FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
PGND
TPS62052
SW
1
6
7
3
2
9
5
4
10
Ci = 10 µF
Co = 22 µF
VO = 1.5 V / 800 mA
L1 = 10 µHVI = 3.3 V to 10 V
TYPICAL APPLICATION CIRCUIT
IO – Output Current – mA
50
30
10
0.01 0.1 1 10
Efficiency – %
60
70
TPS62050
EFFICIENCY
vs
OUTPUT CURRENT
100
100 1 k
80
20
0
40
90
VI = 7.2 V,
VO = 5 V,
SYNC = L
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
800-mA SYNCHRONOUS STEP-DOWN CONVERTER
Check for Samples: TPS62052,TPS62054,TPS62056,TPS62050,TPS62051
1FEATURES DESCRIPTION
The TPS6205x devices are a family of high-efficiency
2High-Efficiency Synchronous Step-Down synchronous step-down dc/dc converters ideally
Converter With up to 95% Efficiency suited for systems powered from a 1-cell or 2-cell
12-µA Quiescent Current (Typ) Li-Ion battery or from a 3-cell to 5-cell NiCd, NiMH, or
2.7-V to 10-V Operating Input Voltage Range alkaline battery.
Adjustable Output Voltage Range From 0.7 V The TPS62050 is a synchronous PWM converter with
to 6 V integrated N-channel and P-channel power MOSFET
Fixed Output Voltage Options Available in switches. Synchronous rectification increases
1.5 V, 1.8 V, and 3.3 V efficiency and reduces external component count. To
Synchronizable to External Clock Signal up to achieve highest efficiency over a wide load current
1.2 MHz range, the converter enters a power-saving
High Efficiency Over a Wide Load Current pulse-frequency modulation (PFM) mode at light load
Range in Power-Save Mode currents. Operating frequency is typically 850 kHz,
allowing the use of small inductor and capacitor
100% Maximum Duty Cycle for Lowest values. The device can be synchronized to an
Dropout external clock signal in the range of 600 kHz to 1.2
Low Noise Operation in Forced Fixed MHz. For low noise operation, the converter can be
Frequency PWM Operation Mode programmed into forced-fixed frequency in PWM
Internal Softstart mode. In shutdown mode, the current consumption is
Overtemperature and Overcurrent Protected reduced to less than 2 µA. The TPS6205x is
available in the 10-pin (DGS) micro-small outline
Available in 10-Pin Microsmall Outline package (MSOP) and operates over an free air
Package MSOP temperature range of 40°C to 85°C.
APPLICATIONS
Cellular Phones
Organizers, PDAs, and Handheld PCs
Low Power DSP Supply
Digital Cameras and Hard Disks
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2MATHCAD is a registered trademark of Mathsoft Incorporated.
PRODUCTION DATA information is current as of publication date. Copyright ©20022011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Package/Ordering Information
PACKAGED DEVICES OUTPUT VOLTAGE LBI/LBO FUNCTIONALITY PACKAGE MARKING
PLASTIC MSOP(1) (DGS)
TPS62050DGS Adjustable 0.7 V to 6 V Standard BFM
TPS62051DGS Adjustable 0.7 V to 6 V Enhanced BGB
TPS62052DGS 1.5 V Standard BGC
TPS62054DGS 1.8 V Standard BGE
TPS62056DGS 3.3 V Standard BGG
(1) The DGS packages are available taped and reeled. Add an R suffix to the device type (i.e., TPS62050DGSR) to order quantities of 2500
devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TPS6205x
Supply voltage, VI0.3 V to 11 V
Voltage at EN, SYNC 0.3 V to VI
Voltage at LBI, FB, LBO, PG 0.3 V to 7 V
Voltage at SW 0.3 V to 11 V(2)
Output current, IO850 mA
Maximum junction temperature, TJ150°C
Operating free-air temperature range, TA40°C to 85°C
Storage temperature range, Tstg 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The voltage at the SW pin is sampled in PFM mode 15 µs after the PMOS has switched off. During this time the voltage at SW is limited
to 7 V maximum. Therefore, the output voltage of the converter is limited to 7 V maximum.
PACKAGE DISSIPATION RATING
TA25°C DERATING FACTOR TA= 70°C TA= 85°C
PACKAGE POWER RATING TA25°C POWER RATING POWER RATING
10-PIN MSOP(1) 555 mW 5.56 mW/°C 305 mW 221 mW
(1) The thermal resistance junction to ambient soldered onto a PCB of the 10-pin MSOP is 180°C/W.
