HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs Data Sheet HSMx-C110/ HSMx-C120/HSMx-C150/HSMx-C170/HSMx-C177/ HSMx-C190/HSMx-C191/HSMx-C197/HSMx-C265 Description Features These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. Small size The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm foot-print with 0.8 mm profile. The HSMx-C177 has the widely used 2.0 x 1.25 mm footprint with 0.4 mm profile. The HSMx-C19x series has the industry standard 1.6 x 0.8 mm footprint with varying profile to suit designers needs, the HSMx-C190 has 0.8 mm profile, the HSMx-C191 has a low profile of 0.6 mm, and the HSMx-C197 has the ultra low profile of 0.4 mm. This family with its thin profile and wide viewing angle makes this LED exceptional for backlighting applications. The HSMx-C110 is a right angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The HSMx-C120 is a smaller right angle package with industry standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse mount package with dimensions of 3.4 x 1.25 x 1.1 mm. These devices are ideal for LCD backlighting and sidelighting applications. In order to facilitate pick and place operation, these chip LEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C170, C177, C190, C191, C197 packages, and 3000 units per reel for HSMx-C110, C150, C265 packages. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Industry standard footprint Compatible with IR solder Diffused optics Operating temperature range of -40C to +85C Right angle & reverse mount package available Various colors available Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications Keypad backlighting Push-button backlighting LCD backlighting Symbol backlighting Front panel indicator Device Selectiion Guide GaP Green HER Orange Yellow Description HSMG-C110 HSMS-C110 HSMD-C110 HSMY-C110 Untinted, Non-Diffused HSMG-C120 HSMS-C120 HSMD-C120 - Untinted, Non-Diffused HSMG-C150 HSMS-C150 HSMD-C150 HSMY-C150 Untinted, Diffused HSMG-C170 HSMS-C170 HSMD-C170 HSMY-C170 Untinted, Diffused HSMG-C177 HSMS-C177 HSMD-C177 HSMY-C177 Untinted, Diffused HSMG-C190 HSMS-C190 HSMD-C190 HSMY-C190 Untinted, Diffused HSMG-C191 HSMS-C191 HSMD-C191 HSMY-C191 Untinted, Diffused HSMG-C197 HSMS-C197 HSMD-C197 HSMY-C197 Untinted, Diffused HSMG-C265 - - - Untinted, Non-Diffused As AlGaAs Red Description HSMH-C110 Untinted, Non-Diffused HSMH-C120 Untinted, Non-Diffused HSMH-C150 Untinted, Diffused HSMH-C170 Untinted, Diffused HSMH-C190 Untinted, Diffused HSMH-C191 Untinted, Diffused HSMH-C265 Untinted, Non-Diffused Package Dimensions CATHODE MARK CATHODE MARK (ANODE MARK FOR HSMH-C150) 1.25 (0.049) 1.6 (0.063) 2.0 (0.079) 3.2 (0.126) DIFFUSED EPOXY POLARITY[3] 2.0 (0.079) 0.6 (0.024) DIFFUSED EPOXY POLARITY[3] 0.5 (0.020) 0.50 0.2 (0.020 0.008) PC BOARD 0.8 (0.031) CATHODE LINE (ANODE LINE FOR HSMH-C170) 0.3 (0.012) 0.4 0.15 (0.016 0.006) 0.4 0.15 (0.016 0.006) SOLDERING TERMINAL HSMx-C150 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified. 3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings. 2 1.4 (0.055) 0.3 (0.012) 1.1 (0.043) PC BOARD CATHODE LINE (ANODE LINE FOR HSMH-C150) 0.50 0.2 (0.020 0.008) (ANODE MARK FOR HSMH-C170) SOLDERING TERMINAL HSMx-C170 CATHODE MARK (ANODE MARK FOR HSMH-C190) CATHODE LINE LED DIE (ANODE MARK FOR HSMH-C110) 1.0 (0.039) 0.8 (0.031) 2.6 (0.102 ) 1.6 (0.063) 3.2 (0.126 ) 1.0 (0.039) [3] POLARITY POLARITY[3] CLEAR EPOXY 1.5 (0.059) 0.3 (0.012) PC BOARD DIFFUSED EPOXY PC BOARD 1.6 (0.063 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE (ANODE LINE FOR HSMH-C190) 0.3 0.15 (0.012 0.006) 0.5 (0.020) 3.2 (0.126 ) 0.3 0.15 (0.012 0.006) CATHODE LINE (ANODE LINE FOR HSMH-C110) 0.8 (0.031) 1.0 (0.039) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C110 CATHODE MARK CATHODE MARK (ANODE MARK FOR HSMH-C191) 0.8 (0.031) 1.25 (0.049) 1.6 (0.063 ) 2.00 (0.079) 1.0 (0.039) POLARITY[3] POLARITY DIFFUSED EPOXY 0.3 (0.012) 0.40 (0.016) DIFFUSED EPOXY PC BOARD PC BOARD CATHODE LINE (ANODE LINE FOR HSMH-C191) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.16 (0.006) 0.6 (0.023) 0.3 (0.012) 0.40 0.15 (0.016 0.006) 0.40 0.15 (0.016 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C191 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified. 