SAK-TC1762-128F66HL AC - Infineon Technologies

Data Sheet, V1.0, Apr. 2008

Microcontrollers

TC1762

32-Bit Single-Chip Microcontroller

TriCore

Edition 2008-04

Published by

Infineon Technologies AG

81726 München, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values

stated herein and/or any information regarding the application of the device, Infineon Technologies hereby

disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-

infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.

Data Sheet, V1.0, Apr. 2008

Microcontrollers

TC1762

32-Bit Single-Chip Microcontroller

TriCore

TC1762
Preliminary
Data Sheet V1.0, 2008-04 
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
TC1762 Data Sheet
Revision History: V1.0, 2008-04
Previous Version: V0.5 2007-03
Page Subjects (major changes since last revision)
7VSSOSC3 is deleted from the TC1762 Logic Symbol.
8, 10 TDATA0 of Pin 17, TCLK0 of Pin 20, TCLK0 of Pin 74 and TDATA0 of Pin
77 are updated in the Pinning Diagram and Pin Definition and Functions
Table.
33 Transmit DMA request in Block Diagram of ASC Interfaces is updated.
35 Alternate output functions in block diagram of SSC interfaces are updated.
41 Programmable baud rate of the MLI is updated.
42 TDATA0 and TCLK0 of the block diagram of MLI interfaces are updated.
54 The description for WDT double reset detection is updated.
91 The power sequencing details is updated.
102 MLI timing, maximum operating frequency limit is extended, t31 is added.
106 Thermal resistance junction leads is updated.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com

TC1762
Table of ContentsPreliminary
Data Sheet 1 V1.0, 2008-04 
Summary of Features  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
General Device Information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1 Block Diagram  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . .7
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4 Pad Driver and Input Classes Overview  . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
5 Pin Definitions and Functions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Functional Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
1 System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . . .24
2 On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
3 Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
4 Memory Protection System  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
5 DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6 Interrupt System   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
7 Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . . .33
8 High-Speed Synchronous Serial Interface (SSC0)  . . . . . . . . . . . . . . . . . . .35
9 Micro Second Bus Interface (MSC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
10 MultiCAN Controller (CAN)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
11 Micro Link Serial Bus Interface (MLI0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
12 General Purpose Timer Array  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
12.1 Functionality of GPTA0  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
13 Analog-to-Digital Converter (ADC0)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
14 Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . . .49
15 System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
16 Watchdog Timer   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
17 System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
18 Boot Options  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
19 Power Management System   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
20 On-Chip Debug Support  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
21 Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
22 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
23 Identification Register Values  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
Electrical Parameters  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
1 General Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
1.1 Parameter Interpretation  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
1.2 Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . .67
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
1.4 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
2 DC Parameters  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Table of Contents

TC1762
Table of ContentsPreliminary
Data Sheet 2 V1.0, 2008-04 
2.1 Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
2.2 Analog to Digital Converter (ADC0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
2.3 Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . . .82
2.4 Oscillator Pins  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
2.5 Temperature Sensor  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
2.6 Power Supply Current   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
3 AC Parameters  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
3.1 Testing Waveforms  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
3.2 Output Rise/Fall Times  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90
3.3 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
3.4 Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
3.5 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
3.6 Debug Trace Timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
3.7 Timing for JTAG Signals  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
3.8 Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
3.8.1 Micro Link Interface (MLI) Timing  . . . . . . . . . . . . . . . . . . . . . . . . . . .102
3.8.2 Micro Second Channel (MSC) Interface Timing  . . . . . . . . . . . . . . . .104
3.8.3 Synchronous Serial Channel (SSC) Master Mode Timing . . . . . . . . .105
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
2 Package Outline   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
3 Flash Memory Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108
4 Quality Declaration   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109

TC1762

Summary of FeaturesPreliminary

Data Sheet 3 V1.0, 2008-04

1 Summary of Features

The TC1762 has the following features:

• High-performance 32-bit super-scaler TriCore v1.3 CPU with 4-stage pipeline

– Superior real-time performance

– Strong bit handling

– Fully integrated DSP capabilities

– Single precision Floating Point Unit (FPU)

– 66 or 80 MHz operation at full temperature range

• Multiple on-chip memories

– 32 Kbyte Local Data Memory (SRAM)

– 4 Kbyte Overlay Memory

– 8 Kbyte Scratch-Pad RAM (SPRAM)

– 8 Kbyte Instruction Cache (ICACHE)

– 1024 Kbyte Flash Memory

– 16 Kbyte Data Flash (2 Kbyte EEPROM emulation)

– 16 Kbyte Boot ROM

• 8-channel DMA Controller

• Fast-response interrupt system with 255 hardware priority arbitration levels serviced

by CPU

• High-performance on-chip bus structure

– 64-bit Local Memory Bus (LMB) to Flash memory

– System Peripheral Bus (SPB) for interconnections of functional units

• Versatile on-chip Peripheral Units

– Two Asynchronous/Synchronous Serial Channels (ASCs) with baudrate

generator, parity, framing and overrun error detection

– One High Speed Synchronous Serial Channel (SSC) with programmable data

length and shift direction

– One Micro Second Bus (MSC) interface for serial port expansion to external power

devices

– One high-speed Micro Link Interface (MLI) for serial inter-processor

communication

– One MultiCAN Module with two CAN nodes and 64 free assignable message

objects for high efficiency data handling via FIFO buffering and gateway data

transfer

– One General Purpose Timer Array Module (GPTA) with a powerful set of digital

signal filtering and timer functionality to realize autonomous and complex

Input/Output management

– One 16-channel Analog-to-Digital Converter unit (ADC) with selectable 8-bit, 10-

bit, or 12-bit, supporting 32 input channels

– One 2-channel Fast Analog-to-Digital Converter unit (FADC) with concatenated

comb filters for hardware data reduction: supporting 10-bit resolution, with

minimum conversion time of 262.5ns (@ 80 MHz) or 318.2ns (@ 66 MHz)

TC1762

Summary of FeaturesPreliminary

Data Sheet 4 V1.0, 2008-04

• 32 analog input lines for ADC and FADC

• 81 digital general purpose I/O lines

• Digital I/O ports with 3.3 V capability

• On-chip debug support for OCDS Level 1 and 2 (CPU, DMA)

• Dedicated Emulation Device chip for multi-core debugging, tracing, and calibration

via USB V1.1 interface available (TC1766ED)

• Power Management System

• Clock Generation Unit with PLL

• Core supply voltage of 1.5 V

• I/O voltage of 3.3 V

• Full automotive temperature range: -40° to +125°C

• PG-LQFP-176-2 package

TC1762

Summary of FeaturesPreliminary

Data Sheet 5 V1.0, 2008-04

Ordering Information

The ordering code for Infineon microcontrollers provides an exact reference to the

required product. This ordering code identifies:

• The derivative itself, i.e. its function set, the temperature range, and the supply

voltage

• The package and the type of delivery

For the available ordering codes for the TC1762, please refer to the “Product Catalog

Microcontrollers” that summarizes all available microcontroller variants.

This document describes the derivatives of the device.The Table 1-1 enumerates these

derivatives and summarizes the differences.

Table 1-1 TC1762 Derivative Synopsis

Derivative Ambient Temperature Range

SAK-TC1762-128F66HL TA = -40oC to +125oC; 66 MHz operation frequency

SAK-TC1762-128F80HL TA = -40oC to +125oC; 80 MHz operation frequency

TC1762

General Device InformationPreliminary

Data Sheet 6 V1.0, 2008-04

2 General Device Information

Chapter 2 provides the general information for the TC1762.

2.1 Block Diagram

Figure 2-1 shows the TC1762 block diagram.

Figure 2-1 TC1762 Block Diagram

DMA

8 c h.

BI0

FPI

CPU

Syst em Peripheral Bus (SPB)

Ports

SBCU

MCB06056

M ulti CA N

( 2 Nodes ,

64 Buffer)

STM

Ext.

Request

Unit

LBCU

LFI B r idge

OCDS Debug

Interface/JTAG

Abbreviations:

ICA CHE : Ins tr uc tion Cac he

SPRAM: Scrat ch-Pad RAM

LDRA M : Loc al Data RA M

OV RA M : O v er lay RA M

BRO M: Boot RO M

P Flas h: P r ogr am Flas h

DFlas h: Dat a Flas h

LM B: Local Memory Bus

SPB: Syst em Peripheral Bus

MLI0

TriCore

(TC1.3M)

PMI

8 KB SPRAM

8 KB ICACHE

DMI

32 K B LDRA M

CPS

16 KB BRO M

1024 K B P flas h

16 KB DF lash

PMU

GPTA

FPU

ASC1

ASC0

Mem

Check

4 K B OV RA M

Overlay

Mechanism

FADC

2 c h.

ADC0

32 c h.

A nalog In put

Assignment

SSC0

DM A B us

PLL SCU PLL

Loc al M em or y B us (LM B )

BI1

SMIF

MSC0

TC1762

General Device InformationPreliminary

Data Sheet 7 V1.0, 2008-04

2.2 Logic Symbol

Figure 2-2 shows the TC1762 logic symbol.

Figure 2-2 TC1762 Logic Symbol

FCLN0

FCLP0A

TESTMODE

BYPASS

NMI

HDRST

PORST

MS C0 Co n tr o l

Digital Circuitry

Pow er Supply

General C ont rol

SOP0A

SON0

DDP

AN[35:0]

AD C Analog I nput s V

DDM

SSM

DDMF

SSMF

DDAF

SSAF

AREF0

AGND0

FAREF

FAGND

DDFL3

AD C /F ADC Analog

Pow er Supply

MCB06066

Port 0 16-bit

DDOSC3

Alt ernat e F unc t ions

BRKOUT

XTAL1

XTAL2

Oscillator

TDI

TCK

TRST

Port 1 15-bit

Port 2 14-bit

Port 3 16-bit

Port 4 4-bit

GPTA, SCU

GPTA, ADC

S S C0 , ML I0 , G P TA, MS C0

ASC0/ 1, SSC0, SCU , CAN

TDO O CDS / JTA G Co n tr o l

GPTA, SCU

TMS

BRKIN

TRCLK

DDOSC

SSOSC

Port 5 16-bit G P TA , O CDS L 2 , MLI0

TC1762

General Device InformationPreliminary

Data Sheet 8 V1.0, 2008-04

2.3 Pin Configuration

Figure 2-3 shows the TC1762 pin configuration.

Figure 2-3 TC1762 Pinning for PG-LQFP-176-2 Package

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

145

146

147

148

149

150

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

169

170

171

172

173

174

175

176

P0.0/IN0/SWCFG0/OUT0/OUT56

P0.1/IN1/SWCFG1/OUT1/OUT57

P0.2/IN2/SWCFG2/OUT2/OUT58

P0.3/IN3/SWCFG3/OUT3/OUT59

P0.4/IN4/SWCFG4/OUT4/OUT60

P0.5/IN5/SWCFG5/OUT5/OUT61

P0.6/IN6/SWCFG6/REQ2/OUT6/OUT62

P0.7/IN7/SWCFG7/REQ3/OUT7/OUT63

P0.8/IN8/SWCFG8/OUT8/OUT64

P0.9/IN9/SWCFG9/OUT9/OUT65

P0.10/IN10/SWCFG10/OUT10/OUT66

P0.11/IN11/SWCFG11/OUT11/OUT67

P0.12/IN12/SWCFG12/OUT12/OUT68

P0.13/IN13/SWCFG13/OUT13/OUT69

P0.14/IN14/SWCFG14/REQ4/OUT14/OUT70

P0.15/IN15/SWCFG15/REQ5/OUT15/OUT71

P1.0/IN16/OUT16/OUT72

P1.1/IN17/OUT17/OUT73

P1.2/IN18/OUT18/OUT74

P1.3/IN19/OUT19/OUT75

P1.4/IN20/EMG_IN/OUT20/OUT76

P1.5/IN21/OUT21/OUT77

P1.6/IN22/OUT22/OUT78

P1.7/IN23/OUT23/OUT79

P1.8/IN24/IN48/OUT24/OUT48

P1.9/IN25/IN49/OUT25/OUT49

P1.10/IN26/IN50/OUT26/OUT50

P1.11/IN27/IN51/OUT27/OUT51

AD0EMUX0/P1.12

AD0EMUX1/P1.13

AD0EMUX2/P1.14

TCLK0/OUT32/IN32/P2.0

SLSO03/OUT33/TREADY0A/IN33/P2.1

TVALID0A/OUT34/IN34/P2.2

TDATA0/OUT35/IN35/P2.3

OUT36/RCLK0A/IN36/P2.4

RREADY0A/OUT37/IN37/P2.5

OUT38/RVALID0A/IN38/P2.6

OUT39/RDATA0A/IN39/P2.7

P2.8/SLSO04/EN00

P2.9/SLSO05/EN01

P2.10/GPIO

P2.11/FCLP0B

P2.12/SOP0B

P2.13/SDI0

P3.0/RXD0A

P3.1/TXD0A

P3.2/SCLK0

P3.3/MRST0

P3.4/MTSR0

P3.5/SLSO00/SLSO00

P3.6/SLSO01/SLSO01

P3.7/SLSI0/SLSO02

P3.8/SLSO06/TXD1A

P3.9/RXD1A

P3.10/REQ0

P3.11/REQ1

P3.12/RXDCAN0/RXD0B

P3.13/TXDCAN0/TXD0B

P3.14/RXDCAN1/RXD1B

P3.15/TXDCAN1/TXD1B

OUT52/OUT28/HWCFG0/IN52/IN28/P4.0

OUT53/OUT29/HWCFG1/IN53/IN29/P4.1

OUT54/OUT30/HWCFG2/IN54/IN30/P4.2

P4.3/IN31/IN55/OUT31/OUT55/SYSCLK

OCDSDBG0/OUT40/IN40/P5.0

OCDSDBG1/OUT41/IN41/P5.1

OCDSDBG2/OUT42/IN42/P5.2

OCDSDBG4/OUT44/IN44/P5.4

OCDSDBG3/OUT43/IN43/P5.3

OCDSDBG5/OUT45/IN45/P5.5

OCDSDBG6/OUT46/IN46/P5.6

OCDSDBG7/OUT47/IN47/P5.7

OCDSDBG8/RDATA0B/P5.8

OCDSDBG9/RVALID0B/P5.9

OCDSDBG10/RREADY0B/P5.10

OCDSDBG11/RCLK0B/P5.11

OCDSDBG12/TDATA0/P5.12

OCDSDBG13/TVALID0B/P5.13

OCDSDBG14/TREADY0B/P5.14

OCDSDBG15/TCLK0/P5.15

FCLP0A

FCLN0

SOP0A

SON0

AN0

AN1

AN2

AN3

AN4

AN5

AN6

AN8

AN7

AN9

AN10

AN11

AN12

AN13

AN14

AN15

AN16

AN17

AN18

AN19

AN20

AN21

AN22

AN23

AN24

AN25

AN26

AN27

AN28

AN29

AN30

AN31

AN32

AN33

AN34

AN35

TRST

TCK

TDI

TDO

TMS

BRKIN

BRKOUT

NMI

HDRST

PORST

BYPASS

TESTMODE

XTAL1

XTAL2

VDD

VDDP

VSS

N.C.

TRCLK

TC1762

VDD

VDDP

VSS

VDDMF

VSSMF

VDDAF

VSSAF

VFAREF

VFAGND

VDDM

VSSM

VAREF0

VAGND0

VDD

VDDP

VSS

VDD

VDDP

VSS

VDD

VDDP

VSS

VDDOSC

VDDOSC3

VSSOSC

VDDFL3

VDDP

VSS

VDD

VDDP

VSS

VDD

VDDP

VSS

MCP06067

TC1762

General Device InformationPreliminary

Data Sheet 9 V1.0, 2008-04

2.4 Pad Driver and Input Classes Overview

The TC1762 provides different types and classes of input and output lines. For

understanding of the abbreviations in Table 2-1 starting at the next page, Table 4-1

gives an overview on the pad type and class types.

TC1762

General Device InformationPreliminary

Data Sheet 10 V1.0, 2008-04

2.5 Pin Definitions and Functions

Table 2-1 shows the TC1762 pin definitions and functions.

Table 2-1 Pin Definitions and Functions

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

Parallel Ports

P0 I/O A1 VDDP Port 0

Port 0 is a 16-bit bi-directional general-

purpose I/O port which can be alternatively

used for GPTA I/O lines or external trigger

inputs.

P0.0

P0.1

P0.2

P0.3

P0.4

P0.5

P0.6

P0.7

P0.8

P0.9

P0.10

P0.11

P0.12

P0.13

P0.14

P0.15

145

146

147

148

166

167

173

174

149

150

151

152

168

169

175

176

IN0 / OUT0 /

IN1 / OUT1 /

IN2 / OUT2 /

IN3 / OUT3 /

IN4 / OUT4 /

IN5 / OUT5 /

IN6 / OUT6 /

REQ2

IN7 / OUT7 /

REQ3

IN8 / OUT8 /

IN9 / OUT9 /

IN10 / OUT10 /

IN11 / OUT11 /

IN12 / OUT12 /

IN13 / OUT13 /

IN14 / OUT14 /

REQ4

IN15 / OUT15 /

REQ5

OUT56 line of GPTA

OUT57 line of GPTA

OUT58 line of GPTA

OUT59 line of GPTA

OUT60 line of GPTA

OUT61 line of GPTA

OUT62 line of GPTA

External trigger input 2

OUT63 line of GPTA

External trigger input 3

OUT64 line of GPTA

OUT65 line of GPTA

OUT66 line of GPTA

OUT67 line of GPTA

OUT68 line of GPTA

OUT69 line of GPTA

OUT70 line of GPTA

External trigger input 4

OUT71 line of GPTA

External trigger input 5

In addition, the state of the port pins are

latched into the software configuration input

HDRST. Therefore, Port 0 pins can be used

for operating mode selections by software.