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
Supply voltage at VI2.7 10 V
Voltage at PG, LBO 6 V
Maximum output current 800(1) mA
Operating junction temperature -40 125 °C
(1) Assuming no thermal limitation
2Copyright ©20022011, Texas Instruments Incorporated
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
ELECTRICAL CHARACTERISTICS
VI= 7.2 V, VO= 3.3 V, IO= 300 mA, EN = VI, TA=40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIInput voltage range 2.7 10 V
I(Q) Operating quiescent current IO= 0 mA, SYNC = GND, VI= 7.2 V 12 20 µA
EN = GND 1.5 5
I(SD) Shutdown current µA
EN = GND, TA=25°C 1.5 3
Quiescent current with enhanced LBI comparator
IQ(LBI) EN = VI, LBI=GND, TPS62051 only 5 µA
version.
ENABLE
VIH EN high level input voltage 1.3 V
VIL EN low level input voltage 0.3 V
EN trip point hysteresis 100 mV
Ilkg EN input leakage current EN = GND or VIN, VI= 7.2 V 0.01 0.2 µA
I(EN) EN input current 0.6 V V(EN)4 V 2 µA
V(UVLO) Undervoltage lockout threshold 1.6 V
POWER SWITCH
VI5.4 V; IO= 300 mA 400 650
rDS(on) P-channel MOSFET on-resistance m
VI= 2.7 V; IO= 300 mA 600 850
P-channel MOSFET leakage current VDS = 10 V 1 µA
P-channel MOSFET current limit VI= 7.2V, VO= 3.3 V 1000 1200 1400 mA
VI5.4 V; IO= 300 mA 300 450
rDS(on) N-channel MOSFET on-resistance m
VI= 2.7 V; IO= 300 mA 450 550
N-channel MOSFET leakage current VDS = 6 V 1 µA
POWER GOOD OUTPUT, LBI, LBO
V(PG) Power good trip voltage Vml -2% V
VOramping positive 50
Power good delay time µs
VOramping negative 200
VOL PG, LBO output low voltage V(FB) = 0.8 x VOnominal, I(sink) = 1 mA 0.3 V
PG, LBO output leakage current V(FB) = VOnominal, V(LBI) = VI0.01 0.25 µA
Minimum supply voltage for valid power good, LBO 2.3 V
signal
V(LBI) Low battery input trip voltage Input voltage falling 1.21 V
Low battery input trip point accuracy 1.5%
V(LBI,HY Low battery input hysteresis 15 mV
S)
Ilkg(LBI) LBI leakage current 0.01 0.1 µA
OSCILLATOR
fSOscillator frequency 600 850 1000 kHz
f(SYNC) Synchronization range 600 1200 kHz
VIH SYNC high level input voltage 1.5 V
VIL SYNC low level input voltage 0.3 V
Ilkg SYNC input leakage current SYNC = GND or VIN 0.01 0.1 µA
SYNC trip point hysteresis 100 mV
Duty cycle of external clock signal 20% 90%
OUTPUT
Adjustable output voltage
VOTPS62050, TPS62051 0.7 6.0 V
range
V(FB) Feedback voltage TPS62050, TPS62051 0.5 V
FB leakage current TPS62050, TPS62051 0.02 0.1 µA
Feedback voltage tolerance TPS62050, TPS62051 VI= 2.7 V to 10 V, 0 mA<IO<600 mA -3% 3%
Copyright ©20022011, Texas Instruments Incorporated 3
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
VI= 7.2 V, VO= 3.3 V, IO= 300 mA, EN = VI, TA=40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TPS62052 VI= 2.7 V to 10 V, 0 mA<IO<600 mA -3% 3%
Fixed output voltage TPS62054 VI= 2.7 V to 10 V, 0 mA<IO<600 mA -3% 3%
tolerance(1)
TPS62056 VI= 3.75 V to 10 V, 0 mA<IO<600 mA -3% 3%
Resistance of internal voltage divider for fixed-voltage 700 1000 1300 k
versions
Line regulation VO= 3.3 V, VI= 5 V to 10 V, IO= 600 mA 5.2 mV/V
Load regulation VI= 7.2 V; IO= 10 mA to 600 mA 0.0045 %/mA
VI= 5 V; VO= 3.3 V; IO= 300 mA 93%
ηEfficiency VI= 3.6 V; VO= 2.5 V; IO= 200 mA 93%
Duty cycle range for main switches 100%
Minimum ton time for main switch 100 ns
Shutdown temperature 145 °C
IO= 200 mA, VI= 5 V, Vo= 3.3 V,
Start-up time 1 ms
Co= 22 µF, L = 10 µH
(1) The worst case rDS(on) of the PMOS in 100% mode for an input voltage of 3.3 V is 0.75 . This value can be used to determine the
minimum input voltage if the output current is less than 600 mA with the TPS62056.
4Copyright ©20022011, Texas Instruments Incorporated
1
2
3
4
5
10
9
8
7
6
VIN
LBO
GND
PG
FB
PGND
SW
EN
SYNC
LBI
DGS PACKAGE
(TOP VIEW)
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
PIN ASSIGNMENTS
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
EN 8 I Enable. A logic high enables the converter, logic low forces the device into shutdown mode, reducing the supply
current to less than 2 µA.
