1
2
3
4
5
6
7
14
13
12
11
10
9
8
2OUT
1OUT
1IN–
VCC+
1IN+
2IN–
2IN+
3OUT
3IN–
4IN+
GND
4IN–
3IN+
4OUT
LMV339 . . . D OR PW PACKAGE
(TOP VIEW)
LMV393 . . . D, DDU, DGK OR PW PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
GND
VCC+
2OUT
2IN–
2IN+
LMV331 . . . DBV OR DCK PACKAGE
(TOP VIEW)
VCC+
OUT
1
2
3
5
4
1IN+
GND
1IN–
LMV339 . . . RUC PACKAGE
(TOP VIEW)
1
2
3
4
5
12
11
10
9
8
7
6
14 13
1OUT
1IN–
VCC+
1IN+
2IN–
2IN+
3IN–
4IN+
GND
4IN–
3IN+
4OUT
3OUT
2OUT
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136R –AUGUST 1999–REVISED MAY 2012
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS
1FEATURES
• 2.7-V and 5-V Performance
• Low Supply Current
– LMV331 . . . 130 μA Typ
– LMV393 . . . 210 μA Typ
– LMV339 . . . 410 μA Typ
• Input Common-Mode Voltage Range Includes
Ground
• Low Output Saturation Voltage 200 mV Typical
• Open-Collector Output for Maximum Flexibility
DESCRIPTION/
ORDERING INFORMATION
The LMV393 and LMV339 devices are low-voltage
(2.7 V to 5.5 V) versions of the dual and quad
comparators, LM393 and LM339, which operate from
5 V to 30 V. The LMV331 is the single-comparator
version.
The LMV331, LMV339, and LMV393 are the most
cost-effective solutions for applications where low-
voltage operation, low power, space saving, and price
are the primary specifications in circuit design for
portable consumer products. These devices offer
specifications that meet or exceed the familiar LM339
and LM393 devices at a fraction of the supply current.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
IN+
IN−
OUT
GND
R1
Q1
Q3
Q7Q6
VCC+
Q2 Q4 Q5
R2 R3
Q8
Q9
+
–
IN–
IN+
OUT
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136R –AUGUST 1999–REVISED MAY 2012
www.ti.com
ORDERING INFORMATION(1)
TOP-SIDE
TAPACKAGE(2) ORDERABLE PART NUMBER MARKING(3)
Reel of 3000 LMV331IDCKR
SC-70 – DCK R2_
Reel of 250 LMV331IDCKT
Single Reel of 3000 LMV331IDBVR
SOT23-5 – DBV R1I_
Reel of 250 LMV331IDBVT
MSOP/VSSOP – DGK Reel of 2500 LMV393IDGKR R9_
Tube of 75 LMV393ID
SOIC – D MV393I
Reel of 2500 LMV393IDR
Dual
–40°C to 85°C Tube of 90 LMV393IPW
TSSOP – PW MV393I
Reel of 2000 LMV393IPWR
VSSOP – DDU Reel of 3000 LMV393IDDUR RABR
Tube of 50 LMV339ID
SOIC – D LM339I
Reel of 2500 LMV339IDR
Quad Tube of 150 LMV339IPW
TSSOP – PW MV339I
Reel of 2000 LMV339IPWR
µQFN – RUC Reel of 3000 LMV339IRUCR RT_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DGK/RUC : The actual top-side marking has one additional character that designates the wafer fab/assembly site.