TC1762

General Device InformationPreliminary

Data Sheet 11 V1.0, 2008-04

P1 I/O VDDP Port 1

Port 1 is a 15-bit bi-directional general

purpose I/O port which can be alternatively

used for GPTA I/O lines and ADC0 interface.

P1.0

P1.1

P1.2

P1.3

P1.4

P1.5

P1.6

P1.7

P1.8

P1.9

P1.10

P1.11

P1.12

P1.13

P1.14

107

108

109

110

IN16 / OUT16 /

IN17 / OUT17 /

IN18 / OUT18 /

IN19 / OUT19 /

IN20 / OUT20 /

IN21 / OUT21 /

IN22 / OUT22 /

IN23 / OUT23 /

IN24 / OUT24 /

IN25 / OUT25 /

IN26 / OUT26 /

IN27 / OUT27 /

AD0EMUX0

AD0EMUX1

AD0EMUX2

OUT72 line of GPTA

OUT73 line of GPTA

OUT74 line of GPTA

OUT75 line of GPTA

OUT76 line of GPTA

OUT77 line of GPTA

OUT78 line of GPTA

OUT79 line of GPTA

IN48 / OUT48 line of GPTA

IN49 / OUT49 line of GPTA

IN50 / OUT50 line of GPTA

IN51 / OUT51 line of GPTA

ADC0 external multiplexer

control output 0

ADC0 external multiplexer

control output 1

ADC0 external multiplexer

control output 2

In addition, P1.4 also serves as emergency

shut-off input for certain I/O lines (e.g. GPTA

related outputs).

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 12 V1.0, 2008-04

P2 I/O VDDP Port 2

Port 2 is a 14-bit bi-directional general-

purpose I/O port which can be alternatively

used for GPTA I/O, and interface for MLI0,

MSC0 or SSC0.

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P2.6

P2.7

TCLK0

IN32 / OUT32

TREADY0A

IN33 / OUT33

SLSO03

TVALID0A

IN34 / OUT34

TDATA0

IN35 / OUT35

RCLK0A

IN36 / OUT36

RREADY0A

IN37 / OUT37

RVALID0A

IN38 / OUT38

RDATA0A

IN39 / OUT39

MLI0 transmit channel clock

output A

line of GPTA

MLI0 transmit channel ready

input A

line of GPTA

SSC0 slave select output 3

MLI0 transmit channel valid

output A

line of GPTA

MLI0 transmit channel data

output A

line of GPTA

MLI0 receive channel clock

input A

line of GPTA

MLI0 receive channel ready

output A

line of GPTA

MLI0 receive channel valid

input A

line of GPTA

MLI0 receive channel data

input A

line of GPTA

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 13 V1.0, 2008-04

P2.8

P2.9

P2.10

P2.11

P2.12

P2.13

164

160

161

162

163

165

SLSO04

EN00

SLSO05

EN01

FCLP0B

SOP0B

SDI0

SSC0 Slave Select output 4

MSC0 enable output 0

SSC0 Slave Select output 5

MSC0 enable output 1

MSC0 clock output B

MSC0 serial data output B

MSC0 serial data input

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 14 V1.0, 2008-04

P3 I/O VDDP Port 3

Port 3 is a 16-bit bi-directional general-

purpose I/O port which can be alternatively

used for ASC0/1, SSC0 and CAN lines.

P3.0

P3.1 136

135 A2

A2 RXD0A

TXD0A ASC0 receiver inp./outp. A

ASC0 transmitter output A

This pin is sampled at the rising edge of

PORST. If this pin and the BYPASS input pin

are both active, then oscillator bypass mode

is entered.

P3.2

P3.3

P3.4

P3.5

P3.6

P3.7

P3.8

P3.9

P3.10

P3.11

P3.12

P3.13

P3.14

P3.15

129

130

132

126

127

131

128

138

137

144

143

142

134

133

SCLK0

MRST0

MTSR0

SLSO00

SLSO01

SLSI0

SLSO02

SLSO06

TXD1A

RXD1A

REQ0

REQ1

RXDCAN0

RXD0B

TXDCAN0

TXD0B

RXDCAN1

RXD1B

TXDCAN1

TXD1B

SSC0 clock input/output

SSC0 master receive input/

slave transmit output

SSC0 master transmit

output/slave receive input

SSC0 slave select output 0

SSC0 slave select output 1

SSC0 slave select input

SSC0 slave select output 2

SSC0 slave select output 6

ASC1 transmitter output A

ASC1 receiver inp./outp. A

External trigger input 0

External trigger input 1

CAN node 0 receiver input

ASC0 receiver inp./outp. B

CAN node 0 transm. output

ASC0 transmitter output B

CAN node 1 receiver input

ASC1 receiver inp./outp. B

CAN node 1 transm. output

ASC1 transmitter output B

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 15 V1.0, 2008-04

P4 I/O VDDP Port 4 / Hardware Configuration Inputs

P4.[3:0] HWCFG[3:0] Boot mode and boot location

inputs; inputs are latched

with the rising edge of

HDRST.

During normal operation, Port 4 pins may be

used as alternate functions for GPTA or

system clock output.

P4.0

P4.1

P4.2

P4.3

IN28 / OUT28 /

IN29 / OUT29 /

IN30 / OUT30 /

IN31 / OUT31 /

SYSCLK

IN52 / OUT52 line of GPTA

IN53 / OUT53 line of GPTA

IN54 / OUT54 line of GPTA

IN55 / OUT55 line of GPTA

System Clock Output

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 16 V1.0, 2008-04

P5 I/O A2 VDDP Port 5

Port 5 is a 16-bit bi-directional general-

purpose I/O port. In emulation, it is us ed as a

trace port for OCDS Level 2 debug lines. In

normal operation, it is used for GPTA I/O or

the MLI0 interface.

P5.0

P5.1

P5.2

P5.3

P5.4

P5.5

P5.6

P5.7

OCDSDBG0

IN40 / OUT40

OCDSDBG1

IN41 / OUT41

OCDSDBG2

IN42 / OUT42

OCDSDBG3

IN43 / OUT43

OCDSDBG4

IN44 / OUT44

OCDSDBG5

IN45 / OUT45

OCDSDBG6

IN46 / OUT46

OCDSDBG7

IN47 / OUT47

OCDS L2 Debug Line 0

(Pipeline Status Sig. PS0)

line of GPTA

OCDS L2 Debug Line 1

(Pipeline Status Sig. PS1)

line of GPTA

OCDS L2 Debug Line 2

(Pipeline Status Sig. PS2)

line of GPTA

OCDS L2 Debug Line 3

(Pipeline Status Sig. PS3)

line of GPTA

OCDS L2 Debug Line 4

(Pipeline Status Sig. PS4)

line of GPTA

OCDS L2 Debug Line 5

(Break Qualification Line

BRK0)

line of GPTA

OCDS L2 Debug Line 6

(Break Qualification Line

BRK1)

line of GPTA

OCDS L2 Debug Line 7

(Break Qualification Line

BRK2)

line of GPTA

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 17 V1.0, 2008-04

P5.8

P5.9

P5.10

P5.11

P5.12

P5.13

P5.14

P5.15

OCDSDBG8

RDATA0B

OCDSDBG9

RVALID0B

OCDSDBG10

RREADY0B

OCDSDBG11

RCLK0B

OCDSDBG12

TDATA0

OCDSDBG13

TVALID0B

OCDSDBG14

TREADY0B

OCDSDBG15

TCLK0

OCDS L2 Debug Line 8

(Indirect PC Addr. PC0)

MLI0 receive channel data

input B

OCDS L2 Debug Line 9

(Indirect PC Addr. PC1)

MLI0 receive channel valid

input B

OCDS L2 Debug Line 10

(Indirect PC Addr. PC2)

MLI0 receive channel ready

output B

OCDS L2 Debug Line 11

(Indirect PC Addr. PC3)

MLI0 receive channel clock

input B

OCDS L2 Debug Line 12

(Indirect PC Addr. PC04)

MLI0 transmit channel data

output B

OCDS L2 Debug Line 13

(Indirect PC Addr. PC05)

MLI0 transmit channel valid

output B

OCDS L2 Debug Line 14

(Indirect PC Address PC6)

MLI0 transmit channel ready

input B

OCDS L2 Debug Line 15

(Indirect PC Address PC7)

MLI0 transmit channel clock

output B

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 18 V1.0, 2008-04

MSC0 Outputs

FCLP0A

FCLN0

SOP0A

SON0

157

156

159

158

CVDDP LVDS MSC Clock and Data Outputs2)

MSC0 Differential Driver Clock Output

Positive A

MSC0 Differential Driver Clock Output

Negative

MSC0 Differential Driver Serial Data Output

Positive A

MSC0 Differential Driver Serial Data Output

Negative

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 19 V1.0, 2008-04

Analog Inputs

AN[35:0]

AN0

AN1

AN2

AN3

AN4

AN5

AN6

AN7

AN8

AN9

AN10

AN11

AN12

AN13

AN14

AN15

AN16

AN17

AN18

AN19

AN20

AN21

AN22

AN23

AN24

AN25

AN26

AN27

AN28

AN29

AN30

ID – Analog Input Port

The Analog Input Port provides altogether 36

analog input lines to ADC0 and FAD C.

AN[31:0]: ADC0 analog inputs [31:0]

AN[35:32]: FADC analog differential inputs

Analog input 0

Analog input 1

Analog input 2

Analog input 3

Analog input 4

Analog input 5

Analog input 6

Analog input 7

Analog input 8

Analog input 9

Analog input 10

Analog input 11

Analog input 12

Analog input 13

Analog input 14

Analog input 15

Analog input 16

Analog input 17

Analog input 18

Analog input 19

Analog input 20

Analog input 21

Analog input 22

Analog input 23

Analog input 24

Analog input 25

Analog input 26

Analog input 27

Analog input 28

Analog input 29

Analog input 30

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762
General Device InformationPreliminary
Data Sheet 20 V1.0, 2008-04 
AN31
AN32
AN33
AN34
AN35
32
31
30
29
28
I D – Analog input 31
Analog input 32
Analog input 33
Analog input 34
Analog input 35
System I/O
TRST 114 I A21) VDDP JTAG Module Reset/Enable Input
TCK 115 I A21) VDDP JTAG Module Clock Input
TDI 111 I A11) VDDP JTAG Module Serial Data Input
TDO 113 O A2 VDDP JTAG Module Serial Data Output
TMS 112 I A21) VDDP JTAG Module State Machine Control I nput
BRKIN 117 I/O A3 VDDP OCDS Break Input (Alternate Output)2)3)
BRK
OUT 116 I/O A3 VDDP OCDS Break Output (Alternate Input)2)3)
TRCLK 9OA4 VDDP Trace Clock for OCDS_L2 Lines2)
NMI 120 I A24)5) VDDP Non-Maskable Interrupt Input
HDRST 122 I/O A26) VDDP Hardware Reset Input /
Reset Indication Output
PORST 
7) 121 I A24) VDDP Power-on Reset Input
BYPASS 119 I A11) VDDP PLL Clock Bypass Select Input
This input has to be held stable during power-
on resets. With BYPASS = 1, the spike filters 
in the HDRST, PORST and NMI inputs are 
switched off.
TEST
MODE 118 I A24)8) VDDP Test Mode Select Input
For normal operation of the TC1762, this pin 
should be connected to high level.
XTAL1
XTAL2 102
103 I
On.a. VDDOSC Oscillator/PLL/Clock Generator 
Input/Output Pins
N.C. 21, 
89 –– – Not Connected
These pins are reserved for future extension 
and must not be connected externally.
Table 2-1 Pin Definitions and Functions (cont’d)
Symbol Pins I/O Pad 
Driver 
Class
Power
Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 21 V1.0, 2008-04

Power Supplies

VDDM 54 – – – ADC Analog Part Power Supply (3.3 V)

VSSM 53 – – – ADC Analog Part Ground for VDDM

VDDMF 24 – – – FADC Analog Part Power Supply (3.3 V)

VSSMF 25 – – – FADC Analog Part Ground for VDDMF

VDDAF 23 – – – FADC Analog Part Logic Power Supply

(1.5 V)

VSSAF 22 – – – FADC Analog Part Logic Ground for VDDAF

VAREF0 52 – – – ADC Reference Voltage

VAGND0 51 – – – ADC Reference Ground

VFAREF 26 – – – FADC Reference Voltage

VFAGND 27 – – – FADC Reference Ground

VDDOSC 105 – – – Main Oscillator and PLL Power Supply

(1.5 V)

VDDOSC3 106 – – – Main Oscillator Power Supply (3.3 V)

VSSOSC 104 – – – Main Oscillator and PLL Ground

VDDFL3 141 – – – Power Supply for Flash (3.3 V)

VDD 10,

68,

84,

99,

123,

153,

170

–– – Core Power Supply (1.5 V)

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 22 V1.0, 2008-04

VDDP 11,

69,

83,

100,

124,

154,

171,

139

–– – Port Power Supply (3.3 V)

VSS 12,

70,

85,

101,

125,

155,

172,

140,

–– – Ground

1) These pads are I/O pads with input only function. Its input characteristics are identical with the input

characteristics as defined for class A pads.

2) In case of a power-fail condition (one or more power supply voltages drop below the specified voltage range),

an undefined output driving level may occur at these pins.

3) Programmed by software as either break input or break output.

4) These pads are input only pads with input characteristics.

5) Input only pads with input spike filter.

6) Open drain pad with input spike filter.

7) The dual input reset system of TC1762/TC1766ED, assumes that the PORST reset pin is used for power-on

reset only. It has to be taken into account that if a system uses the PORST reset input for other system resets,

the emulation part of the TC1766ED Emulation Device is reset as well. Thus, it will always force a comple te

re-initialization of the emulator and will prevent the user debugging across these types of resets.

8) Input only pads without input spike filter.

Table 2-1 Pin Definitions and Functions (cont’d)

Symbol Pins I/O Pad

Driver

Class

Power

Supply Functions

TC1762

General Device InformationPreliminary

Data Sheet 23 V1.0, 2008-04

Table 2-2 List of Pull-up/Pull-down Reset Behavior of the Pins

Pins PORST =0 PORST=1

All GPIOs, TDI, TMS, TDO Pull-up

HDRST Drive-low Pull-up

BYPASS Pull-up High-impedance

TRST, TCK High-impedance Pull-down

TRCLK High-impedance

BRKIN, BRKOUT, TESTMODE Pull-up

NMI, PORST Pull-down

TC1762

Functional DescriptionPreliminary

Data Sheet 24 V1.0, 2008-04

3 Functional Description

Chapter 3 provides an overview of the TC1762 functional description.

3.1 System Architecture and On-Chip Bus Systems

The TC1762 has two independent on-chip buses (see also TC1762 block diagram on

Page 2-6):

• Local Memory Bus (LMB)

• System Peripheral Bus (SPB)

The LMB Bus connects the CPU local resources for data and instruction fetch. The Local

Memory Bus interconnects the memory units and functional units, such as CPU and

PMU. The main target of the LMB bus is to support devices with fast response times,

optimized for speed. This allows the DMI and PMI fast access to local memory and

reduces load on the FPI bus. The Tricore system itself is located on LMB bus.

The Local Memory Bus is a synchronous, pipelined, split bus with variable block size

transfer support. It supports 8-, 16-, 32- and 64-bit single transactions and variable

length 64-bit block transfers.

The SPB Bus is accessible to the CPU via the LMB Bus bridge. The System Peripheral

Bus (SPB Bus) in TC1762 is an on-chip FPI Bus. The FPI Bus interconnects the

functional units of the TC1762, such as the DMA and on-chip peripheral components.

The FPI Bus is designed to be quick to be acquired by on-chip functional units, and quick

to transfer data. The low setup overhead of the FPI Bus access protocol guarantees fast

FPI Bus acquisition, which is required for time-critical applications.The FPI Bus is

designed to sustain high transfer rates. For example, a peak transfer rate of up to 320

Mbyte/s can be achieved with a 80 MHz bus clock and 32-bit data bus. With a 66 MHz

bus clock, the peak transfer rate is up to 264 Mbytes/s. Multiple data transfers per bus

arbitration cycle allow the FPI Bus to operate at close to its peak bandwidth.

Both the LMB Bus and the SPB Bus runs at full CPU speed. The maximum CPU speed

is 66 or 80 MHz depending on the derivative.

Additionally, two simplified bus interfaces ar e connected to and controlled by the DMA

Controller:

•DMA Bus

• SMIF Interface

TC1762

Functional DescriptionPreliminary

Data Sheet 25 V1.0, 2008-04

3.2 On-Chip Memories

As shown in the TC1762 block diagram on Page 2-6, some of the TC1762 units provide

on-chip memories that are used as program or data memory.

