TDA7056A/N2,112 - NXP SEMICONDUCTORS

DATA SH EET

Product specificiation July 1994

INTEGRATED CIRCUITS

TDA7056A

3 W BTL mono audio output

amplifier with DC volume control

July 1994 2

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

FEATURES

•DC volume control

•Few external components

•Mute mode

•Thermal protectio n

•Short-circuit proof

•No switch-on and off clicks

•Good overall stab ility

•Low power cons umption

•Low HF radiation

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7056A is a mono BTL output amplifier with DC

volume control. It is designed for use in TV and monitors,

but also suitable for battery- fe d portable recorders an d

radios.

Missing Current Limiter (MCL)

A MCL protection circuits is built-in. The MCL circuit is

activated when the differ ence in current be tween the

output terminal of ea ch amplifier exceed s 100 mA (ty pical

300 mA). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

Note

1. SOT110-1.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 4.5 −18 V

POoutput power RL = 16 Ω; VP = 12 V 3 3.5 −W

Gvvoltage gain 34.5 35.5 36.5 dB

φgain control range 75 80 −dB

IPtotal quiescent current VP = 12 V; RL = ∞−816mA

THD total harmonic distortion VP = 0.5 W −0.3 1 %

EXTENDED TYPE

NUMBER PACKAGE

PINS PIN POSITION MATERIAL CODE

TDA7056A 9 SIL plastic SOT110(1)

July 1994 3

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

handbook, full pagewidth

positive input

7MGA072 - 1

TDA7056A

6I + i

I – i

TEMPERATURE

PROTECTION

signal

ground

DC volume control

n.c.

positive output

negative output

power

ground

Vref STABILIZER

n.c.

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected

VP2 positive supply v oltage

VI3 voltage input

GND1 4 signal ground

VC 5 DC volume control

OUT+6 positive output

GND2 7 power ground

OUT−8 negative output

n.c. 9 not connected

Fig.2 Pin configuration.

handbook, halfpage

MGA071

TDA7056A

n.c.

OUT−

GND2

OUT+

GND1

n.c.

July 1994 4

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

FUNCTIONAL DESCRIPTION

The TDA7056A is a mono BTL output amplifie r with DC

volume control, desig ned for use in TV and monitor bu t

also suitable for battery-fed portable recorders and radios.

In conventional DC volume circuits the contr ol or in put

stage is AC coupled to the output stage via external

capacitor to keep the offset voltage low.

In the TDA7056A the DC volume stage is integrated into

the input stage so that coupling capacitors are not required

and a low offset voltage is maintaine d.

At the same time the minimum supply voltage remains low.

The BTL principle offer s the follo wing advantages:

•lower peak value of the supply current

•the frequency of the ripple on the supply voltage is twice

the signal frequency

Thus, a reduced power supply and smaller capacitors can

be used which results in cost savings.

For portable applications there is a trend to decrease the

supply voltage, resulting in a reduction of output power at

conventional output stages. Using the BTL princip l e

increases the output power.

The maximum gain of the amplifier is fixed at 35.5 dB. The

DC volume control stage has a logarithmic control

characteristic.

The total gain can be controlled from 35.5 dB to −44 dB.

If the DC volume control voltage is below 0.3 V, the device

switches to the mute mode.

The amplifier is short-circuit proof to ground, VP and

across the load. A thermal protection circuit is also

implemented. If the crystal temper ature rises above

+150 °C the gain will be reduced, thereby reducing the

output power.

Special attention is given to switch-on and off clicks, low

HF radiation and a good overall stability.

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

THERMAL RESIST ANCE

Note to the thermal resistance

VP = 12 V; RL = 16 Ω; The maximum sine-wave dissipation is = 1.8 W. The Rth vj-a of the package is 55 K/W;

Tamb (max) = 150 − 55 x 1.8 = 51 °C

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage range −18 V

IORM repetitive peak output current −1.25 A

IOSM non repetitive peak output current −1.5 A

Ptot total power dissipation Tcase < 60 °C−9W

Tamb operating ambi ent temperature range −40 +85 °C

Tstg storage temperature range −55 +150 °C

Tvj virtual junction temperature −+150 °C

Tsc short-cir cuit time −1hr

V3input voltage pin 3 −8V

V5input voltage pin 5 −8V

SYMBOL PARAMETER THERMAL RESISTANCE

Rth j-a from junction to ambient in free air 55 K/W

Rth j-c from junction to case 10 K/W

July 1994 5

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

CHARACTERISTICS

VP = 12 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherw ise specified (see Fig. 6)

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The noise output voltage (R MS value) at f = 500 kHz is measured with RS = 0 Ω an d bandwidth = 5 kHz.

