2015 Microchip Technology Inc. DS20005408A-page 1
MCP1664
Features
•36V, 400m Integrated Switch
• Up to 92% Efficiency
• Drive LED Strings in Constant Current
• 1.8A Peak Input Current Limit:
-I
LED up to 200 mA at 3.3V VIN, 4 White LEDs
-I
LED up to 300 mA at 5.0V VIN, 4 White LEDs
-I
LED up to 150 mA at 4.2V VIN, 8 White LEDs
• Input Voltage Range: 2.4V to 5.5V
• Undervoltage Lockout (UVLO):
-UVLOatV
IN Rising: 2.3V, typical
-UVLOatV
IN Falling: 1.85V, typical
• Shutdown Current (EN = GND): 40 nA Typical
• PWM Operation: 500 kHz Switching Frequency
• Cycle-by-Cycle Current Limiting
• Intern al Com pen sation
• Open Load Protection (OLP) in the event of:
- Feedback Pin Shorted to GND (Prevent
Excessive Current into LEDs)
- Disconnected LED String (Prevent
Overvoltage to the Converter’s Output and
SW Pin)
• Overtemperature Protection
• Available Packages:
- 5-Lead SOT-23
- 8-Lead 2x3 TDFN
Applications
• Two and Three-Cell Alkaline or NiMH/NiCd White
LED Driver for Backlighting Pr oducts
• Li-Ion Battery LED Lightning Application
• Camera Flash
• LED Flashlights and Backlight Current Source
• Medical Equipment
• Por tabl e De vices:
- Hand-Held Gaming Devices
- GPS Navigation Systems
-LCD Monitors
- Portable DVD Play ers
General Description
The MCP1664 is a compact, space-efficient,
fixed-frequency, non-synchronous step-up converter
optimized to drive multiple strings of LEDs with
constant current powered from two and three-cell
alkali ne or NiMH/N iCd as well as from one-c ell Li-Ion or
Li-Polymer batteries.
The device integrates a 36V, 400 m lo w-side sw itch,
which is protected by the 1.8A cycle-by-cycle inductor
peak current limit operation. The MCP1664 starts up
without high inrush current or output overshoot. All
compensation and protection circuitry is integrated to
minimize the number of external components.
The inter nal feedback (VFB) voltage is set to 3 00 mV for
low p ower diss ipation w hen s en si ng an d regulat ing the
LED current. A single resistor sets the LED current.
The device features an UVLO which avoids start-up
with low inputs or discharged batteries for two
cell-powere d applicat ions.
The MCP1664 features an open load protection (OLP)
which turns off the operation in situations when the
LED string is ac cidentally disconnected o r the feedback
pin is short-circuited to GND.
While i n Shutdown mode (EN = GND), the device stops
switching, and consumes 40 nA typical of input current.
Package Types
* Includes Exposed Thermal Pad (EP); see Table 3-1.
SW
EN
VIN
1
GND 2
PGND
VIN
NC
EN
VFB
SGND
SW NC
MCP1664 SOT-23
VFB 34
5
MCP1664 2x3 TDFN*
1
2
3
4
8
7
6
5
EP
9
High-Voltage Step-Up LED Driver with UVLO and Open Load Protection
MCP1664
DS20005408A-page 2 2015 Microchip Technology Inc.
Typical Application
VIN
GND
VFB
COUT
10 µF
CIN
4.7 – 30 µF
L
4.7 – 10 µH
SW
EN
+
-
ALKALINE
ON
OFF
+
-
ALAKLINE
VIN
2.4V – 3.0V
LED6
12
RSET
LED1
I
LED
=25mA
ILED =0.3V
RSET
LED2
Max. 32V
VFB =0.3V
VOUT
0
50
100
150
200
250
300
350
2 2.5 3 3.5 4 4.5 5 5.5
IOUT (mA)
VIN (V)
4 wLEDs, L = 4.7 µH
8 wLEDs, L = 10 µH
L = 4.7 µH for maximum 4 white LEDs
L = 10 µH for 5 to 10 white LEDs
CIN = 4.7–10µF for V
IN >2.5V
CIN = 20 – 30 µF for VIN <2.5V
D
MBRM140
MCP1664
Maximum LED Current in Regulation vs. Input Voltage, TA = +25°C
2015 Microchip Technology Inc. DS20005408A-page 3
MCP1664
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VSW – GND.....................................................................+36V
EN, VIN – GND...............................................................+6.0V
VFB...............................................................................+0.35V
Power Dissi p a tion ................ ...... ....... ...... ....Internally Limited
Storage Temperature ...... .... .. .. .. .... .. ..... .... .. .. .-65°C to +150°C
Ambient Temperature with Power Applied....-40°C to +125°C
Operating Junction Temperature ...................-40°C to +150°C
ESD Protection On All Pins:
HBM.................................................................4 kV
MM..................................................................400V
† Notice: S tresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the devi ce at those or any other c onditions ab ove those
indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.