• Program memory in PMU

– 16 Kbyte Boot ROM (BROM)

– 1024 Kbyte Program Flash (PFlash)

• Program memory in PMI

– 8 Kbyte Scratch-Pad RAM (SPRAM)

– 8 Kbyte Instruction Cache (ICACHE)

• Data memory in PMU

– 16 Kbyte Data Flash (DFlash)

– 4 Kbyte Overlay RAM (OVRAM)

• Data memory in DMI

– 32 Kbyte Local Data RAM (LDRAM)

• On-chip SRAM with parity error protection

Features of Program Flash

• 1024 Kbyte on-chip program Flash memory

• Usable for instruction code or constant data storage

• 256-byte program interface

– 256 bytes are programmed into PFLASH page in one step/command

• 256-bit read interface

– Transfer from PFLASH to CPU/PMI by four 64-bit single cycle burst transfers

• Dynamic correction of single-bit errors during read access

• Detection of double-bit errors

• Fixed sector architecture

– Eight 16 Kbyte, one 128 Kbyte, one 256 Kbyte and one 512 Kbyte sectors

– Each sector separately erasable

– Each sector separately write-protectable

• Configurable read protection for complete PFLASH with sophisticated read access

supervision, combined with write protection for complete PFLASH (protection against

“Trojan horse” software)

• Configurable write protection for each sector

– Each sector separately write-protectable

– With capability to be re-programmed

– With capability to be locked forever (OTP)

• Password mechanism for temporary disabling of write and read protection

• On-chip generation of programming voltage

• JEDEC-standard based command sequences for PFLASH control

– Write state machine controls programming and erase operations

– Status and error reporting by status flags and interrupt

• Margin check for detection of problematic PFLASH bits

TC1762

Functional DescriptionPreliminary

Data Sheet 26 V1.0, 2008-04

Features of Data Flash

• 16 Kbyte on-chip data Flash memory, organized in two 8 Kbyte banks

• Usable for data storage with EEPROM functionality

• 128 Byte of program interface

– 128 bytes are programmed into one DFLASH page by one step/command

• 64-bit read interface (no burst transfers)

• Dynamic correction of single-bit errors during read access

• Detection of double-bit errors

• Fixed sector architecture

– Two 8 Kbyte banks/sectors

– Each sector separately erasable

• Configurable read protec ti on (combined with write protection) for complete DFLASH

together with PFLASH read protection

• Password mechanism for temporary disabling of write and read protection

• Erasing/programming of one bank possible while reading data from the other bank

• Programming of one bank while erasing the other bank possible

• On-chip generation of programming voltage

• JEDEC-standard based command sequences for DFLASH control

– Write state machine controls programming and erase operations

– Status and error reporting by status flags and interrupt

• Margin check for detection of problematic DFLASH bits

TC1762

Functional DescriptionPreliminary

Data Sheet 27 V1.0, 2008-04

3.3 Architectural Address Map

Table 3-1 shows the overall architectural address map as defined for the TriCore and as

implemented in TC1762.

Table 3-1 TC1762 Architectural Address Map

Seg-

ment Contents Size Description

0-7 Global 8 x 256

Mbyte Reserved (MMU space); cached

8 Global

Memory 256 Mbyte Reserved (246 Mbyte); PMU, Boot ROM;

cached

9 Global

Memory 256 Mbyte FPI space; cached

10 Global

Memory 256 Mbyte Reserved (246 Mbyte), PMU, Boot ROM; non-

cached

11 Global

Memory 256 Mbyte FPI space; non-cached

12 Local LMB

Memory 256 Mbyte Reserved; bottom 4 Mbyte visible from FPI bus

in segment 14; cached

13 DMI 64 Mbyte Local Data Memory RAM; non-cached

PMI 64 Mbyte Local Code Memory RAM; non-cached

EXT_PER 96 Mbyte Reserved; non-cached

EXT_EMU 16 Mbyte Reserved; non-cached

BOOTROM 16 Mbyte Boot ROM space, Boot ROM mirror;

non-cached

14 EXTPER 128 Mbyte Reserved;

non-speculative; non-cached; no execution

CPU[0 ..15]

image region 16 x 8

Mbyte Non-speculative; non-cached; no executi on

15 LMB_PER

CSFRs

INT_PER

256

Mbyte CSFRs of CPUs[0 ..15];

LMB & FPI Peripheral Space;

non-speculative; non-cached;

no execution

TC1762

Functional DescriptionPreliminary

Data Sheet 28 V1.0, 2008-04

3.4 Memory Protection System

The TC1762 memory protection system specifies the addressable range and read/write

permissions of memory segments available to the current executing task. The memory

protection system controls the position and range of addressable segments in memory.

It also controls the types of read and write operations allowed within addressable

memory segments. Any illegal memory access is detected by the memory protection

hardware, which then invokes the appropriate Trap Service Routine (TSR) to handle the

error. Thus, the memory protection system protects critical system functions against both

software and hardware errors. The memory protection hardware can also generate

signals to the Debug Unit to facilitate tracing illegal memory accesses.

There are two Memory Protection Register Sets in the TC1762, numbered 0 and 1,

which specify memory protection ranges and permissions for code and data. The

PSW.PRS bit field determines which of these is the set currently in use by the CPU. As

the TC1762 uses a Harvard-style memory architecture, each Memory Protection

to receive a particular protection modes. Each Code Protection Register Set can specify

up to two address ranges to receive a particular protection modes.

Each Data Protection Register Sets and Code Protection Register Sets determines the

range and protection modes for a separate memory area. Each set contains a pair of

registers which determine the address range (the Data Segment Protection Registers

and Code Segment Protection Registers) and one register (Data Protection Mode

range.

TC1762

Functional DescriptionPreliminary

Data Sheet 29 V1.0, 2008-04

3.5 DMA Controller and Memory Checker

The DMA Controller of the TC1762 transfers data from data source locations to data

destination locations without intervention of the CPU or other on-chip devices. One data

move operation is controlled by one DMA channel. Eight DMA channels are provided in

one DMA Sub-Block. The Bus Switch provides the connection of the DMA Sub-Block to

the two FPI Bus interfaces and an MLI bus interface. In the TC1762, the FPI Bus

interfaces are connected to the System Peripheral Bus and the DMA Bus. The third

specific bus interface provides a connection to the Micro Link Interface module (MLI0 in

the TC1762) and other DMA-related devices (Memory Checker module in the TC1762).

Clock control, address decoding, DMA request wiring, and DMA interrupt service request

control are implementation-specific and managed outside the DMA controller kernel.

Figure 3-1 shows the implementation details and interconnections of the DMA module.

Figure 3-1 DMA Controller Block Diagram

Features

• 8 independent DMA channels

Interrupt

Request

Nodes

MCB06149

Clock

Control

DMA

SR[15:0]

DMA Contr o ll er

Arbiter/

Switch

Control

Bus

Switch

FPI Bus

Interfa ce 0

FP I Bus

In te r fa ce 1

MLI

Interface

Memory

Checker

MLI0

System

Periphera

Bus

DMA Bus

DMA

Requests

On-chip

Periph.

Units

Address

Decoder

D M A Interr upt C ontr ol

CH0n_OUT

DMA

Channels

00-07

DM A Su b-Bl o ck 0

Request

Selection/

Arbitration Transaction

Cont rol Unit

TC1762

Functional DescriptionPreliminary

Data Sheet 30 V1.0, 2008-04

– 8 DMA channels in the DMA Sub-Block

– Up to 8 selectable request inputs per DMA channel

– 2-level programmable priority of DMA channels within the DMA Sub-Block

– Software and hardware DMA request

– Hardware requests by selected on-chip peripherals and external inputs

• Programmable priority of the DMA Sub-Blocks on the bus interfaces

• Buffer capability for move actions on the buses (at least 1 move per bus is buffered).

• Individually programmable operation modes for each DMA channel

– Single Mode: stops and disables DMA channel after a predefined number of DMA

transfers

– Continuous Mode: DMA channel remains enabled after a predefined number of

DMA transfers; DMA transaction can be repeated.

– Programmable address modification

• Full 32-bit addressing capability of each DMA channel

– 4 Gbyte address range

– Support of circular buffer addressing mode

• Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit

• Micro Link bus interface support

• Register set for each DMA channel

– Source and destination address register

– Channel control and status register

– Transfer count register

• Flexible interrupt generation (the service request node logic for the MLI channels is

also implemented in the DMA module)

• All buses connected to the DMA module must work at the same frequency.

• Read/write requests of the System Bus side to the peripherals on DMA Bus are

bridged to the DMA Bus (only the DMA is the master on the DMA bus), allowing easy

access to these peripherals by CPU

Memory Checker

The Memory Checker Module (MCHK) makes it possible to check the data consistency

of memories. Any SPB bus master may access the memory checker. It is pref erable the

DMA does it as described hereafter. It uses DMA 8-bit, 16-bit, or 32-bit moves to read

from the selected address area and to write the value read in a me mory checker input

checksum calculation is triggered and the result of the calculation is stored in the

memory checker result register.

The memory checker uses the standard Ethernet polynomial, which is given by:

G32 = x32+ x26+ x23+ x22+ x16+ x12+ x11+ x10+ x8+ x7+ x5+ x4+ x2+ x +1

Note: Although the polynomial above is used for generation, the generation algorithm

differs from the one that is used by the Ethernet protocol.

TC1762

Functional DescriptionPreliminary

Data Sheet 31 V1.0, 2008-04

3.6 Interrupt System

The TC1762 interrupt system provides a flexible and time-efficient means of processing

interrupts. An interrupt request is serviced by the CPU, which is called the “Service

Provider”. Interrupt requests are called “Service Requests” rather than “Interrupt

Requests” in this document.

Each peripheral in the TC1762 can generate service requests. Additionally, the Bus

Control Units, the Debug Unit, and even the CPU itself can generate service requests to

the Service Provider.

As shown in Figure 3-2, each TC1762 unit that can generate service requests is

connected to one or multiple Service Request Nodes (SRN). Each SRN contains a

Service Request Control Register mod_SRCx, where “mod” is the identifier of the

service requesting unit and “x” an optional index. The CPU Interrupt Arbitration Bus

connects the SRNs with the Interrupt Control Unit (ICU), which arbitrates service

requests for the CPU and administers the CPU Interrupt Arbitration Bus.

The Debug Unit can generate service requests to the CPU. The CPU makes service

requests directly to itself (via the ICU). The CPU Service Request Nodes are activated

through software.

Depending on the selected system clock frequency fSYS, the number of fSYS clock cycles

per arbitration cycle must be selected as follows:

•fSYS < 60 MHz: ICR.CONECYC = 1

•fSYS > 60 MHz: ICR.CONECYC = 0

TC1762

Functional DescriptionPreliminary

Data Sheet 32 V1.0, 2008-04

Figure 3-2 Block Diagram of the TC1762 Interrupt System

Servi ce R e q.

Nodes

Service R eq.

Nodes

Service

Requestors

CPU I nt errupt

Cont rol Unit

Interrupt

Service

Provider

MCA06181

4 SRNs

MLI0

3 SRNs

SSC0

4 SRNs

ASC0

4 SRNsASC1

6 SRNsMultiCAN

4 SRNsADC0

2 SRNsFADC

38 SRNs

GPTA0

CPU

Interrupt

Arbi tr ati on Bus

Int. Req.

PIPN

CPU

CCPN

Int. Ack.

Software

and

Breakpoint

Interrupts

ICU

2 SRNs

MSC0

1 SR N

4 SR N s

Ext. Int

STM

FPU

Flash

Service

Requestors

LBCU

SBCU

Cerberus

DMA

2 SRNs

1 SRN

2 SRNs

DMA Bus

CPU I nt errupt

Cont rol Unit

5 SRNs

TC1762

Functional DescriptionPreliminary

Data Sheet 33 V1.0, 2008-04

3.7 Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1)

Figure 3-3 shows a global view of the functional blocks and interfaces of the two

Asynchronous/Synchronous Serial Interfaces, ASC0 and ASC1.

Figure 3-3 Block Diagram of the ASC Interfaces

The ASC provides serial communication between the TC1762 and other

microcontrollers, microprocessors, or external peripherals.

The ASC supports full-duplex asynchronous communication and half-duplex

synchronous communication. In Synchronous Mode, data is transmitted or received

synchronous to a shift clock that is generated by the ASC internally. In Asynchronous

Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be

MCB06211c

ASC0

Module

(Kernel)

Por t 3

Control

ASC1

Module

(Kernel)

P3.12 /

RXD0B

P3.13 /

TXD0B

P3.0 /

RXD0A

P3.1 /

TXD0A

P3.14 /

RXD1B

P3.15 /

TXD1B

P3.9 /

RXD1A

P3.8 /

TXD1A

RXD_I1

RXD_O

RXD_I0

TXD_O

RXD_I1

RXD_O

RXD_I0

TXD_O

Interrupt

Control

EIR

TBIR

TIR

RIR

Clock

Control

Address

Decoder

Interrupt

Control

ASC

EIR

TBIR

TIR

RIR

DMA

ASC0_RDR

ASC0_TDR

DMA

ASC1_RDR

ASC1_TDR

TC1762

Functional DescriptionPreliminary

Data Sheet 34 V1.0, 2008-04

selected. Parity, framing, and overrun error detection are provided to increase the

reliability of data transfers. Transmission and reception of data is double-buffered. For

multiprocessor communication, a mechanism is included to distinguish address bytes

from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator

provides the ASC with a separate serial clock signal , which can be accurately adjusted

by a prescaler implemented as fractional divider.

Features

• Full-duplex asynchronous operating modes

– 8-bit or 9-bit data frames, LSB first

– Parity-bit generation/checking

– One or two stop bits

– Baud rate from 5.0 Mbit/s to 1.19 bit/s (@ 80 MHz module clock) and 4.1Mbit/s to

0.98 bit/s (@ 66 MHz module clock)

– Multiprocessor mode for automatic add ress/data byte detection

– Loop-back capability

• Half-duplex 8-bit synchronous operating mode

– Baud rate from 10.0 Mbit/s to 813.8 bit/s (@ 80 MHz module clock) and 8.25 Mbit/s

to 671.4 bit/s (@ 66 MHz module clock)

• Double-buffered transmitter/receiver

• Interrupt generation

– On a transmit buffer empty condition

– On a transmit last bit of a frame condition

– On a receive buffer full condition

– On an error condition (frame, parity, overrun error)

TC1762

Functional DescriptionPreliminary

Data Sheet 35 V1.0, 2008-04

3.8 High-Speed Synchronous Serial Interface (SSC0)

Figure 3-4 shows a global view of the functional blocks and interfaces of the high-speed

Synchronous Serial Interface, SSC0.

Figure 3-4 Block Diagram of the SSC Interfaces

The SSC supports full-duplex and half-duplex serial synchronous communi cation up to

40.0 MBaud at 80 MHz module clock and up to 33 MBaud at 66 MHz module clock. The

serial clock signal can be generated by the SSC itself (Master Mode) or can be received

from an external master (Slave Mode). Data width, shift direction, clock polarity and

phase are programmable. This allows communication with SPI-compatible devices.

Transmission and reception of data is double-buffered. A shift clock generator provides

the SSC with a separate serial clock signal. Seven slave select inputs are available for

Clock

Control

Address

Decoder

Interrupt

Control

SSC0

SSC0_TDR

EIR

TIR

RIR

Port 3

Control

SSC0

Module

(Kernel)

MRSTB

MTSR

Master SLSI1

SLSO[2:0]

MRSTA

MTSRB

MRST

MTSRA

SCLKB

SCLK

SCLKA

Slave

Master

Slave

Master

CLC0

SLSI[7:2]

Enable

M/S Select

1) These lines a re not conn ected

Port 2

Control

SLSO[5:3]

SLSO6

SLSO7

SSC0_RDR

DMA

MCB06225

P3.3 / MRST0

P3.4 / MTSR0

P3.2 /SCLK0

P3.7 / SLSI0

P2.8 / SLSO04

P2.9 / SLSO05

P2.1 / SLSO03

P3 .7 /SLS O02

P3.5 /SLSO00

P3 .8 /SLS O06

P3.6 /SLSO01

TC1762

Functional DescriptionPreliminary

Data Sheet 36 V1.0, 2008-04

Slave Mode operation. Eight programmable slave select outputs (chip selects) are

supported in Master Mode.

Features

• Master and Slave Mode operation

– Full-duplex or half-duplex operation

– Automatic pad control possible

• Flexible data format

– Programmable number of data bits: 2 to 16 bits

– Programmable shift direction: LSB or MSB shift first

– Programmable clock polarity: Idle low or idle high state for the shift clock

– Programmable clock/data phase: Data shift with leading or trailing edge of the shift

clock

• Baud rate generation from 40.0 Mbit/s to 610.36 bit/s (@ 80 MHz module clock) and

503.5 bit/s to 33 Mbit/s (@ 66 MHz module clock)

• Interrupt generation

– On a transmitter empty condition

– On a receiver full condition

– On an error condition (receive, phase, baud rate, transmit error)

• Flexible SSC pin configuration

• Seven slave select inputs SLSI[7:1] in Slave Mode

• Eight programmable slave select outputs SLSO[7:0] in Master Mode

– Automatic SLSO generation with programmable timing

– Programmable active level and enable control

TC1762

Functional DescriptionPreliminary

Data Sheet 37 V1.0, 2008-04

3.9 Micro Second Bus Interface (MSC0)

The MSC interface provides a serial communication link typically used to connect power

switches or other peripheral devices. The serial communication link includes a fast

synchronous downstream channel and a slow asynchronous upstream channel.

