© Semiconductor Components Industries, LLC, 2008
May, 2008 − Rev. 4
1Publication Order Number:
BYW51−200/D
BYW51-200
SWITCHMODE]
Power Rectifier
Features and Benefits
•Low Forward Voltage
•Low Power Loss/High Efficiency
•High Surge Capacity
•175°C Operating Junction Temperature
•16 A Total (8 A Per Diode Leg)
•Pb−Free Packages are Available*
Applications
•Power Supply − Output Rectification
•Power Management
•Instrumentation
Mechanical Characteristics
•Case: Epoxy, Molded
•Epoxy Meets UL 94 V−0 @ 0.125 in
•Weight: 1.9 Grams (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•ESD Rating: Human Body Model 3B
Machine Model C
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
BYW51−200 TO−220
TO−220AB
CASE 221A
PLASTIC
50 Units/Rail
ULTRAFAST RECTIFIER
16 AMPERES, 200 VOLTS
trr = 35 ns
1
3
2, 4
A = Assembly Location
Y = Year
WW = Work Week
BYW51−200 = Device Code
G = Pb−Free Package
AKA = Diode Polarity
http://onsemi.com
BYW51−200G TO−220
(Pb−Free)
50 Units/Rail
MARKING
DIAGRAM
AYWW
BYW51−200G
AKA
BYW51−200
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current
TC = 156°C
Per Leg
Total Device
IF(AV)
8.0
16
A
Peak Rectified Forward Current
(Square Wave, 20 kHz),
TC = 153°C − Per Diode Leg
IFM 16 A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM 100 A
Operating Junction Temperature and Storage Temperature TJ, Tstg −65 to +175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic Conditions Symbol Value Unit
Maximum Thermal Resistance, Junction−to−Case Min. Pad RqJC 3.0 °C/W
Maximum Thermal Resistance, Junction−to−Ambient Min. Pad RqJA 60.0
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Typical Max Unit
Instantaneous Forward Voltage (Note 1)
(iF = 8.0 A, Tj = 100°C)
(iF = 8.0 A, Tj = 25°C)
vF
−
−
0.8
0.89
0.89
0.97
V
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, Tj = 100°C)
(Rated dc Voltage, Tj = 25°C)
iR
−
−
21
3.8
1000
10
mA
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/s)
(IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A)
trr
− − 35
25
ns
1. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤2.0%
BYW51−200
http://onsemi.com
3
Figure 1. Typical Forward Voltage, Per Leg
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.3 0.60.4 0.8
30
0.1
0.3
0.2
2.0
1.0
100
20
7.0
0.7
3.0
0.5
5.0
50
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
0.9
VR, REVERSE VOLTAGE (VOLTS)
06040 100 120
400
800
0.08
0.04
0.02
8.0
4.0
2.0
200
40
20
80 TJ = 175°C
IR
20 80 200
0.5
0.7
10
70
1.0 1.1 1.2
100°C
TJ = 175°C
25°C
160 180140
0.8
0.4
0.2
, REVERSE CURRENT ( A)m
100°C
25°C
* The curves shown are typical for the highest voltage device in the voltage
grouping. Typical reverse current for lower voltage selections can be es
timated from these same curves if VR is sufficiently below rated VR.
i
0.2
VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
0.2 0.50.4 0.7 0.8
100
0.1
10
0.3 0.6 1.3
Figure 2. Maximum Forward Voltage
1.0 1.20.9
1.0
Figure 3. Typical Reverse Current, Per Leg*
1.1
IF
, INSTANTANEOUS FORWARD CURRENT (A)
175°C
100°C25°C
TA, AMBIENT TEMPERATURE (°C)
025
2.0
4.0
0
6.0
8.0
10
12
20
50 75 100 125 150 175
SQUARE WAVE
dc
SQUARE WAVE
dc
RqJA = 16°C/W
RqJA = 60°C/W
(NO HEATSINK)
TC, CASE TEMPERATURE (°C)
140 155150
0
4.0
2.0
6.0
10
8.0
20
14
12
145 180
Figure 4. Current Derating, Case, Per Leg
160 175170165
18
16
SQUARE WAVE
dc
Figure 5. Current Derating, Ambient, Per Leg
IF(AV), AVERAGE FORWARD CURRENT (A)
IF(AV), AVERAGE FORWARD CURRENT (A)
14
16
18
BYW51−200
http://onsemi.com
4
1000
10
30
100
300
1.0 10 100
VR, REVERSE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
TJ = 25°C
0 4.0
2.0
4.0
6.0
8.0
24
0
8.0 12 16 20
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Power Dissipation, Per Leg
TJ = 175°C
dc
SQUARE WAVE
2.0 6.0 10 14 18
10
14
16
20
22
Figure 7. Typical Capacitance, Per Leg
PF(AV), AVERAGE POWER DISSIPATION (W)
12
18
BYW51−200
http://onsemi.com
5
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.570 0.620 14.48 15.75
B0.380 0.405 9.66 10.28
C0.160 0.190 4.07 4.82
D0.025 0.035 0.64 0.88
F0.142 0.161 3.61 4.09
G0.095 0.105 2.42 2.66
H0.110 0.155 2.80 3.93
J0.014 0.025 0.36 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.15 1.52
N0.190 0.210 4.83 5.33
Q0.100 0.120 2.54 3.04
R0.080 0.110 2.04 2.79
S0.045 0.055 1.15 1.39
T0.235 0.255 5.97 6.47
U0.000 0.050 0.00 1.27
V0.045 --- 1.15 ---
Z--- 0.080 --- 2.04
B
Q
H
Z
L
V
G
N
A
K
F
123
4
D
SEATING
PLANE
−T−
C
S
T
U
R
J
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
BYW51−200/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
l
Sales Representative
