LM2937ESX-3.3/NOPB - Texas Instruments High-Performance Analog

LM2937-2.5, LM2937-3.3

www.ti.com

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

LM2937-2.5, LM2937-3.3 400mA and 500mA Voltage Regulators

Check for Samples: LM2937-2.5,LM2937-3.3

1FEATURES DESCRIPTION

The LM2937-2.5 and LM2937-3.3 are positive voltage

2• Fully Specified for Operation Over −40°C to regulators capable of supplying up to 500 mA of load

+125°C current. Both regulators are ideal for converting a

• Output Current in Excess of 500 mA (400mA common 5V logic supply, or higher input supply

for SOT-223 package) voltage, to the lower 2.5V and 3.3V supplies to power

VLSI ASIC's and microcontrollers. Special circuitry

• Output Trimmed for 5% Tolerance Under All has been incorporated to minimize the quiescent

Operating Conditions current to typically only 10 mA with a full 500 mA load

• Wide Output Capacitor ESR Range, 0.01Ωup current when the input to output voltage differential is

to 5Ωgreater than 5V.

• Internal Short Circuit and Thermal Overload The LM2937 requires an output bypass capacitor for

Protection stability. As with most regulators utilizing a PNP pass

• Reverse Battery Protection transistor, the ESR of this capacitor remains a critical

design parameter, but the LM2937-2.5 and LM2937-

• 60V Input Transient Protection 3.3 include special compensation circuitry that

• Mirror Image Insertion Protection relaxes ESR requirements. The LM2937 is stable for

all ESR ratings less than 5Ω. This allows the use of

low ESR chip capacitors.

The regulators are also suited for automotive

applications, with built in protection from reverse

battery connections, two-battery jumps and up to

+60V/−50V load dump transients. Familiar regulator

features such as short circuit and thermal shutdown

protection are also built in.

Connection Diagrams

Figure 1. TO-220 Plastic Package Figure 2. SOT-223 Plastic Package

Front View Front View

See Package Number NDE0003B See Package Number DCY0004A

Figure 3. DDPAK/TO-263 Surface-Mount Package Figure 4. DDPAK/TO-263 Surface-Mount Package

Top View Side View

See Package Number KTT0003B See Package Number KTT0003B

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2937-2.5, LM2937-3.3

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)(2)

Input Voltage Continuous 26V

Transient (t ≤100 ms) 60V

Internal Power Dissipation (3) Internally Limited

Maximum Junction Temperature 150°C

Storage Temperature Range −65°C to +150°C

Lead Temperature Soldering TO-220 (10 seconds) 260°C

DDPAK/TO-263 (10 seconds) 230°C

SOT-223 (Vapor Phase, 60 seconds) 215°C

SOT-223 (Infrared, 15 seconds) 220°C

ESD Susceptibility (4) 2 kV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package,

73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the

device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or

SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to

the package (see Application Hints for more information on heatsinking).

(4) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.

Operating Conditions(1)

Temperature Range (2) LM2937ES, LM2937ET −40°C ≤TA≤125°C

LM2937IMP −40°C ≤TA≤85°C

Input Voltage Range 4.75V to 26V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package,

73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the

device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or

SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to

the package (see Application Hints for more information on heatsinking).

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

www.ti.com

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

Electrical Characteristics(1)

VIN = VNOM + 5V, IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package,

COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range, of the

indicated device, all other specifications are for TA= TJ= 25°C.

