSS , (Normalized) Drain-Source Breakdown Voltage FQPF27P06 Typical Characteristics 1.0 Notes : 1. VGS = 0 V 2. ID = -250 A 0.9 0.8 -100 -50 0 50 100 150 1.5 1.0 Notes : 1. VGS = -10 V 2. ID = -13.5 A 0.5 0.0 -100 200 -50 o 0 50 100 150 200 o TJ, Junction Temperature [ C] TJ, Junction Temperature [ C] Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 18 Operation in This Area is Limited by R DS(on) 2 15 1 ms -I D, Drain Current [A] -I D, Drain Current [A] 10 10 ms 1 10 100 ms DC 0 10 Notes : o 1. TC = 25 C 12 9 6 3 o 2. TJ = 175 C 3. Single Pulse -1 10 0 1 10 0 25 2 10 10 50 Figure 9. Maximum Safe Operating Area 100 125 150 175 Figure 10. Maximum Drain Current vs. Case Temperature D = 0 .5 10 0 0 .2 N o te s : 1 . Z J C ( t ) = 3 . 1 9 /W M a x . 2 . D u ty F a c t o r , D = t 1 /t 2 3 . T J M - T C = P D M * Z J C( t ) 0 .1 0 .0 5 10 -1 0 .0 2 PDM 0 .0 1 t1 JC ( t) , T h e r m a l R e s p o n s e 75 TC, Case Temperature [] -VDS, Drain-Source Voltage [V] Z t2 s in g le p u ls e 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ] Figure 11. Transient Thermal Response Curve (c)2001 Fairchild Semiconductor Corporation Rev. A2. May 2001 http://store.iiic.cc/ FQPF27P06 Gate Charge Test Circuit & Waveform VGS Same Type as DUT 50K Qg 200nF 12V -10V 300nF VDS VGS Qgs Qgd DUT -3mA Charge Resistive Switching Test Circuit & Waveforms VDS RL t on VDD VGS RG td(on) VGS t off tr td(off) tf 10% DUT -10V VDS 90% Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- L IAS2 -------------------2 BVDSS - VDD L VDS tp ID RG VDD DUT -10V tp VDD Time VDS (t) ID (t) IAS BVDSS (c)2001 Fairchild Semiconductor Corporation Rev. A2. May 2001 http://store.iiic.cc/ FQPF27P06 Peak Diode Recovery dv/dt Test Circuit & Waveforms + VDS DUT _ I SD L Driver RG VGS VGS ( Driver ) I SD ( DUT ) Compliment of DUT (N-Channel) VDD * dv/dt controlled by RG * ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V Body Diode Reverse Current IRM di/dt IFM , Body Diode Forward Current VDS ( DUT ) VSD Body Diode Forward Voltage Drop VDD Body Diode Recovery dv/dt (c)2001 Fairchild Semiconductor Corporation Rev. A2. May 2001 http://store.iiic.cc/ FQPF27P06 Package Dimensions 3.30 0.10 TO-220F 10.16 0.20 2.54 0.20 o3.18 0.10 (7.00) (1.00x45) 15.87 0.20 15.80 0.20 6.68 0.20 (0.70) 0.80 0.10 ) 0 (3 9.75 0.30 MAX1.47 #1 +0.10 0.50 -0.05 2.54TYP [2.54 0.20] 2.76 0.20 2.54TYP [2.54 0.20] 9.40 0.20 4.70 0.20 0.35 0.10 (c)2001 Fairchild Semiconductor Corporation Rev. A2. May 2001 http://store.iiic.cc/ TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SLIENT SWITCHER(R) SMART STARTTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM UltraFET(R) VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. (c)2001 Fairchild Semiconductor Corporation Rev. H2 http://store.iiic.cc/