Figure 3-5 shows a global view of the MSC interface signals.

Figure 3-5 Block Diagram of the MSC Interfaces

The downstream and upstream channels of the MSC module communicate with the

external world via nine I/O lines. Eight output lines are required for the serial

communication of the downstre am channel (clock, data, and enable signals). One out of

eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The

source of the serial data to be transmitted by the downstream channel can be MSC

lines are typically connected to other on-chip peripheral units (for example with a timer

unit like the GPTA). An emergency stop input signal makes it possible to set bits of the

serial data stream to dedicated values in emergency cases.

MSC0

Module

(Kernel)

MCA0625

Port 2

Control

P2.13 / SDI0

EN0

SOP

SON0

SON SOP0A

P2.9 / EN01

P2.8 / EN00

FCLN0

FCLN FCLP0A

FCLP

EN1

P2.11 / FCLP0

P2.12 / SOP0B

Upstream

Channel Downstream Cha nnel

Clock

Control

Address

Decoder

Interrupt

Control SR[1:0]

EMGSTOPMSC

ALTINL[15:0]

ALTINH[15:0]

To DMA SR[3:2]

(from GPTA)

(from SCU)

fMSC0

fCLC0

SR15 (from CAN )

SDI[0]1)

1) SDI[7:1] are connected to high level

TC1762

Functional DescriptionPreliminary

Data Sheet 38 V1.0, 2008-04

Clock control, address decoding, and interrupt service request control are managed

outside the MSC module kernel. Service request outputs are able to trigger an interrupt

or a DMA request.

Features

• Fast synchronous serial interface to connect power switches in particular, or other

peripheral devices via serial buses

• High-speed synchronous serial transmission on downstream channel

– Serial output clock frequency: fFCL =fMSC/2

– Fractional clock divider for precise frequency control of serial clock fMSC

– Command, data, and passive frame types

– Start of serial frame: Software-controlled, timer-controlled, or free-running

– Programmable upstream data frame length (16 or 12 bits)

– Transmission with or without SEL bit

– Flexible chip select generation indicates status during serial frame transmission

– Emergency stop without CPU intervention

• Low-speed asynchronous serial reception on upstream channel

– Baud rate: fMSC divided by 4, 8, 16, 32, 64, 128, or 256

– Standard asynchronous serial frames

– Parity error checker

– 8-to-1 input multiplexer for SDI lines

– Built-in spike filter on SDI lines

TC1762

Functional DescriptionPreliminary

Data Sheet 39 V1.0, 2008-04

3.10 MultiCAN Controller (CAN)

Figure 3-6 shows a global view of the MultiCAN module with its functional blocks and

interfaces.

Figure 3-6 Block Diagram of MultiCAN Module

The MultiCAN module contains two independently-operating CAN nodes with Full-CAN

functionality that are able to exchange Data and Remote Frames via a gateway function.

Transmission and reception of CAN frames is handled in accordance with CAN

specification V2.0 B (active). Each CAN node can receive and transmit standard frames

with 11-bit identifiers as well as extended frames with 29-bit identifiers.

Both CAN nodes share a common set of message objects. Each message object can be

individually allocated to one of the CAN nodes. Besides serving as a storage container

for incoming and outgoing frames, message objects can be combined to build gateways

between the CAN nodes or to setup a FIFO buffer.

The message objects are organized in double-chained linked lists, where each CAN

node has its own list of message objects. A CAN node stores frames only into message

objects that are allocated to the message object list of the CAN node, and it transmits

only messages belonging to this message object list. A powerful, command-driven list

controller performs all message object list operations.

The bit timings for the CAN nodes are derived from the module timer clock (fCAN), and

are programmable up to a data rate of 1 Mbit/s. External bus transceivers are connected

to a CAN node via a pair of receive and transmit pins.

MultiCAN Module K ernel

MCA0628

Interrupt

Control

CAN

Port 3

Control

CAN Control

Message

Object

Buffer

Objects

TXDC0

RXDC0

TXDC1

RXDC1

Linked

List

Control

P3.15 /

TXDCAN

P3.14 /

RXDCAN

P3.13 /

TXDCAN

P3.12 /

RXDCAN

CLC

Clock

Control

Address

Decoder

DMA

INT_O

[1:0]

INT_O15

INT_O

[5:2]

CAN

Node 0

CAN

Node 1

TC1762

Functional DescriptionPreliminary

Data Sheet 40 V1.0, 2008-04

MultiCAN Features

• CAN functionality conforms to CAN specification V2.0 B active for each CAN node

(compliant to ISO 11898)

• Two independent CAN nodes

• 64 independent message objects (shared by the CAN nodes)

• Dedicated control registers for each CAN node

• Data transfer rate up to 1Mbit/s, individually programmable for each node

• Flexible and powerful message transfer control and error handling capabilities

• Full-CAN functionality: message objects can be individually

– assigned to one of the two CAN nodes

– configured as transmit or receive object

– configured as message buffer with FIFO algorithm

– configured to handle frames with 11-bit or 29-bit identifiers

– provided with programmable acceptance mask register for filtering

– monitored via a frame counter

– configured for Remote Monitoring Mode

• Automatic Gateway Mode support

• 6 individually programmable interrupt nodes

• CAN analyzer mode for bus monitoring

TC1762

Functional DescriptionPreliminary

Data Sheet 41 V1.0, 2008-04

3.11 Micro Link Serial Bus Interface (MLI0)

The Micro Link Interface is a fast synchronous serial interface that allows data exchange

between microcontrollers of the 32-bit AUDO microcontroller family without intervention

of a CPU or other bus masters. Figure 3-7 shows how two microcontrollers are typically

connected together via their MLI interface. The MLI operates in both microcontrollers as

a bus master on the system bus.

Figure 3-7 Typical Micro Link Interface Connection

Features

• Synchronous serial communication between MLI transmitters and MLI receivers

located on the same or on different microcontroller devices

• Automatic data transfer/request transactions between local/remote controller

• Fully transparent read/write access supported (= remote programming)

• Complete address range of remote controller available

• Specific frame protocol to transfer commands, addresses and data

• Error control by parity bit

• 32-bit, 16-bit, and 8-bit data transfers

• Programmable baud rates

– MLI transmitter baud rate: max. fMLI/2 (= 40 Mbit/s @ 80 MHz module clock)

– MLI receiver baud rate: max. fMLI

• Multiple remote (slave) controllers are supported

MLI transmitter and MLI receiver communicate with other off-chip MLI receivers and MLI

transmitters via a 4-line serial I/O bus each. Several I/O lines of these I/O buses are

available outside the MLI module kernel as four-line output or input buses.

MCA06061

Controller 1

CPU

Peripheral

MLI

System Bus

Controller 2

CPU

Peripheral

MLI

System Bus

Memory Memory

TC1762

Functional DescriptionPreliminary

Data Sheet 42 V1.0, 2008-04

Figure 3-8 shows a global view of the functional blocks of the MLI module with its

interfaces.

Figure 3-8 Block Diagram of the MLI Module

SR[3:0]

MLI0

Address

Decoder

Interrupt

Control

Clock

Control

To DMA SR[4:7]

Port 2

Control

P2.1 / TRE ADY0A

TREADYA

TCLK

TREADYD

TVALIDA

TVALIDD

TDATA

TransmitterReceiver

RCLKA

RCLKD

RREADYA

RREADYD

RVALIDA

RVALIDD

RDATAA

RDATAB

TREADYB

RREADYB

RVALIDB

RDATAD

TVALIDB

RCLKB

MLI0

Module

(Kernel)

MCB06322

P2.0 / TCLK0

P5.14 / TREA DY0B

P2.2 / TVALID0A

P2.3 / TDA TA0

P2.4 / RCLK 0 A

P2.5 / RREA DY0A

P2.6 / RV ALID0A

P2.7 / RDATA0A

P5.11 / RCLK0B

P5.9 / RV ALID0B

P5.8 / RDATA0B

P5.10 / RREADY0B

P5.13 / TVALID0B

Port 5

Control

P5.15 / TCLK 0

P5.12 / TDATA0

BRKOUT

Cerberus

TC1762

Functional DescriptionPreliminary

Data Sheet 43 V1.0, 2008-04

3.12 General Purpose Timer Array

The GPTA provides a set of timer, compare, and capture functionalities that can be

flexibly combined to form signal measurement and signal generation units. They are

optimized for tasks typical of engine, gearbox, electrical motor control applications, but

can also be used to generate simple and complex signal waveforms needed in other

industrial applications.

The TC1762 contains one General Purpose Timer Array (GPTA0). Figure 3-9 shows a

global view of the GPTA module.

Figure 3-9 Block Diagram of the GPTA Module

Signal

Generation Unit

MCB06063

GT1

GT0

FPC5

FPC4

FPC3

FPC2

FPC1

FPC0

PDL1

PDL0

DCM2

DCM1

DCM0

DIGITAL

PLL

DCM3

GTC02

GTC01

GTC00

GTC31

Global

Timer

Cell Array

GTC03

GTC30

Clock Bus

GPTA

Clock Generation Unit

Cloc

Con

Clock Distribution Unit

fGPTA

LTC02

LTC01

LTC00

LTC63

Local

Timer

Cell Array

LTC03

LTC62

I/O Line Sharing Unit

Interrupt Sharing Unit

TC1762

Functional DescriptionPreliminary

Data Sheet 44 V1.0, 2008-04

3.12.1 Functionality of GPTA0

The General Purpose Timer Array GPTA0 provides a set of hardware modules required

for high-speed digital signal processing:

• Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation.

• Phase Discrimination Logic units (PDL) decode the direction information output by a

rotation tracking system.

• Duty Cycle Measurement Cells (DCM) provide pulse-width measurement

capabilities.

• A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA

module clock ticks during an input signal’s period.

• Global Timer units (GT) driven by various clock sources are implemented to operate

as a time base for the associated Global Timer Cells.

• Global Timer Cells (GTC) can be programmed to capture the contents of a Global

Timer on an external or internal event. A GTC may also be used to control an external

port pin depending on the result of an internal compare operation. GTCs can be

logically concatenated to provide a common external port pin with a complex signal

waveform.

• Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may also be

logically tied together to drive a common external port pin with a complex signal

waveform. LTCs — enabled in Timer Mode or Capture Mode — can be clocked or

triggered by various external or internal events.

Input lines can be shared by an LTC and a GTC to trigger their programmed operation

simultaneously.

The following list summarizes the specific features of the GPTA unit.

Clock Generation Unit

• Filter and Prescaler Cell (FPC)

– Six independent units

– Three basic operating modes:

Prescaler, Delayed Debounce Filter, Immediate Debounce Filter

– Selectable input sources:

Port lines, GPTA module clock, FPC output of preceding FPC cell

– Selectable input clocks:

GPTA module clock, prescaled GPTA modu le clock, DCM clock, compensated or

uncompensated PLL clock

–fGPTA/2 maximum input signal frequency in Filter Modes

• Phase Discriminator Logic (PDL)

– Two independent units

– Two operating modes (2- and 3-sensor signals)

–fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input

signal frequency in 3-sensor Mode

TC1762

Functional DescriptionPreliminary

Data Sheet 45 V1.0, 2008-04

• Duty Cycle Measurement (DCM)

– Four independent units

– 0 - 100% margin and time-out handling

–fGPTA maximum resolution

–fGPTA/2 maximum input signal frequency

• Digital Phase Locked Loop (PLL)

– One unit

– Arbitrary multiplication factor between 1 and 65535

–fGPTA maximum resolution

–fGPTA/2 maximum input signal frequency

• Clock Distribution Unit (CDU)

– One unit

– Provides nine clock output signals:

fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock

Signal Generation Unit

• Global Timers (GT)

– Two independent units

– Two operating modes (Free-Running Timer and Reload Timer)

– 24-bit data width

–fGPTA maximum resolution

–fGPTA/2 maximum input signal frequency

• Global Timer Cell (GTC)

– 32 units related to the Global Timers

– Two operating modes (Capture, Compare and Capture after Compare)

– 24-bit data width

–fGPTA maximum resolution

–fGPTA/2 maximum input signal frequency

• Local Timer Cell (LTC)

– 64 independent units

– Three basic operating modes (Timer, Capture and Compare) for 63 units

– Special compare modes for one unit

– 16-bit data width

–fGPTA maximum resolution

–fGPTA/2 maximum input signal frequency

Interrupt Control Unit

• 111 interrupt sources, generating up to 38 service requests

TC1762

Functional DescriptionPreliminary

Data Sheet 46 V1.0, 2008-04

I/O Sharing Unit

• Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and

MSC interface

TC1762

Functional DescriptionPreliminary

Data Sheet 47 V1.0, 2008-04

3.13 Analog-to-Digital Converter (ADC0)

Section 3.13 shows the global view of the ADC module with its functional blocks and

interfaces and the features which are provided by the module.

Figure 3-10 Block Diagram of the ADC Module

The ADC module has 16 analog input channels. An analog multiplexer selects the input

line for the analog input channels from among 32 analog inputs. Additionally, an external

analog multiplexer can be used for analog input extension. External Clock control,

address decoding, and service request (interrupt) control are managed outside the ADC

module kernel. External trigger conditions are controlled by an External Request Unit.

This unit generates the control signals for auto-scan control (ASGT), software trigger

control (SW0TR, SW0GT), the event trigger control (ETR, EGT), queue control (QTR,

QGT), and timer trigger control (TTR, TGT).

An automatic self-calibration adjusts the ADC module to changing temperatures or

process variations. Figure 3-10 shows the global view of the ADC module with its

functional blocks and interfaces.

ADC0

Module

Kernel

Interrupt

Control

Clock

Control

Address

Decoder

ADC

To DMA

AIN16

Analog Mu ltiplexer

MCA0642

VAGND0

VDD VSS

DDM

VAREF0

VSSM

Group 1

P1.13 /AD0EMUX1

P1.12 /AD0EMUX0

AN0

AN15

AN16

fCLC Port 1

Control

AIN0

AIN15

Group 0

ASGT

SW0TR, SW0GT

ETR, EGT

QTR, QGT

TTR, TG T

External

Request

Unit

(SCU)

AIN30

From GPTA

From Ports

From MSC0

P1.14 /

AD0EMUX2 (GRPS

)

AN30

AIN31 AN31

Die

Temperature

Measurement

SCU_CON.DTSON

GPRS

EMUX0

EMUX1

SR[3:0]

SR[7:4]

TC1762

Functional DescriptionPreliminary

Data Sheet 48 V1.0, 2008-04

Features

• 8-bit, 10-bit, 12-bit A/D conversion

• Conversion time below 2.5µs @ 10-bit resolution

• Extended channel status information on request source

• Successive approximation conversion method

• Total Unadjusted Error (TUE) of ±2 LSB @ 10-bit resolution

• Integrated sample & hold functionality

• Direct control of up to 16 analog input channels

• Dedicated control and status registers for each analog channel

• Powerful conversion request sources

• Selectable reference voltages for each channel

• Programmable sample and conversion timing schemes

• Limit checking

• Flexible ADC module service request control unit

• Automatic control of external analog multiplexers

• Equidistant samples initiated by timer

• External trigger and gating inputs for conversion requests

• Power reduction and clock control feature

• On-chip die temperature sensor output voltage measurement

TC1762

Functional DescriptionPreliminary

Data Sheet 49 V1.0, 2008-04

3.14 Fast Analog-to-Digital Converter Unit (FADC)

The on-chip FADC module of the TC1762 basically is a 2-channel A/D converter with 10-

bit resolution that operates by the method of the successive approximation.