Output Voltage (VOUT) 2.5V 3.3V Units

Parameter Conditions Typ Limit Typ Limit

Output Voltage 5 mA ≤IOUT ≤IOUTmax 2.42 3.20 V (Min)

2.5 2.38 3.3 3.14 V(Min)

2.56 3.40 V(Max)

2.62 3.46 V(Max)

Line Regulation(2) 4.75V ≤VIN ≤26V, 7.5 25 9.9 33 mV(Max)

IOUT = 5 mA

Load Regulation 5 mA ≤IOUT ≤IOUTmax 2.5 25 3.3 33 mV(Max)

Quiescent Current 7V ≤VIN ≤26V, 2 10 210 mA(Max)

IOUT = 5 mA

VIN = (VOUT + 5V), 10 20 10 20 mA(Max)

IOUT = IOUTmax

VIN = 5V, IOUT = IOUTmax 66 100125 66 100125 mA(Max)

Output Noise Voltage 10 Hz–100 kHz, 75 99 μVrms

IOUT = 5 mA

Long Term Stability 1000 Hrs. 10 13.2 mV

Short-Circuit Current 1.0 0.6 1.0 0.6 A(Min)

Peak Line Transient Voltage tf< 100 ms, RL= 100Ω75 60 75 60 V(Min)

Maximum Operational Input 26 26 V(Min)

Voltage

Reverse DC Input Voltage VOUT ≥ −0.6V, RL= 100Ω −30 −15 −30 −15 V(Min)

Reverse Transient Input tr< 1 ms, RL= 100Ω−75 −50 −75 −50 V(Min)

Voltage

(1) Typicals are at TJ= 25°C and represent the most likely parametric norm.

(2) The minimum input voltage required for proper biasing of these regulators is 4.75V. Below this level the outputs will fall out of regulation.

This effect is not the normal dropout characteristic where the output falls out of regulation due to the PNP pass transistor entering

saturation. If a value for worst case effective input to output dropout voltage is required in a specification, the values should be 2.37V

maximum for the LM2937-2.5 and 1.6V maximum for the LM2937-3.3.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

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Typical Performance Characteristics

Output Voltage vs Temperature (2.5V) Output Voltage vs Temperature (3.3V)

Figure 5. Figure 6.

Quiescent Current vs Output Current (2.5V) Quiescent Current vs Output Current (3.3V)

Figure 7. Figure 8.

Quiescent Current vs Input Voltage (2.5V) Quiescent Current vs Input Voltage (3.3V)

Figure 9. Figure 10.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

www.ti.com

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

Typical Performance Characteristics (continued)

Line Transient Response Load Transient Response

Figure 11. Figure 12.

Ripple Rejection Output Impedance

Figure 13. Figure 14.

Maximum Power Dissipation (TO-220) Maximum Power Dissipation (DDPAK/TO-263) (1)

Figure 15. Figure 16.

(1) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package,

73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the

device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or

SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to

the package (see Application Hints for more information on heatsinking).

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

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Typical Performance Characteristics (continued)

Low Voltage Behavior (2.5V) Low Voltage Behavior (3.3)

Figure 17. Figure 18.

Output at Voltage Extremes Output Capacitor ESR

Figure 19. Figure 20.

Peak Output Current

Figure 21.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

www.ti.com

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

Typical Application

* Required if the regulator is located more than 3 inches from the power supply filter capacitors.

** Required for stability. Cout must be at least 10 μF (over the full expected operating temperature range) and located

as close as possible to the regulator. The equivalent series resistance, ESR, of this capacitor may be as high as 3Ω

APPLICATION HINTS

EXTERNAL CAPACITORS

The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both

ESR (Equivalent Series Resistance) and minimum amount of capacitance.

MINIMUM CAPACITANCE:

The minimum output capacitance required to maintain stability is 10 μF (this value may be increased without

limit). Larger values of output capacitance will give improved transient response.

ESR LIMITS:

The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of

ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet

these requirements, or oscillations can result.

Figure 22. Output Capacitor ESR

Figure 23. ESR Limits

It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer

must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the

design.

For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to

−40°C. This type of capacitor is not well-suited for low temperature operation.

Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum

electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid

Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value.

If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of

the Tantalum will keep the effective ESR from rising as quickly at low temperatures.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

www.ti.com

HEATSINKING

A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of

the application. Under all possible operating conditions, the junction temperature must be within the range

specified under Absolute Maximum Ratings.

To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.

