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FEATURES APPLICATIONS
D PACKAGE
(TOPVIEW)
1
2
3
4
8
7
6
5
NC
VCC+
OUT
NC
NC
IN–
IN+
VCC–
NC – No internal connection
DBV PACKAGE
(TOPVIEW)
1
2
3
5
4
OUT
VCC+
IN+
VCC–
IN–
DCK PACKAGE
(TOPVIEW)
1
2
3
6
4
OUT
VCC+
IN+
NC
IN–
5VCC–
DESCRIPTION/ORDERING INFORMATION
TLV7211 , , TLV7211ACMOS COMPARATORSWITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
•Battery-Powered Products•Parameters Specified at 2.7-V, 5-V, and 15-VSupplies
•Notebooks and PDAs•Mobile Communications•Supply Current 7 µA (Typ) at 5 V
•Alarm and Security Circuits•Response Time 4 µs (Typ) at 5 V
•Direct Sensor Interface•Push-Pull Output
•Replaces Amplifiers Used as Comparators•Input Common-Mode Range Beyond
With Better Performance and Lower CurrentV
CC–
and V
CC+•Low Input Current
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features aninput offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such asmobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-railinput voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detectorcircuits, optical and magnetic sensors, and alarm and status circuits.
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.
ORDERING INFORMATION
V
OST
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)(MAX)
Reel of 2500 TLV7211AIDRSOIC – D 7211AITube of 75 TLV7211AID5 mV SOT-23-5 – DBV Reel of 3000 TLV7211AIDBVR YBN_Reel of 3000 TLV7211AIDCKRSOT (SC-70) – DCK Y8_Reel of 250 TLV7211AIDCKT–40 °C to 85 °C
Reel of 2500 TLV7211IDRSOIC – D TY7211Tube of 75 TLV7211ID15 mV SOT-23-5 – DBV Reel of 3000 TLV7211IDBVR YBK_Reel of 3000 TLV7211IDCKRSOT (SC-70) – DCK Y7_Reel of 250 TLV7211IDCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
IN–
IN+
OUT
Absolute Maximum Ratings
(1)
ESD Protection
Recommended Operating Conditions
TLV7211 , , TLV7211ACMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
FUNCTIONAL BLOCK DIAGRAM
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC+
– V
CC–
Supply voltage
(2)
16 V±SupplyV
ID
Differential input voltage
(3)
VvoltageV
I
Input voltage range (any input) V
CC–
– 0.3 V
CC+
+ 0.3 VV
O
Output voltage range V
CC–
– 0.3 V
CC+
+ 0.3 VI
CC
Supply current 40 mAI
I
Input current ±5 mAI
O
Output current ±30 mAD package 97θ
JA
Package thermal impedance
(4) (5)
DBV package 206 °C/WDCK package 259T
J
Operating virtual junction temperature 150 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values (except differential voltages and V
CC
specified for the measurement of I
OS
) are with respect to the network GND.(3) Differential voltages are at IN+ with respect to IN–.(4) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(5) The package thermal impedance is calculated in accordance with JESD 51-7.