As shown in Figure 3-11, the main FADC functional blocks are:

• The Input Stage — contains the differential inputs and the programmable amplifier

• The A/D Converter — is responsible for the analog-to-digital conversion

• The Data Reduction Unit — contains prog rammable antialiasing and data reduction

filters

• The Channel Trigger Control block — determines the trigger and gating conditions

for the two FADC channels

• The Channel Timers — can independently trigger the conversion of each FADC

channel

• The A/D Control block is responsible for the overall FADC functionality

The FADC module is supplied by the following power supply and reference voltage lines:

•VDDMF/VDDMF:FADC Analog Part Power Supply (3.3 V)

•VDDAF/VDDAF:FADC Analog Part Logic Power Supply (1.5 V)

•VFAREF/VFAGND:FADC Reference Voltage (3.3 V)/FADC Reference Ground

TC1762

Functional DescriptionPreliminary

Data Sheet 50 V1.0, 2008-04

Figure 3-11 Block Diagram of the FADC Module

Features

• Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz and

318.2 ns @ fFADC =66 MHz)

• 10-bit A/D conversion

– Higher resolution by averaging of consecutive conversions is supported

• Successive approximation conversion method

• Two differential input channels

• Offset and gain calibration support for each channel

• Differential input amplifier with programmable gain of 1, 2, 4 and 8 for each channel

• Free-running (Channel Timers) or triggered conversion modes

• Trigger and gating control for external signals

• Built-in Channel Timers for internal triggering

• Channel timer request periods independently selectable for each channel

Clock

Control

Address

Decoder

MCA0644

VFAGND

DDAF

VSSAF

DDMF

FAREF VSSMF

Interrupt

Control

AN32

TS[7:0]

GS[7:0]

fFADC

fCLC

SR[1:0]

FAIN0P

FAIN0N

FAIN1P

FAIN1N

AN33

AN34

AN35

P3.10 / REQ

External Request Unit

(SCU)

P3.11 / REQ

P0.14 / REQ

P0.15 / REQ

GPTA0

OUT1

OUT9

OUT18

OUT26

OUT2

OUT10

OUT19

OUT27

PDOUT2

PDOUT3

DMA SR[3:2]

FADC

Module

Kernel

TC1762

Functional DescriptionPreliminary

Data Sheet 51 V1.0, 2008-04

• Selectable, programmable anti-aliasing and data reduction filter block

3.15 System Timer

The TC1762’s STM is designed for global system timing applications requiring both high

precision and long period.

Features

• Free-running 56-bit counter

• All 56 bits can be read synchronously

• Different 32-bit portions of the 56-bit counter can be read synchronously

• Flexible interrupt generation based on compare match with partial STM content

• Driven by maximum 66 or 80 MHz (= fSYS, default after reset = fSYS/2) depending on

derivative

• Counting starts automatically after a reset operation

• STM is reset by:

– Watchdog reset

– Software reset (RST_REQ.RRSTM must be set)

– Power-on reset

• STM (and clock divider STM_CLC.RMC) is not reset at a hardware reset (HDRST =

• STM can be halted in debug/suspend mode (via STM_CLC register)

The STM is an upward counter, running either at the system clock frequency fSYS or at a

fraction of it. The STM clock frequency is fSTM =fSYS/RMC with RMC = 0-7 (default after

reset is fSTM =fSYS/2, selected by RMC = 010B). RMC is a bit field in register STM_CLC.

In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After

one of these reset conditions, the STM is enabled and immediately starts counting up. It

is not possible to affect the content of the timer during normal operation of the TC1762.

The timer registers can only be read but not written to.

The STM can be optionally disabled for power-saving purposes, or suspended for

debugging purposes via its clock control register. In suspend mode of the TC1762

(initiated by writing an appropriate value to STM_CLC register), the STM clock is

stopped but all registers are still readable.

Due to the 56-bit width of the STM, it is not possible to read it s entire content with one

instruction. It needs to be read with two load instructions. Since the timer would continue

to count between the two load operations, there is a chance that the two values read are

not consistent (due to possible overflow from the low part of the timer to the high part

between the two read operations). To enable a synchronous and consistent reading

operation of the STM content, a capture register (STM_CAP) is implemented. It latches

the content of the high part of the STM each time when one of the registers STM_TIM0

to STM_TIM5 is read. Thus, STM_CAP holds the upper value of the timer at exactly the

TC1762

Functional DescriptionPreliminary

Data Sheet 52 V1.0, 2008-04

same time when the lower part is read. The second read operation would then read the

content of the STM_CAP to get the complete timer value.

The STM can also be read in sections from seven registers, STM_TIM0 through

STM_TIM6, that select increasingly higher-order 32-bit ranges of the STM. These can

be viewed as individual 32-bit timers, each with a different resolution and timing range.

The content of the 56-bit System Timer can be compared with the content of two

compare values stored in the STM_CMP0 and STM_CMP1 registers. Interrupts can be

generated on a compare match of the STM with the STM_CMP0 or STM_CMP1

registers.

The maximum clock period is 256 ×fSTM. At fSTM = 80 MHz, for example, the STM counts

28.56 years before overflowing. Thus, it is capable of timing the entire expected product

life-time of a system without overflowing continuously.

Figure 3-12 shows an overview on the System Timer with the options for reading parts

of the STM contents.

TC1762

Functional DescriptionPreliminary

Data Sheet 53 V1.0, 2008-04

Figure 3-12 General Block Diagram of the STM Module Registers

STM Module

00HSTM_CAP

STM_TIM6

STM_TIM5

00H

56-Bit System Timer

Address

Decoder

Clock

Control

MCB06185

Compare Register 0

Interrupt

Control

Compare Register1

PORST

STM_TIM4

STM_TIM3

STM_TIM2

STM_TIM1

STM_TIM0

STM_CMP1

STM_CMP0

Enable /

Disable

STM

STMIR1

STMIR0

31 23 15 7 0

55 47 39 31 23 15 7 0

TC1762

Functional DescriptionPreliminary

Data Sheet 54 V1.0, 2008-04

3.16 Watchdog Timer

The WDT provides a highly reliable and secure way to detect and recover from software

or hardware failure. The WDT helps to abort an accidental malfunction of the TC1762 in

a user-specified time period. When enabled, the WDT will cause the TC1762 system to

be reset if the WDT is not serviced within a user-programmable time period. The CPU

must service the WDT within this time interval to prevent the WDT from causing a

TC1762 system reset. Hence, routine service of the WDT confirms that the system is

functioning as expected.

In addition to this standard “Watchdog” function, the WDT incorporates the End-of-

Initialization (Endinit) feature and monitors its modifications. A system-wide line is

connected to the WDT_CON0.ENDINIT bit, serving as an additional write-protection for

critical registers (besides Supervisor Mode protection). Registers protected via this line

can only be modified when Supervisor Mode is active and bit ENDINIT = 0.

A further enhancement in the TC1762’s WDT is its reset prewarning operation. Instead

of resetting the device upon the detection of an error immediately (the way that standard

Watchdogs do), the WDT first issues a Non-Maskable Interrupt (NMI) to the CPU before

resetting the device at a specified time period later. This step gives the CPU a chance to

save the system state to the memory for later investigation of the cause of the

malfunction; an important aid in debugging.

Features

• 16-bit Watchdog counter

• Selectable input frequency: fSYS/256 or fSYS/16384

• 16-bit user-definable reload value for normal Watchdog operation, fixed reload value

for Time-Out and Prewarning Modes

• Incorporation of the ENDINIT bit and monitoring of its modifications

• Sophisticated Password Access mechanism with fixed and user-definable password

fields

• Proper access always requires two write accesses. The time between the two

accesses is monitored by the WDT and is limited.

• Access Error Detection: Invalid password (during first access) or invalid guard bits

(during second access) trigger the Watchdog reset generation

• Overflow Error Detection: An overflow of the counter triggers the Watchdog reset

generation.

• Watchdog function can be disabled; access protection and ENDINIT monitor function

remain enabled.

• Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system

malfunction is assumed and the TC1762 is held in reset until a power-on or hardware

reset occurs. This prevents the device from being periodically reset if, for instance,

connection to the external memory has been lost such that system initialization could

not even be performed.

TC1762

Functional DescriptionPreliminary

Data Sheet 55 V1.0, 2008-04

• Important debugging support is provided through the reset prewarning operation by

first issuing an NMI to the CPU before finally resetting the device after a certain

period of time.

3.17 System Control Unit

The System Control Unit (SCU) of the TC1762 handles several system control tasks.

The system control tasks of the SCU are:

• Clock system selection and control

• Reset and boot operation control

• Power management control

• Configuration input sampling

• External Request Unit

• System clock output control

• On-chip SRAM parity control

• Pad driver temperature compensation control

• Emergency stop input control for GPTA outputs

• GPTA input IN1 control

• Pad test mode control for dedicated pins

• ODCS level 2 trace control

• NMI control

• Miscellaneous SCU control

TC1762

Functional DescriptionPreliminary

Data Sheet 56 V1.0, 2008-04

3.18 Boot Options

The TC1762 booting schemes provide a number of different boot options for the start of

code execution. Table 3-2 shows the boot options available in the TC1762.

Table 3-2 TC1762 Boot Selections

BRKIN HWCFG

[3:0] TESTMODE Type of Boot BootROM

Exit Jump

Address

Normal Boot Options

1 0000B1 Enter bootstrap loader mode 1:

Serial ASC0 boot via ASC0 pins D400 0000H

0001BEnter bootstrap loader mode 2:

Serial CAN boot via P3.12 and

P3.13 pins

0010BStart from internal PFLASH A000 0000H

0011BAlternate boot mode (ABM): Start

from internal PFLASH after CRC

check is correctly executed; enter

a serial bootstrap loader mode1) if

CRC check fails

1) The type of the altern ate bootstrap loader mode is sele cted by the value of the SCU_SCLI R.SWOPT[2:0] bit

field, which contains the levels of the P0.[2:0] latched in with the rising edge of the HDRST.

Defined in

ABM header

or D400 0000H

1111BEnter bootstrap loader mode 3:

Serial ASC0 boot via P3.12 and

P3.13 pins

D400 0000H

others Reserved; execute stop loop –

Debug Boot Options

0 0000B1 Tri-state chip –

others irrel. Reserved; execute stop loop –

TC1762

Functional DescriptionPreliminary

Data Sheet 57 V1.0, 2008-04

3.19 Power Management System

The TC1762 power management system allows software to configure the various

processing units so that they automatically adjust to draw the minimum necessary power

for the application. There are three power management modes:

• Run Mode

• Idle Mode

• Sleep Mode

The operation of each system component in each of these states can be configured by

software. The power-management modes provide flexible reduction of power

consumption through a combination of techniques, including stopping the CPU clock,

stopping the clocks of other system components individually, and individually clock-

speed reduction of some peripheral components.

Besides these explicit software-controlled power-saving modes, special attention has

been paid to automatic power-savi ng in those operating units which are not required at

a certain point of time, or idle in the TC1762. In that case, they are shut off automatically

until their operation is required again.

Table 3-3 describes the features of the power management modes.

In typical operation, Idle Mode and Sleep Mode may be entered and exited frequently

during the run time of an application. For example, system software will typically cause

the CPU to enter Idle Mode each time it has to wait for an interrupt before continuing its

tasks. In Sleep Mode and Idle Mode, wake-up is performed automatically when any

Table 3-3 Power Management Mode Summary

Mode Description

Run The system is fully operational. All clocks and peripherals are enabled,

as determined by software.

Idle The CPU clock is disabled, waiting for a condition to return it to Run

Mode. Idle Mode can be entered by software when the processor has no

active tasks to perform. All peripherals remain powered and clocked.

Processor memory is accessible to peripherals. A reset, Watchdog

Timer event, a falling edge on the NMI pin, or any enabled interrupt event

will return the system to Run Mode.

Sleep The system clock signal is distributed only to those peripherals

programmed to operate in Sleep Mode. The other peripheral module will

be shut down by the suspend signal. Interrupts from operating

peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a

reset event will return the system to Run Mode. Entering this state

requires an orderly shut-down controlled by the Power Management

State Machine.

TC1762

Functional DescriptionPreliminary

Data Sheet 58 V1.0, 2008-04

enabled interrupt signal is detected, or when the count value (WDT_SR.WDTTIM)

changes from 7FFFH to 8000H.

3.20 On-Chip Debug Support

Figure 3-13 shows a block diagram of the TC1762 OCDS system.

Figure 3-13 OCDS System Block Diagram

The TC1762 basically supports three levels of debug operation:

• OCDS Level 1 debug support

• OCDS Level 2 debug support

• OCDS Level 3 debug support

MCB06195

E nab le, Contr o l and Res et

OCDS

DMA

Sy stem Per ipheral Bus

SPB

Peripheral

Unit 1

SPB

Peripheral

Unit n

B r eak and S us pend S ignals

BCU

TriCore OCDS

OCDS

Watch-

dog

Timer

JDI

Debug

I/F

JTAG

Controller

MCBS

Break

Switch

Cerberus

OSCU

DMA L2

BRKIN

TDI

TDO

BRKOUT

TRST

TMS

TCK

OCDS2[15:0] 16

Multiplexer

TC1762

Functional DescriptionPreliminary

Data Sheet 59 V1.0, 2008-04

OCDS Level 1 Debug Support

The OCDS Level 1 debug support is mainly assigned for real-time soft ware debugging

purposes which have a demand for low-cost standard debugger hardware.

The OCDS Level 1 is based on a JTAG interface that is used by the external debug

hardware to communicate with the system. The on-chip Cerberus module controls the

interactions between the JTAG interface and the on-chip modules. The external debug

hardware may become master of the internal buses, and read or write the on-chip

and trigger conditions as well as to control user program execution (run/stop, break,

single-step).

OCDS Level 2 Debug Support

The OCDS Level 2 debug support makes it possible to implement program tracing

capabilities for enhanced debuggers by extending the OCDS Level 1 debug functionality

with an additional 16-bit wide trace output port with trace clock. With the trace extension,

the following four trace capabilities are provided (only one of the three trace capabilities

can be selected at a time):

• Trace of the CPU program flow

• Trace of the DMA Controller transaction requests

• Trace of the DMA Controller Move Engine status information

OCDS Level 3 Debug Support

The OCDS Level 3 debug support is based on a special TC1766 emulation device, the

TC1766ED, which provides additional features required for high-end emulation

purposes. The TC1766ED is a device which includes the TC1766 product chip and

additional emulation extension hardware in a package with the same footprint as the

TC1766.

TC1762

Functional DescriptionPreliminary

Data Sheet 60 V1.0, 2008-04

3.21 Clock Generation and PLL

The TC1762 clock system performs the following functions:

• Acquires and buffers incoming clock signals to create a master clock frequency

• Distributes in-phase synchronized clock signals throughout the TC1762’s entire clock

tree

• Divides a system master clock frequency into lower frequencies required by the

different modules for operation.

• Dynamically reduces power consumption during operation of functional units

• Statically reduces power consumption through programmable power-saving modes

• Reduces electromagnetic interference (EMI) by switching off unused modules

The clock system must be operational before the TC1762 can function, so it contains

special logic to handle power-up and reset operations. Its services are fundamental to

the operation of the entire system, so it contains special fail-safe logic.

Features

• PLL operation for multiplying clock source by different factors

• Direct drive capability for direct clocking

• Comfortable state machine for secure switching between basic PLL, direct or

prescaler operation

• Sleep and Power-Down Mode support

The TC1762 Clock Generation Unit (CGU) as shown in Figure 3-14 allows a very

flexible clock generation. It basically consists of an main oscil lator circuit and a Phase-

Locked Loop (PLL). The PLL can converts a low-frequency external clock signal from the

oscillator circuit to a high-speed internal clock for maximum performance.

The system clock fSYS is generated from an oscillator clock fOSC in either one of the four

hardware/software selectable ways:

•Direct Drive Mode (PLL Bypass):

In Direct Drive Mode, the TC1762 clock system is directly driven by an external clock

signal. input, i.e. fCPU =fOSC and fSYS = fOSC. This allows operation of the TC1762 with

a reasonably small fundamental mode crystal.

•VCO Bypass Mode (Prescaler Mode):

In VCO Bypass Mode, fCPU and fSYS are derived from fOSC by the two divider stages,

P-Divider and K-Divider. The system clock fSYS is equal to fCPU.

•PLL Mode:

In PLL Mode, the PLL is running. The VCO clock fVCO is derived from fOSC, divided by

the P factor, multiplied by the PLL (N-Divider). The clock signals fCPU and fSYS are

derived from fVCO by the K-Divider. The system clock fSYS is equal to fCPU.

•PLL Base Mode:

In PLL Base Mode, the PLL is running at its VCO base frequency and fCPU and fSYS

TC1762

Functional DescriptionPreliminary

Data Sheet 61 V1.0, 2008-04

are derived from fVCO only by the K-Divider. In this mode, the system clock fSYS is

equal to fCPU.

Figure 3-14 Clock Generation Unit

Recommended Oscillator Circuits

The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal

oscillator or an external stable clock source. It basically consists of an inverting amplifier

and a feedback element with XTAL1 as input, and XTAL2 as output.

When using a crystal, a proper external oscillator circuitry must be connected to both

pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz

to 25 MHz. Additionally, it is necessary to have two load capacitances CX1 and CX2, and

depending on the crystal type, a series resistor RX2, to limit the current. A test resistor RQ

may be temporarily inserted to measure the oscillation allowance (negative resi stance)

of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1

and CX2 values shown in Figure 3-15 can be used as starting points for the negative

resistance evaluation and for non-productive systems. The exact values and related

operating range are dependent on the crystal frequency and have to be determined and

optimized together with the crystal vendor using the negative resistance method.

System Control Unit (SCU)

Clock Generation Unit (CGU)

PLL

1:1

Divider

K:1

Divider

MCA06083

Oscillator

Circuit

TAL1

TAL2

OSC

Phase

Detect. VCO

Divider

VCO

SYS

Lock

Detector

OSCR PLL_

LOCK NDIV

[6:0] VCO_

BYPASS KDIV

[3:0] PLL_

BYPASS

VCO_

SEL[1:0]

CPU

SYS

FSL

Divi-

der

PDIV

[2:0] OSC

DISC

OSC_CON

MOSCOGC

BYPASS

OSC_

BYPASS

≥1

Osc. Run

Detect.