DC AND AC CHARACTERISTIC S
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA=+25°C, V
IN = 3.3V, VOUT loaded with 3 white LEDs (VF= 2.65Vat IF=100mA), I
LED =20mA,
CIN =C
OUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the controlled TA range of -40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Input Voltage Range VIN 2.4 — 5.5 V Note 1
Undervoltage Lockout (UVLO) UVLOSTART —2.3— VV
IN rising, ILED =20mA
UVLOSTOP —1.85— VV
IN falling, ILED =20mA
Maximum Output Voltage VOUTmax ——32 VNote 1
Maximum Output Current IOUT —150— mA4.2V V
IN, 8 LEDs
200 — mA 3.3V VIN, 4 LEDs
300 — mA 5.0V VIN, 4 LEDs
Feedbac k Voltage Reference VFB 275 300 325 mV
Feedbac k Inpu t Bias C urren t IVFB —0.025— µA
Shutdown Quiescent Current IQSHDN —0.04— µAEN=GND
NMOS Peak Switch Current
Limit IN(MAX) —1.8— ANote 2
NMOS Switch Leakage INLK —0.4— µAV
IN =V
SW =5V;
VOUT = 5.5V
VEN =V
FB =GND
NMOS Switch ON Resi stance RDS(ON) —0.4— VIN =5V,
ILED = 100 mA,
4 series white LEDs
Note 2
Feedbac k Volt age Line
Regulation |(VFB/VFB)/VIN|— 0.5 1 %/VV
IN = 3.3V to 5V
Maximu m Duty Cycle DCMAX —90— %Note 2
Switching Frequency fSW 425 500 575 kHz ±15%
EN Input Logic High VIH 85 — — % of VIN
EN Input Logic Low VIL ——7.5% of V
IN
EN Input Leakage Current IENLK —0.025— µAV
EN =5V
Note 1: Minimum input voltage in the range of VIN (VIN <5.5V<V
OUT) depends on the maximum duty cycle
(DCMAX) and on the output voltage (VOUT), according to the boost converter equation:
VINmin =V
OUT x(1–DC
MAX). Output voltage is equal to the LED voltage plus the voltage on the sense
resistor (VLED +V_R
SET). Recommended (VOUT - VIN) > 1V.
2: Determined by characterization, not production tested.
MCP1664
DS20005408A-page 4 2015 Microchip Technology Inc.
Start-Up Time tSS — 100 — s EN Lo w to High,
90% of ILED
(Note 2, Figure 2-10)
Thermal Shutdown Die
Temperature TSD —150— °CNote 2
Die Temperature Hysteresis TSDHYS —20— °CNote 2
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA=+25°C, V
IN = 3.0V, IOUT =20mA, V
OUT =12V, C
IN =C
OUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the air-forced TA range of -40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operati ng Junction Temperature
Range TJ-40 — +125 °C Steady State
Storage Temperature Range TA-65 — +150 °C
Maximum Junction Temperature TJ——+150°C
Package Thermal Resistances
Thermal Resistance, 5L SOT-23 JA —201.0 — °C/W
Thermal Resis t a nce, 8L 2x3 TDFN JA —52.5 —°C/W
DC AND AC CHARACTERISTIC S (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA=+25°C, V
IN = 3.3V, VOUT loaded with 3 white LEDs (VF= 2.65Vat IF=100mA), I
LED =20mA,
CIN =C
OUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the controlled TA range of -40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Minimum input voltage in the range of VIN (VIN <5.5V<V
OUT) depends on the maximum duty cycle
(DCMAX) and on the output voltage (VOUT), according to the boost converter equation:
VINmin =V
OUT x(1–DC
MAX). Output voltage is equal to the LED voltage plus the voltage on the sense
resistor (VLED +V_R
SET). Recommended (VOUT - VIN) > 1V.
2: Determined by characterization, not production tested.
2015 Microchip Technology Inc. DS20005408A-page 5
MCP1664
2.0 TYPICAL PERFORMANCE C URVES
Note: Unless otherwise indicated: VIN =3.3V, I
LED =20mA, V
OUT loaded with 4 white LEDs
(VF=2.9VatI
F=100mA), C
IN =C
OUT = 10 µF, X7R ce ramic, L = 4.7 µH.
FIGURE 2-1: Four White LEDs, ILED vs.
VIN.
FIGURE 2-2: Four White LEDs, ILED vs.
Ambient Temperature.
FIGURE 2-3: Eight White LEDs, ILED vs.
Ambient Temperature.
FIGURE 2-4: Four White LED s, E ffi cien cy
vs. ILED.
FIGURE 2-5: Eight White LEDs, Efficiency
vs. ILED.
FIGURE 2-6: Maximum ILED vs. VIN.
