TC1265-3.0VOATR - Microchip Technology

TC1265

Features

• Very Low Dropout Voltage

• 800 mA Output Current

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Overcurrent and Overtemperature Protection

• SHDN Input for Active Power Management

• ERROR Output Can Be Used as a Low Battery

Detector (SOIC only)

Applications

• Battery-operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Typical Application

Description

The TC1265 is a fixed-output, high-accuracy (typically

±0.5%) CMOS low dropout regulator. Designed

specifically for battery-operated systems, the TC1265’s

CMOS construction eliminates wasted ground current,

significantly extending battery life. Total supply current

is typically 80 µA at full load (20 to 60 times lower than

in bipolar regulators).

Key features of the TC1265 include ultra low noise

operation, very low dropout voltage (typically 450 mV

at full load) and fast response to step changes in load.

The TC1265 incorporates both overtemperature and

overcurrent protection. The TC1265 is stable with an

output capacitor of only 1 µF and has a maximum

output current of 800 mA. It is available in 8-Pin SOIC,

5-Pin TO-220 and 5-Pin DDPAK packages.

Package Type

TC1265

VIN VOUT

1µF

GND

VOUT

VIN

SHDN SHDN

VIN

GND

VOUT

Front View

123

Tab Is GND

TC1265

TC1265 NC

SHDN

8-Pin SOIC

GND

BYPASS

VOUT VIN

VIN

VOUT

TC1265

5-Pin TO-220

Tab Is GND

5-Pin DDPAK

123

GND

SHDN

BYP

SHDN

ERROR

800 mA Fixed-Output CMOS LDO with Shutdown

TC1265

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage .........................................................6.5V

Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)

Power Dissipation................Internally Limited (Note 7)

Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V

Operating Temperature Range...... -40°C < TJ < 125°C

Storage Temperature..........................-65°C to +150°C

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect

device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,

SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Input Operating Voltage VIN 2.7 —6.0 VNote 2

Maximum Output Current IOUTMAX 800 ——mA

Output Voltage VOUT VR – 2.5% VR ± 0.5% VR + 2.5% VV

R ≥ 2.5V

VR – 2% VR ± 0.5% VR + 3% VR = 1.8V

VOUT Temperature Coefficient ΔVOUT/ΔT — 40 — ppm/°C Note 3

Line Regulation ΔVOUT/ΔVIN —0.0070.35 %(V

R + 1V) ≤ VIN ≤ 6V

Load Regulation (Note 4) ΔVOUT/VOUT -0.01 0.002 +0.01 %/mA IL = 0.1 mA to IOUTMAX

Dropout Voltage (Note 5) VIN–VOUT —2030 mV VR ≥ 2.5V, IL = 100 µA

—50160 VR ≥ 2.5V, IL = 100 mA

— 150 480 VR ≥ 2.5V, IL = 300 mA

— 260 800 VR ≥ 2.5V, IL = 500 mA

— 450 1300 VR ≥ 2.5V, IL = 800 mA

— 1000 1200 VR = 1.8V, IL = 500 mA

— 1200 1400 IL = 800 mA

Supply Current IDD —80130 µA SHDN = VIH, IL = 0

Shutdown Supply Current ISHDN —0.05 1µA SHDN = 0V

Power Supply Rejection Ratio PSRR — 64 — db F ≤ 1kHz

Output Short Circuit Current IOUTSC — 1200 1400 mA VOUT = 0V

Thermal Regulation ΔVOUT/ΔPD—0.04—V/WNote 6

Output Noise eN — 260 — nV/√Hz IL = IOUTMAX, F = 10 kHZ

Note 1: VR is the regulator output voltage setting.

2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects

are covered by the thermal regulation specification.

5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value

measured at a 1.5V differential.

6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.

7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-

ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-

tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

8: Hysteresis voltage is referenced to VR.

TCVOUT

VOUTMAX VOUTMIN

–()106

–

VOUT TΔ×

-------------------------------------------------------------------------=

TC1265

SHDN Input

SHDN Input High Threshold VIH 45 ——%V

SHDN Input Low Threshold VIL ——15 %VIN

ERROR Output (SOIC Only)

Minimum Operating Voltage VMIN 1.0 — — V

Output Logic Low Voltage VOL ——400 mV 1 mA Flows to ERROR

ERROR Threshold Voltage VTH — 0.95 x VR—V

ERROR Positive Hysteresis VHYS —50—mVNote 8

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,

SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Note 1: VR is the regulator output voltage setting.

