5/8/00
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IRF730AS/L
SMPS MOSFET
HEXFET® Power MOSFET
lSwitch Mode Power Supply (SMPS)
lUninterruptable Power Supply
lHigh speed power switching
Benefits
Applications
lLow Gate Charge Qg results in Simple
Drive Requirement
lImproved Gate, Avalanche and dynamic
dv/dt Ruggedness
lFully Characterized Capacitance and
Avalanche Voltage and Current
VDSS Rds(on) max ID
400V 1.0Ω5.5A
Typical SMPS Topologies:
l Single Transistor Flyback Xfmr. Reset
l Single Transistor Forward Xfmr. Reset
(Both US Line input only).
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V5.5
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V3.5 A
IDM Pulsed Drain Current 22
PD @TC = 25°C Power Dissipation 74 W
Linear Derating Factor 0.6 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 4.6 V/ns
TJOperating Junction and -55 to + 150
TSTG Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C
Absolute Maximum Ratings
lEffective Coss Specified (See AN1001)
PD-93772A
Notes through are on page 10
2
D P a k
TO-262
IRF730AS/L
2www.irf.com
Parameter Min. Typ. Max. Units Conditions
gfs Forward Transconductance 3.1 ––– ––– S VDS = 50V, ID = 3.3A
QgTotal Gate Charge –– – –– – 22 ID = 3.5A
Qgs Gate-to-Source Charge ––– ––– 5.8 nC VDS = 320V
Qgd Gate-to-Drain ("Miller") Charge ––– ––– 9.3 VGS = 10V, See Fig. 6 and 13
td(on) Turn-On Delay Time ––– 10 ––– VDD = 200V
trRise Time ––– 22 ––– ID = 3.5A
td(off) Turn-Off Delay Time ––– 20 – –– R G = 12Ω
tfFall Time ––– 16 ––– R D = 57Ω,See Fig. 10
Ciss Input Capacitance ––– 600 ––– VGS = 0V
Coss Output Capacitance ––– 103 ––– VDS = 25V
Crss Reverse Transfer Capacitance ––– 4.0 –– – pF ƒ = 1.0MHz, See Fig. 5
Coss Output Capacitance ––– 890 ––– VGS = 0V, V DS = 1.0V, ƒ = 1.0MHz
Coss Output Capacitance ––– 30 ––– V GS = 0V, VDS = 320V, ƒ = 1.0MHz
Coss eff. Effective Output Capacitance ––– 45 ––– VGS = 0V, V DS = 0V to 320V
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 40 0 –– – –– – V V GS = 0V, I D = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.5 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 1.0 ΩVGS = 10V, ID = 3.3A
VGS(th) Gate Threshold Voltage 2. 0 ––– 4.5 V VDS = VGS, ID = 250µA
––– ––– 25 µA VDS = 400V, VGS = 0V
––– ––– 250 VDS = 320V, VGS = 0V, TJ = 125°C
Gate-to-Source Forward Leakage ––– ––– 100 VGS = 30V
Gate-to-Source Reverse Leakage ––– ––– -100 nA VGS = -30V
Static @ TJ = 25°C (unless otherwise specified)
IGSS
IDSS Drain-to-Source Leakage Current
Dynamic @ TJ = 25°C (unless otherwise specified)
ns
Parameter Typ. Max. Units
EAS Single Pulse Avalanche Energy ––– 290 mJ
IAR Avalanche Current––– 5.5 A
EAR Repetitive Avalanche Energy ––– 7.4 mJ
Avalanche Characteristics
S
D
G
Parameter Min. Typ. Max. Units Conditions
ISContinuous Source Current MOSFET symbol
(Body Diode) ––– ––– showing the
ISM Pulsed Source Current integral reverse
(Body Diode) ––– ––– p-n junction diode.
