DATA SH EET
Product specification
File under Integrated circuits, IC01 July 1994
INTEGRATED CIRCUITS
TDA7052A/AT
1 W BTL mono audio amplifier with
DC volume control
July 1994 2
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
FEATURES
•DC volume control
•Few external components
•Mute mode
•Thermal protection
•Short-circuit proof
•No switch-on and off clicks
•Good overall stability
•Low power consumption
•Low HF radiation
•ESD protected on all pins
GENERAL DESCRIPTION
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control. They are designed for use in TV and
monitors, but also suitable for battery-fed portable
recorders and radios.
Missing Current Limiter (MCL)
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
QUICK REFERENCE DATA
ORDERING INFORMATION
Notes
1. SOT97-1; 1996 September 10.
2. SOT96-1; 1996 September 10.
SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT
VPpositive supply voltage range 4.5 −18 V
POoutput power
TDA7052A RL = 8 Ω; VP = 6 V 1.0 1.1 −W
TDA7052AT RL = 16 Ω; VP = 6 V 0.5 0.55 −W
Gvmaximum total voltage gain 34.5 35.5 36.5 dB
φgain control range 75 80 −dB
IPtotal quiescent current VP = 6 V; RL = ∞−712mA
THD total harmonic distortion
TDA7052A PO = 0.5 W −0.3 1 %
TDA7052AT PO = 0.25 W −0.3 1 %
EXTENDED TYPE
NUMBER PACKAGE
PINS PIN POSITION MATERIAL CODE
TDA7052A 8 DIL plastic SOT97(1)
TDA7052AT 8 mini-pack plastic SOT96A(2)
July 1994 3
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
handbook, full pagewidth
positive input
6
MCD385 - 1
1
2
TDA7052A
TDA7052AT
VP
4
5
I + i
8I – i
TEMPERATURE
PROTECTION
3
signal
ground
DC volume
control
7
n.c.
positive output
negative output
power
ground
Vref STABILIZER
Fig.1 Block diagram.
PINNING
SYMBOL PIN DESCRIPTION
VP1 positive supply voltage
IN+ 2 positive input
GND1 3 signal ground
VC 4 DC volume control
OUT+ 5 positive output
GND2 6 power ground
n.c 7 not connected
OUT−8 negative output
handbook, halfpage
1
2
3
4
8
7
6
5
MCD384
VPOUT –
GND2
OUT +
GND1
IN +
VC
n.c.
TDA7052A
TDA7052AT
Fig.2 Pin configuration.
July 1994 4
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
FUNCTIONAL DESCRIPTION
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control, designed for use in TV and monitors
but also suitable for battery fed portable recorders and
radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
In the TDA7052A/AT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required and yet a low offset voltage is
maintained. At the same time the minimum supply remains
low.
The BTL principle offers the following advantages:
•Lower peak value of the supply current
•The frequency of the ripple on the supply voltage is twice
the signal frequency.
Thus a reduced power supply with smaller capacitors can
be used which results in cost savings.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 35.5 dB. The
DC volume control stage has a logarithmic control
characteristic.
The total gain can be controlled from 35.5 dB to −44 dB. If
the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, so the output power is
reduced.
Special attention is given to switch on and off clicks, low
HF radiation and a good overall stability.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPsupply voltage range −18 V
IORM repetitive peak output current −1.25 A
IOSM non-repetitive peak output current −1.5 A
Ptot total power dissipation Tamb ≤ 25%
TDA7052A −1.25 W
TDA7052AT −0.8 W
Tamb operating ambient temperature range −40 +85 °C
Tstg storage temperature range −55 +150 °C
Tvj virtual junction temperature −+150 °C
Tsc short-circuit time −1hr
V
2input voltage pin 2 −8V
V
4input voltage pin 4 −8V
July 1994 5
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
THERMAL RESISTANCE
Notes to the thermal resistance
TDA7052A: VP = 6 V; RL = 8 Ω. The maximum sine-wave dissipation is 0.9 W.
Therefore Tamb(max) = 150 − 100 × 0.9 = 60 °C.
TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W.
Therefore Tamb(max) = 150 − 155 × 0.46 = 78 °C.
SYMBOL PARAMETER THERMAL RESISTANCE
Rth j-a from junction to ambient in free air
TDA7052A 100 K/W
TDA7052AT 155 K/W
July 1994 6
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
CHARACTERISTICS
VP = 6 V ; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 Ω; TDA7052AT: RL = 16 Ω; unless otherwise specified (see Fig.6).
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage dividend by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)
is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPpositive supply voltage range 4.5 −18 V
IPtotal quiescent current VP = 6 V; RL = ∞
note 1 −712mA
Maximum gain; V4 = 1.4 V
POoutput power THD = 10%
TDA7052A 1.0 1.1 −W
TDA7052AT 0.5 0.55 −W
THD total harmonic distortion
TDA7052A PO = 0.5 W −0.3 1 %
TDA7052AT PO = 0.25 W −0.3 1 %
Gvvoltage gain 34.5 35.5 36.5 dB
VIinput signal handling V4 = 0.8 V; THD < 1% 0.5 0.65 −V
Vno(rms) noise output voltage (RMS value) f = 500 kHz; note 2 −210 −µV
B bandwidth −1 dB −20 Hz to
300 kHz −
SVRR supply voltage ripple rejection note 3 38 46 −dB
|Voff|DC output offset voltage −0 150 mV
ZIinput impedance (pin 2) 15 20 25 kΩ
Minimum gain; V4 = 0.5 V
Gvvoltage gain −−44 −dB
Vno(rms) noise output voltage (RMS value) note 4 −20 30 µV
Mute position
VOoutput voltage in mute position V4≤ 0.3 V; VI = 600 mV −− 30 µV
DC volume control
φgain control range 75 80 −dB
I4control current V4 = 0.4 V 60 70 80 µA
July 1994 7
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
handbook, halfpage
MCD388
40
– 80
20
– 20
– 40
0
0 1.2 2.00.4 1.60.8 V (V)
4
gain
(dB)
– 60
Fig.3 Gain control as a function of DC volume control.
handbook, halfpage
1000
0
800
400
200
600
0 1.2 2.0
MCD389 - 1
0.4 1.60.8
V (V)
4
Vnoise
(µV)
Fig.4 Noise output voltage as a function of DC
volume control.
handbook, halfpage
0 1.2 2.0
100
– 20
MCD390 - 1
60
20
– 60
– 100 0.4 1.60.8 V (V)
4
I4
(µA)
Fig.5 Control current as a function of DC volume
control.
July 1994 8
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
APPLICATION INFORMATION
handbook, full pagewidth
positive
input
5 kΩ
0.47 µF
RS
6
MCD386 - 1
100 nF 220 µF
1
2R = 8 Ω
L
TDA7052A
TDA7052AT
R = 16 Ω
L
V = 6 V
P
(1)
4
5
I + i
8I – i
Vref STABILIZER TEMPERATURE
PROTECTION
3
ground
(TDA7052A)
(TDA7052A/AT)
DC
volume
control
7
n.c.
Fig.6 Test and application diagram.
This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.
handbook, halfpage
MCD387
4
volume
control
1 MΩ1 µF
Fig.7 Application with potentiometer as volume
control; maximum gain = 30 dB.
July 1994 9
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
July 1994 10
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
July 1994 11
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
July 1994 12
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
volume control TDA7052A/AT
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