SYMBOL (EACH COMPARATOR)
SIMPLIFIED SCHEMATIC
2Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136R –AUGUST 1999–REVISED MAY 2012
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage(2) 5.5 V
VID Differential input voltage(3) ±5.5 V
VIInput voltage range (either input) 0 VCC+ V
At or below TA= 25°C,
Duration of output short circuit (one amplifier) to ground(4) Unlimited
VCC ≤5.5 V 8 pin 97
D package 14 pin 86
DBV package 206
DCK package 252
θJA Package thermal impedance(5) (6) DDU package TBD °C/W
RUC package TBD
DGK package 172
8 pin 149
PW package 14 pin 113
TJOperating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions MIN MAX UNIT
VCC Supply voltage (single-supply operation) 2.7 5.5 V
VCC+ +
VOUT Output voltage V
0.3
TAOperating free-air temperature I temperature –40 85 °C
Copyright © 1999–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136R –AUGUST 1999–REVISED MAY 2012
www.ti.com
Electrical Characteristics
VCC+ = 2.7 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
VIO Input offset voltage 25°C 1.7 7 mV
Average temperature –40°C to
αVIO coefficient of input offset 5 μV/°C
85°C
voltage 25°C 15 250
IIB Input bias current nA
–40°C to 400
85°C
25°C 5 50
IIO Input offset current nA
–40°C to 150
85°C
IOOutput current (sinking) VO≤1.5 V 25°C 5 23 mA
25°C 0.003
Output Leakage Current µA
–40°C to 1
85°C
Common-mode input
VICR 25°C –0.1 to 2 V
voltage range
VSAT Saturation voltage IO≤1.5 mA 25°C 200 mV
LMV331 25°C 40 100
ICC Supply current LMV393 (both comparators) 25°C 70 140 μA
LMV339 (all four comparators) 25°C 140 200
Switching Characteristics
TA= 25°C, VCC+ = 2.7 V, RL= 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
Input overdrive = 10 mV 1000
Propagation delay high to low level output
tPHL ns
switching Input overdrive = 100 mV 350
Input overdrive = 10 mV 500
Propagation delay low to high level output
tPLH ns
switching Input overdrive = 100 mV 400
4Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136R –AUGUST 1999–REVISED MAY 2012
Electrical Characteristics
VCC+ = 5 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
25°C 1.7 7
VIO Input offset voltage mV
–40°C to 9
85°C
Average temperature
αVIO coefficient of input offset 25°C 5 μV/°C
voltage 25°C 25 250
IIB Input bias current nA
–40°C to 400
85°C
25°C 2 50
IIO Input offset current nA
–40°C to 150
85°C
IOOutput current (sinking) VO≤1.5 V 25°C 10 84 mA
25°C 0.003
Output Leakage Current µA
–40°C to 1
85°C
Common-mode input
VICR 25°C –0.1 to 4.2 V
voltage range
Large-signal differential
AVD 25°C 20 50 V/mV
voltage gain 25°C 200 400
VSAT Saturation voltage IO≤4 mA mV
–40°C to 700
85°C
25°C 60 120
LMV331 –40°C to 150
85°C
25°C 100 200
ICC Supply current LMV393 (both comparators) μA
–40°C to 250
85°C
25°C 170 300
LMV339 (all four comparators) –40°C to 350
85°C
Switching Characteristics
TA= 25°C, VCC+ = 5 V, RL= 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
Input overdrive = 10 mV 600
Propagation delay high to low level output
tPHL ns
switching Input overdrive = 100 mV 200
Input overdrive = 10 mV 450
Propagation delay low to high level output
tPLH ns
switching Input overdrive = 100 mV 300
Copyright © 1999–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136R –AUGUST 1999–REVISED MAY 2012
www.ti.com
REVISION HISTORY
Changes from Revision M (November 2005) to Revision N Page
• Changed document format from Quicksilver to DocZone. .................................................................................................... 1
• Added RUC package pin out and RUC package ordering information. ............................................................................... 1
Changes from Revision N (April 2011) to Revision O Page
• Changed VIin the Absolute Maximum Ratings from 5.5 V to VCC+ ...................................................................................... 3
Changes from Revision O (February 2012) to Revision P Page
• Corrected typo in Ordering Information Table for Top Side Marking, R9_. .......................................................................... 2
Changes from Revision P (March 2012) to Revision Q Page
• Corrected the Top Side Marking for RUC package, RT_. .................................................................................................... 2
Changes from Revision Q (April 2012) to Revision R Page
• Added RUC to marking list ................................................................................................................................................... 2
6Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV331IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339ID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IDE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV339IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV339IRUCR ACTIVE QFN RUC 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LMV393IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LMV393IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 4
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV331, LMV393 :
•Automotive: LMV331-Q1, LMV393-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV331IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV331IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
LMV331IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LMV331IDBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
LMV331IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV331IDCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
LMV331IDCKT SC70 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
LMV331IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LMV339IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LMV339IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LMV339IRUCR QFN RUC 14 3000 180.0 8.4 2.3 2.3 0.55 4.0 8.0 Q2
LMV393IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
LMV393IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
LMV393IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV393IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LMV393IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
LMV331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
LMV331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
LMV331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
LMV331IDCKR SC70 DCK 5 3000 180.0 180.0 18.0
LMV331IDCKR SC70 DCK 5 3000 205.0 200.0 33.0
LMV331IDCKT SC70 DCK 5 250 205.0 200.0 33.0
LMV331IDCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV339IDR SOIC D 14 2500 367.0 367.0 38.0
LMV339IPWR TSSOP PW 14 2000 367.0 367.0 35.0
LMV339IRUCR QFN RUC 14 3000 202.0 201.0 28.0
LMV393IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV393IDGKR VSSOP DGK 8 2500 370.0 355.0 55.0
LMV393IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LMV393IDR SOIC D 8 2500 340.5 338.1 20.6
LMV393IPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
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