FB 5 I Feedback pin for the fixed output voltage option. For the adjustable version, an external resistive divider is
connected to this pin. The internal voltage divider is disabled for the adjustable version.
GND 3 I Ground
LBO 2 O Open drain low battery output. Logic low signal indicates a low battery voltage.
LBI 6 I Low battery input
PG 4 O Power good comparator output. This is an open-drain output. A pullup resistor should be connected between PG
and VOUT. The output floats when the output voltage is greater than 95% of the nominal value.
PGND 10 I Power ground. Connect all power grounds to this pin.
SW 9 O Connect the inductor to this pin. This pin is the switch pin and connected to the drain of the internal power
MOSFETS.
SYNC 7 I Input for synchronization to the external clock signal. This input can be connected to an external clock or pulled to
GND or VI. When an external clock signal is applied, the device synchronizes to this external clock and the device
operates in fixed PWM mode. When the pin is pulled to either GND or VI, the internal oscillator is used and the
logic level determines if the device operates in fixed PWM or PWM/PFM mode.SYNC = HIGH: Low-noise mode
enabled, fixed frequency PWM operation is forcedSYNC = LOW (GND): Power-save mode enabled, PFM/PWM
mode enabled.
VIN 1 I Supply voltage input
Copyright ©20022011, Texas Instruments Incorporated 5
Undervoltage
Lockout
Bias Supply
_
+
+
REF
Current Limit Comparator
+
REF
I(AVG) Comparator
P-Channel
Power MOSFET
N-Channel
Power MOSFET
Driver
Shoot-Through
Logic
+
Load Comparator
Control
Logic
+
1.21 V
Soft Start
850 kHz
Oscillator
+
S
R
Comparator High
Comparator Low
Comparator High2
+
Compensation
R2
See Note
R1
VREF = 0.5 V
Comparator Low
Comparator Low2
Comparator High
Saw Tooth
Generator
VI
V(COMP)
Comparator
SW
PG
LBO
GNDPGNDLBIFB
VI
EN
SKIP Comparator
Error Amp
SYNC
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
NOTE: For the adjustable versions (TPS62050, TPS62051), the internal feedback driver is disabled and the FB pin is
directly connected to the GM amplifier.
6Copyright ©20022011, Texas Instruments Incorporated
PGND
FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
TPS62050
SW
1
6
7
3
2
9
5
4
10
L1 = 10 µHVO = 5 V
R1 =
820 k
C(ff) = 6.8 pF
R2 = 91 k
Co = 22 µF
Ci = 10 µF
VI
R5
130 k
R6
100 k
R3
1 M R4
1 M
TDK
C3216X5R1A106M Taiyo Yuden
JMK316BJ226ML
WE PD 744 777 10
Quiescent Current Measurements and Efficiency Were Taken
With: R5 = Open, R4 = Open, LBI Connected to GND.
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
PARAMETER MEASUREMENT INFORMATION
All graphs were generated using the circuit as shown unless otherwise noted. For output voltages other than 5 V,
the fixed voltage versions are used. The resistors R1, R2, and the feedforward capacitor (Cff) are removed and
the feedback pin is directly connected to the output.
Figure 1. Standard Circuit for Adjustable Version
Copyright ©20022011, Texas Instruments Incorporated 7
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 5.5 V
VI = 6.5 V
VI = 7.2 V
VI = 8.4 V
VI = 10 V
SYNC = L
VO = 5 V
TA = 25°C
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 2.7 V
VI = 3.3 V
VI = 5 V
SYNC = L
VO = 1.5 V
TA = 25°C
VI = 7.2 V
VI = 10 V
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 2.7 V
VI = 3.3 V
VI = 5 V
SYNC = L
VO = 1.8 V
TA = 25°C
VI = 7.2 V
VI = 10 V
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 2.7 V
SYNC = H
VO = 1.5 V
TA = 25°C
VI = 5 V
VI = 3.3 V
VI = 10 V
VI = 7.2 V
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 3.5 V
VI = 5 V
SYNC = L
VO = 3.3 V
TA = 25°C
VI = 10 V
VI = 7.2 V
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 5.5 V
SYNC = H
VO = 5 V
TA = 25°C
VI = 7.2 V
VI = 6.5 V
VI = 10 V
VI = 8.4 V
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS
Table 1. TABLE OF GRAPHS
FIGURE
Efficiency vs load current 1 - 8
Switching frequency vs temperature 9
Output voltage ripple in SKIP mode 10
Output voltage ripple in PWM mode 11
Line transient response in PWM mode 12
Load transient 13
V(switch) and IL(inductor current) in skip mode 14
Start-up timing 15
TPS62050 TPS62052 TPS62054
EFFICIENCY EFFICIENCY EFFICIENCY
vs vs vs
LOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 2. Figure 3. Figure 4.