TYP UNIT
Human-Body Model 2000 V
MIN MAX UNIT
V
CC+
– V
CC–
Supply voltage 2.7 15 VT
J
Operating virtual junction temperature –40 85 °C
2
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2.7-V Electrical Characteristics
TLV7211 , , TLV7211ACMOS COMPARATORSWITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
V
CC+
= 2.7 V, V
CC–
= GND, V
CM
= V
O
= V
CC+
/2, and R
L
> 1 M Ω(unless otherwise noted)
TLV7211A TLV7211PARAMETER TEST CONDITIONS T
J
UNITMIN TYP MAX MIN TYP MAX
25 °C 3 5 3 15V
OS
Input offset voltage mV–40 °C to 85 °C 8 18Input offset voltageTCV
OS
25 °C 1 1 µV/ °Ctemperature driftInput offset voltage
25 °C 3.3 3.3 µV/monthaverage drift
(1)
I
B
Input current 25 °C 0.04 0.04 pAI
OS
Input offset current 25 °C 0.02 0.02 pACommon-mode
CMRR 0 ≤V
CM
≤2.7 V 25 °C 75 75 dBrejection ratioPower-supply rejectionPSRR 2.7 V ≤V
CC+
≤15 V 25 °C 80 80 dBratioA
V
Voltage gain 25 °C 100 100 dB25 °C 2.9 3 2.9 3CMRR > 55 dB
–40 °C to 85 °C 2.7 2.7Input common-modeCMVR Vvoltage range
25 °C –0.3 –0.2 –0.3 –0.2CMRR > 55 dB
–40 °C to 85 °C 0 025 °C 2.4 2.5 2.4 2.5High-level outputV
OH
I
load
= 2.5 mA Vvoltage
–40 °C to 85 °C 2.3 2.325 °C 0.2 0.3 0.2 0.3Low-level outputV
OL
I
load
= 2.5 mA Vvoltage
–40 °C to 85 °C 0.4 0.425 °C 7 12 7 12V
OUT
= Low
–40 °C to 85 °C 14 14I
CC
Supply current µA25 °C 5 10 5 10V
OUT
= High-Idle
–40 °C to 85 °C 12 12
(1) Input offset voltage average drift is calculated by dividing the accelerated operating life V
OS
drift by the equivalent operational time. Thisrepresents worst-case input conditions and includes the first 30 days of drift.
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5-V Electrical Characteristics
TLV7211 , , TLV7211ACMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
V
CC+
= 5 V, V
CC–
= GND, V
CM
= V
O
= V
CC+
/2, and R
L
> 1 M Ω(unless otherwise noted)
TLV7211A TLV7211PARAMETER TEST CONDITIONS T
J
UNITMIN TYP MAX MIN TYP MAX
25 °C 3 5 3 15V
OS
Input offset voltage mV–40 °C to 85 °C 8 18Input offset voltageTCV
OS
25 °C 1 1 µV/ °Ctemperature driftInput offset voltage
25 °C 3.3 3.3 µV/monthaverage drift
(1)
I
B
Input current 25 °C 0.04 0.04 pAI
OS
Input offset current 25 °C 0.02 0.02 pACommon-mode
CMRR 25 °C 75 75 dBrejection ratioPower-supply rejectionPSRR 5 V ≤V
CC+
≤10 V 25 °C 80 80 dBratioA
V
Voltage gain 25 °C 100 100 dB25 °C 5.2 5.3 5.2 5.3CMRR > 55 dB
–40 °C to 85 °C 5 5Input common-modeCMVR Vvoltage range
25 °C –0.3 –0.2 –0.3 –0.2CMRR > 55 dB
–40 °C to 85 °C 0 025 °C 4.6 4.8 4.6 4.8High-level outputV
OH
I
load
= 5 mA Vvoltage
–40 °C to 85 °C 4.45 4.4525 °C 0.2 0.4 0.2 0.4Low-level outputV
OL
I
load
= 5 mA Vvoltage
–40 °C to 85 °C 0.55 0.5525 °C 7 14 7 14V
OUT
= Low
–40 °C to 85 °C 18 18I
CC
Supply current µA25 °C 5 10 5 10V
OUT
= High-Idle
–40 °C to 85 °C 13 13Short-circuit outputI
OH
I
source
25 °C 30 30 mAcurrent
Short-circuit outputI
OL
I
sink
, V
O
< 12 V
(2)
25 °C 45 45 mAcurrent
(1) Input offset voltage average drift is calculated by dividing the accelerated operating life V
OS
drift by the equivalent operational time. Thisrepresents worst-case input conditions and includes the first 30 days of drift.(2) Do not short circuit the output to V+ if V+ is >12 V.
