Datasheet Temperature Sensor ICs Low current Thermostat Output BDJxxx1HFV Series Key Specifications General Description BDJxxx1HFV series is a thermostat output temperature sensor IC with built-in temperature detection element, constant current circuit, and a high-accuracy reference voltage source in one chip. Temperature detection can be realized at 2.5C accuracy without the need for a complicated design. It is the best suited for portable equipment of micro- and low-current, power down function, and battery drive. It is possible to use it for a wide range of applications such as heat detection and temperature monitors because it provides an analog output in addition to the thermostat power output. BDJxxx1HFV series has 6 products at 60C, 70C, 75C, 80C, 85C and 90C detection temperature. Power Supply Voltage Range: 2.4V to 5.5V Supply Current: Normal Function mode 7.5A (Typ) Power Down mode 0.3A (Typ) High Accuracy Thermostat: 2.5C (Max) @Ta=60C to +90C Sensing Temperature Hysteresis: 10.0C (Typ) High Accuracy Analog Output: 2.5C (Max) @Ta=-30C to +100C Analog Output Temperature Sensitivity: -8.2 mV/C (Typ) Operating Temperature Range: -30C to +100C Package W(Typ) x D(Typ) x H(Max) Features Detection Temperature lineup at 60C, 70C, 75C, 80C, 85C, 90C (6 products) Built-in power down control function. (Min PD interface Voltage is 1.5V) Low thermal resistance package (Typ 187C/W) ESD Rating of 8kV (HBM) OS Output Active H HVSOF5 1.60mm x 1.60mm x 0.60mm Applications Cellular Phone, Digital Camera, Thermal Protection for Electrical Equipment (Notebook PC, FPD-TV, etc.) Typical Application Circuit Please adjust capacitor according to the noise condition of the set. VDD TEMP IREF 1 0.1F GND C 5 VREF TEMP SENSOR 3 Capacitor according to the noise condition of the set. + - 2 PD 1F Please adjust bypass OS Please pull-up of over 10k for the OS output terminal. 4 PD C Product structureSilicon monolithic integrated circuit .www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product has no designed protection against radioactive rays 1/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Block Diagram and Pin Configuration TOP VIEW TEMP IREF 1 5 VDD VREF GND C PD 2 TEMP SENSOR C 3 C 4 PD OS C C C Pin Descriptions Pin No. Pin Name Function Comment 1 TEMP Output voltage in inverse proportion to the Temperature 2 GND Ground 3 PD Power Down Control H: Normal Function mode L: Power Down mode H: Thermostat and Analog Output operation. L: Power Down state. 4 OS Digital Thermostat Output Open-Drain Active-High. Use pull-up resistor of more than 10k. 5 VDD Set to Open state or connect to a high input impedance node (over 10M). Power Supply Voltage www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Absolute Maximum Ratings (Ta = 25C) Parameter Power Supply Voltage Symbol Rating Unit VDD -0.3 to +7.0 (Note 1) V Input Voltage (Pd) VIN -0.3 to +VDD+0.3 V OS Terminal Voltage VOS -0.3 to +7.0 (Note 1) V OS Terminal Current IOS 5.0 mA Power Dissipation Pd 0.53 (Note 2) W Tstg -55 to +150 C Storage Temperature Range (Note 1) However, not exceeding Pd. (Note 2) When mounted on ROHM standard board, derate by 5.36mW/C for Ta higher than 25 C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Rating Min Typ Max Unit Power Supply Voltage VDD 2.4 2.8 5.5 V Operating Temperature Range Topr -30 - +100 C Electrical Characteristics (Unless otherwise specified, VDD = 2.8V, Ta = 25C) Parameter Symbol Limit Unit Conditions Min Typ Max IDD - 7.5 12.0 A PD="H" IDDPD - 0.3 1.0 A PD="L" VIL GND - 0.2 V Input H Voltage VIH 1.5 - VDD V PD Leakage Current ILPD - - 1.0 A PD=2.8V VTEMP 1.279 1.300 1.321 V Ta = 30C VSE -8.00 -8.20 -8.40 mV/C TEMP Load Regulation VTEMPRL - - 1.0 mV difference of IOUT : 0A / 2A TEMP VDD Regulation VTEMPVDD - - 4.0 mV VDD=2.4V to 5.5V IL - - 1.0 A VOS =5.0V VOL - - 0.4 V IOS = 1.0mA Supply Current Normal Function Mode Power Down Mode PD Input L Voltage Analog Output TEMP Output Voltage TEMP Temperature Sensitivity Ta = -30C to +100C OS Output Open Drain OS Leakage Current OS Output Voltage Radiation hardiness is not designed. Temperature Accuracy (Unless otherwise specified, VDD = 2.8V) Parameter