TPS62056 TPS62050 TPS62052
EFFICIENCY EFFICIENCY EFFICIENCY
vs vs vs
LOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 5. Figure 6. Figure 7.
8Copyright ©20022011, Texas Instruments Incorporated
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 3.5 V
SYNC = H
VO = 3.3 V
TA = 25°C
VI = 5 V
VI = 10 V
VI = 7.2 V
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1 k
IL − Load Current − mA
Efficiency − %
VI = 2.7 V
SYNC = H
VO = 1.8 V
TA = 25°C
VI = 5 V
VI = 3.3 V
VI = 10 V
VI = 7.2 V
800
810
820
830
840
850
860
870
880
890
900
−40 −20 0 20 40 60 80 100
Switching Frequency − kHz
TA − Free-Air Temperature − °C
2.7 V
3.6 V
7.2 V
5 V
1 µs/div
2 V/div
VI = 7.2 V
VO = 3.3 V
IO = 800 mA
Output Voltage
Voltage at SW Pin
10 mV/div
10 µs/div
2 V/div 10 mV/div
VI = 7.2 V, VO = 3.3 VOutput Voltage
Voltage at SW Pin IO = 20 mA
VI = 5 V
RL = 2.7
EN
VO
II
5 V/div
100 mA/div
200 µs/div
1 V/div
50 µs/div
500 mA/div
50 mV/div
VI = 5 V
VO = 3.3 V
Output Voltage
Load Step = 60 mA to 540 mA
Voltage at SW Pin
Inductor Current VI = 5 V
IO = 100 mA
5 V/div
100 mA/div
5 µs/div
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
TPS62054 TPS62056
EFFICIENCY EFFICIENCY SWITCHING FREQUENCY
vs vs vs
LOAD CURRENT LOAD CURRENT FREE-AIR TEMPERATURE
Figure 8. Figure 9. Figure 10.
OUTPUT VOLTAGE RIPPLE OUTPUT VOLTAGE RIPPLE LINE TRANSIENT RESPONSE
IN SKIP MODE IN PWM MODE IN PWM MODE
Figure 11. Figure 12. Figure 13.
V(SWITCH) AND IL
(INDUCTOR CURRENT)
LOAD TRANSIENT IN SKIP MODE START-UP TIMING
Figure 14. Figure 15. Figure 16.
Copyright ©20022011, Texas Instruments Incorporated 9
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
APPLICATION INFORMATION
Operation
The TPS6205x is a synchronous step-down converter that operates with a 850-kHz fixed frequency pulse width
modulation (PWM) at moderate to heavy load currents and enters the power-save mode at light load current.
During PWM operation the converter uses a unique fast response voltage mode control scheme with input
voltage feed forward to achieve good line and load regulation with the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal (S), the P-channel MOSFET switch
is turned on and the inductor current ramps up until the voltage-comparator trips and the control logic turns the
switch off. Also the switch is turned off by the current limit comparator in case the current limit of the P-channel
switch is exceeded. After the dead time preventing current shoot through, the N-channel MOSFET rectifier is
turned on and the inductor current ramps down. The next cycle is initiated by the clock signal again, turning off
the N-channel rectifier and turning on the P-channel switch.
The error amplifier as well as the input voltage determines the rise time of the saw tooth generator; therefore,
any change in input voltage or output voltage directly controls the duty cycle of the converter giving a very good
line and load transient regulation.
Constant Frequency Mode Operation (SYNC = HIGH)
In the constant frequency mode, the output voltage is regulated by varying the duty cycle of the PWM signal in
the range of 100% to 10%. Connecting the SYNC pin to a voltage greater than 1.5 V forces the converter to
operate permanently in the PWM mode even at light or no load currents. The advantage is the converter
operates with a fixed switching frequency that allows simple filtering of the switching frequency for noise sensitive
applications. In this mode, the efficiency is lower compared to the power-save mode during light loads (see
Figure 17). The N-MOSFET of the devices stays on even when the current into the output drops to zero. This
prevents the device from going into discontinuous mode. The device transfers unused energy back to the input.
Therefore, there is no ringing at the output that usually occurs in the discontinuous mode. The duty cycle range
in constant frequency mode is 100% to 10%.
It is possible to switch from forced PWM mode to the power-save mode during operation by pulling the SYNC pin
low. The flexible configuration of the SYNC pin during operation of the device allows efficient power management
by adjusting the operation of the TPS6205x to the specific system requirements.