4
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15-V Electrical Characteristics
TLV7211 , , TLV7211ACMOS COMPARATORSWITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
V
CC+
= 15 V, V
CC–
= GND, V
CM
= V
O
= V
CC+
/2, and R
L
> 1 M Ω(unless otherwise noted)
TLV7211A TLV7211TESTPARAMETER T
J
UNITCONDITIONS
MIN TYP MAX MIN TYP MAX
25 °C 3 5 3 15V
OS
Input offset voltage mV–40 °C to 85 °C 8 18Input offset voltageTCV
OS
25 °C 4 4 µV/ °Ctemperature driftInput offset voltage average
25 °C 4 4 µV/monthdrift
(1)
I
B
Input current 25 °C 0.04 0.04 pAI
OS
Input offset current 25 °C 0.02 0.02 pACommon-mode rejectionCMRR 25 °C 82 82 dBratioPSRR Power-supply rejection ratio 5 V ≤V
CC+
≤10 V 25 °C 80 80 dBA
V
Voltage gain 25 °C 100 100 dB25 °C 15.2 15.3 15.2 15.3CMRR > 55 dB
–40 °C to 85 °C 15 15Input common-mode voltageCMVR Vrange
25 °C –0.3 –0.2 –0.3 –0.2CMRR > 55 dB
–40 °C to 85 °C 0 025 °C 14.6 14.8 14.6 14.8V
OH
High-level output voltage I
load
= 5 mA V–40 °C to 85 °C 14.45 14.4525 °C 0.2 0.4 0.2 0.4V
OL
Low-level output voltage I
load
= 5 mA V–40 °C to 85 °C 0.55 0.5525 °C 7 14 7 14V
OUT
= Low
–40 °C to 85 °C 18 18I
CC
Supply current µA25 °C 5 12 5 12V
OUT
= High-Idle
–40 °C to 85 °C 14 14I
OH
Short-circuit output current I
source
25 °C 30 30 mAI
OL
Short-circuit output current I
sink
, V
O
< 12 V
(2)
25 °C 45 45 mA
(1) Input offset voltage average drift is calculated by dividing the accelerated operating life V
OS
drift by the equivalent operational time. Thisrepresents worst-case input conditions and includes the first 30 days of drift.(2) Do not short circuit the output to V+ if V+ is >12 V.
5Submit Documentation Feedback
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Switching Characteristics
TLV7211 , , TLV7211ACMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
T
J
= 25 °C, V
CC+
= 5 V, V
CC–
= GND, V
CM
= V
O
= V
CC+
/2, and R
L
> 1 M Ω(unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
t
rise
Rise time f = 10 kHz, C
L
= 50 pF
(1)
, Overdrive = 10 mV 0.3 µst
fall
Fall time f = 10 kHz, C
L
= 50 pF
(1)
, Overdrive = 10 mV 0.3 µs10 mV 10f = 10 kHz, C
L
= 50 pF
(1)
100 mV 4t
PHL
Propagation delay time, high to low
(2)
µs10 mV 10V
CC+
= 2.7 V, f = 10 kHz, C
L
= 50 pF
(1)
100 mV 410 mV 6f = 10 kHz, C
L
= 50 pF
(1)
100 mV 4t
PLH
Propagation delay time, low to high
(2)
µs10 mV 7V
CC+
= 2.7 V, f = 10 kHz, C
L
= 50 pF
(1)
100 mV 4
(1) C
L
includes probe and jig capacitance.(2) Input step voltage for propagation delay measurement is 2 V.
6
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TYPICAL CHARACTERISTICS
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Supply Voltage – V
Supply Current – µA
Positive Input = 0 V
Negative Input = 0.1 V
TA= -40°C
TA= 25°C TA= 85°C
TA= 125°C
0
1
2
3
4
5
6
7
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Supply Voltage – V
Supply Current – µA
TA= -40°C TA= 25°C
TA= 85°C
TA= 125°C
Positive Input = 0.1 V
Negative Input = 0 V
Positive Input = 0 V
Negative Input = 0.1 V
15 V
5 V
2.7 V
0
1
2
3
4
5
6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature – °C
Supply Current – µA
Positive Input = 0.1 V
Negative Input = 0 V
VCC = 15 V
VCC = 5 V
VCC = 2.7 V
TLV7211 , , TLV7211ACMOS COMPARATORSWITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
SUPPLY CURRENT SUPPLY CURRENTvs vsSUPPLY VOLTAGE SUPPLY VOLTAGE(SOURCING) (SINKING)
SUPPLY CURRENT SUPPLY CURRENTvs vsTEMPERATURE TEMPERATURE(SOURCING) (SINKING)
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0
10
20
30
40
50
60
70
80
0 1 2 3 4 5 6 7 8 9 10 11 12
Supply Voltage – V
Source Current – mA
Positive Input = 0.1 V
Negative Input = 0 V
TA= -40°C
TA= 25°C
TA= 85°C
TA= 125°C
0
20
40
60
80
100
120