3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)

is applied to the positive su pply rail.

4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 4.5 −18 V

IPtotal quiescent current VP = 12 V; RL = ∞; note 1 −816mA

Maximum gain (V5 = 1.4 V)

POoutput power THD = 10%; RL = 16 Ω33.5 −W

THD = 10%; RL = 8 Ω− 5.2 −W

THD total harmonic distortion PO = 0.5 W −0.3 1 %

Gvvoltage gain 34.5 35.5 36.5 dB

VIinput signal han dling V5 = 0.8 V;THD < 1% 0.5 0.65 −V

Vno(rms) noise output voltage (RMS value) f = 500 kHz; note 2 −210 −μV

B bandwidth at −1 dB −20 Hz to

300 kHz −

SVRR supply voltage ripple rejection note 3 38 46 −dB

|Voff|DC output offset voltage −0150mV

ZIinput impedanc e pin 3 15 20 25 kΩ

Minimum gain (V5 = 0.5 V)

Gvvoltage gain −−44 −dB

Vno(rms) noise output voltage (RMS value) note 4 −20 30 μV

Mute position

VOoutput voltage in mute position V5 ≤ 0.3 V; VI = 600 mV −− 30 μV

DC volume control

φgain control range 75 80 −dB

I5control current V5 = 0 V 60 70 80 μA

July 1994 6

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

Fig.3 Gain as a function of DC volume control.

handbook, halfpage

MGA075

– 80

– 20

– 40

0 1.2 2.00.4 1.60.8 V (V)

gain

(dB)

– 60

Fig.4 Noise output voltage as a function of DC

volume control.

handbook, halfpage

1000

800

400

200

600

0 1.2 2.0

MGA076 - 1

0.4 1.60.8

V (V)

Vnoise

(μV)

Fig.5 Control current as a function of DC vo lume

control.

handbook, halfpage

0 1.2 2.0

100

– 20

MGA077 - 1

– 60

– 100 0.4 1.60.8

V (V)

(μA)

July 1994 7

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

APPLICATION INFORMATION

handbook, full pagewidth

positive

input

kΩ

0.47 μF

MGA073 - 1

100

nF 220 μF

TDA7056A

R = 16 Ω

(1)

I + i

8I – i

Vref STABILIZER TEMPERATURE

PROTECTION

ground

volume

control

n.c.

Fig.6 Test and application diagram.

(1) This capacitor can be omitted if the 220 μF electrolytic capacitor is connected close to pin 2.

Fig.7 Application using a potentiometer for

volume control; Gv = 30 dB.

handbook, halfpage

100 kΩ

volume

control

MGA074

July 1994 8

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

PACKAGE OUTLINE

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

1q1q2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 95-02-25

03-03-12

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

IL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110

-1

July 1994 9

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order cod e 9398 6 52 900 11).

Soldering by dipping or by wave

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 sec onds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necess ary immediately aft er soldering to ke ep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

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Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliab le .

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

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Notwithstanding an y damages that customer migh t incur

for any reason whatsoe ve r, NXP Semic on ductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and prod uct descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

July 1994 10

NXP Semiconductors Product specificiation

3 W BTL mono audio output amplifier with

DC volume control TDA7056A

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

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any of these products are for illustrative purposes only.

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warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modificat ion .

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Semiconductors prod ucts, and NXP Semiconduc tors

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customer(s). NXP does not accept any liability in this

respect.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratin gs only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the qua l ity and

reliability of the device.

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Semiconductor s pr od ucts are sold subject to the general

terms and conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

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Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, an d as such is

not complete, exhaus tive or legally binding.

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or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

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specifications, and (b) whenever customer uses the

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customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

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The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged

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Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the tech nical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands RM5/02/pp11 Date of release: July 1994