TC1762

Functional DescriptionPreliminary

Data Sheet 62 V1.0, 2008-04

Oscillation measurement with the final target system is strongly recommended to verify

the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin

negative resistance) for the oscillator-crystal system.

When using an external clock signal, the signal must be connected to XTAL1. XTAL2 is

left open (unconnected). The external clock frequency can be in the range of 0 - 40 MHz

if the PLL is bypassed, and 4 - 40 MHz if the PLL is used.

The oscillator can also be used in combination with a ceramic resonator. The final

circuitry must also be verified by the resonator vendor.

Figure 3-15 shows the recommended external oscillator circuitries for both operating

modes, external crystal mode and external input clock mode. A block capacitor is

recommended to be placed between VDDOSC/VDDOSC3 and VSSOSC.

Figure 3-15 Oscillator Circuitries

Note: For crystal operation, it is strongly recommended to measure the negative

resistance in the final target system (layout) to determine the optimum parameters

for the oscillator operation. Please refer to the minimum and maximum values of

the negative resistance specified by the crystal supplier.

TC1762

Oscillator TC1762

Oscillator

MCS06084

DDOSC

SSOSC

4 - 25

MHz

XTAL1

XTAL2

DDOSC

SSOSC

XTAL1

XTAL2

External C l ock

Signal

OSC fOSC

Fundamental

M ode C rystal

4 - 40

MHz

DDOSC3

C r ys tal Fr equenc y

X21)

4 MHz

8 MHz

12 M H z

16 - 25 M H z 10 pF

12 pF

18 pF

33 pF

1) Note that thes e ar e ev aluation s tar t v alu es !

X21)

TC1762

Functional DescriptionPreliminary

Data Sheet 63 V1.0, 2008-04

3.22 Power Supply

The TC1762 has several power supply lines for different voltage classes:

• 1.5 V: Core logic, oscillator and A/D converter supply

• 3.3 V: I/O ports, Flash memories, oscillator, and A/D converter supply with reference

voltages

Figure 3-16 shows the power supply concept of the TC1762 with the power supply pins

and its connections to the functional units.

Figure 3-16 Power Supply Concept of TC1762

TC1762

TC1762 PwrSupply

Core

Flash

Memories

(1.5 V )

PLL

OSC

DDFL3

3.3 V

FADC

DDAF

(1.5V)

SSAF

DDMF

(3.3V)

SSMF

2 2

FAREF

(3.3V)

FAGND

SSA

Ports

DDP

(3.3 V )

ADC

DDM

(3.3V)

SSM

AREF

(3.3V)

AGND

DDA

(1.5 V )

DDOSC3

(3.3 V)

DDOSC

( 1 .5 V )

SSOSC

TC1762

Functional DescriptionPreliminary

Data Sheet 64 V1.0, 2008-04

3.23 Identification Register Values

Table 3-4 shows the address map and reset values of the TC1762 Identification

Registers.

Table 3-4 TC1762 Identification Registers

Short Name Address Reset Value Stepping

SCU_ ID F000 0008H002C C002H-

MANID F000 0070H0000 1820H-

CHIPID F000 0074H0000 8B02H-

RTID F000 0078H0000 0001HAA-Step

0000 0011HAB-Step

0000 0007HAC-Step

SBCU_ID F000 0108H0000 6A0AH-

STM_ID F000 0208H0000 C006H-

CBS_ JDPID F000 0408H0000 6307H-

MSC0_ ID F000 0808H0028 C001H-

ASC0_ ID F000 0A08H0000 4402H-

ASC1_ ID F000 0B08H0000 4402H-

GPTA0_ ID F000 1808H0029 C004H-

DMA_ID F000 3C08H001A C012H-

CAN_ID F000 4008H002B C012H-

SSC0_ ID F010 0108H0000 4510H-

FADC_ ID F010 0308H0027 C012H-

ADC0_ID F010 0408H0030 C001H-

MLI0_ ID F010 C008H0025 C006H-

MCHK_ ID F010 C208H001B C001H-

CPS_ID F7E0 FF08H0015 C006H-

CPU_ID F7E1 FE18H000A C005H-

PMU_ID F800 0508H002E C012H-

FLASH_ID F800 2008H0041 C002H-

DMI_ID F87F FC08H0008 C004H-

PMI_ID F87F FD08H000B C004H-

TC1762

Functional DescriptionPreliminary

Data Sheet 65 V1.0, 2008-04

LBCU_ID F87F FE08H000F C005H-

LFI_ID F87F FF08H000C C005H-

Table 3-4 TC1762 Identification Registers

Short Name Address Reset Value Stepping

TC1762

Electrical ParametersPreliminary

Data Sheet 66 V1.0, 2008-04

4 Electrical Parameters

Chapter 4 provides the characteristics of the electrical parameters which are

implementation-specific for the TC1762.

4.1 General Parameters

The general parameters are described here to aid the users in interpreting the

parameters mainly in Section 4.2 and Section 4.3. The absolute maximum ratings and

its operating conditions are provided for the appropriate setting in the TC1762.

4.1.1 Parameter Interpretation

The parameters listed in this section partly represent the characteristics of the TC1762

and partly its requirements on the system. To aid interpreting the parameters easily

when evaluating them for a design, they are marked with an two-letter abbreviation in

column “Symbol”:

•CC

Such parameters indicate Controller Characteristics which are a distinctive feature of

the TC1762 and must be regarded for a system design.

•SR

Such parameters indicate System Requirements which must provided by the

microcontroller system in which the TC1762 designed in.

TC1762

Electrical ParametersPreliminary

Data Sheet 67 V1.0, 2008-04

4.1.2 Pad Driver and Pad Classes Summary

This section gives an overview on the different pad driver classes and its basic

characteristics. More details (mainly DC parameters) are defined in Section 4.2.1.

Table 4-1 Pad Driver and Pad Classes Overview

Class Power

Supply Type Sub Class Speed

Grade Load Leakage1)

1) Values are for TJmax =150°C.

Termination

A3.3V LVTTL

I/O,

LVTTL

outputs

(e.g. GPIO) 6 MHz 100 pF 500 nA No

(e.g. serial

I/Os)

MHz 50 pF 6 µASeries

termination

recommended

(e.g. BRKIN,

BRKOUT)

66 or

MHz2)

2) This value corresponds to the operating frequency of the device, which depending on the derivative, can be

66 or 80 MHz.

50 pF 6 µASeries

termination

recommended

(for f > 25 MHz)

(e.g. Trace

Clock)

66 or

MHz2)

25 pF 6 µASeries

termination

recommended

C3.3V LVDS – 50

MHz – Parallel

termination3),

100Ω±10%

3) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or

properly terminated with the differential parallel termination of 100Ω±10%.

D– Analog inputs, reference voltage inputs

TC1762

Electrical ParametersPreliminary

Data Sheet 68 V1.0, 2008-04

4.1.3 Absolute Maximum Ratings

Table 4-2 shows the absolute maximum ratings of the TC1762 parameters.

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in

the operational sections of this specification is not implied. Exposure to absolute

Table 4-2 Absolute Maximum Rating Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Ambient temperature TASR -40 125 °C Under bias

Storage temperature TST SR -65 150 °C–

Junction temperature TJSR -40 150 °C Under bias

Voltage at 1.5 V power supply

pins with respect to VSS1)

1) Applicable for VDD, VDDOSC, VDDPLL, and VDDAF.

VDD SR – 2.25 V –

Voltage at 3.3 V power supply

pins with respect to VSS2)

2) Applicable for VDDP, VDDFL3, VDDM, and VDDMF.

VDDP SR – 3.75 V –

Voltage on any Class A input

pin and dedicated input pins

with respect to VSS

VIN SR -0.5 VDDP + 0.5

max. 3.7

VWhatever is

lower

Voltage on any Class D

analog input pin with respect

to VAGND

VAIN,

VAREFx

SR -0.5 VDDM + 0.5

or max. 3.7 VWhatever is

lower

Voltage on any Class D

analog input pin with respect

to VSSAF

VAINF,

VFAREF

SR -0.5 VDDMF + 0.5

or max. 3.7 VWhatever is

lower

CPU & LMB Bus

Frequency3)4)

3) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter

parameters.

4) This value d epend on the derivative and the operating fre quency it is designated for. For a device operatin g

at 66 MHz, the absolute maximum frequency is also 66 MHz. Similarly, for a device operating at 80 MHz, the

absolute maximum frequency is 80 MHz.

fCPU SR – 66 or 80 MHz –

FPI Bus Frequency3)4) fSYS SR – 66 or 80 MHz 5)

5) The ratio between fCPU and fSYS is fixed at 1:1.

TC1762

Electrical ParametersPreliminary

Data Sheet 69 V1.0, 2008-04

maximum rating conditions for extended periods may affect device reliability.

During absolute maximum rating overload conditions (VIN > related VDD or

VIN <VSS) the voltage on the related VDD pins with respect to ground (VSS) must

not exceed the values defined by the absolute maximum ratings.

4.1.4 Operating Conditions

The following operating conditions must not be exceeded in order to ensure correct

operation of the TC1762. All parameters specified in the following table refer to these

operating conditions, unless otherwise noted.

Table 4-3 Operating Condition Parameters

Parameter Symbol Limit

Values Unit Notes

Conditions

Min. Max.

Digital supply voltage1) VDD

VDDOSC

SR 1.42 1.582) V–

VDDP

VDDOSC3

SR 3.13 3.473) V For Class A

pins

(3.3V ±5%)

VDDFL3 SR 3.13 3.473) V–

Digital ground voltage VSS SR 0 V –

Ambient temperature under

bias TASR -40 +125 °C–

Analog supply voltages – – – – See separate

specification

Page 4-75,

Page 4-82

CPU clock fCPU SR –4) 805) MHz –

Short circuit current ISC SR -5 +5 mA 6)

Absolute sum of short circuit

currents of a pin group (see

Table 4-4)

Σ|ISC| SR – 20 mA See note7)

Absolute sum of short circuit

currents of the device Σ|ISC| SR – 100 mA See note 7)

TC1762

Electrical ParametersPreliminary

Data Sheet 70 V1.0, 2008-04

Inactive device pin current

(VDD =V

DDP =0) IID SR -1 1 mA Voltage on all

power supply

pins VDDx =0

External load capacitance CLSR – See

chara

cterist

ics

pF Depending on

pin class

1) Digital supply voltages applied to the TC1762 must be static regulated voltages which allow a typical voltage

swing of ±5%.

2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less

than 100 µs and the cumulated summary of the pulses does not exceed 1 h.

3) Voltage overshoot to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less than

100 µs and the cumulated summary of the pulses does not exceed 1 h.

4) The TC1762 uses a static design, s o the minimu m operation frequenc y is 0 MHz. Due to test time restriction

no lower frequency boundary is tested, however.

5) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter

parameters.

6) Applicable for digital outputs.

7) See additional document “TC1796 Pin Reliability in Overload“ for overload current definitions.

Table 4-3 Operating Condition Parameters

Parameter Symbol Limit

Values Unit Notes

Conditions

Min. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 71 V1.0, 2008-04

Table 4-4 Pin Groups for Overload/Short-Circuit Current Sum Parameter

Group Pins

1 TRCLK, P5.[7:0], P0.[7:6], P0.[15:14]

2 P0.[13:12], P0.[5:4], P2.[13:8], SOP0A, SON0, FCLP0A, FCLN0

3 P0.[11:8], P0.[3:0], P3.[13:11]

4 P3[10:0], P3.[15:14]

5 HDRST, PORST, NMI, TESTMODE, BRKIN, BRKOUT, BYPASS, TCK,

TRST, TDO, TMS, TDI, P1.[7:4]

6 P1.[3:0], P1.[11:8], P4.[3:0]

7 P2.[7:0], P1.[14:12]

8 P5.[15:8]

TC1762

Electrical ParametersPreliminary

Data Sheet 72 V1.0, 2008-04

4.2 DC Parameters

The electrical characteristics of the DC Parameters are detailed in this section.

4.2.1 Input/Output Pins

Table 4-5 provides the characteristics of the input/output pins of the TC1762.

Table 4-5 Input/Output DC-Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

Min. Max.

General Parameters

Pull-up current1) |IPUH|CC10 100 µAVIN < VIHAmin;

class A1/A2/Input pads.

20 200 µAVIN < VIHAmin;

class A3/A4 pads.

Pull-down

current1) |IPDL|CC10 150 µAVIN > VILAmax;

class A1/A2/Input pads.

20 200 µAVIN > VILAmax;

class A3/A4 pads.

Pin capacitance1)

(Digital I/O) CIO CC – 10 pF f = 1 MHz

TA = 25 °C

Input only Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)

Input low voltage

class A1/A2 pins VILA SR -0.3 0.34 ×

VDDP

V–

Input high voltage

class A1/A2 pins VIHA SR 0.64 ×

VDDP

VDDP+

0.3 or

max. 3.6

V Whatever is lower

Ratio VIL/VIH CC 0.53 – – –

Input low voltage

class A3 pins VILA3 SR – 0.8 V –

Input high voltage

class A3 pins VIHA3 SR 2.0 – V –

Input hysteresis HYSA CC 0.1 ×

VDDP

–V

2)5)

Input leakage

current IOZI CC – ±3000

±6000

nA ((VDDP/2)-1) < VIN

< ((VDDP/2)+1)

otherwise3)

TC1762

Electrical ParametersPreliminary

Data Sheet 73 V1.0, 2008-04

Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)

Output low

voltage4) VOLA CC – 0.4 V IOL = 2 mA for strong driver

mode, (Not applicable to

Class A1 pins)

IOL = 1.8 mA for medium

driver mode, A2 pads

IOL = 1.4 mA for medium

driver mode, A1 pads

IOL =370µA for weak

driver mode

Output high

voltage3) VOHA CC 2.4 – V IOH = -2 mA for strong

driver mode, (Not

applicable to Class A1

pins)

IOH = -1.8 mA for medium

driver mode, A1/A2 pads

IOH = -370 µA for weak

driver mode

VDDP -

0.4 –VIOH = -1.4 mA for strong

driver mode, (Not

applicable to Class A1

pins)

IOH = -1 mA for medium

driver mode, A1/A2 pads

IOH = -280 µA for weak

driver mode

Input low voltage

class A1/2 pins VILA SR -0.3 0.34 ×

VDDP

V–

Input high voltage

class A1/2 pins VIHA SR 0.64 ×

VDDP

VDDP +

0.3 or

3.6

V Whatever is lower

Ratio VIL/VIH CC 0.53 – – –

Input hysteresis HYSA CC 0.1 ×

VDDP

–V

2)5)

Table 4-5 Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

Min. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 74 V1.0, 2008-04

Input leakage

current Class

A2/3/4 pins

IOZA24 CC – ±3000

±6000

nA ((VDDP/2)-1) < VIN

<((VDDP/2)+1)

otherwise3)

Input leakage

current

Class A1 pins

IOZA1 CC – ±500 nA 0 V <VIN < VDDP

Class C Pads (VDDP = 3.13 to 3.47 V = 3.3V ±5%)

Output low voltage VOL CC 815 mV Parallel termination

100 Ω±1%

Output high

voltage VOH CC 1545 mV

Output differential

voltage VOD CC 150 600 mV

Output offset

voltage VOS CC 1075 1325 mV

Output impedance R0CC 40 140 –

Class D Pads

see ADC Characteristics – – – –

1) Not subject to production test, verified by design / characterization.

2) The pads that have s pike filter function in the input path: PORST, HDRST, NMI do not have hysteresis.

3) Only one of these parameters is tested, the other is verified by design characterization

4) Max. resistance between pin and next power supply pin 25 Ω for strong driver mode

(verified by design characterization).

5) Function verified by design, value is not subject to production test - verified by design/characterization.

Hysteresis is implemented to avoid metas table states and switching due to in ternal ground bounc e. It canno t

be guaranteed that it suppresses switching due to external system noise.

Table 4-5 Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

Min. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 75 V1.0, 2008-04

4.2.2 Analog to Digital Converter (ADC0)

Table 4-6 provides the characteristics of the ADC module in the TC1762.

Table 4-6 ADC Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions /

Remarks

Min. Typ. Max.