3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings. 3 1.10 (0.043) MIN. SOLDERING TERMINAL HSMx-C177 3.4 (0.134) CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265] LED DIE CATHODE MARK 1.25 (0.049) 0.80 (0.031) 1.60 (0.063) GREEN SOLDER MASK POLARITY [3] POLARITY 1.2 (0.047) UNDIFFUSED EPOXY DIFFUSED EPOXY 1.1 (0.043) 1.1 (0.043) PC BOARD CATHODE LINE (ANODE LINE FOR HSMH-C265) 0.40 (0.016) PC BOARD 0.16 (0.006) 0.3 (0.012) CATHODE LINE 0.50 0.15 (0.020 0.006) 0.50 0.15 (0.020 0.006) 0.30 0.15 (0.012 0.006) 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C265 HSMx-C197 CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE 0.3 (0.012) 0.6 (0.024) 1.6 (0.063) POLARITY[3] 1.2 (0.047) CLEAR EPOXY 1.0 (0.039) PC BOARD 0.5 (0.020) CATHODE LINE (ANODE LINE FOR HSMH-C120) 3 - 0.3 (0.012) SOLDERING TERMINAL HSMx-C120 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified. 3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings. 4 Absolute Maximum Ratings for GaP at TA=25C Parameter C110/150/265 C120/170/177/190/191/197 Units DC Forward Current[1] 25 20 mA Power Dissipation 65 52 mW Reverse Voltage (IR=100 A) 5 5 V LED Junction Temperature 95 95 C Operating Temperature Range -40 to +85 -40 to +85 C Storage Temperature Range -40 to +85 -40 to +85 C Soldering Temperature See reflow soldering profile (Figure 9 & 10) Absolute Maximum Ratings for AlGaAs at TA=25C Parameter C110/150 C120/170/190/191/265 Units DC Forward Current[1] 30 25 mA Power Dissipation 78 65 mW Reverse Voltage (IR=100A) 5 5 V LED Junction Temperature 95 95 C Operating Temperature Range -40 to +85 -40 to +85 C Storage Temperature Range -40 to +85 -40 to +85 C Soldering Temperature See reflow soldering profile (Figure 9 & 10) Note: 1. Derate linearly as shown in Figure 4 for temperature above 25C. Electrical Characteristics at TA=25C Part Number 5 Color Forward Voltage VF(Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR(Volts) @ IR = 100 A Min. Capacitance C(pF), @ VF = 0 V, f = 1 MHz Typ. Thermal Resistance RJ-P (C/W) Typ. HSMS-C110/150 HSMS-C120 HSMS-C170/177/190/191/197 HER 2.1 2.6 5 5 400 350 250 HSMD-C110/150 HSMD-C120 HSMD-C170/177/190/191/197 Orange 2.2 2.6 5 7 400 350 250 HSMY-C110/150 HSMY-C170/177/190/191/197 Yellow 2.1 2.6 5 6 400 250 HSMG-C110/150 HSMG-C120 HSMG-C170/177/190191/197/265 Green 2.2 2.6 5 9 400 350 250 HSMH-C110/150 HSMH-C120 HSMH-C170/190/191/265 AlGaAs 1.8 2.6 5 18 460 400 300 Optical Characteristics at TA=25C Part Number Color Luminous Intensity[1] Iv(mcd)@20mA Min. Typ. Peak Wavelength peak(nm) Typ. Dominant Wavelength d(nm) Typ. HSMG-C110/177/197 HSMG-C120 HSMG-C150/170/190/191/265 Green 4.5 15.0 570 572 130 155 170 HSMS-C110/177/197 HSMS-C120 HSMS-C150/170/190/191 HER 2.8 10.0 630 626 130 155 170 HSMD-C110/177/197 HSMD-C120 HSMD-C150/170/190/191 Orange 2.8 8.0 605 604 130 155 170 HSMY-C110/177/197 HSMY-C150/170/190/191 Yellow 2.8 8.0 589 586 130 170 HSMH-C110 HSMH-C120 HSMH-C150/170/190/191/265 AlGaAs 7.2 17.0 660 639 130 155 170 Viewing Angle 21/2()[2] Typ. Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Green Color Bins[1] Yellow Color Bins[1] Bin ID Dom. Wavelength (nm) Min. Max. Bin ID Dom. Wavelength (nm) Min. Max. A 561.5 564.5 A 582.0 584.5 B 564.5 567.5 B 584.5 587.0 C 567.5 570.5 C 587.0 589.5 D 570.5 573.5 D 589.5 592.0 E 573.5 576.5 E 592.0 594.5 F 594.5 597.0 Tolerance: 1 nm Tolerance: 1 nm Orange Color Bins[1] Bin ID Dom. Wavelength (nm) Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance: 1 nm 6 Light Intensity (Iv) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. Bin ID Intensity (mcd) Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There is no upper Iv bin limits. Tolerance: 15% 1.0 RELATIVE INTENSITY GREEN AlGaAs YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH - nm 1.6 AlGaAs HER AlGaAs GREEN 10 1 YELLOW 0.1 1.7 1.9 2.1 2.3 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 7 1.2 0.8 0.4 GaP ORANGE 1.5 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT - mA 100 0 0 10 20 30 IF - FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. 40 IF MAX. - MAXIMUM FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength. 35 C110/C150 AlGaAs 30 C110/C150/C265 HER, ORANGE, YELLOW, GREEN C120/C170/C177/ C190/C191/C197/ C265 AlGaAs 25 20 10 5 0 RqJ-A = 600C/W C120/C170/ C177/C190/ C191/C197 HER, ORANGE, YELLOW, GREEN 15 0 20 RqJ-A = 800C/W 40 60 80 100 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward current vs. ambient temperature. 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C120. 8 100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265. TEMPERATURE 10 SEC. MAX. TEMPERATURE 10 SEC. MAX. 230C MAX. 4C/SEC. MAX. 140-160C 217 C 200 C 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. 3C/SEC. MAX. 4C/SEC. MAX. 255 - 260 C 3 C/SEC. MAX. OVER 2 MIN. TIME TIME Figure 10. Recommended Pb-free reflow soldering profile. Figure 9. Recommended reflow soldering profile. 0.8 (0.031) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 11. Recommended soldering pattern for HSMx-C150. 9 1.2 (0.047) 0.9 (0.035) Figure 12. Recommended soldering pattern for HSMx-C170 and C177. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) Figure 13. Recommended soldering pattern for HSMx-C190, C191 and C197. 5.0 (0.200) 0.4 (0.016) 0.9 (0.035) 0.4 (0.016) 0.9 (0.035) 0.7 (0.028) 1.0 (0.039) 0.2 (0.008) 0.15 (0.006) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) CENTERING BOARD 1.2 (0.047) 0.8 (0.031) 1.5 (0.059) Figure 14. Recommended soldering pattern for HSMx-C110. 0.8 (0.031) Figure 15. Recommended soldering pattern for HSMx-C120. USER FEED DIRECTION 2.2 (0.087) DIA. PCB HOLE CATHODE SIDE 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) PRINTED LABEL Figure 16. Recommended soldering pattern for HSMx-C265. Figure 17. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020) O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020) 59.60 1.00 (2.346 0.039) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) Figure 18. Reel dimensions. Note: All dimensions in millimeters (inches). 10 6 PS 5.0 0.5 (0.197 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) HSMx-C110/C120 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.20 (0.047) 3.40 (0.134) 1.70 (0.067) 0.75 (0.030) 1.90 (0.075) 1.15 (0.045) 1.27 (0.050) 3.50 (0.138) 1.88 (0.074) 0.95 (0.037) 2.30 (0.091) 1.45 (0.057) 0.60 (0.024) 2.30 (0.091) 1.40 (0.055) 0.90 (0.035) 1.75 (0.069) 0.90 (0.035) 0.87 (0.034) 1.86 (0.073) 0.89 (0.035) 0.60 (0.024) 1.75 (0.069) 0.95 (0.037) PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION R 1.0 0.05 (0.039 0.002) R 0.5 0.05 (0.020 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 8.00 0.30 (0.315 0.012) 4.00 (0.157) HSMx-C265 SERIES 11 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER Figure 19. Tape dimensions. CARRIER TAPE USER FEED DIRECTION DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 20. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.)unless otherwise specified. For product information and a complete list of distributors, please go to our website: Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 5C. b) Device exposed to factory conditions <30C/60% RH more than 672 hours. Baking recommended condition: 60 +/- 5C for 20 hours. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4806EN AV02-0551EN - March 5, 2012