Note: The gra phs and table s pro vi ded follo w ing this note ar e a st a tis tic al sum ma ry ba sed on a limi ted nu mb er of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
20
40
60
80
100
120
140
160
2.32.73.13.53.94.34.75.15.5
LED Current (mA)
Input Voltage (V)
RSET = 15.2ȍ
RSET = 6ȍ
RSET = 2.1ȍ
RSET = 3ȍ
0
20
40
60
80
100
120
140
160
-40 -25 -10 5 20 35 50 65 80 95 110 125
LED Current (mA)
Ambient Temperature (
o
C)
RSET = 15.2ȍ
RSET = 6ȍ
RSET = 3ȍ
RSET = 2.1ȍ
0
20
40
60
80
100
120
140
160
-40-25-10 5 203550658095110125
LED Current (mA)
Ambient Temperature (
o
C)
R
SET
= 15.2ȍ
8 x wLED, L = 10μH, V
IN
= 4.2V
R
SET
= 6ȍ
R
SET
= 3ȍ
R
SET
= 2.1ȍ
0
10
20
30
40
50
60
70
80
90
100
0 50 100 150 200 250 300 350
Efficiency (%)
ILED (mA)
VIN = 3.0V VIN = 4.0V
VIN = 5.5V
0
10
20
30
40
50
60
70
80
90
100
0 50 100 150 200 250
Efficiency (%)
ILED (mA)
VIN = 4.0V
VIN = 5.5V
VIN = 3.0V
8 x wLED
L = 10 µH
0
50
100
150
200
250
300
350
400
2.32.73.13.53.94.34.75.15.5
LED Current (mA)
Input Voltage (V)
8 wLEDs, L = 10 µH
4 wLEDs, L = 4.7µH
5 wLEDs, L = 10µH
MCP1664
DS20005408A-page 6 2015 Microchip Technology Inc.
Note: Unless otherwise indicated: VIN =3.3V, I
LED =20mA, V
OUT loaded with 4 white LEDs
(VF=2.9VatI
F=100mA), C
IN =C
OUT = 10 µF, X7R ce ramic, L = 4.7 µH.
FIGURE 2-7: Underv oltage Lockout
(UVLO) vs. Ambient Temperature.
FIGURE 2-8: Shutdown Quiescent
Current, IQSHDN, vs. VIN (EN = GND).
FIGURE 2-9: Switching Frequency,
fSW vs. Ambient Temperature.
FIGURE 2-10: Start-Up Time vs.
LED Number.
FIGURE 2-11: Start-Up When
VIN =V
ENABLE.
FIGURE 2-12: Start-Up After Enable.
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
UVLO Thresholds (V)
Ambient Temperature (oC)
UVLO Stop
UVLO Start
0
10
20
30
40
50
2.5 2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 5.5
Shutdown IQ(nA)
Input Voltage (V)
450
475
500
525
550
-40 -25 -10 5 20 35 50 65 80 95 110 125
Switching Frequency (kHz)
Ambient Temperature (°C)
0
25
50
75
100
125
150
175
200
345678
Soft Start Time (µs)
Number of LEDs
Blue Bars: ILED = 20 mA
Red Bars: ILED = 40 mA
COUT = 10 µF
ILED
10 mA/div
EN
2V/div
VIN
2V/div
80µs/div
3 wLEDs
ILED
10 mA/div
EN
2V/div
VIN
2V/div
80µs/div
3 wLEDs
2015 Microchip Technology Inc. DS20005408A-page 7
MCP1664
Note: Unless otherwise indicated: VIN =3.3V, I
LED =20mA, V
OUT loaded with 4 white LEDs
(VF=2.9VatI
F=100mA), C
IN =C
OUT = 10 µF, X7R ce ramic, L = 4.7 µH.
FIGURE 2-13: 100 Hz PWM Dimming,
15% Duty Cycle.
FIGURE 2-14: 100 Hz PWM Dimming,
85% Duty Cycle.
FIGURE 2-15: Open Load (LED Fail or FB
to GND) Response.
FIGURE 2-16: T hree Wh ite LE Ds PW M
Discontinuous Mode Waveforms.
FIGURE 2-17: T hree Wh ite LE Ds PW M
Continuous Mode Waveforms.
FIGURE 2-18: Line S tep Response.
VIN steps from 2.5V to 4.5V.
ILED
10 mA/div
SW
5V/div
EN
2V/div 2ms/div
3 wLEDs
ILED
10 mA/div
SW
5V/div
EN
2V/div 2ms/div
3 wLEDs
ILED
10 mA/div
SW
5V/div
VFB
200mV/div 10 ms/div
3 wLEDs
ILED
AC Coupled
SW
5V/div
VOUT
5V/div 1µs/div
3 wLEDs
2mA/div
ILED =20mA
ILED
AC Coupled
SW
5V/div
VOUT
5V/div 1µs/div
3 wLEDs
10 mA/div
ILED = 145 mA
ILED
AC Coupled
VIN
2V/div
1ms/div
Line Step
2mA/div
2.5V to 4.5V
3 wLEDs
ILED = 20mA
Step from 2.5V to 4.5V
MCP1664
DS20005408A-page 8 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005408A-page 9
MCP1664
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
3.1 Feedback Voltage Pin (VFB)
The VFB pin is used to r egu late t he vo ltage acr oss t he
RSET sense res is tor to 300 mV to ke ep th e ou tpu t LED
current in regulation. Connect the cathode of the LED
to the VFB pin.
3.2 Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated reference voltage and error amplifier.
3.3 Switch Node Pin (SW)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and has a
typical value of 1.8A. The integrated N-Channel switch
drain is internally connected to the SW node.