Analog supply

voltage VDDM SR 3.13 3.3 3.471) V–

VDD SR 1.42 1.5 1.582) V Power supply for

ADC digital part,

internal supply

Analog ground

voltage VSSM SR -0.1 – 0.1 V –

Analog reference

voltage 17) VAREFx SR VAGNDx+

1V VDDM VDDM+

0.051)

3)4)

V–

Analog reference

ground 17) VAGNDx SR VSSMx -

0.05V 0VAREF

- 1 V V–

Analog reference

voltage range5)17) VAREFx-

VAGNDx

SR VDDM/2 VDDM

+ 0.05

Analog input

voltage range VAIN SR VAGNDx –V

AREFx V–

VDDM

supply current IDDM SR 2.5 4 mA

rms

Power-up

calibration

time

tPUC CC – – 3840 fADC

CLK –

Internal ADC

clocks fBC CC 2 – 40 MHz fBC =fANA ×4

fANA CC 0.5 – 10 MHz fANA =fBC /4

Sample time tSCC 4 ×(CHCONn.STC

+2)×tBC

µs–

8×tBC –– µs

TC1762
Electrical ParametersPreliminary
Data Sheet 76 V1.0, 2008-04 
Conversion time tCCC tS+40×tBC +2×tDIV µs For 8-bit 
conversion
tS+48×tBC +2×tDIV µs For 10-bit 
conversion
tS+56×tBC +2×tDIV µs For 12-bit 
conversion
Total unadjusted 
error 4) TUE7) CC – – ±1 LSB For 8-bit conv.
––±2 LSB For 10-bit conv.
––±4 LSB For 12-bit conv.8)9)
––±8 LSB For 12-bit 
conv.10)9)
DNL error11)5) TUEDNL CC – ±1.5 ±3.0 LSB For 12-bit conv.12) 
9)
INL error11)5) TUEINL CC – ±1.5 ±3.0 LSB For 12-bit conv.12) 
9)
Gain error11)5) TUEGAIN CC – ±0.5 ±3.5 LSB For 12-bit conv.12) 
9)
Offset error11)5) TUEOFF CC – ±1.0 ±4.0 LSB For 12-bit conv.12) 
9)
Input leakage 
current at analog 
inputs AN0, AN1 
and AN31. 
see Figure 4-313)
IOZ114) CC –1000 – 300 nA (0% VDDM) < VIN < 
(2% VDDM)
–200 400 nA (2% VDDM) < VIN < 
(95% VDDM)
–200 1000 nA (95% VDDM) < VIN 
< (98%  VDDM)
–200 3000 nA (98% VDDM) < VIN 
< (100% VDDM)
Table 4-6 ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter Symbol Limit Values Unit Test Conditions / 
Remarks
Min. Typ. Max.

TC1762
Electrical ParametersPreliminary
Data Sheet 77 V1.0, 2008-04 
Input leakage 
current at analog 
inputs AN2 to 
AN30, see 
Figure 4-3
IOZ114) CC –1000 – 200 nA (0% VDDM) < VIN < 
(2% VDDM)
–200 300 nA (2% VDDM) < VIN < 
(95% VDDM)
–200 1000 nA (95% VDDM) < VIN 
< (98%  VDDM)
–200 3000 nA (98% VDDM) < VIN 
< (100% VDDM)
Input leakage 
current at VAREF
IOZ2 CC – – ±1µA0V<VAREF <
VDDM, no 
conversion 
running
Input current at 
VAREF17) IAREF CC – 35 75 µA
rms 0V<VAREF <
VDDM15)
Total capacitance 
of the voltage 
reference 
inputs16)17)
CAREFTOT CC – – 25 pF 9)
Switched 
capacitance at 
the positive 
reference voltage 
input 17)
CAREFSW CC – 15 20 pF 9)18)
Resistance of the 
reference voltage 
input path16)
RAREF CC – 1 1.5 kΩ500 Ohm 
increased for 
AN[1:0] used as 
reference input 9)
Total capacitance 
of the analog 
inputs16)
CAINTOT CC – – 25 pF 6)9)
Switched 
capacitance at 
the analog 
voltage inputs
CAINSW CC – – 7 pF 9)19)
Table 4-6 ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter Symbol Limit Values Unit Test Conditions / 
Remarks
Min. Typ. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 78 V1.0, 2008-04

ON resistance of

the transmission

gates in the

analog voltage

path

RAIN CC – 1 1.5 kΩ9)

ON resistance for

the ADC test

(pull-down for

AIN7)

RAIN7T CC 200 300 1000 ΩT e st feature

available only for

AIN7

Current through

resistance for the

ADC test (pull-

down for AIN7)

IAIN7T CC – 15

rms 30

peak mA Test feat ure

available only for

AIN7

1) Voltage overshoot to 4 V are permissible, provided the puls e duration is less than 100 µs and the cumulated

summary of the pulses does not exceed 1 h.

2) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated

summary of the pulses does not exceed 1 h.

3) A running conversion may become inexact in case of violating the normal operating conditions (voltage

overshoot).

4) If the reference voltage VAREF increases or the VDDM decreases, so that VAREF =( VDDM + 0.05 V to

VDDM + 0.07 V), then the accuracy of the ADC decreases by 4LSB12.

5) If a redu ced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase.

If the reference voltage is reduced with the factor k (k<1), then TUE, DNL, INL Gain and Offset errors increase

with the factor 1/k.

If a reduced reference voltage in a range of 1 V to VDDM/2 is used, then there are additional decreas e in the

ADC speed and accuracy.

6) Current peaks of up to 6 mA with a duration of max. 2 ns may occur

7) TUE is tested at VAREF =3.3V, VAGND = 0 V and VDDM =3.3V

8) ADC module capability.

9) Not subject to production test, verified by design / characterization.

10)Value under typical application conditions due to integration (switching noise, etc.).

11)The sum of DNL/INL/Gain/Offset errors does not exceed the related TUE total unadjusted error.

12)For 10-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with factor 0.25.

For 8-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with 0.0625.

13)The leakage current definition is a continuous function, as shown in Figure 4-3. The numerical values defined

determine the characteristic points of the given continuous linear approximation - they do not define step

function.

14)Only one of these parameters is tested, the other is verified by design characterization.

Table 4-6 ADC Characteristics (cont’d) (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions /

Remarks

Min. Typ. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 79 V1.0, 2008-04

Figure 4-1 ADC0 Clock Circuit

15)IAREF_MAX is valid for the minimum specified conversion time. The current flowing during an ADC conversion

with a duration of up to tC=25µs can be calculated with the formula IAREF_MAX =QCONV/tC. Every conversion

needs a total charge of QCONV = 150pC from VAREF.

All ADC conversions with a duration longer than tC = 25µs consume an IAREF_MAX = 6µA.

16)For the definition of the parameters see also Figure 4-2.

17)Applies to AIN0 and AIN1, when used as auxiliary reference inputs.

18)This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage

at once. Instead of this smaller capacitances are successively switched to the reference voltage.

19)The sampling capacity of the conversion C-Network is pre-ch arged to VAREF/2 before the sampling moment.

Because of the parasitic elements the voltage measured at AINx is lower then VAREF/2.

MCA04657_mod

Programmable

Clock Divide r

(1:1) to (1:256)

DIV

Fractional

Divider

CLC

ANA

Programmable

Counter

Sample

Time

CON.CTC CHCONn.STC

TIMER

Control/Status Logic

Interrupt Logic

External Trigger Logic

External Multiplexer Logic

Request Generation Logic

A /D C onve rter M odule

Arbiter

(1:20) Control Unit

(Timer)

1:4

TC1762

Electrical ParametersPreliminary

Data Sheet 80 V1.0, 2008-04

Figure 4-2 ADC0 Input Circuits

Reference Voltage Input Circuitry

Analog Input Circuitry

Analog_InpRefDiag

REXT

VAIN CEXT

RAIN, On

CAINTOT - CAINSW

CAINSW

ANx

VAREF

RAREF, On

CAREFTOT - CAREFSW CAREFSW

VAGNDx

VAREFx

RAIN7T

VAGNDx

TC1762

Electrical ParametersPreliminary

Data Sheet 81 V1.0, 2008-04

Figure 4-3 ADC0 Analog Inputs Leakage

AN2 to AN3 0

DDM

300nA

1uA

3uA

2% 95% 100%98%

Ioz1

AN0 , AN1 an d AN31

DDM

400nA

-1uA

3uA

2% 95% 100%98%

Ioz1

300nA

-200nA

200nA

1uA

-1uA

-200nA

TC1762
Electrical ParametersPreliminary
Data Sheet 82 V1.0, 2008-04 
4.2.3 Fast Analog to Digital Converter (FADC)
Table 4-7 provides the characteristics of the FADC module in the TC1762.
Table 4-7 FADC Characteristics (Operating Conditions apply)
Parameter Symbol Limit Values Unit Remarks
Conditions
Min. Max.
DNL error EDNL CC – ±1 LSB 12)
INL error EINL CC – ±4 LSB 12)
Gradient error1)12) EGRAD CC – ±3 % 2)With calibration,
gain 1, 2
– ±5 % Without calibration
gain 1, 2, 4
– ±6 % Without calibration
gain 8
Offset error12) EOFF3) CC – ±204) mV 2)With calibration
–±60
4) mV Without calibration
Reference error of 
internal VFAREF/2 EREF CC – ±60 mV –
Input leakage current 
at analog inputs 
AN32 to AN35.
5) see Figure 4-5
IOZ16) CC –1000 300 nA (0% VDDM) < VIN < 
(2% VDDM)
–200 400 nA (2% VDDM) < VIN < 
(95% VDDM)
–200 1000 nA (95% VDDM) < VIN < 
(98% VDDM)
–200 3000 nA (98% VDDM) < VIN < 
(100% VDDM)
Analog supply 
voltages VDDMF SR 3.13 3.477) V–
VDDAF SR 1.42 1.588) V–
Analog ground 
voltage VSSAF SR -0.1 0.1 V –
Analog reference 
voltage VFAREF SR 3.13 3.477)9) V Nominal 3.3 V
Analog reference 
ground VFAGND SR VSSAF -
0.05V VSSAF 
+0.05V V–
Analog input voltage 
range VAINF SR VFAGND VDDMF V–

TC1762

Electrical ParametersPreliminary

Data Sheet 83 V1.0, 2008-04

Analog supply

currents IDDMF SR – 9 mA –

IDDAF SR – 17 mA 10)

Input current at each

VFAREF

IFAREF CC – 150 µA

rms Independent of

conversion

Input leakage current

at VFAREF11) IFOZ2 CC – ±500 nA 0 V < VIN <VDDMF

Input leakage current

at VFAGND

IFOZ3 CC ±8 µA

Conversion time tCCC – 21 CLK of

fADC

For 10-bit conv.

Converter Clock fADC CC – 80 MHz –

Input resistance of

the analog voltage

path (Rn, Rp)

RFAIN CC 100 200 kΩ12)

Channel Amplifier

Cutoff Frequency fCOFF CC 2 MHz –

Settling Time of a

Channel Amplifier

after changing ENN

or ENP

tSET CC 5 µsec –

1) Calibration of the gain is possible for the gain of 1 and 2, and not possible for the gain of 4 and 8.

2) Calibration should be performed at each power-up. In case of continuous operation, calibration should be

performed minimum once per week.

3) The offset error voltage drifts over the whole temperature range typically ±2 LSB.

4) Applies when the gain of the channel equals one. For the other gain settings, the offset error increases; it must

be multiplied with the applied gain.

5) The leakage current definition is a continuous function, as shown in Figure 4-5. The numerical values defined

determine the characteristic points of the given continuous linear approximation - they do not define step

function.

6) Only one of these parameters is tested, the other is verified by design characterization.

7) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated

summary of the pulses does not exceed 1 h.

8) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated

sum of the pulses does not exceed 1 h.

9) A running conversion may become inexact in case of violating the normal operating conditions (voltage

overshoots).

10)Current peaks of up to 40 mA with a duration of max. 2 ns may occur

Table 4-7 FADC Characteristics (cont’d)(Operating Conditions apply)

Parameter Symbol Limit Values Unit Remarks

Conditions

Min. Max.

TC1762

Electrical ParametersPreliminary

Data Sheet 84 V1.0, 2008-04

The calibration procedure should run after each power-up, when all power supply

voltages and the reference voltage have stabilized. The offset calibration must run first,

followed by the gain calibration.

Figure 4-4 FADC Input Circuits

11)This value applies in power-down mode.

12)Not subject to production test, verified by design / characterization.

FADC_InpRefDiag

FAINxN

FAINxP

VFAGND

FADC Analog Input Stage

VFAREF/2

VFAREF

FADC Reference Voltage

Input Circ uitry

VFAGND

VFAREF

IFAREF

TC1762

Electrical ParametersPreliminary

Data Sheet 85 V1.0, 2008-04

Figure 4-5 Analog Inputs AN32-AN35 Leakage

AN32 to AN35

DDM

400nA

-1uA

3uA

2% 95% 100%98%

Ioz1

300nA

-200nA

1uA

TC1762

Electrical ParametersPreliminary

Data Sheet 86 V1.0, 2008-04

4.2.4 Oscillator Pins

Table 4-8 provides the characteristics of the oscillator pins in the TC1762.

Note: It is strongly recommended to measure the oscillation allowance (negative

resistance) in the final target system (layout) to determine the optimal parameters

for the oscillator operation. Please refer to the limits specified by the crystal

supplier.

Table 4-8 Oscillator Pins Characteristics (Operating Conditions apply)

Parameter Symbol Limit values Unit Test Conditions

Min. Max.

Frequency Range fOSC CC 4 25 MHz –

Input low voltage at

XTAL11)

1) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.3 × VDDOSC3 is

necessary.

VILX SR -0.2 0.3 ×

VDDOSC3

V–

Input high voltage at

XTAL11) VIHX SR 0.7 ×

VDDOSC3

+ 0.2 V–

Input current at XTAL1 IIX1 CC – ±25 µA0 V < VIN < VDDOSC3

TC1762

Electrical ParametersPreliminary

Data Sheet 87 V1.0, 2008-04

4.2.5 Temperature Sensor

Table 4-9 provides the characteristics of the temperature sensor in the TC1762.

Table 4-9 Temperature Sensor Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Remarks

Min. Max.

Temperature

Sensor Range TSR SR -40 150 °C –

Start-up time

after resets

inactive

tTSST SR 10 µs

Temperature

of the die at

the sensor

location

TTS CC TTS = (ADC_Code - 487) ×0.396 - 40 °C 10-bit ADC

result

TTS = (ADC_Code - 1948) × 0.099 - 40 °C 12Bit ADC

result

Sensor

Inaccuracy TTSA CC ±10 °C

A/D Converter

clock for DTS

signal

fANA SR – 10 MHz Conversion

with ADC0

TC1762
Electrical ParametersPreliminary
Data Sheet 88 V1.0, 2008-04 
4.2.6 Power Supply Current
Table 4-10 provides the characteristics of the power supply current in the TC1762.
Table 4-10 Power Supply Current (Operating Conditions apply)
Parameter Symbol Limit Values Unit Test 
Conditions / 
Remarks
Min. Typ. Max.
PORST low current at 
VDD
IDD_PORST CC – – 961)
1) Maximum value measured at TA= 125 °C.
mA The PLL 
running at the 
base frequency
1382)
2) Maximum value measured at TJ= 150 °C.
PORST low current at 
VDDP
IDDP_PORST CC – – 121) mA The PLL 
running at the 
base frequency
132)
Active mode core 
supply current3)4)
3) Infineon Power Loop: CPU and PCP running, all peripherals activ e. The power consumption of each custom
application will most probably be lower than this value, but must be evaluated separately.
4) The IDD decreases typically to 240mA if the fCPU is decreased to 40 MHz, at constant TJ= 150 °C, for the
Infineon Max. Power Loop.
IDD CC – – 2901) mA fCPU = 80MHz
fCPU/fSYS =1:1
3302)
Active mode core 
supply current3)4) IDD CC – – 2501) mA fCPU = 66MHz
fCPU/fSYS =1:1
3002)
Active mode analog 
supply current IDDAx;
IDDMx
CC – – – mA See 
ADC0/FADC
Oscillator and PLL 
core power supply IDDOSC CC – – 5 mA –
Oscillator and PLL 
pads power supply IDDOSC3 CC – – 3.65)
5) Estimated value; double-bonded at package level with VDDP.
mA –
FLASH power supply 
current IDDFL3 CC – – 45 mA –
LVDS port supply
(via VDDP)6)
6) In case the LVDS pads are disabled, the power consumption per pair is negligible (less than 1µA).
ILVDS CC – – 25 mA LVDS pads 
active
Maximum Allowed 
Power Dissipation7)
7) For the calculation of the junction to ambient thermal resistance RTJA, see Chapter 5.1.
PDmax SR PD×RTJA < 25°C – At worst case, 
TA=125°C

TC1762

Electrical ParametersPreliminary

Data Sheet 89 V1.0, 2008-04

4.3 AC Parameters

All AC parameters are defined with the temperature compensation disabled, which

means that pads are constantly kept at the maximum strength.

4.3.1 Testing Waveforms

The testing waveforms for rise/fall time, output delay and output high impedance are

shown in Figure 4-6, Figure 4-7 and Figure 4-8.

Figure 4-6 Rise/Fall Time Parameters

Figure 4-7 Testing Waveform, Output Delay

Figure 4-8 Testing Waveform, Output High Impedance

10%

90%

10%

90%

VSS

VDDP

rise_fall

Mct04881_LL.vsd

VDDE / 2 Test Points VDDE / 2

VSS

VDDP

MCT04880_LL

Load

+ 0.1 V V

- 0.1 V

Timing

Reference

Points

Load

- 0.1 V V

- 0.1 V

TC1762

Electrical ParametersPreliminary

Data Sheet 90 V1.0, 2008-04

4.3.2 Output Rise/Fall Times

Table 4-11 provides the characteristics of the output rise/fall times in the TC1762.

Table 4-11 Output Rise/Fall Times (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Conditions

Min. Max.