Power-Save Mode Operation (SYNC = LOW)
As the load current decreases, the converter enters the power-save mode operation. During power-save mode
the converter operates with reduced switching frequency in PFM and with a minimum quiescent current to
maintain high efficiency. Whenever the average output current goes below the skip threshold, the converter
enters the power-save mode. The average current depends on the input voltage. It is 100 mA at low input
voltages and up to 200 mA with maximum input voltage. The average output current must be below the threshold
for at least 32 clock cycles (tcy) to enter the power-save mode. During the power-save mode the output voltage is
monitored with a comparator. When the output voltage falls below the comp low threshold set to 0.8% above VO
nominal, the P-channel switch turns on. The P-channel switch turns off as the peak switch current of typically 200
mA is reached. The N-channel rectifier turns on and the inductor current ramps down. As the inductor current
approaches zero, the N-channel rectifier is turned off and the switch is turned on starting the next pulse. When
the output voltage can not be reached with a single pulse, the device continues to switch with its normal
operating frequency, until the comparator detects the output voltage to be 1.6% above the nominal output
voltage. The converter wakes up again when the output voltage falls below the comp low threshold. This control
method reduces the quiescent current to typically to 12 µA and the switching frequency to a minimum achieving
the highest converter efficiency. Having these skip current thresholds 0.8% and 1.6% above the nominal output
voltage gives a lower absolute voltage drop during a load transient as anticipated with a standard converter
operating in this mode.
Feedforward Capacitor
The feedforward capacitor, C(ff) shown in Figure 21, improves the performance in SKIP mode. The comparator is
faster, therefore, there is less voltage ripple at the output in SKIP mode. Use the values listed in Table 2. Larger
values decrease stability in fixed frequency PWM mode. If the TPS6205x is only operated in fixed frequency
PWM mode, the feedforward capacitor is not needed.
10 Copyright ©20022011, Texas Instruments Incorporated
, nominal
0.8%
1.6%
–1.6%
t
VO
VI(min) +VO(max) )IO(max) ǒrDS(on)(max) )RLǓ
IO(max) = Maximum output current plus inductor ripple current
rDS(on)(max) = Maximum P-Channel switch rDS(on)
RL = DC resistance of the inductor
VO(max) = Nominal output voltage plus maximum output voltage tolerance
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
Figure 17. Power-Save Mode Output Voltage Thresholds
The converter enters the fixed frequency PWM mode again as soon as the output voltage falls below the comp
low 2 threshold set to 1.6% below VO, nominal.
Soft-Start
The TPS6205x has an internal soft-start circuit that limits the inrush current during start-up. This prevents
possible voltage drops of the input voltage if a battery or a high impedance power source is connected to the
input of the TPS6205x.
The soft-start is implemented as a digital circuit increasing the switch current in steps of 200 mA, 400 mA, 800
mA and then the typical switch current limit of 1.2 A. Therefore the start-up time mainly depends on the output
capacitor and load current. Typical start-up time with a 22-µF output capacitor and a 200-mA load current is 1
ms.
100% Duty Cycle Low Dropout Operation
The TPS6205x offers the lowest possible input to output voltage difference while still maintaining operation with
the use of the 100% duty cycle mode. In this mode, the P-channel switch is constantly turned on. This is
particularly useful in battery powered applications to achieve longest operation time by taking full advantage of
the whole battery voltage range, i.e. The minimum input voltage to maintain regulation depends on the load
current and output voltage and can be calculated as:
Enable and Overtemperature Protection
Logic low on EN forces the TPS6205x into shutdown. In shutdown, the power switch, drivers, voltage reference,
oscillator, and all other functions are turned off. The supply current is reduced to less than 2 µA in the shutdown
mode. When the device is in thermal shutdown, the bandgap is forced to stay on even if the device is set into
shutdown by pulling EN to GND. As soon as the temperature drops below the threshold, the device automatically
starts again.
If an output voltage is present when the device is disabled, which could be an external voltage source or super
cap, the reverse leakage current is specified under electrical characteristics. Pulling the enable pin high starts up
the TPS6205x with the soft-start as described under the paragraph soft-start. If the EN pin is connected to any
voltage other than VIor GND, an increased leakage current of typically 10 µA and up to 20 µA can occur.
Copyright ©20022011, Texas Instruments Incorporated 11
5 V
EN
VINVIN
Vt = 0.7 V
0 µA for VEN < 0.6 V
Typically 0.3 µA to 5 µAfor VEN < 4 V
Enable to Internal Circuitry
EN
VIN
ON
OFF
0.3 µA, min
R >1.3 V/0.3 µA
TPS6205x
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
Figure 18. Internal Circuit of the ENABLE Pin
The EN pin can be used in a pushbutton configuration as shown in Figure 19. The external resistor to GND must
be capable of sinking 0.3 µA with a minimum voltage drop of 1.3 V to keep the system enabled when both
switches are open. When the ON-button is pressed, the device is enabled and the current through the external
resistor keeps the voltage level high to ensure that the device stays on when the ON-button is released. When
the OFF-button is pressed, the device is switched off and the current through the external resistor is zero. The
device therefore stays off even when the OFF-button is released.
Figure 19. Pushbutton Configuration for the EN-Pin
Undervoltage Lockout
The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions.