3.4 Not Connected (NC)
This is an unconnected pin.
3.5 Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source should be decoupled from GND with a 4.7 µF
minimum capacitor.
3.6 Power Ground Pin (PGND)
The power ground pin is used as a return for the
high-current N-Channel switch. The PGND and SGND
pins are connected externally. The signal ground and
power ground must be connected externally in one
point.
3.7 Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable device switching and lower quiescent current
while disabled. A logic high (>85% of VIN) will enable
the regulator output. A logic low (<7.5% of VIN) will
ensure that the regulator is disabled.
3.8 Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
pins. T hey m ust be conn ected to the same poten tial o n
the Printed Circuit Board (PCB).
3.9 Ground Pin (GND)
The ground or return pin is used for circuit ground
connection. The length of the trace from the input cap
return, the output cap return and the GND pin must be
as short as pos sibl e to mi nimiz e nois e on th e GND pin.
The SOT-23 5-lead package uses a single ground pin.
TABLE 3-1: PIN FUNCTION TABLE
MCP1664
SOT-23 MCP1664
2x3 TDFN Symbol Description
31V
FB Feedback Voltage Pin
—2S
GND Signal Ground Pin (TDFN only)
1 3 SW Switch Node, Boost Inductor Pin
— 4, 6 NC Not Conn ected
55V
IN Input Voltage Pin
—7P
GND Power Ground Pin (TDFN only)
4 8 EN Enable Control Input Pin
— 9 EP Exposed Thermal Pad (EP); must be connected to Ground.
(TDFN only)
2 — GND Ground Pin (SOT-23 only)
MCP1664
DS20005408A-page 10 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005408A-page 11
MCP1664
4.0 DETAILED DESCRIPTION
4.1 Device Overvi ew
The MCP1664 is a fixed-frequency, synchronous
step-up converter, with a low voltage reference of
300 mV, optimized to keep the output current constant
by regulating the voltage across the feedback resistor
(RSET). The MCP1664 integrates a peak current mode
arch itec tu re a nd d elivers hig h-effi cie nc y c on ve r si on for
LED lightning applications while being powered by
two-cell and three-cell Alkaline, Ultimate Lithium,
NiMH, NiCd and single-cell Li-Ion battery inputs. The
maximu m i npu t vol tage, VINmax is 5.5V. A high level of
integration lowers total system cost, eases
implem en t ati on and reduc es boa rd ar ea.
The conventional boost converter with a high voltage
reference has a high voltage drop across the LED
series current limit resistor . The power dissipated in thi s
resistor, which is usually in series with the LED string,
reduces the total efficien cy conversi on of an LED dr iver
solution. Therefore, the voltage drop on the sense
resistor (RSET) used to regulate the LED current must
be low. In the case of MCP1664, the VFB value is
300 mV.
The device features controlled start-up voltage
(UVLOSTART = 2.3V) and an open load protection in
case the LED fails or short circuit of the VFB pin to GND.
Once the VFB voltage drops below 50 mV, the device
stops switching and the output voltage will be equal to
the input voltage (minus a diode drop voltage). This
feature prevents damage to the device and LEDs in
case of an accidental event like the one previously
described.
The 400 m, 36V integrated switch is protected by the
1.8A cycle-by-cycle inductor peak current limit
operation. When the Enable pin is pulled to ground
(EN = GND), the device stops switching, enters in
Shutdown mode and consumes less than 50 nA of
input current (Figure 2-8).
MCP1664
DS20005408A-page 12 2015 Microchip Technology Inc.
4.2 Functional Description
The MCP1664 is a compact, high-efficiency, fixed
500 kHz frequency, step-up DC-DC converter that
operates as a constant current generator for
applications powered by either two-cell or three-cell
alkaline or Lithium En ergizer; t hre e-cell NiCd or NiMH;
or one-cell Li-Ion or Li-Polymer batteries.
Figure 4-1 describes the functional block diagram of
the MCP1664. It incorporates a current mode control
scheme in which the PWM ramp signal is derived from
the NMOS power switch current (VSENSE). A slope
compensation signal (VRAMP) is added to the current
sense signal (VSENSE) and compared to the output of
the error amplifier (VERROR) to control the ON-time of
the power switch.
FIGURE 4-1: MCP1664 Simplified Block Diagram.
2015 Microchip Technology Inc. DS20005408A-page 13
MCP1664
4.2.1 INTERNAL BIAS
The MCP1664 gets its bias from VIN. The VIN bias is
used to power the device and drive circuits over the
entire operating ra nge. The ma xim um VIN is 5.5V.
4.2.2 START-UP
The MCP1664 is capable of starting from two alkaline
cells . The M CP1664 s tarts switc hing at approx imately
2.3V typical for a light load current. Once started, the
device will continue to operate under normal load
conditions down to 1.85V typical.
The start-up time is dependent on the LED’s current,
the number of the LEDs connected at output and on the
output capacitor value (see Figure 2-10). Output
capacitor value increases the start-up time.