Symbol Limit Min Typ Max Unit Conditions Thermostat Sensing Temperature Accuracy Tacc - - 2.5 C Sensing Temperature Hysteresis Thys 7.5 10.0 12.5 C TTEMP - - 2.5 C Analog Output TEMP Temperature Accuracy www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/13 VDD = 2.8V Ta = -30C to +100C TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Typical Performance Curves 15 2.0 Ta=30C TEMP Voltage : VTEMP [V] 10 Vtemp [V] Supply Current IDD [A] IDD [: A] Ta=30C PD="H" 5 PD="L" 0 0 1 2 3 4 5 6 0.5 0 7 1 2 3 4 5 6 Supply Voltage : VDD [V] VDD [V] Supply Voltage : VDD [V] VDD [V] Figure 1. Supply Current vs Supply Voltage Figure 2. TEMP Voltage vs Supply Voltage Vtemp [mV] TEMP Voltage : VTEMP [V] 0 1.5 1.0 0.5 -2 -4 -6 -8 VDD=2.8V, Ta=30C -10 0.0 -40 7 2 VDD=2.8V Vtemp[V] 1.0 0.0 2.0 TEMP Voltage : VTEMP [V] 1.5 -12 -20 0 20 40 60 Temperature : Ta [C] Temp[] 80 0 100 2 3 4 Output Iout Voltage [uA]: IOUT [A] 5 Figure 4. TEMP Voltage vs Output Current Figure 3. TEMP Voltage vs Temperature www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 4/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Typical Performance Curves - continued 0.8 OL OS Output Voltage V [V] : VOL [V] VDD=2.8V, Ta=25C 0.6 0.4 0.2 0 0 1 2 3 4 5 Load Current : IOS [mA] IOS [mA] Figure 5. OS Output Voltage vs Load Current www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Application Information 1. Function Diagram (ex. 80C detect Active-H type BDJ0801HFV) The internal IC temperature sensor senses temperature. TEMP terminal output voltage is converted to temperature. VTEMP value is 1.300[V] at Ta = 30[C]. The value of VTEMP voltage reduction is inversely proportional to the temperature at a rate of -8.2mV/C. OS Output Voltage (VOS) [V] Analog Temp. Sensor Output [V] 3.0 2.5 2.0 VTEMP@30C (1.300V) 1.5 1.0 Temperature Sensitivity (-8.20mV/C typ) 0.5 VOS Detect Point Temperature Hysteresis (10C typ) 0 -50 -30 -10 10 30 50 70 90 110 130 Temperature [C] If the temperature exceeds the detect point temperature, the internal comparator forces the OS output to change from "L" to "H". (ex. Active-H Type) OS returns to "L" when the temperature becomes 10C lower than the detect point temperature. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series 2. Operation Sequence (ex.80C detect Active-H type BDJ0801HFV) VDD H level 1.5V L level 0.2V PD 7.5A IDD 7.5A 0.3A 0.3A 0.3A 1.300V@Ta=30C TEMP OS Ref Voltage 70C 80C Hi Z Hi Z Hi Z Hi Z(pull-up) Hi Z Hi Z Hi Z time tOS_L tOS_H BDJ0801HFV operation starts after PD "H" Input. Please refer to the OS terminal signal table below for the wait time after PD "H" Input. Ta Symbol Wait time Under detect Temp. tOS_L 200s Over detect Temp. tOS_H 1000s www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series I/O Equivalent Circuits PD OS VDD OS PD GND GND Use pull-up resistor of more than 10k. TEMP VDD TEMP GND www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 6. Example of monolithic IC structure www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Ordering Information B D J x x x 1 H F V - TR Detect Temp. 090: 90C 085: 85C 080: 80C 075: 75C 070: 70C 060: 60C Output Format 1 : Active-H Package HFV:HVSOF5 Packaging and forming specification TR: Embossed tape and reel Lineup Product Name Detect Temp. (C) OS Output Format Product Name Detect Temp. (C) OS Output Format BDJ0901HFV BDJ0851HFV 90 85 Open Drain Open Drain Active H Active H BDJ0751HFV BDJ0701HFV 75 70 Open Drain Open Drain Active H Active H BDJ0801HFV 80 Open Drain Active H BDJ0601HFV 60 Open Drain Active H Marking Diagram HVSOF5 (TOP VIEW) Part Number Marking LOT Number Orderable Part Number Part Number Marking BDJ0901HFV-TR gd BDJ0851HFV-TR ge BDJ0801HFV-TR gf BDJ0751HFV-TR gg BDJ0701HFV-TR gh BDJ0601HFV-TR gm www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 HVSOF5 12/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 BDJxxx1HFV Series Revision History Date Revision 06.Nov.2015 001 Changes New Release www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/13 TSZ02201-0M2M0F515120-1-2 06.Nov.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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