2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects

are covered by the thermal regulation specification.

5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value

measured at a 1.5V differential.

6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.

7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-

ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-

tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

8: Hysteresis voltage is referenced to VR.

TCVOUT

VOUTMAX VOUTMIN

–()106

–

VOUT TΔ×

-------------------------------------------------------------------------=

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF,

SHDN > VIH, TA = +25°C.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range TA-40 — +125 °C (Note 1)

Operating Temperature Range TJ-40 — +125 °C

Storage Temperature Range TA-65 — +150 °C

Thermal Package Resistances

Thermal Resistance, 5L-DDPAK θJA —57—°C/W

Thermal Resistance, 5L-TO-220 θJA —71—°C/W

Thermal Resistance, 8L-SOIC θJA — 163 — °C/W

Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).

TC1265

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Line Regulation vs.

Temperature.

FIGURE 2-2: Output Noise vs. Frequency.

FIGURE 2-3: Load Regulation vs.

Temperature.

FIGURE 2-4: IDD vs. Temperature.

FIGURE 2-5: 3.0V Dropout Voltage vs.

ILOAD.

FIGURE 2-6: 3.0V VOUT vs.Temperature.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

020

018

016

012

010

008

006

004

002

000

014

(

)

TIO

(

)

C25

C70

C85

C 125

FREQUENCY (kHz)

NOISE (

V/√Hz)

10.0

1.0

0.01 0.01 1 10 100 1000

0.1

0.0

RLOAD = 50

COUT = 1

-40°C 0°C 25°C 70°C 85°C 125°C

0.0100

0.0090

0.0080

0.0070

0.0060

0.0050

0.0040

0.0030

0.0020

0.0010

0.0100

TEMPERATURE (°C)

LOAD REGULATION (%/mA)

1 mA to 800 mA

OUT =

TEMPERATURE (°C)

IDD

(µA)

150

135

120

105

-40°C 0°C 25°C 70°C 85°C

VOUT

125°C

0.600

0.550

0.500

0.450

0.400

0.350

0.300

0.250

0.200

0.150

0.100

0.050

0.000

0100 200 300 400 500 600 700 800

LOAD

(mA)

DROPOUT VOLTAGE (V)

C125

-40

030

020

010

000

990

980

970

960

950

940

930

920

(

)

(

)

ILO

300

ILO

500

ILO

800

C25

C70

C85

C 125

TC1265

2.0 TYPICAL PERFORMANCE CURVES (CONT)

FIGURE 2-1: ISHDN vs. Temperature.

0.090

0.080

0.070

0.060

0.050

0.040

0.030

0.020

0.010

0.000

TEMPERATURE (°C)

ISHDN (µA)

-40°C 0°C 25°C 70°C 85°C 125°C

TC1265

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Regulated Output Voltage (VOUT)

Regulated voltage output.

3.2 Ground (GND)

Ground terminal.

3.3 Reference Bypass (BYPASS)

Reference bypass input. Connecting a 470 pF to this

input further reduces output noise.

3.4 Out-of-Regulation Flag (ERROR)

Out-of-regulation flag (open-drain output). This output

goes low when VOUT is out-of-tolerance by

approximately -5%.

3.5 Shutdown Control (SHDN)

Shutdown control input. The regulator is fully enabled

when a logic-high is applied to this input. The regulator

enters shutdown when a logic-low is applied to this

input. During shutdown, the output voltage falls to zero

and the supply current is reduced to 0.05 µA (typical).

3.6 Unregulated Supply (VIN)

Unregulated supply input.

Pin No.

(8-Pin SOIC)

Pin No.

(5-Pin DDPAK)

(5-Pin TO-220)

Symbol Description

15V

OUT Regulated voltage output

2 3 GND Ground terminal

3 — NC No connect

4 1 BYPASS Reference bypass input

5—ERROR

Out-of-Regulation Flag (open-drain output)

6 2 SHDN Shutdown control input

7 — NC No connect

84V

IN Unregulated supply input

TC1265

4.0 DETAILED DESCRIPTION

The TC1265 is a precision, fixed-output LDO. Unlike

bipolar regulators, the TC1265’s supply current does

not increase with load current. In addition, VOUT

remains stable and within regulation over the entire

0mA to I

LOADMAX load current range (an important

consideration in RTC and CMOS RAM battery back-up

applications).