When the device is powered, the output capacitor
charges to a value clos e to the input volt age (VIN minus
a Schottky diode voltage drop). To avoid high inrush
current s that occur w he n charging the output c ap a ci tor
during start-up, the switch peak current is limited to
1.8A. Onc e the volta ge on the output cap acitor reaches
the sum of the forward voltages of all LEDs, the
MCP1664 enters in constant current operation.
Due to the direct path from input to output, in the case
of dimm ing applicat ion s (EN v oltage sw it ches from low
to high), the output capacitor is already charged and
the outpu t start s from a va lue close to th e input volt age.
In this particular situation the device starts faster.
The internal oscillator has a delayed start to let the
output capacitor be completely charged to the input
voltage value.
4.2.3 UNDERVOLTAGE LOCKOUT
(UVLO)
The MCP1664 features an UVLO that prevents fault
operation below 1.85V typical, which is close to the
value of two discharged alkaline batteries.
Essentially, there is a comparator, which monitors VIN
and a reference voltage derived from the bandgap.
The device starts its normal operation at 2.3V typical
input. A hysteresis is set for the comparator to avoid
input transients (temporary VIN drop) which might
trigger the lower UVLO threshold and restart the
device.
When the input voltage is below the UVLOSTART
threshold, the device is operating with limited
specification.
4.2.4 ENABLE PIN
The MCP1664 enables switching when the EN pin is
set high. The device is put into Shutdown mode when
the EN p in is set lo w . To enable the boost co nverter , th e
EN voltage level must be greater than 85% of the VIN
volt age. To disable t he boo st conve rter, the EN voltage
must be less than 7.5% of the VIN vol tage.
4.2.4.1 Shutdown Mode.
Input-to-Output Path (EN = GND)
In Shutdown mode, the MCP1664 stops switching and
all internal control circuitry is switched off. The input
volt age will b e b ypassed to ou tput throug h th e i nd uctor
and the Schottky diode.
While the device stops switching, VOUT is equal to t he
output capacitor voltage, which slowly discharges on
the l eak path ( from VOUT to a val ue clos e to VIN) a fter
the LEDs have been turned off.
In Shutdown mode, the current consumed by the
MCP1664 from batteries is very low, below 50 nA.
4.2.5 PWM MODE OPERATION
The MCP1664 operates as a fixed-frequency,
non-synchronous converter. The switching frequency
is maintained with a precision oscillator at 500 kHz.
Lossless current sensing converts the inductor’s peak
current signal to a voltage (VSENSE) an d ad ds i t t o the
internal slope compensation (VRAMP). This summed
signal is co mpared to the volt ag e erro r amp li f ier outp ut
(VERROR) to provide a peak current control signal
(VPWM) for the PWM. The slope compensation signal
depends on the i nput voltage. The r efo re, t he c on vert er
provides the proper amount of slope compensation to
ensure stability. The peak limit current is set to 1.8A.
MCP1664
DS20005408A-page 14 2015 Microchip Technology Inc.
4.2.6 INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed-loop system by
comparing the output voltage to a reference at the
input of the error am plifie r and by feedin g the ampl ified
and inverted signal to the control input of the inner
current loop. The compensation network provides
phase leads and lags at appropriate frequencies to
cancel excessive phase lags and leads of the power
circuit. All necessary compensation and slope
compensation components are integrated.
4.2.7 OPEN LOAD PROTECTION (OLP)
An internal VFB fault signal turns off the PWM signal
(VEXT) when output goes out of r egulation i n the event
of:
• open load (LED string fails)
or
• short circuit of the feedback pin to GND.
In any of the above events, for a regular integrated
circuit (IC) without any protection implemented, the VFB
voltage drops to ground potential, its N-channel
transis tor is forced to switch at f ull duty cycle and VOUT
rises. Thi s fault event may cause the SW pin to ex ceed
it s ma ximu m vol t age ra ting a nd ma y d amag e the b oost
regulato r IC, its exter nal co mp onent s a nd the LEDs. To
avoid these, the MCP1664 features an open load
protection (OLP) which turns off PWM switching when
such a condition is detected. There is an overvoltage
comparator with 50 mV reference which monitors the
VFB voltage.
If the OLP event occurs with the input voltage below
the UVLOSTART threshold and VFB remains under
50 mV due to weak input (discharged batteries) or an
overload condition, the device latches its output; it
resumes after power-up.
The OLP comparator is disabled during start-up
sequences and thermal shutdown.
4.2.8 OVERCURRENT LIMIT
The MC P1664 uses a 1.8 A cycle-by-c ycle input curre nt
limit to protect the N-channel switch. There is an
overcurrent comparator which resets the drive latch
when th e peak of the in ductor curre nt reaches the li mit.
In current limitatio n, the output vol tage and lo ad current
start dropping.
4.2.9 OUTPUT SHORT-CIRCUIT
CONDITION
Like all non-synchronous boost converters, the
MCP1664 inductor current will increase excessively
during a short circuit on the converter’s output. Short
circuit on the output will cause the diode rectifier to fail
and the inductor’s temperature to rise or even to fail.