Synchronization
If no clock signal is applied, the converter operates with a typical switching frequency of 850 kHz. It is possible to
synchronize the converter to an external clock within a frequency range from 600 kHz to 1200 kHz. The device
automatically detects the rising edge of the first clock and synchronizes to the external clock. If the clock signal is
stopped, the converter automatically switches back to the internal clock and continues operation. The switchover
is initiated if no rising edge on the SYNC pin is detected for a duration of four clock cycles. Therefore, the
maximum delay time can be 8.3 µs if the internal clock has its minimum frequency of 600 kHz. During this time,
there is no clock signal available. The device stops switching until the internal circuitry is switched to the internal
clock source.
When the device is switched between internal synchronization and external synchronization during operation, the
output voltage may show transient over/undershoot during switchover. The voltage transients are minimized by
using 850 kHz as an initial external frequency, and changing the frequency slowly (>1 ms) to the value desired.
The voltage drop at the output when the device is switched from external synchronization to internal
synchronization can be reduced by increasing the output capacitor value.
If the device is synchronized to an external clock, the power-save mode is disabled and the device stays in
forced PWM mode.
12 Copyright ©20022011, Texas Instruments Incorporated
LBI
ENABLE
LBO
VIN
Bandgap
LBI
Comparator
Enable to Internal Circuitry
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
Connecting the SYNC pin to the GND pin enables the power-save mode. The converter operates in the PWM
mode at moderate to heavy loads and in the PFM mode during light loads maintaining high efficiency over a wide
load current range.
Power Good Comparator
The power good (PG) comparator has an open drain output capable of sinking typically 1 mA. The PG function is
only active when the device is enabled (EN = high). When the device is disabled (EN = low), the PG pin is pulled
to GND.
The PG output is only valid after a 250 µs delay after the device is enabled and the supply voltage is greater
than 2.7 V. Power good is low during the first 250 µs after shutdown and in shutdown.
The PG pin floats high when the output voltage exceeds typically 98.5% of its nominal value. Leave the PG pin
unconnected, or connect to GND when not used.
Low-Battery Detector (Standard Version)
The low-battery output (LBO) is an open drain type which goes low when the voltage at the low battery input
(LBI) falls below the trip point of 1.21 V ±1.5%. The voltage at which the low-battery warning is issued is adjusted
with a resistive divider as shown in Figure 21. The sum of the resistors R1 and R2 is recommended to be in the
100-kto 1-Mrange for high efficiency at low output current. An external pullup resistor at LBO can either be
connected to OUT, or any other voltage rail in the voltage range of 0 V to 6 V. During start-up, the LBO output
signal is invalid for the first 500 µs. LBO is high impedance when the device is disabled. If the low-battery
comparator function is not used, connect LBI to ground. The low-battery detector is disabled when the device is
disabled. Leave the LBO pin unconnected, or connect to GND when not used.
ENABLE/Low-Battery Detector (Enhanced Version) TPS62051 Only
The TPS62051 offers an enhanced LBI functionality to provide a precise, user programmable undervoltage
shutdown. No additional supply voltage supervisor (SVS) is needed to provide this function.
When the enable (EN) pin is pulled high, only the internal bandgap voltage reference is switched on to provide a
reference source for the LBI comparator. As long as the voltage at LBI is less than the LBI trip point, all other
internal circuits are shut down, reducing the supply current to 5 µA. As soon as input voltage at LBI rises above
the LBI trip point of 1.21 V, the device is completely enabled and starts switching.
Figure 20. Block Diagram of ENABLE/LBI Functionality for TPS62051
The logic level of the LBO pin is not defined for the first 500 µs after EN is pulled high.
When the enhanced LBI is used to supervise the battery voltage and shut down the TPS62051 at low input
voltages, the battery voltage rises again when the current drops to zero. The implemented hysteresis on the LBI
pin may not be sufficient for all types of batteries. Figure 21 shows how an additional external hysteresis can be
implemented.
Copyright ©20022011, Texas Instruments Incorporated 13
FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
PGND
TPS62051
SW
1
6
7
3
2
9
5
4
10
R3 R4 R1
R2
R5
R6
R7
1 Cell Li-lon Ci = 10 µF
L1 = 10 µHVO = 2.5 V / 600 mA
Co = 22 µF
C(ff) =
6.8 pF
PGND
FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
TPS62050
SW
1
6
7
3
2
9
5
4
10
L1 = 10 µHVO = 5 V
R1 =
820 k
C(ff) = 6.8 pF
R2 = 91 k
Co = 22 µF
Ci = 10 µF
VI
R5
130 k
R6
100 k
R3
1 M R4
1 M
TDK
C3216X5R1A106M Taiyo Yuden
JMK316BJ226ML
WE PD 744 777 10
Quiescent Current Measurements and Efficiency Were Taken
With: R5 = Open, R4 = Open, LBI Connected to GND.