Figure 4-1 shows a typical application circuit.

FIGURE 4-1: Typical Application Circuit.

4.1 Output Capacitor

A 1 µF (min.) capacitor from VOUT to ground is

required. The output capacitor should have an Effective

Series Resistance (ESR) greater than 0.1Ω and less

than 5Ω. A 1 µF capacitor should be connected from

VIN to GND if there is more than 10 inches of wire

between the regulator and the AC filter capacitor, or if a

battery is used as the power source. Aluminum electro-

lytic or tantalum capacitor types can be used. Since

many aluminum electrolytic capacitors freeze at

approximately -30°C, solid tantalums are

recommended for applications operating below -25°C.

When operating from sources other than batteries,

supply-noise rejection and transient response can be

improved by increasing the value of the input and

output capacitors, and by employing passive filtering

techniques.

4.2 ERROR Output

ERROR is driven low whenever VOUT falls out of

regulation by more than – 5% (typ.). This condition may

be caused by low input voltage, output current limiting,

or thermal limiting. The ERROR threshold is 5% below

rated VOUT regardless of the programmed output

voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a

5.0V regulator and 2.85V (typ.) for a 3.0V regulator).

ERROR output operation is shown in Figure 4-2.

Note that ERROR is active when VOUT is at or below

VTH and inactive when VOUT is above VTH + VH.

As shown in Figure 4-1, ERROR can be used as a

battery low flag or as a processor RESET signal (with

the addition of timing capacitor C3). R1 x C3 should be

chosen to maintain ERROR below VIH of the processor

RESET input for at least 200 ms to allow time for the

system to stabilize. Pull-up resistor R1 can be tied to

VOUT

, VIN or any other voltage less than (VIN + 0.3V).

FIGURE 4-2: ERROR Output Operation.

V+

TC1265

VIN

Battery

VOUT

ERRORSHDN

GND

VOUT

1µF

Shutdown Control

(to CMOS Logic or Tie

to VIN, if unused)

1µF

C3 Required Only

if ERROR is used as a

Processor RESET Signal

(See Text) C3

0.2 µF

BATTLOW

or RESET VOUT

VTH

VIH

Hysteresis (VH)

VOL

ERROR

TC1265

5.0 THERMAL CONSIDERATIONS

5.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

5.2 Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input voltage, output voltage and

output current. The following equation is used to

calculate worst-case actual power dissipation:

EQUATION 5-1:

The maximum allowable power dissipation

(Equation 5-2) is a function of the maximum ambient

temperature (TAMAX), the maximum allowable die

temperature (TJMAX) and the thermal resistance from

junction-to-air (θJA).

EQUATION 5-2:

Table 5-1 and Ta b l e 5 - 2 show various values of θJA

for

the TC1265 package types.

TABLE 5-1: THERMAL RESISTANCE

GUIDELINES FOR TC1265 IN

8-PIN SOIC PACKAGE

TABLE 5-2: THERMAL RESISTANCE

GUIDELINES FOR TC1265 IN

5-PIN DDPAK/TO-220

PACKAGE

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits. For example:

Find:

1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

Maximum allowable power dissipation:

In this example, the TC1265 dissipates a maximum of

260 mW, below the allowable limit of 500 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits. For example, the maximum allowable

VIN is found by substituting the maximum allowable

power dissipation of 500 mW into Equation 5-1, from

which VINMAX = 4.6V.

Copper

Area

(Topside)*

Copper

Area

(Backside)

Board

Area

Thermal

Resistance

(θJA)

2500 sq mm 2500 sq mm 2500 sq mm 60°C/W

1000 sq mm 2500 sq mm 2500 sq mm 60°C/W

225 sq mm 2500 sq mm 2500 sq mm 68°C/W

100 sq mm 2500 sq mm 2500 sq mm 74°C/W

* Pin 2 is ground. Device is mounted on the top-side.