When the diode fails, the SW pin becomes a
high-im pedance n ode; it rema ins conne cted only to the
inductor and the exc es si ve resul t ed ringi ng ma y ca us e
damage to the MCP1664.
4.2.10 OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated into
the MCP1664. This circuitry monitors the device
junction temperature and shuts the device off if the
temperature exceeds +150°C. The device will
automatically restart when the junction temperature
drops by 20°C. The OLP is disabled during an
overtemperature condition.
2015 Microchip Technology Inc. DS20005408A-page 15
MCP1664
5.0 APPLICATION INFORMATION
5.1 Typical Applications
The MCP1664 non-synchronous boost LED current
regulato r ope rate s o ve r a wide outp ut ra nge up to 3 2V,
which allows it to drive up to 10 LEDs in series
connection. The input voltage ranges from 2.4V to
5.5V. The device operates down to 1.85V with limited
specification. The UVLO typical thresholds are set to
2.3V typical when VIN is ramping and to 1.85V when
VIN is falling. Output current capability increases with
the inp ut volt age and is lim ited b y the 1.8A t ypica l pea k
input current limit. Typical characterization curves in
this data sheet are presented to display the typical
output current capability.
5.2 LED Brightness Control
5.2.1 CONSTANT CURRENT
CALCULATIONS
To calculate the resistor value for setting the LED
current, us e Equation 5-1, where RSET is conne cte d to
VFB and GND. The reference voltage, VFB, is 300 mV.
The cal culated c urrent does no t depend o n the numb er
of LEDs in the string.
EQUATION 5-1:
EXAMPL E 1:
EXAMPL E 2:
The power dissipated on the RSET resistor is low and
equal to VFB xI
LED. For ILED = 100 mA, the power
dissipated on the sense resistor is 30 mW and the
efficiency of the conversion is high.
5.2.2 PW M DIMM ING
LED brightness can also be controlled by setting the
maximum current for the LED string (using
Equation 5-1) and by lowering this current in small
step s, with a v ariable duty cycl e PWM s ignal ap plied to
the EN pin. The maximum frequency for dimming is
limited by the MCP1664’s start-up time, which varies
with the LED current. By varying the duty cycle of the
signal applied on the EN pin (from 0 to 100%), the LED
current is changing linearly.
5.2.3 OUTPUT CURRENT CAPABILITY.
MINIMUM INPUT VOLTAGE
The maximum device output current is dependent upon
the input and output voltage. As there is a 1.8A inductor
peak current limit, output current can go out of
regulation before reaching the maximum duty cycle.
(Note that, for boost converters, the average inductor
current is equal to the input current.) Characterization
graphs show device limits.
The maxi mum num ber of LEDs (nLED in Equation 5-2)
that can be placed in serie s and be driven is de pendent
on t he maximu m LED forward voltage (VFmax) and LED
current s et by the RSET resisto r. The maximu m v o l t age
at th e out put of the MCP1 664 s hou ld be 3 2V. Consider
that VFmax has some variation over the operating
temperature range and that the LED data sheet must
be reviewed for the correct data to be introduced in
Equation 5-2. A maximum of 10 white LEDs in series
connection can be driven safely.
EQUATION 5-2:
Characterization graphs show the maximum current
the device can supply according to the numbers of
LEDs at the output.
For example, to ensure a 150 mA load current for
five LEDs (output equal to approximately 15V), a
minimum of 3V input voltage is necessary. If an
application is required to drive eight LEDs and is
powered by one Li-Ion battery (VIN from 3.6V to 4.2V),
the minimum LED current the MCP1664 can regulate is
close to 125 mA (Figure 2-6).
VFB = 300 mV
ILED = 100 mA
RSET =3
VFB = 300 mV
ILED = 200 mA
RSET =1.5
ILED VFB
RSET
------------=
VFmax nLED
VFB
+32V
MCP1664
DS20005408A-page 16 2015 Microchip Technology Inc.
5.2.4 OPEN LOAD PROTECTION
The MCP1664 features an open load protection (OLP)
in cas e th e L ED is d is con ne cte d fro m the ou tput line. If
the voltage on the VFB pin drops below 50 mV, the
device stops swit ching and prevents ov ervoltage on the
output and SW pin as well as excessive current into
LEDs.
OLP is not enabled during start-up and thermal
shutdown events.
5.3 Input Capacitor Selectio n
The boost input current is smoothened by the boost
inductor, reducing the amount of filtering necessary at
the input. Some capacitance is recommended to
provide decoupling from the source and to ensure that
the input does not drop excessively during switching
transients. Because the MCP1664 is rated to work at
an ambi ent temperature of u p to +125°C, low ESR X7R
ceramic capacitors are well suited since they have a
low temperature coefficient and small size. For use
within a limited temperature range of up to +85°C, a
X5R ceramic capacitor can be used. For light load
applications, 4.7 µF of capacitance is sufficient at the
input. For high-power applications that have high
source impedance or lo ng leads, using a 10 µF – 20 µF
input capacitor is recommended. When the device is
working below a 3.0V input with high LED current,
additional input capacitance can be added to provide a
stable input voltage (3 x 10 µF or 33 µF) due to high
input current demand. The input capacitor must be
rated at a minimum of 6.3V. For MLCC ceramic
capacitors and X7R or X5R capacitors, capacitance
varies over the operating temperature or the DC bias
range. Usually, there is a drop down to 50% of
capacitance. Review the capacitor manufacturer data
sheet to see how rated capacitance varies over these
conditions.