VSD Diode Forward Voltage ––– ––– 1 .6 V TJ = 25°C, I S = 5.5A, VGS = 0V
trr Reverse Recovery Time ––– 370 5 50 n s TJ = 25°C, IF = 3.5A
Qrr Reverse RecoveryCharge ––– 1 .6 2.4 µC di/dt = 100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Diode Characteristics
5.5
22 A
Thermal Resistance Parameter Typ. Max. Units
RθJC Junction-to-Case ––– 1.7 °C/W
RθJA Junction-to-Ambient ( PCB Mounted, steady-state)* –– – 40
IRF730AS/L
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Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.01
0.1
1
10
100
0.1 1 10 100
20
µ
s PULSE WIDTH
T = 150 C
J°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
0.1
1
10
100
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V = 50V
20µs PULSE WIDTH
DS
V , Gate-to-Source Volta
g
e (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J°
T = 150 C
J°
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
5.9A
0.01
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Volta
g
e (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
5.5
IRF730AS/L
4www.irf.com
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
0.1
1
10
100
10 100 1000
OPERATION IN THIS AREA LIMITED
BY RDS(on)
Single Pulse
T
T = 150 C
= 25 C
°°
J
C
V , Drain-to-Source Voltage (V)
I , Drain Current (A)I , Drain Current (A)
DS
D
10us
100us
1ms
10ms
0 5 10 15 20 25
0
4
8
12
16
20
Q , Total Gate Char
g
e (nC)
V , Gate-to-Source Voltage (V)
G
GS
FOR TEST CIRCUIT
SEE FIGURE
I =
D
13
5.9A
V = 80V
DS
V = 200V
DS
V = 320V
DS
0.1
1
10
100
0.4 0.6 0.8 1.0 1.2
V ,Source-to-Drain Voltage (V)
I , Reverse Drain Current (A)
SD
SD
V = 0 V
GS
T = 25 C
J°
T = 150 C
J°
5.5
110 100 1000
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
10000
100000
C, Capacitance(pF)
Coss
Crss
Ciss
VGS = 0V, f = 1 MHZ
Ciss = C
gs + C
gd, C
ds SHORTED
Crss
= C
gd
Coss
= C
ds + C
gd
IRF730AS/L
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Fig 10a. Switching Time Test Circuit
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
VDS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
RD
VGS
RGD.U.T.
10V
+
-
VDD
V
DS
90%
10%
V
GS t
d(on)
t
r
t
d(off)
t
f
25 50 75 100 125 150
0.0
1.0
2.0
3.0
4.0
5.0
6.0
T , Case Temperature ( C)
I , Drain Current (A)
°
C
D
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1
Notes:
1. Duty factor D = t / t
2. Peak T = P x Z + T
1 2
JDM thJC C
P
t
t
DM
1
2
t , Rectangular Pulse Duration (sec)
Thermal Response (Z )
1
thJC
0.01
0.02
0.05
0.10
0.20
D = 0.50
SINGLE PULSE
(THERMAL RESPONSE)
IRF730AS/L
6www.irf.com
Q
G
Q
GS
Q
GD
V
G
Charge
D.U.T. V
DS
I
D
I
G
3mA
V
GS
.3µF
50KΩ
.2µF
12V
Current Regulator
Same Type as D.U.T.
Current Sampling Resistors
+
-
10 V
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
Fig 12b. Unclamped Inductive Waveforms
Fig 12a. Unclamped Inductive Test Circuit
tp
V
(BR)DSS
I
AS
R
G
I
AS
0.01
Ω
t
p
D.U.T
L
VDS
+
-V
DD
DRIVER
A
15V
20V
Fig 12d. Typical Drain-to-Source Voltage
Vs. Avalanche Current
25 50 75 100 125 150
0
100
200
300
400
500
600
700
Starting T , Junction Temperature ( C)
E , Single Pulse Avalanche Energy (mJ)
J
AS
°
ID
TOP
BOTTOM
2.5A
3.5A
5.5A
0.0 1.0 2.0 3.0 4.0 5.0 6.0
IAV , Avalanche Current ( A)
540
550
560
570
580
590
600
610
V DSav , Avalanche Voltage ( V )
IRF730AS/L
www.irf.com 7
P.W. Period
di/dt
Diode Recovery
dv/dt
Ripple ≤5%
Body Diode Forward Drop
Re-Applied
Voltage
Reverse
Recovery
Current Body Diode Forward
Current
V
GS
=10V
V
DD
I
SD
Driver Gate Drive
D.U.T. I
SD
Waveform
D.U.T. V
DS
Waveform
Inductor Curent
D = P.W.
