HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002. 02.26
Page No. : 1/3
HTIP50 HS MC Product Specification
HTIP50
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP50 is designed for line operated audio output amplifier
switch-mode power supply drivers and other switching applications.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temper atur e............................................................................................ -50 ~ +150 °C
Junction Temper ature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
Total Power Dissipation (Ta=25°C)....................................................................................... 2 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 500 V
BVCEO Collector to Emitter Voltage.................................................................................. 400 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................... 1 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 500 - - V IC=1mA, IE= 0
BVCEO 400 - - V IC=30mA, IB=0
BVEBO 5 - - V IE=0.1mA, IC= 0
IEBO - - 1 mA VEB=5V, IC=0
ICEO - - 1 mA VCE=300V, IB=0
ICES - - 1 mA VCE=500V, VEB=0
*VCE(sat) - - 1 V IC=1A, IB=0.2A
VBE(on) - - 1.5 V IC=1A, VCE=10V
*hFE1 30 - 150 IC=0.3A, VCE= 10V
*hFE2 10 - - IC=1A, VCE=10V
fT 10 - - M Hz IC=0.2A, VCB= 10V, f=2MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
TO-220
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002. 02.26
Page No. : 2/3
HTIP50 HS MC Product Specification
Characteristics Curve
Current Gain & Collect or Current
10
100
1000
1 10 100 1000
Coll e c tor Curr e nt-I
C
(mA)
hFE
hFE @ V
CE
=10V
25
o
C
75
o
C
125
o
C
Satura tion Voltage & Collector Cur rent
10
100
1000
1 10 100 1000
Coll e c tor Curr e nt-I
C
(mA)
Sat u r ation Volt ag e (m V)
V
CE(sat)
@ I
C
=5I
B
25
o
C
75
o
C
125
o
C
ON Voltage & Col lector Current
100
1000
1 10 100 1000
Coll e c tor Curr e nt-I
C
(mA)
O N Voltage (mV)
VBE(ON) @ VCE=10V
25oC
75oC
125oC
Cutoff Frequency & Collector Current
10
100
1 10 100 1000
Collector Curren t (mA)
Cutoff Frequency (MHz)...
VCE=10V
Capaci tance & Re verse-B iased V oltage
1
10
100
1 10 100
R evers e Biased Vol tage (V)
Capacitanc e ( pF)
Cob
Safe Operati ng Area
0.001
0.01
0.1
1
10
1 10 100 1000
Forward Vol tage-V
CE
(V)
Collector Current-I
C
(mA)
P
T
=1s
P
T
=100ms
P
T
=1ms
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002. 02.26
Page No. : 3/3
HTIP50 HS MC Product Specification
TO-220AB Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 A l l oy; solder pl ating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of cust om er product design, infringement of patents, or applicat ion assistance.
Head Office And Factory:
• Head Office (Hi-Sincerit y Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Tai wan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Pa rk Hsi n-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax: 886-3-5982931
AB
E
G
IK
M
OP
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Pac k age
HSMC Package Code: E
Marking:
Date Code Control Code
H
5TIP
0