Table 5-1 contains the recommended range for the
input capacitor value.
5.4 Output Capaci tor Selection
The output capacitor helps provide a stable output
voltage and smooth load current during sudden load
transients and reduces the LED current ripple. Ceramic
capac itor s are well suited for this application (X5R and
X7R). The output capacitor ranges from 4.7 µF in case
of lig ht loads and di mming appli cations and up to 20 µF
for hundreds of mAmps LED current applications. Extra
output capacitor value is recommended when device
drives higher output currents and with small boost
ratios (input voltage close to the output voltage).
As mentio ned in Se ction 5.3, Input Capa citor Se lection
X7R or X5R capacitance varies over the operating
temperature or the DC bias range. With a voltage
applied at the maximum DC rating, capacitance might
drop down to half. This might affect the stability or limit
the output power. Capacitance drop over the entire
temperature range is less than 20%. Users must
carefully select the DC voltage rating (DCVRATE) for the
output ca pacitor according to Equations 5-3 and 5-4:
EQUATION 5-3:
or
EQUATION 5-4:
Table 5-1 contains the recommended range for the
input and output capacitor value.
TABLE 5-1: CAPACITOR VALUE RANGE
CIN COUT
Minimum 4.7 µF 4.7 µF
Maximum — 47 µF
DCVRATE VFmax nLED
VFB
+
DCVRATE VOUTmax
2015 Microchip Technology Inc. DS20005408A-page 17
MCP1664
5.5 Inductor Selection
The MCP1664 is designed to be used with small
surface mount inductors; the inductance value can
range from 4.7 µH to 10 µH. An inductance value of
4.7 µH is recommended for output voltages below 15V
(4 or 5 LEDs in series connection). For higher output
voltages, up to 32V (from 5 to maximum 10 LEDs), an
inductance value of 10 µH is optimum.
Several parameters are used to select the correct
inductor: maximum rated current, saturation current
and copper resistance (DCR). For boost converters,
the inductor current is much higher than the output
current. The average inductor current is equal to the
input current. The inductor’s peak current is much
higher than the average. The lower the inductor DCR,
the higher the efficiency of the converter, a common
trade-off in size versus efficiency.
Peak current is the maximum or limit value and
saturation current typically specifies a point at which
the inductance has rolled off a percentage of the rated
value. This can range from a 20% to 40% reduction in
inductance. As inductance rolls off, the inductor ripple
current i ncreases, a s does the p eak switc h current. It is
important to keep the inductance from rolling off too
much, causing switch current to reach the peak limit.
5.6 Rectifier Diode Selection
Schottky diodes a re used to reduce loss es. The di ode’s
average and peak current rating must be greater than
the average output current and the peak inductor
current, respectively. The diode’s reverse breakdown
voltage must be higher than the internal switch
maximum rating voltage of 36V.
The converter’s efficiency will be improved if the
voltage drop across the diode is lower. The forward
volt age (VF) ratin g is forward-c urrent depe ndent, whic h
is equal in particular to the load current.
For high currents and high ambient temperatures, use
a diode with goo d therm al charac teristic s.
5.7 Thermal Ca lculations
The MCP1664 is available in two different packages
(5-lead SOT-23 and 8-lead 2x3 TDFN). By calculating
the power dissipation and applying the package
thermal resistance (JA), the junction temperature is
estimated. The maximum operating junction
temperature rating (steady state) for the MCP1664 is
+125°C.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estima ted by Equation 5-5.
EQUATION 5-5:
The differe nce b etw ee n the firs t term , i npu t p ow er, and
the secon d term, power delivered, is the internal pow er
dissipation of the MCP1664. This is an estimate,
assuming that most of the power lost is internal to the
MCP1664 and not CIN, COUT, the rectifier diode and the
inducto r . The re is some percen tag e of power lost in the
boost inductor and the rectifier diode, with very little
loss in the input and output capacitors. For a more
accurate estimation of internal power dissipation,
subtract the IINRMS2xL
DCR and ILED xV
F power
dissipation (where IINRMS is the average input current,
LDCR is the inductor series resistance and VF is the
diode voltage drop). Another sourc e of power losses f or
the LED driver, that is external to the MCP1664, is the
sense resistor. The losses for the sense re sistor c an be
approxi ma ted by VFB xI
LED.
