Semiconductor Components Industries, LLC, 2001
October, 2001 – Rev. 7 1Publication Order Number:
SN74LS164/D
SN74LS164
Serial-In Parallel-Out
Shift Register
The SN74LS164 is a high speed 8-Bit Serial-In Parallel-Out Shift
Register. Serial data is entered through a 2-Input AND gate
synchronous with the LOW to HIGH transition of the clock. The
device features an asynchronous Master Reset which clears the
register setting all outputs LOW independent of the clock. It utilizes
the Schottky diode clamped process to achieve high speeds and is fully
compatible with all ON Semiconductor TTL products.
Typical Shift Frequency of 35 MHz
Asynchronous Master Reset
Gated Serial Data Input
Fully Synchronous Data Transfers
Input Clamp Diodes Limit High Speed Termination Effects
ESD > 3500 Volts
GUARANTEED OPERATING RANGES
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage 4.75 5.0 5.25 V
TAOperating Ambient
Temperature Range 0 25 70 °C
IOH Output Current – High –0.4 mA
IOL Output Current – Low 8.0 mA
LOW
POWER
SCHOTTKY
SOIC
D SUFFIX
CASE 751A
PLASTIC
N SUFFIX
CASE 646
14
1
14
1
SOEIAJ
M SUFFIX
CASE 965
14 1
http://onsemi.com
Device Package Shipping
ORDERING INFORMATION
SN74LS164N 14 Pin DIP 2000 Units/Box
SN74LS164D SOIC–14 55 Units/Rail
SN74LS164DR2 SOIC–14 2500/Tape & Reel
SN74LS164M SOE IAJ–14 See Note 1
SN74LS164MEL SOEIAJ–14
1. For ordering information on the EIAJ version of
the SOIC package, please contact your local
ON Semiconductor representative.
See Note 1
SN74LS164
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2
CONNECTION DIAGRAM DIP (TOP VIEW)
Data Inputs
Clock (Active HIGH Going Edge) Input
Master Reset (Active LOW) Input
Outputs
A, B
CP
MR
Q0 - Q7
0.5 U.L.
0.5 U.L.
0.5 U.L.
10 U.L.
0.25 U.L.
0.25 U.L.
0.25 U.L.
5 U.L.
NOTES:
a) 1 TTL Unit Load (U.L.) = 40 A HIGH/1.6 mA LOW.
HIGH LOW
(Note a)LOADING
PIN NAMES
VCC = PIN 14
GND = PIN 7
LOGIC SYMBOL
NOTE:
The Flatpak version has the same
pinouts (Connection Diagram) as
the Dual InLine Package.
1
2
8
934 5610111213
A
B
CP
LS164
8BIT SHIFT REGISTER
MR Q0Q1Q2Q3Q4Q5Q6Q7
14 13 12 11 10 9
123456
8
7
VCC Q7Q6Q5Q4MR CP
ABQ
0Q1Q2Q3GND
SN74LS164
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3
LOGIC DIAGRAM
Q6Q7
A
B
Q0Q1Q3
Q2Q5
Q4
MR
CP
DQ
CD
DQ
CD
DQ
CD
DQ
CD
DQ
CD
DQ
CD
DQ
CD
DQ
CD
63 4 5 11 1210 13
VCC = PIN 14
GND = PIN 7
= PIN NUMBERS
1
2
8
9
FUNCTIONAL DESCRIPTION
The LS164 is an edge-triggered 8-bit shift register with
serial data entry and an output from each of the eight stages.
Data is entered serially through one of two inputs (A or B);
either of these inputs can be used as an active HIGH Enable
for data entry through the other input. An unused input must
be tied HIGH, or both inputs connected together.
Each LOW-to-HIGH transition on the Clock (CP) input
shifts data one place to the right and enters into Q0 the logical
AND of the two data inputs (AB) that existed before the
rising clock edge. A LOW level on the Master Reset (MR)
input overrides all other inputs and clears the register
asynchronously, forcing all Q outputs LOW.
