DATA SH EET
Product specification
Supersedes data of 1999 May 10 1999 Dec 03
DISCRETE SEMICONDUCTORS
BAP50-04
General purpose PIN diode
ok, halfpage
M3D088
1999 Dec 03 2
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
FEATURES
Two elements in series configuration in a small-siz ed
plastic SMD package
Low diode capacitance
Low diode fo rward resistanc e.
APPLICATIONS
General RF applications.
DESCRIPTION
Two planar PIN diodes in series configuration in an SOT23
small plastic SMD package.
PINNING
PIN DESCRIPTION
1 anode
2 cathode
3 common connection
handbook, halfpage
21
3MAM232
12
3
Marking code: 4Lp.
Fig.1 Simplified outline (SOT23) and symbol.
LIMITING VALUES
In accordance with the Absolute Max i mum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
VRcontinuous revers e voltage 50 V
IFcontinuous forwa rd c urrent 50 mA
Ptot total power dissipation Ts=90C250 mW
Tstg storage temperature 65 +150 C
Tjjunction temperature 65 +150 C
1999 Dec 03 3
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
ELECTRICAL CHARACTERISTIC S
Tj= 25C unless otherwise specified.
Note
1. Guaranteed on AQL bas is: inspection level S4, AQL 1.0.
THERMAL CHARACTE RISTI CS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per diode
VFforward voltage IF=50mA 0.95 1.1 V
VRreverse voltage IR=10A50V
IRreverse current VR=50V 100 nA
Cddiode capacit ance VR=0; f=1MHz 0.45 pF
VR=1V; f=1MHz 0.35 0.6 pF
VR=5V; f=1MHz 0.3 0.5 pF
rDdiode forw ard resistance IF= 0.5 mA; f = 100 MHz; note 1 25 40
IF= 1 mA; f = 100 MHz; note 1 14 25
IF=10mA; f=100MHz; note 1 35
Lcharge carrier life time when switched from IF10 mA to IR6mA;
RL100 ; measured at IR3mA 1.05 s
LSseries inductance 1.4 nH
SYMBOL PARAMETER VALUE UNIT
Rth j-s thermal resistance from junction to soldering point 220 K/W
1999 Dec 03 4
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
GRAPHICAL DATA
handbook, halfpage
10
3
10
10
2
1
MGS317
10
−2
10
−1
110
IF (mA)
rD
(Ω)
Fig.2 Forward resistance as a function of the
forward current; typical values.
f=100MHz; T
j=25C.
handbook, halfpage
0 5 10 20
VR (V)
Cd
(fF)
600
0
200
400
15
MGL927
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
f=1MHz; T
j=25C.
handbook, halfpage
0.5 3
f (GHz)
|S21|2
(dB)
0
−5
−4
MGS319
−3
−2
−1
1
(1)
(2)
(3)
1.5 2 2.5
Fig.4 Insertion loss (S212) of the diode in on-state
as a function of frequency; typical values.
(1) IF=10mA. (2) IF=1mA. (3) IF=0.5mA.
Diode inserted in series with a 50 stripline circuit and
biased via the analyzer Tee network.
Tamb =25C.
handbook, halfpage
0.5 3
f (GHz)
|S21|2
(dB)
0
−25
−20
MGS320
−15
−10
−5
1 1.5 2 2.5
Fig.5 Isolation (S212) of the diode in off-state as
a function of freque ncy; typical values.
Diode zero biased and inserted in serie s with a 50 stripline circuit.
Tamb =25C.
1999 Dec 03 5
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
PACKAGE OUTLINE
UNIT A1
max. bpcDE e1HELpQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
04-11-04
06-03-16
IEC JEDEC JEITA
mm 0.1 0.48
0.38 0.15
0.09 3.0
2.8 1.4
1.2 0.95
e
1.9 2.5
2.1 0.55
0.45 0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23 TO-236AB
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
wM
vMA
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface-mounted package; 3 leads SOT23
1999 Dec 03 6
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
DATA SHEET STATUS
Notes
1. Please consult the most recently issued documen t b efor e initiating or completing a design.
2. The product status of device (s) described in this document may have changed since this do cument was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the pr oduct specification.
DEFINITIONS
Product specification The information and da ta
provided in a Product data she et shall define the
specification of the product as agreed between NXP
Semiconductors and its custo m er, unless NXP
Semiconductors and cus to mer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which th e NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconduc tors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or conseq uential
damages (including - without limitation - lost profits, lost
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(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and prod uct descriptions, at any time and
without notice. This document supersedes and replaces all
information su pplied prior to the publicat ion hereof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical sys tems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to res ult in personal injur y, de ath or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductor s pr od ucts in such equipment or
application s and therefore such inclusion and /o r use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors pro du ct is su itable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and opera ting safeguards to minimize the risks
associated with their ap plications and produ cts.
1999 Dec 03 7
NXP Semiconductors Product specification
General purpose PIN diode BAP50-04
NXP Semiconductors does not accept any liability related
to any default, damage, cost s or problem which is based
on any weakness or default in the customer’s applications
or products, or the applic ation or use by customer’s th ird
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semic on ductors products in order to
avoid a default of the app lications and th e products or of
the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this
respect.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operat ion of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold subje ct to the general
terms and conditio ns of commercial sale, as published at
http://www.nxp.com/profile/terms, unless other wise
agreed in a valid written individual agreeme nt. In case an
individual agreeme nt is co nc luded only the terms and
conditions of the resp ective agreement shall apply. NXP
Semiconductors hereby expressly objects to applyi ng the
customer’s general terms and conditions with regard to the
purchase of NXP Semicon ductors produc ts by customer.
No offer to sell or license Nothing in this document
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Export control This document as well as the item(s)
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regulations. Export might require a prior authorization from
national authorities.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Li miting values and
Characteristics sections of this document, and as su ch is
not complete, exhaus tive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is au tomotive qualified, the
product is not suitable fo r automotive use. It is neither
qualified nor te sted in accorda nce with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified prod ucts in automotive equip men t or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for suc h aut omo tive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own ris k, an d (c) customer fully inde mnifies
NXP Semiconductors for an y liability, damages or failed
product clai ms r esult ing fr om cus to mer d esi gn an d us e of
the product for automotive ap plic ations beyond NXP
Semiconductors ’ st andard warranty and NXP
Semiconductors’ product specifications.
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Contact information
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© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this do cum en t d oes not form part of an y q uot ation or co ntract, is believed to be a ccur ate a nd re liable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other ind us trial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No cha ng es were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R77/02/pp8 Date of release: 1999 Dec 03