Where:

VINMAX

VOUTMIN

ILOADMAX

PD = Worst-case actual power dissipation

= Minimum regulator output voltage

= Maximum output (load) current

= Maximum voltage on VIN

PDVINMAX VOUTMIN

–()ILOADMAX

Where:

VINMAX

VOUTMIN

ILOADMAX

PD = Worst-case actual power dissipation

= Minimum regulator output voltage

= Maximum output (load) current

= Maximum voltage on VIN

PDMAX

TJMAX TAMAX

–

θJA

---------------------------------------=

Copper

Area

(Topside)*

Copper

Area

(Backside)

Board

Area

Thermal

Resistance

(θJA)

2500 sq mm 2500 sq mm 2500 sq mm 25°C/W

1000 sq mm 2500 sq mm 2500 sq mm 27°C/W

125 sq mm 2500 sq mm 2500 sq mm 35°C/W

* Tab of device attached to top-side copper

Given:

VINMAX =3.3V ± 10%

VOUTMIN = 2.7V ± 0.5%

ILOADMAX =275mA

TJMAX = 125°C

TAMAX =95°C

θJA = 60°C/W (SOIC)

PDVINMAX VOUTMIN

–()ILOADMAX

≈

PD3.3 1.1×()2.7 .995×()– 275 10 3–

×=

PD260 mW=

PDMAX

TJMAX TAMAX

–

θJA

---------------------------------------=

PDMAX

125 95–()

-------------------------=

PDMAX 500 mW=

TC1265

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

XXXXXXXXX

YYWWNNN

5-Lead DDPAK

TC1265

3.3VET

Example

5-Lead TO-220

XXXXXXXXX

YYWWNNN

Example:

TC1265

3.3VAT^^

0642256

8-Lead SOIC (150 mil) Example:

XXXXXXXX

XXXXYYWW

NNN

1265-33V

OA^^0642

256

0642256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

TC1265

5-Lead Plastic (ET) (DDPAK) )

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

BOTTOM VIEW

TOP VIEW

c L

(5X)

Significant Characteristic

Revised 07-19-05

Notes:

Mold Draft Angle

Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

7°

Pitch

Number of Pins

Overall Width

Standoff

Molded Package Length

Exposed Pad Width

Overall Height

MAX

Units

Dimension Limits

.398

.000

.256 REF

INCHES

.067 BSC

MIN

NOM MAX

.010 0.00

10.11

6.50 REF

MILLIMETERS

.183

MIN

1.70 BSC

NOM

0.25

4.65

JEDEC equivalent: TO-252

4.50.170

.005 0.13

Foot Length L .068 .089 .110 1.73 2.26 2.79

Foot Angle

-- -- 8°

.177

Controlling Parameter

4.32

.385 .410 9.78 10.41

.330 .350 .370 8.38 8.89 9.40

Overall Length D1 .549 .577 .605 13.94 14.66 15.37

Lead Thickness c.014 .020 .026 0.36 0.51 0.66

Pad Thickness c2 .045 -- .055 1.14 -- 1.40

Lead Width .037b .026 .032 0.66 0.81 0.94

3° --

8°

7°3°

Exposed Pad Length D2 .303 REF 7.75 REF

Pad Length L3 .045 -- .067 1.14 -- 1.70

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

Drawing No. C04-012

TC1265

5-Lead Plastic Transistor Outline (AT) (TO-220)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

LH1

(5°)

ØP

EJECTOR PIN

Drawing No. C04-036

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.