MODE SELECT — TRUTH TABLE
OPERATING
MODE
INPUTS OUTPUTS
MODE MR A B Q0Q1–Q7
Reset (Clear) L X X L L – L
H I I L q0–q
6
Shift H I h L q0–q
6
H h I L q0–q
6
H h h H q0–q
6
L (l) = LOW Voltage Levels
H (h) = HIGH Voltage Levels
X = Don’t Care
qn = Lower case letters indicate the state of the referenced input or output one
qn = set-up time prior to the LOW to HIGH clock transition.
SN74LS164
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4
DC CHARACTERISTICS OVER OPERATING
TEMPERATURE RANGE (unless otherwise specified)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
VIH Input HIGH Voltage 2.0 V Guaranteed Input HIGH Voltage for
All Inputs
VIL Input LOW Voltage 0.8 VGuaranteed Input LOW Voltage for
All Inputs
VIK Input Clamp Diode Voltage –0.65 1.5 V VCC = MIN, IIN = –18 mA
VOH Output HIGH Voltage 2.7 3.5 VVCC = MIN, IOH = MAX, VIN = VIH
or VIL per Truth Table
VOL
Out
p
ut LOW Voltage
0.25 0.4 V IOL = 4.0 mA VCC = VCC MIN,
VIN VIH or VIL
VOL Output LOW Voltage 0.35 0.5 V IOL = 8.0 mA VIN = VIH or VIL
per Truth Table
IIH
In
p
ut HIGH Current
20 µA VCC = MAX, VIN = 2.7 V
IIH Input HIGH Current 0.1 mA VCC = MAX, VIN = 7.0 V
IIL Input LOW Current –0.4 mA VCC = MAX, VIN = 0.4 V
IOS Short Circuit Current (Note 2) –20 –100 mA VCC = MAX
ICC Power Supply Current 27 mA VCC = MAX
2. Not more than one output should be shorted at a time, nor for more than 1 second.
AC CHARACTERISTICS (TA = 25°C)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
fMAX Maximum Clock Frequency 25 36 MHz
tPHL Propagation Delay
MR to Output Q 24 36 ns VCC = 5.0 V
CL
=
15
p
F
tPLH
tPHL Propagation Delay
Clock to Output Q 17
21 27
32 ns
C
L =
15
pF
AC SETUP REQUIREMENTS (TA = 25°C)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
tWCP, MR Pulse Width 20 ns
tsData Setup Time 15 ns
VCC =50V
thData Hold Time 5.0 ns VCC = 5.0 V
trec MR to Clock Recovery Time 20 ns
SN74LS164
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5
AC WAVEFORMS
*The shaded areas indicate when the input is permitted to change for predictable output performance.
Figure 1. Clock to Output Delays
and Clock Pulse Width Figure 2. Master Reset Pulse Width,
Master Reset to Output Delay and
Master Reset to Clock Recovery Time
Figure 3. Data Setup and Hold Times
CONDITIONS: MR = H
1.3 V
1.3 V 1.3 V 1.3 V
1.3 V
1.3 V 1.3 V
1.3 V
1.3 V
tPHL tPLH
CP
QCP
Q
MR
trec
tW
tPHL
tW
I/fmax
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V 1.3 V 1.3 V
CP
D
Q
ts(H) th(H) ts(L) th(L)
tW
1/fmax
1.3 V 1.3 V*1.3V
SN74LS164
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6
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ISSUE M
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 18.80
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M--- 10 --- 10
N0.015 0.039 0.38 1.01

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG DK
C
SEATING
PLANE
N
–T–
14 PL
M
0.13 (0.005)
L
M
J0.290 0.310 7.37 7.87
SN74LS164
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7
PACKAGE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P7 PL
14 8
71 M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
–T–
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
 
SN74LS164
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8
PACKAGE DIMENSIONS
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A1
HE
Q1
LE
10 0
10
LEQ1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
M SUFFIX
SOEIAJ PACKAGE
CASE 965–01
ISSUE O
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4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: r14525@onsemi.com
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For additional information, please contact your local
Sales Representative.
SN74LS164/D
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