0 1 2 3 4 5 6 7 8 9 10 11 12
Supply Voltage – V
Sinking Current – mA
Positive Input = 0.1 V
Negative Input = 0 V
TA= -40°C
TA= 25°C
TA= 85°C
TA= 125°C
0
100
200
300
400
500
600
700
800
900
0 1 2 3 4 5 6 7 8 9 10
Output Sinking Current – mA
Output Voltage to GND – mV
VCC = 5 V
TA= -40°C
TA= 25°C
TA= 85°C
TA= 125°C
0
200
400
600
800
1000
1200
0 1 2 3 4 5 6 7 8 9 10
Output Sourcing Current – mA
Output Voltage to V CC – mV
VCC = 5 V
TA= -40°C
TA= 25°C
TA= 125°C
TA= 85°C
OutputVoltage to V – mV
CC
TLV7211 , , TLV7211ACMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
TYPICAL CHARACTERISTICS (continued)
OUTPUT SOURCING CURRENT OUTPUT SINKING CURRENTvs vsSUPPLY VOLTAGE SUPPLY VOLTAGE
OUTPUT VOLTAGE OUTPUT VOLTAGEvs vsOUTPUT SOURCING CURRENT OUTPUT SINKING CURRENT
8
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0
100
200
300
400
500
600
700
800
900
0 1 2 3 4 5 6 7 8 9 10
Output Sinking Current – mA
Output Voltage to GND – mV
VCC = 15 V
TA= -40°C
TA= 25°C
TA= 85°C
TA= 125°C
0
200
400
600
800
1000
1200
1400
1600
0 1 2 3 4 5 6 7 8 9 10
Output Sourcing Current – mA
Output Voltage to V CC – mV
VCC = 15 V
TA= -40°C
TA= 25°C
TA= 85°C
TA= 125°C
OutputVoltage to V – mV
CC
2 µs per Division
1 V per Division
20 mV
100 mV 5 mV
10 mV
2 µs per Division
1 V per Division
100 mV
20 mV
10 mV
5 mV
Input
TLV7211 , , TLV7211ACMOS COMPARATORSWITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE OUTPUT VOLTAGEvs vsOUTPUT SOURCING CURRENT OUTPUT SINKING CURRENT
Response Time (t
PLH
) for Various Input Overdrives Response Time (t
PHL
) for Various Input Overdrives(V
CC
= 2.7 V) (V
CC
= 2.7 V)
9Submit Documentation Feedback
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2 µs per Division
1 V per Division
100 mV
20 mV
10 mV
5 mV
Input
2 µs per Division
1 V per Division
100 mV
20 mV
10 mV
5 mV
Input
2 µs per Division
3 V per Division
100 mV
20 mV
10 mV
5 mV
Input
2 µs per Division
3 V per Division
100 mV
20 mV
10 mV
5 mV
Input
TLV7211 , , TLV7211ACMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
TYPICAL CHARACTERISTICS (continued)
Response Time (t
PLH
) for Various Input Overdrives Response Time (t
PHL
) for Various Input Overdrives(V
CC
= 5 V) (V
CC
= 5 V)
Response Time (t
PLH
) for Various Input Overdrives Response Time (t
PHL
) for Various Input Overdrives(V
CC
= 15 V) (V
CC
= 15 V)
10
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TLV7211AID ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211ID ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV7211IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2007
Addendum-Page 1
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV7211AIDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV7211AIDCKR SC70 DCK 6 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TLV7211AIDCKT SC70 DCK 6 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TLV7211AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLV7211IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV7211IDCKR SC70 DCK 6 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TLV7211IDCKT SC70 DCK 6 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TLV7211IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV7211AIDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV7211AIDCKR SC70 DCK 6 3000 202.0 201.0 28.0
TLV7211AIDCKT SC70 DCK 6 250 202.0 201.0 28.0
TLV7211AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV7211IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV7211IDCKR SC70 DCK 6 3000 202.0 201.0 28.0
TLV7211IDCKT SC70 DCK 6 250 202.0 201.0 28.0
TLV7211IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2011
Pack Materials-Page 2
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