TABLE 5-2: MCP1664 RECOMMENDED
INDUCTORS FOR BOOST
CONVERTER
Part Number Value
(µH) DCR
(typ) ISAT
(A) Size
WxLxH (mm)
Coilcraft
MSS6132-472 4.7 0.043 2.84 6.1x6.1x3.2
XFL4020-472 4.7 0.0574 2.7 4.3x4.3x2.1
LPS5030-472 4.7 0.083 2.0 5.0x5.0x3.0
LPS6235-103 10 0.100 2.4 6.2x6.2x3.5
XAL4040-103 10 0.092 1.9 4.3x4.3x4.1
Wurth® Elektronik Group
7440530047 WE-TPC 4.7 0.07 2.2 5.8x5.8x2.8
74404042047 WE-LQS 4.7 0.03 2.0 4.0x4.0x1.6
74438335047 WE-MAPI 4.7 0.141 2.0 3.0x3.0x1.5
744778610 WE-PD2 10 0.074 1.8 5.9x6.2x4.9
74408943100 WE-SPC 10 0.082 2.1 4.8x4.8x3.8
TDK EPCOS
B82462G4472 4.7 0.04 1.8 6.3x6.3x3.0
LTF5022-4R7 4.7 0.073 2.0 5.2x5.0x2.2
VLCF4024-4R7 4.7 0.075 1.76 4.0x4.0x2.4
SLF7055-100 10 0.039 2.5 7.0x7.0x5.5
TABLE 5-3: RECOMMENDED SCHOTTKY
DIODES
Type VOUTmax TA
PMEG2010 18V < +85°C
STPS120 18V < +125°C
MBRM120 18V < +125°C
PMEG4010 32V < +85°C
UPS5819 32V < +85°C
MBRM140 32V < +125°C
VOUT IOUT
Efficiency
--------------------------------------


VOUT IOUT
–PDis
=
MCP1664
DS20005408A-page 18 2015 Microchip Technology Inc.
5.8 PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should b e used. Th erefore, it is import ant th at the inp ut
and outp ut capaci tors be place d as close as p ossible to
the MCP1664 to minimize the loop area.
The RSET resistor and feedback signal should be
routed aw ay from the switchi ng node and the s witching
current l oop. W hen po ssib le, gro und pl anes and tra ces
should be used to help shield the feedback signal and
minimize noise and magnetic interferences.
FIGURE 5-1: MCP1664 5-Lead SOT-23 Recommended Layout.
COUT
L
CIN
+VIN
GND
+VOUT
EN
1
GND
Vias to GND Bottom Plane
RSET
Vias to GND Bottom Plane
D
A
K
GND Bottom Plane
K
A
LEDs
LED1
LEDN
MCP1664
2015 Microchip Technology Inc. DS20005408A-page 19
MCP1664
FIGURE 5-2: MCP1664 TDFN Recommended Layout.
COUT
L
CIN
+VIN
+VOUT
GND
Vias to GND
Bottom Plane
1
AK
D
EN
Via to GND
GND Bottom Plane
K
A
LEDs LEDN
LED1
LED2
RSET
MCP1664
EN routed to the
Bottom Plane
MCP1664
DS20005408A-page 20 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005408A-page 21
MCP1664
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event th e full Mi croch ip pa rt numbe r can not be ma rked on one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
5-Lead SOT-23 Example
AABR5
10256
8-Lead TDFN (2x3x0.75 mm) Example
ACH
510
25
MCP1664
DS20005408A-page 22 2015 Microchip Technology Inc.
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φ
N
b
E
E1
D
123
e
e1
A
A1
A2 c
L
L1
   
2015 Microchip Technology Inc. DS20005408A-page 23
MCP1664
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP1664
DS20005408A-page 24 2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015 Microchip Technology Inc. DS20005408A-page 25
MCP1664
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP1664
DS20005408A-page 26 2015 Microchip Technology Inc.
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2015 Microchip Technology Inc. DS20005408A-page 27
MCP1664
APPENDIX A: REVISION HISTORY
Revision A (June 2015)
• Original Release of this Document.
MCP1664
DS20005408A-page 28 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005408A-page 29
MCP1664
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MCP1664: High-Voltage Step-Up LED Driver with UVLO
and OLP
Tape and Reel
Option: T = Tape and Reel (1)
Temperature
Range: E=-40C to +125C (Extended)
Package: MN = Plastic Dual Flat, No Lead Package -
2x3x0 .75 mm Body, 8-Lead (TDFN )
OT = Plastic Small Outline Transistor, 5-Lead (SOT -23)
*Y = Nickel palladium gold manufacturing designator.
Only available on the TDFN package.
Examples:
a) MCP1664T-E/OT: Tape and Reel,
Extended temperature,
5LD SOT-23 package
b) MCP1664T-E/MNY: Tape and R eel,
Extended temperature,
8LD 2x3 TDFN package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identi-
fier is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and Reel
Option
MCP1664
DS20005408A-page 30 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005408A-page 31
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce
and may be supers eded by updates . I t is you r r es ponsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer ,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoL yzer , PIC, PICSTART, PIC32 logo, RightTouch, S pyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsP ICDEM. net, ECA N, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity , KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology I ncorporat ed in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology I nc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsid ia r y of Mic rochip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporat ed, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-526-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that it s family of products is one of the most secure families of it s kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hoppi ng
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS20005408A-page 32 2015 Microchip Technology Inc.
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Worldwide Sales and Service
01/27/15
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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MCP1664T-E/OT MCP1664T-E/MNY