The figure below shows the voltages and currents which are present in the circuit, as well as the formula for

calculating the power dissipated in the regulator:

IIN = IL÷ IG

PD= (VIN −VOUT) IL+ (VIN) IG

Figure 24. Power Dissipation Diagram

The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). This is

calculated by using the formula:

TR(max) = TJ(max) −TA(max)

where:

• TJ(max) is the maximum allowable junction temperature, which is 125°C for commercial grade parts.

• TA(max) is the maximum ambient temperature which will be encountered in the application.

Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient

thermal resistance, θ(J−A), can now be found:

θ(J−A) = TR(max)/PD

NOTE

If the maximum allowable value for θ(J−A) is found to be ≥53°C/W for the TO-220 package,

≥80°C/W for the DDPAK/TO-263 package, or ≥174°C/W for the SOT-223 package, no

heatsink is needed since the package alone will dissipate enough heat to satisfy these

requirements.

If the calculated value for θ(J−A)falls below these limits, a heatsink is required.

HEATSINKING TO-220 PACKAGE PARTS

The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane

is to be used, the values of θ(J−A) will be the same as shown in the next section for the DDPAK/TO-263.

If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ(H−A), must

first be calculated:

θ(H−A) =θ(J−A) − θ(C−H) − θ(J−C)

Where:

•θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be

assumed for θ(J−C) for this calculation.

•θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value

of θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If

the exact value is unknown, 2°C/W should be assumed for θ(C−H).

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

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SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is

less than or equal to this number.

θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots

temperature rise vs power dissipation for the heatsink.

HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS

Both the DDPAK/TO-263 (“KTT”) and SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB

itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to

the plane.

Figure 25 shows for the DDPAK/TO-263 the measured values of θ(J−A) for different copper area sizes using a

typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.

Figure 25. θ(J−A) vs Copper (1 ounce) Area for the DDPAK/TO-263 Package

As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It

should also be observed that the minimum value of θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is

32°C/W.

As a design aid, Figure 26 shows the maximum allowable power dissipation compared to ambient temperature

for the DDPAK/TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).

Figure 26. Maximum Power Dissipation vs TAMB for the DDPAK/TO-263 Package

Figure 27 and Figure 28 show the information for the SOT-223 package. Figure 28 assumes a θ(J−A) of 74°C/W

for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

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Figure 27. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package

Figure 28. Maximum Power Dissipation vs TAMB for the SOT-223 Package

Please see AN-1028 (SNVA036) for power enhancement techniques to be used with the SOT-223 package.

SOT-223 SOLDERING RECOMMENDATIONS

It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed

circuit board. The excessive temperatures involved may cause package cracking.

Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223

package.

Product Folder Links: LM2937-2.5 LM2937-3.3

LM2937-2.5, LM2937-3.3

www.ti.com

SNVS015E –FEBRUARY 1998–REVISED APRIL 2013

REVISION HISTORY

Changes from Revision D (April 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 10

Product Folder Links: LM2937-2.5 LM2937-3.3

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2937ES-2.5 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-2.5

LM2937ES-2.5/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-2.5

LM2937ES-3.3 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-3.3

LM2937ES-3.3/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-3.3

LM2937ESX-3.3 NRND DDPAK/

TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2937ES

-3.3

LM2937ESX-3.3/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-3.3

LM2937ET-2.5 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-2.5

LM2937ET-2.5/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-2.5

LM2937ET-3.3 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-3.3

LM2937ET-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-3.3

LM2937IMP-2.5 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L68B

LM2937IMP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L68B

LM2937IMP-3.3 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 85 L69B

LM2937IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L69B

LM2937IMPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L68B

LM2937IMPX-3.3 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 85 L69B

LM2937IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L69B

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2937ESX-3.3 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937ESX-3.3/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937IMP-2.5 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-2.5/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-3.3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2937ESX-3.3 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937ESX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937IMP-2.5 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

MECHANICAL DATA

NDE0003B

www.ti.com

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

MECHANICAL DATA

KTT0003B

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TS3B (Rev F)

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