VO+VFB R1 )R2
R2 R1 +R2 ǒVO
VFBǓ–R2 VFB +0.5V
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
Figure 21. Enhanced LBI With Increased Hysteresis
A MATHCAD®file to calculate R7 can be downloaded from the product folder on the TI web.
No Load Operation
If the converter operates in the forced PWM mode and there is no load connected to the output, the converter
regulates the output voltage by allowing the inductor current to reverse for a short period of time.
STANDARD CIRCUIT FOR ADJUSTABLE VERSION
14 Copyright ©20022011, Texas Instruments Incorporated
L1 = 10 µHVO = 1.8 V / 600 mA
Co = 22 µF
Ci = 10 µF
VI = 2.7 V to 10 V
FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
PGND
TPS62054
SW
1
6
7
3
2
9
5
4
10
R3
R5
R6
R4
PGND
FB
PG
VIN
8
LBO
GND
SYNC
EN
LBI
TPS62050
SW
1
6
7
3
2
9
5
4
10
L1 = 10 µHVO = 0.7 V / 600 mA
R1 = 270 kC(ff) = 22 pF
R2 = 680 kCo = 47 µF
Ci = 10 µF
VI = 2.7 V to 7 V
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
Table 2. Values
NOMINAL OUTPUT VOLTAGE EQUATION POSSIBLE RESISTOR COMBINATION TYPICAL FEEDBACK CAPACITOR
0.7 V R1 = 0.4 x R2 R1 = 270 k, R2 = 680 k C(ff) = 22 pF
1.2 V R1 = 1.4 x R2 R1 = 510 k, R2 = 360 k (1.21 V) C(ff) = 6.8 pF
1.5 V R1 = 2 x R2 R1 = 300 k, R2 = 150 k (1.50 V) C(ff) = 6.8 pF
1.8 V R1 = 2.6 x R2 R1 = 390 k, R2 = 150 k (1.80 V) C(ff) = 6.8 pF
2.5 V R1 = 4 x R2 R1 = 680 k, R2 = 169 k (2.51 V) C(ff) = 6.8 pF
3.3 V R1 = 5.6 x R2 R1 = 560 k, R2 = 100 k (3.30 V) C(ff) = 6.8 pF
5 V R1 = 9 x R2 R1 = 820 k, R2 = 91 k (5.0 V) C(ff) = 6.8 pF
STANDARD CIRCUIT FOR FIXED VOLTAGE VERSION
CONVERTER FOR 0.7-V OUTPUT VOLTAGE
The TPS62050 is used to generate output voltages as low as 0.7 V. With such low output voltages, the inductor
discharges very slowly. This leads to a high output voltage ripple in power-save mode (SYNC = GND). It is
therefore recommended to use a larger output capacitor to keep the output ripple low. With an output capacitor of
47 µF, the output voltage ripple is less than 40 mVPP.
Copyright ©20022011, Texas Instruments Incorporated 15
DIL+VO
1*VO
VI
L fIL(max) +IO(max) )DIL
2
f = Switching frequency (850 kHz typical)
L = Inductor value
IL = Peak-to-peak inductor ripple current
IL(max) = Maximum inductor current
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
LAYOUT AND BOARD SPACE
All capacitors should be soldered as close as possible to the IC.
For information on the PCB layout see the user's guideSLVU081.
Keep the feedback track as short as possible. Any coupling to the FB pin may cause additional output voltage
ripple.
INDUCTOR SELECTION
A 10-µH minimum inductor should be used with the TPS6205x. Values larger than 22 µH or smaller than 10 µH
may cause stability problems due to the internal compensation of the regulator. After choosing the inductor value
of typically 10 µH, two additional inductor parameter should be considered: the current rating of the inductor and
the dc resistance. The dc resistance of the inductance directly influences the efficiency of the converter.
Therefore, an inductor with lowest dc resistance should be selected for highest efficiency. In order to avoid
saturation of the inductor, the inductor should be rated at least for the maximum output current plus half the
inductor ripple current which is calculated as:
The highest inductor current occurs at maximum VIN . A more conservative approach is to select the inductor
current rating just for the maximum switch current of the TPS6205x which is 1.4 A maximum. See Table 3 for
inductors that have been tested for operation with the TPS6205x.