JEDEC equivalent: TO-220

Controlling Parameter

Mold Draft Angle

Lead Width

Lead Thickness

.014

Dimension Limits

Overall Height

Lead Length

Overall Width

Lead Pitch

.540

MIN

Units

.060

INCHES

.022 0.36 0.56

MILLIMETERS

.190

.560 13.72

MIN

MAX

4.83

14.22

MAX

.160 4.06

3° 7° 3° 7°

Overall Length D

1.020.64.040

.025

Overall Lead Centers e1 .263

.385

.560

.273 6.68 6.93

.072 1.52 1.83

.415 9.78 10.54

.590 14.22 14.99

Through Hole Diameter P .146 .156 3.71 3.96

J1Base to Bottom of Lead .090 2.29.115 2.92

Through Hole Center Q.103 2.87.113 2.62

Flag Thickness F .045 1.40.055 1.14

Flag Length H1 .234 6.55.258 5.94

Space Between Leads e3 .030 1.02.040 0.76

Revised 08-01-05

TC1265

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Foot Angle φ048048

1512015120

Mold Draft Angle Bottom

1512015120

Mold Draft Angle Top

0.510.420.33.020.017.013BLead Width

0.250.230.20.010.009.008

Lead Thickness

0.760.620.48.030.025.019LFoot Length

0.510.380.25.020.015.010hChamfer Distance

5.004.904.80.197.193.189DOverall Length

3.993.913.71.157.154.146E1Molded Package Width

6.206.025.79.244.237.228EOverall Width

0.250.180.10.010.007.004A1Standoff §

1.551.421.32.061.056.052A2Molded Package Thickness

1.751.551.35.069.061.053AOverall Height

1.27.050

Pitch

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

§ Significant Characteristic

TC1265

APPENDIX A: REVISION HISTORY

Revision D (October 2006)

•Section 1.0 “Electrical Characteristics”:

Changed dropout voltage voltage typical value for

IL = 500 mA from 700 to 1000 and maximum

value from 1000 to 1200 for. Changed typical

value for IL = 800 mA from 890 to 1200

•Section 6.0 “Packaging Information”: Added

pb-free symbol to package marking information

• Added disclaimer to package outline drawings

• Updated package outline drawings as needed

• Added Appendix A - Revision History

Revision C (October 2004)

• Not Documented

Revision B (May 2002)

• Not Documented

Revision A (March 2002)

• Original Release of this Document.

TC1265

NOTES:

TC1265

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device TC1265 Fixed Output CMOS LDO with Shutdown

Voltage Option:* 1.8V = 1.8V

2.5V = 2.5V

3.0V = 3.0V

3.3V = 3.3V

* Other output voltages are available. Please contact your local

Microchip sales office for details.

Package AT = Plastic (TO-220), 5-Lead

ET = Plastic Transistor Outline (DDPAK), 5-Lead

ETTR = Plastic Transistor Outline (DDPAK), 5-Lead,

Tape and Reel

OA = Plastic SOIC, (150 mil Body), 8-lead

OATR = Plastic SOIC, (150 mil Body), 8-lead,

Tape and Reel

PART NO. X.XX XX

PackageVoltage

Option

Device

Examples:

a) TC1265-1.8VAT 1.8V LDO, TO-220-5 pkg.

b) TC1265-2.5VAT 2.5V LDO, TO-220-5 pkg.

c) TC1265-3.0VAT 3.0V LDO, TO-220-5 pkg.

d) TC1265-3.3VAT 3.3V LDO, TO-220-5 pkg.

a) TC1265-1.8VETTR 1.8V LDO, DDPAK-5 pkg.,

Tape and Reel

b) TC1265-2.5VETTR 2.5V LDO, DDPAK-5 pkg.,

Tape and Reel

c) TC1265-3.0VETTR 3.0V LDO, DDPAK-5 pkg.,

Tape and Reel

d) TC1265-3.3VETTR 3.3V LDO, DDPAK-5 pkg.,

Tape and Reel

a) TC1265-1.8VOA 1.8V LDO, SOIC-8 pkg.

b) TC1265-1.8VOATR 1.8V LDO, SOIC-8 pkg.,

Tape and Reel

c) TC1265-2.5VOA 2.5V LDO, SOIC-8 pkg.

d) TC1265-2.5VOATR 2.5V LDO, SOIC-8 pkg.,

Tape and Reel

e) TC1265-3.0VOA 3.0V LDO, SOIC-8 pkg.

f) TC1265-3.0VOATR 3.0V LDO, SOIC-8 pkg.,

Tape and Reel

g) TC1265-3.3VOA 3.3V LDO, SOIC-8 pkg.

h) TC1265-3.3VOATR 3.3V LDO, SOIC-8 pkg.,

Tape and Reel

Tape and

Reel

TC1265

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active

Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC®

8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,

microperipherals, nonvolatile memory and analog products. In addition,

Microchip’s quality system for the design and manufacture of

development systems is ISO 9001:2000 certified.

AMERICAS

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EUROPE

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WORLDWIDE SALES AND SERVICE

10/19/06