Period
+
-
+
+
+
-
-
-
Fig 14. For N-Channel HEXFETS
* VGS = 5V for Logic Level Devices
Peak Diode Recovery dv/dt Test Circuit
RGVDD
• dv/dt controlled by RG
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
D.U.T Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
*
IRF730AS/L
8www.irf.com
D2Pak Package Outline
D2Pak
Part Marking Information
10.16 (.400)
REF .
6.47 (.255 )
6.18 (.243 )
2.61 (.1 03 )
2.32 (.0 91 )
8.89 (.350)
REF .
- B -
1.32 (.052)
1.22 (.048)
2.79 (.110)
2.29 (.090)
1.39 (.055)
1.14 (.045)
5.28 (.2 08 )
4.78 (.1 88 )
4.69 (.185)
4.20 (.165)
10.54 (.415)
10.29 (.405)
- A -
2
1 3 15.49 (.610)
14.73 (.580)
3X 0.93 (.037)
0.69 (.027)
5 .08 (.20 0)
3X 1.40 (.055)
1.14 (.045)
1.78 (.070)
1.27 (.050)
1.40 (.055)
MAX .
NOTES:
1 DIMENSIONS AFTER SO LDER DIP.
2 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
3 CONTROLLING DIMENSION : INCH.
4 HEATSINK & LEAD DIMENSIONS DO NOT INCLUDE BURRS.
0.55 (.022)
0.46 (.018)
0.2 5 (.0 1 0) M B A M MINIMUM RECOM MENDE D FOOTPRINT
11.43 (.450)
8 .89 (.35 0)
17 .78 (.70 0)
3.81 (.15 0)
2.08 (.082)
2X
LEAD AS SIG N MEN TS
1 - GA TE
2 - DR AIN
3 - SOURCE
2.54 (.100)
2X
PAR T NU MB ER
INTERNATIONAL
RE CTIFIE R
LO G O DATE CODE
(YYW W )
YY = YEAR
WW = WEEK
A S SEMBLY
LO T C O D E
F530S
9B 1 M
9246
A
IRF730AS/L
www.irf.com 9
TO-262
Par t Marking Infor mation
Package Outline
TO-262 Outline
IRF730AS/L
10 www.irf.com
Tape & Reel Information
D2Pak
3
4
4
TRR
FEED D IRE CTION
1 .85 (.0 73)
1 .65 (.0 65)
1 .60 (.063)
1 .50 (.059)
4.10 (.161)
3.90 (.153)
TRL
FEED DIRECTION
10.90 (.429)
10.70 (.421) 16.10 (.634)
15.90 (.626)
1.75 (.069)
1.25 (.049)
11.60 (.457)
11.40 (.449) 15.42 (.609)
15.22 (.601)
4.72 (.136)
4.52 (.178)
24.30 (.957)
23.90 (.941)
0.368 (.0145)
0.342 (.0135)
1.60 (.063)
1.50 (.059)
13.50 (.532 )
12.80 (.504 )
330.00
(14.173)
MAX.
2 7.4 0 (1.079)
2 3.9 0 (.9 41)
60.00 (2.362)
M IN.
30.40 (1.197)
M A X.
26 .40 (1.03 9)
24 .40 (.9 61 )
NO TES :
1. CO MFORM S TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ O UTER EDGE.
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
ISD ≤ 5.5A, di/dt ≤ 90A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Notes:
Starting TJ = 25°C, L = 19mH
RG = 25Ω, I AS = 5.5A. (See Figure 12)
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Coss eff. is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS
Uses IRF730A data and test conditions
* When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 5/00