Table 3. Inductors
MANUFACTURER TYPE INDUCTANCE DC RESISTANCE SATURATION CURRENT
SLF7032T- 10 µH±20% 53 m ±20% 1.4 A
100M1R4SLF7032T- 22 µH±20% 110 m ±20% 0.96 A
TDK 220M96SLF7045T- 10 µH±20% 36 m ±20% 1.3 A
100M1R3SLF7045T- 22 µH±20% 61 m ±20% 0.9 A
100MR90
CDR74B 10 µH 70 m1.65 A
CDR74B 22 µH 130 m1.12 A
CDH74 10 µH 49 m1.8 A
CDH74 22 µH 110 m1.23 A
Sumida CDR63B 10 µH 140 m1 A
CDRH4D28 10 µH 128 m1 A
CDRH5D28 10 µH 48 m1.3 A
CDRH5D18 10 µH 92 m1.2 A
DT3316P-153 15 µH 60 m1.8 A
Coilcraft DT3316P-223 22 µH 84 m1.5 A
WE-PD 744 778 10 10 µH 72 m1.68 A
WE-PD 744 777 10 10 µH 49 m1.84 A
Wuerth WE-PD 744 778 122 22 µH 190 m1.07A
WE-PD 744 777 122 22 µH 110 m1.23 A
16 Copyright ©20022011, Texas Instruments Incorporated
IRMS(Co) +VO
1–VO
VI
L f 1
2 3
Ǹ
DVO+VO
1*VO
VI
L f ǒ1
8 Co f)RESRǓ
IRMS +IO(max) VO
VI ǒ1*VO
VIǓ
Ǹ
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
OUTPUT CAPACITOR SELECTION
The output capacitor should have a minimum value of 22µF. For best performance, a low ESR ceramic output
capacitor is needed.
For completeness, the RMS ripple current is calculated as:
The overall output ripple voltage is the sum of the voltage spike caused by the output capacitor ESR plus the
voltage ripple caused by charge and discharging the output capacitor:
The highest output voltage ripple occurs at the highest input voltage VI.
INPUT CAPACITOR SELECTION
Because the buck converter has a pulsating input current, a low ESR input capacitor is required for best input
voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. The input
capacitor should have a minimum value of 10 µF and can be increased without any limit for better input voltage
filtering. The input capacitor should be rated for the maximum input ripple current calculated as:
The worst case RMS ripple current occurs at D = 0.5 and is calculated as: IRMS = IO/2. Ceramic capacitors have a
good performance because of their low ESR value and they are less sensitive to voltage transients compared to
tantalum capacitors. Place the input capacitor as close as possible to the input pin of the IC for best
performance.
Table 4. Capacitors
MANUFACTURER PART NUMBER SIZE VOLTAGE CAPACITANCE TYPE
JMK212BJ106MG 0805 6.3 V 10 µF Ceramic
JMK316BJ106ML 1206 6.3 V 10 µF Ceramic
JMK316BJ226ML 1206 6.3 V 22 µF Ceramic
Taiyo Yuden LMK316BJ475ML 1206 10 V 4.7 µF(1) Ceramic
EMK316BJ475ML 1206 16 V 4.7 µF(1) Ceramic
EMK325BJ106KN-T 1210 16 V 10 µF Ceramic
Kemet C1206C106M9PAC 1206 6.3 V 10 µF Ceramic
C2012X5R0J106M 0805 6.3 V 10 µF Ceramic
TDK C3216X5R0J226M 1206 6.3 V 22 µF Ceramic
C3216X5R1A106M 1206 10 V 10 µF Ceramic
(1) Connect two in parallel.
Copyright ©20022011, Texas Instruments Incorporated 17
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
www.ti.com
Table 5. Capacitor Manufacturers
MANUFACTURER CAPACITOR TYPE INTERNET
Taiyo Yuden X7R/X5R ceramic www.t-yuden.com
TDK X7R/X5R ceramic www.component.tdk.com
Vishay X7R/X5R ceramic www.vishay.com
Kemet X7R/X5R ceramic www.kemet.com
18 Copyright ©20022011, Texas Instruments Incorporated
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E SEPTEMBER 2002REVISED JUNE 2011
REVISION HISTORY
Note: Page numbers of current version may differ from previous versions.
Changes from Revision D (October 2003) to Revision E Page
Changed to Revision E, June 2011 ...................................................................................................................................... 1
Changed formatting. ............................................................................................................................................................. 1
Changed "goes active high"to "floats"in Terminal Functions table, row PG, description. .................................................. 5
Changed "becomes active"to "floats"in last paragraph of Power Good Comparator section. .......................................... 13
Copyright ©20022011, Texas Instruments Incorporated 19
PACKAGE OPTION ADDENDUM
www.ti.com 2-Jun-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS62050DGS ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM
TPS62050DGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM
TPS62050DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM
TPS62050DGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-1-260C-UNLIM
TPS62051DGS ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62051DGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62051DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62051DGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62052DGS ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62052DGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62052DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62052DGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62054DGS ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62054DGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62054DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62054DGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62056DGS ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 2-Jun-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS62056DGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62056DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS62056DGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS62050DGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS62051DGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS62052DGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS62054DGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS62056DGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS62050DGSR MSOP DGS 10 2500 367.0 367.0 35.0
TPS62051DGSR MSOP DGS 10 2500 367.0 367.0 35.0
TPS62052DGSR MSOP DGS 10 2500 367.0 367.0 35.0
TPS62054DGSR MSOP DGS 10 2500 367.0 367.0 35.0
TPS62056DGSR MSOP DGS 10 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated