EMDS12N2H-100.000M - Ecliptek Corporation

RoHS

EMDS12N2H-100.000M

EMDS12 N 2 H -100.000M

Series

RoHS Compliant (Pb-free) 2.5V 6 Pad 5mm x 7mm

Plastic SMD LVDS MEMS Oscillator

Frequency Tolerance/Stability

±25ppm Maximum over -20°C to +70°C

Duty Cycle

50 ±5(%)

Nominal Frequency

100.000MHz

Logic Control / Additional Output

Output Enable (OE) and Complementary Output

ELECTRICAL SPECIFICATIONS

Nominal Frequency 100.000MHz

Frequency Tolerance/Stability ±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

1st Year Aging at 25°C, Reflow, Shock, and Vibration)

Aging at 25°C ±1ppm First Year Maximum

Supply Voltage +2.5Vdc ±0.125Vdc

Input Current 75mA Maximum (Excluding Load Termination Current)

Output Voltage Logic High (Voh) 1.425Vdc Typical

Output Voltage Logic Low (Vol) 1.075Vdc Typical

Differential Output Voltage (Vod) 247mVdc Minimum, 350mVdc Typical, 454mVdc Maximum

Offset Voltage (Vos) 1.125V Minimum, 1.250V Typical, 1.375V Maximum

Rise/Fall Time 225pSec Typical, 325pSec Maximum (Measured over 20% to 80% of waveform)

Differential Output Error (dVod) 50mVdc Maximum

Duty Cycle 50 ±5(%) (Measured at 50% of waveform)

Offset Error (dVos) 50mVdc Maximum

Load Drive Capability 100 Ohms Between Output and Complementary Output

Output Logic Type LVDS

Logic Control / Additional Output Output Enable (OE) and Complementary Output

Output Control Input Voltage Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable Output and Complementary Output (High Impedance)

Output Enable Current 70mA Maximum (OE) Without Load

Period Jitter (Deterministic) 0.2pSec Typical

Period Jitter (Random) 2.0pSec Typical

Period Jitter (RMS) 2.5pSec Typical, 3.5pSec Maximum

Period Jitter (pk-pk) 25pSec Typical, 30pSec Maximum

RMS Phase Jitter (Fj = 637kHz to

10MHz; Random) 2.1pSec Typical

RMS Phase Jitter (Fj = 1MHz to

20MHz; Random) 1.7pSec Typical

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random) 1.5pSec Typical

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V

Flammability UL94-V0

Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity Level J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)

Temperature Cycling MIL-STD-883, Method 1010, Condition B

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 5

EMDS12N2H-100.000M

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Thermal Shock MIL-STD-883, Method 1011, Condition B

Vibration MIL-STD-883, Method 2007, Condition A, 20G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

7.00

±0.15 2.30

1.47

1.20 ±0.10 (x4)

5.00

±0.15

0.85

±0.15

0.08

MAX

1.40

±0.10 (x4)

Note A: Center paddle is connected

internally to oscillator ground (Pad 3).

5.08

±0.10

2.60

±0.15

2.54 TYP

PIN CONNECTION

1 Output Enable (OE)

2 No Connect

3 Case Ground

4 Output

5 Complementary Output

6 Supply Voltage

LINE MARKING

1XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X6)

All Dimensions in Millimeters

0.54 (X4)

2.39 (X3)

1.80 (X6)

2.00 (X6)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 5

EMDS12N2H-100.000M

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

VOS

VIH

VIL

Q & Q OUTPUTS TRI-STATE INPUT

HIGH IMPEDANCE

STATE

80%

20%

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

tPLZ tPZL

Q MINUS Q OUTPUT

HIGH IMPEDANCE

STATE

VOD

VOp-p

Output

Supply

Voltage

(VDD)

Ground

Power

Supply Voltage

Meter

Current

Meter

0.01µF

(Note 1)

0.1µF

(Note 1)

Power

Supply No

Connect

Switch

Complementary

Output

Tri-State

Oscilloscope Frequency

Counter

Probe 2

(Note 2) Probe 1

(Note 2)

Test Circuit for Tri-State and Complementary Output

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)

to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is

recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

100 Ohms

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EMDS12N2H-100.000M

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EMDS12N2H-100.000M

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 5