Class A1 Pads

Rise/fall times1)

Class A1 pads

1) Not all parameters are subject to produc tion test, but verified by design/characterization and test correlation.

tRA1, tFA1 50

140

18000

150

550

65000

ns Regular (medium) driver, 50 pF

Regular (medium) driver, 150 pF

Regular (medium) driver, 20 nF

Weak driver, 20 pF

Weak driver, 150 pF

Weak driver, 20 000 pF

Class A2 Pads

Rise/fall times 1)

Class A2 pads tFA2, tFA2 3.3

5.5

140

18000

150

550

65000

ns Strong driver, sharp edge, 50 pF

Strong driver, sharp edge, 100pF

Strong driver, med. edge, 50 pF

Strong driver, soft edge, 50 pF

Medium driver, 50 pF

Medium driver, 150 pF

Medium driver, 20 000 pF

Weak driver, 20 pF

Weak driver, 150 pF

Weak driver, 20 000 pF

Class A3 Pads

Rise/fall times 1)

Class A3 pads tFA3, tFA3 2.5 ns 50 pF

Class A4 Pads

Rise/fall times 1)

Class A4 pads tFA4, tFA4 2.0 ns 25 pF

Class C Pads

Rise/fall times

Class C pads trC, tfC 2ns

TC1762

Electrical ParametersPreliminary

Data Sheet 91 V1.0, 2008-04

4.3.3 Power Sequencing

There is a restriction for the power sequencing of the 3.3 V domain as shown in

Figure 4-9. It must always be higher than 1.5 V domain - 0.5 V. The gray area shows the

valid range for V3.3V relative to an exemplary V1.5V ramp. VDDP, VDDOSC3, VDDM, VDDMF,

VDDFL3 belong to the 3.3 V domain. The VDDM and V DDMF subdomains are connected with

antiparallel ESD protection diodes. There are no other such connections between the

subdomains. VDD , VDDOSC and VDDAF belong to the 1.5 V domain.

Figure 4-9 VDDP / VDD Power Up Sequence

All ground pins VSS must be externally connected to one single star point in the system.

The difference voltage between the ground pins must not exceed 200 mV.

The PORST signal must be activated at latest before any power supply voltage falls

below the levels shown on the figure below. In this case, only the memory row of a Flash

memory that was the target of the write at the moment of the power loss will contain

unreliable content. Additionally, the PORST signal should be activated as soon as

possible. The sooner the PORST signal is activated, the less time the system operates

outside of the normal operating power supply range.

PowerSeq

1.5V

3.3V

1.5

3.3

> V

1.5

- 0.5V

Time

Power Supply Voltage

Valid area for V

3.3

Valid area for V

3.3

Time

DDP

(3.3V) PORST

TC1762

Electrical ParametersPreliminary

Data Sheet 92 V1.0, 2008-04

Figure 4-10 Power Down / Power Loss Sequence

DDP

P ower S upply V oltage

PORST

PORST3.3

DDP

-5% -12%

3.3V 3.13V 2.9V

DDPmin

PORST

-5% -12%

1.5V 1.42V1.32V

PORST1.5min

DDmin

PowerDown3.3_1.5_reset_only_LL.vsd

TC1762

Electrical ParametersPreliminary

Data Sheet 93 V1.0, 2008-04

4.3.4 Power, Pad and Reset Timing

Table 4-12 provides the characteristics of the power, pad and reset timing in the

TC1762.

Table 4-12 Power, Pad and Reset Timing Parameters

Parameter Symbol Limit Values Unit

Min. Max.

Min. VDDP voltage to ensure defined

pad states1)

1) This parameter is valid under assumption that PORST signal is constantly at low-level during the power-

up/power-down of the VDDP.

VDDPPA CC 0.6 – V

Oscillator start-up time2) tOSCS CC – 10 ms

Minimum PORST active time after

power supplies are stable at operating

levels

tPOA SR 10 – ms

HDRST pulse width tHD CC 1024 clock

cycles3) –fSYS

PORST rise time tPOR SR – 50 ms

Setup time to PORST rising edge4) tPOS SR 0 – ns

Hold time from PORST rising edge4) tPOH SR 100 – ns

Setup time to HDRST rising edge5) tHDS SR 0 – ns

Hold time from HDRST rising edge5) tHDH SR 100 +

(2 ×1/fSYS)–ns

Ports inactive after PORST reset

active6)7) tPIP CC – 150 ns

Ports inactive after HDRST reset

active8) tPI CC – 150 +

5×1/fSYS

Minimum VDDP PORST activation

threshold.9) VPORST3.3 SR – 2.9 V

Minimum VDD PORST activation

threshold. 9) VPORST1.5 SR – 1.32 V

Power-on Reset Boot Time10) tBP CC 2.15 3.50 ms

Hardware/Software Reset Boot Time

at fCPU=80MHz11) tBCC 500 800 µs

Hardware/Software Reset Boot Time

at fCPU=66MHz11) tBCC 560 860 µs

TC1762

Electrical ParametersPreliminary

Data Sheet 94 V1.0, 2008-04

Figure 4-11 Power, Pad and Reset Timing

2) This parameter is verified by device characterization. The external oscillator circuitry must be optimized by the

customer and checked for negative resistance as recommended and specified by crystal suppliers.

3) Any HDRST activation is internally prolonged to 1024 FPI bus clock (fSYS) cycles.

4) Applicable for input pins TESTMODE, TRST, BRKIN, and TXD1A with noise suppression filter of PORST

switched-on (BYPASS = 0).

5) The setup/hold values are applic able for Port 0 and Port 4 input pins with noise suppression filter of HDRST

switched-on (BYPASS = 0), independently whether HDRST is used as input or output.

6) Not subject to production test, verified by design / characterization.

7) This parameter includes the delay of the analog spike filter in the PORST pad.

8) Not subject to production test, verified by design / characterization.

9) In case of power loss during internal flash write, prevents Flash write to random address.

10)Booting from Flash, the duration of the boot-time is defined between the rising edge of the PORST and the

moment when the first user instruction has entered the CPU and its processing starts.

11)Booting from Flash, the duration of the boot time is defined between the following events:

1. Hardware reset: the falling edge of a short HDRST pulse and the moment when the first user instruction has

entered the CPU and its processing starts, if the HDRST pulse is shorter than 1024 ×TSYS.

If the HDRST pulse is longer than 1024 ×TSYS, only the time beyond the 1024 ×TSYS should be added to the

boot time (HDRST falling edge to first user instruction).

2. Software reset: the moment of starting the software reset and the moment when the first user instruction

has entered the CPU and its processing starts

reset_beh

1) as programmed

VDDP

PORST

HDRST

Pads Pad-

state

undefined

VDD

DDPPA

Pad-

state

undefined

2) Tri-state, pull device active

DDPR

OSC

oscs

1) 2) 1) 2)

POA

TC1762

Electrical ParametersPreliminary

Data Sheet 95 V1.0, 2008-04

4.3.5 Phase Locked Loop (PLL)

Section 4.3.5 provides the characteristics of the PLL parameters and its operation in the

TC1762.

Note: All PLL characteristics defined on this and the next page are verified by design

characterization.

Phase Locked Loop Operation

When PLL operation is enabled and configured, the PLL clock fVCO (and with it the CPU

clock fCPU) is constantly adjusted to the selected frequency. The relation between fVCO

and fSYS is defined by: fVCO =K×fCPU. The PLL causes a jitter of fCPU and affects the

clock outputs TRCLK and SYSCLK (P4.3) which are derived from the PLL clock fVCO.

There are two formulas that define the (absolute) approximate maximum value of jitter

DP in ns dependent on the K-factor, the CPU clock frequency fCPU in MHz, and the

number P of consecutive fCPU clock periods.

(4.1)

(4.2)

K : K-Divider Value

P : Number of fCPU periods

DP : Jitter in ns

fCPU : CPU frequency in MHz

Table 4-13 PLL Parameters (Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Max.

Accumulated jitter DPSee Figure 4-12 –

VCO frequency range fVCO 400 500 MHz

500 600 MHz

600 700 MHz

PLL base frequency1)

1) The CPU base frequency which is selected after reset is calculated by dividing the limit values by 16 (this is

the K factor after reset).

fPLLBASE 140 320 MHz

150 400 MHz

200 480 MHz

PLL lock-in time tL– 200 µs

P K 900<× Dp ns[] 5P×

fcpu MHz[]

----------------------------- 0 9,+





±=

P K 900≥× Dp ns[] 4500

fcpu MHz[]K×

---------------------------------------- 0 9,+





±=

TC1762

Electrical ParametersPreliminary

Data Sheet 96 V1.0, 2008-04

Note: The frequency of system clock fSYS can be selected to be either fCPU or fCPU/2.

With rising number P of clock cycles the maximum jitter increases linearly up to a value

of P that is defined by the K-factor of the PLL. Beyond this value of P the maximum

accumulated jitter remains at a constant value. Further, a lower CPU clock frequency

fCPU results in a higher absolute maximum jitter value.

Figure 4-12 illustrates the jitter curve for for several K/ fCPU combinations.

Figure 4-12 Approximated Maximum Accumulated PLL Jitter for Typical CPU

Clock Frequencies fCPU (overview)

±0.0

P [Periods]

±1.0

±2.0

±3.0

±5.0

25 50 75 100 125 150

±4.0

175

TC1762 PLL Jitter (Preliminary)

±6.0

±7.0

±8.0

±9.0

±10.0

±11.0

±12.0

±13.0

Jitter [ns]

CPU

= 80 MHz (K = 8)

CPU

= 80 MHz (K = 5)

CPU

= 66 MHz ( K = 7)

CPU

= 66 MHz (K = 10)

CPU

= 40 MHz

CPU

= 40 MHz (K = 10)

(K = 17)

TC1762

Electrical ParametersPreliminary

Data Sheet 97 V1.0, 2008-04

Figure 4-13 Approximated Maximum Accumulated PLL Jitter for Typical CPU

Clock Frequencies fCPU (detail)

Note: The maximum peak-to-peak noise on the main oscillator and PLL power supply

(measured between VDDOSC and VSSOSC) is limited to a peak-to-peak voltage of

VPP = 10 mV. This condition can be achieved by appropriate blocking to the supply

pins and using PCB supply and ground planes.

±0.90

±1.00

±1.10

±1.40

23 45

TC1762 PLL Jitter (preliminary )

±1.20

±1.30

Jitter [ns]

P [Periods]

CPU

= 40 MHz

CPU

= 66 MHz

CPU

= 80 MHz

TC1762

Electrical ParametersPreliminary

Data Sheet 98 V1.0, 2008-04

4.3.6 Debug Trace Timing

VSS = 0 V; VDDP = 3.13 to 3.47 V (Class A); TA = -40 °C to +125 °C;

CL (TRCLK) = 25 pF; CL (TR[15:0]) = 50 pF

Figure 4-14 Debug Trace Timing

Table 4-14 Debug Trace Timing Parameter1)

1) Not subject to production test, verified by design/characterization.

Parameter Symbol Limit Values Unit

Min. Max.

TR[15:0] new state from TRCLK t9CC -1 4 ns

Trace_Tmg

TRCLK

TR[15:0] Old State New State

TC1762

Electrical ParametersPreliminary

Data Sheet 99 V1.0, 2008-04

4.3.7 Timing for JTAG Signals

(Operating Conditions apply, CL = 50 pF)

Figure 4-15 TCK Clock Timing

Table 4-15 TCK Clock Timing Parameter

Parameter Symbol Limit Values Unit

Min. Max.

TCK clock period1)

1) fTCK should be lower or equal to fSYS

tTCK SR 25 – ns

TCK high time t1SR 10 – ns

TCK low time t2SR 10 – ns

TCK clock rise time t3SR – 4 ns

TCK clock fall time t4SR – 4 ns

TCK

0.9 V

0.1 V

TCK

0.5 V

TC1762

Electrical ParametersPreliminary

Data Sheet 100 V1.0, 2008-04

Table 4-16 JTAG Timing Parameter1)

1) Not subject to production test, verified by design / characterization.

Parameter Symbol Limit

Values Unit Test

Conditions /

Remarks

Min. Max.

TMS setup to TCK t1SR 6.0 – ns –

TMS hold to TCK t2SR 6.0 – ns –

TDI setup to TCK t1SR 6.0 – ns –

TDI hold to TCK t2SR 6.0 – ns –

TDO valid output from TCK2)

2) The falling edge on TCK is used to capture the TDO timing.

t3CC – 14.5 ns CL = 50 pF3)4)

3) By reducing the load from 50 pF to 20 pF, a reduction of approximately 1.0 ns in timing is expected.

4) By redu cing the power supply range from +/-5 % to +5/-2 %, a reduction of approximately 0. 5 ns in timing is

expected.

3.0 – CL = 20 pF

TDO high impedance to valid output

from TCK2) t4CC – 15.5 ns CL = 50 pF3)4)

TDO valid output to high impedance

from TCK2) t5CC – 14.5 ns CL = 50 pF4)

TC1762

Electrical ParametersPreliminary

Data Sheet 101 V1.0, 2008-04

Figure 4-16 JTAG Timing

Note: The JTAG module is fully compliant with IEEE1149.1-2000 with JTAG clock at

20 MHz. The JTAG clock at 40 MHz is possible with the modi fied timing diagram

shown in Figure 4-16.

TMS

TDI

TCK

TDO

TC1762

Electrical ParametersPreliminary

Data Sheet 102 V1.0, 2008-04

4.3.8 Peripheral Timings

Section 4.3.8 provides the characteristics of the peripheral timings in the TC1762.

Note: Peripheral timing parameters are not subject to production test. They are verified

by design/characterization.

4.3.8.1 Micro Link Interface (MLI) Timing

Table 4-17 provides the characteristics of the MLI timing in the TC1762.

Table 4-17 MLI Timing (Operating Conditions apply, CL = 50 pF)

Parameter Symbol Limit Values Unit

Min. Max.

TCLK clock period1)2)

1) TCLK signal rise/fall times are the same as the A2 Pads rise/fall times.

2) TCLK high and low times can be minimum 1 ×TMLI

t30 CC 23)

3) TMLImin = TSYS = 1/fSYS. When fSYS = 80MHz, t30 = 25ns

–1/fSYS

RCLK clock period t31 SR 1 – 1/fSYS

MLI outputs delay from TCLK t35 CC 0 8 ns

MLI inputs setup to RCLK t36 SR 4 – ns

MLI inputs hold to RCLK t37 SR 4 – ns

RREADY output delay from RCLK t38 CC 0 8 ns

TC1762

Electrical ParametersPreliminary

Data Sheet 103 V1.0, 2008-04

Figure 4-17 MLI Interface Timing

Note: The generation of RREADYx is in the input clock domain of the receiver. The

reception of TREADYx is asynchronous to TCLKx.

MLI_Tmg_1.vsd

TDATAx

TVALIDx

t35 t35

t37

t36

TCLKx 0.1 VDDP

0.9 VDDP

RDATAx

RVALIDx

RCLKx

t30

TREADYx

RREADYx

t38 t38

t30

TC1762

Electrical ParametersPreliminary

Data Sheet 104 V1.0, 2008-04

4.3.8.2 Micro Second Channel (MSC) Interface Timing

Table 4-18 provides the characteristics of the MSC timing in the TC1762.

Figure 4-18 MSC Interface Timing

Note: The data at SOP should be sampled with the falling edge of FCLP in the target

device.

Table 4-18 MSC Interface Timing (Operating Conditions apply, CL = 50 pF)

Parameter Symbol Limit Values Unit

Min. Max.

FCLP clock period1)2)

1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.

2) FCLP signal high and low can be minimum 1 ×TMSC.

t40 CC 2 ×TMSC3)

3) TMSCmin = TSYS = 1/fSYS. When fSYS = 80MHz, t40 = 25ns

–ns

SOP/ENx outputs delay from FCLP t45 CC -10 10 ns

SDI bit time t46 SR 8 ×TMSC –ns

SDI rise time t48 SR 100 ns

SDI fall time t49 SR 100 ns

MSC_Tmg_1.vsd

0.1 V

DDP

0.9 V

DDP

0.1 V

DDP

0.9 V

DDP

SOP

FCLP

SDI

TC1762

Electrical ParametersPreliminary

Data Sheet 105 V1.0, 2008-04

4.3.8.3 Synchronous Serial Channel (SSC) Master Mode Timing

Table 4-19 provides the characteristics of the SSC timing in the TC1762.

Figure 4-19 SSC Master Mode Timing

Table 4-19 SSC Master Mode Timing (Operating Conditions apply, CL = 50 pF)

Parameter Symbol Limit Values Unit

Min. Max.

SCLK clock period1)2)

1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times.

2) SCLK signal high and low times can be minimum 1 ×TSSC.

t50 CC 2 ×TSSC3)

3) TSSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t50 = 25ns

–ns

MTSR/SLSOx delay from SCLK t51 CC 0 8 ns

MRST setup to SCLK t52 SR 10 – ns

MRST hold from SCLK t53 SR 5 – ns

SSC_Tmg_1.vsd

SCLK1)2)

MTSR1)

t51 t51

MRST1)

t53

Data

valid

t52

SLSOx2)

t51

1) This timing is based on the following setup: CON.PH = CON.PO = 0.

2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0

and the first SCLK high pulse is in the first one of a transmission.

t50

TC1762

PackagingPreliminary

Data Sheet 106 V1.0, 2008-04

5 Packaging

Chapter 5 provides the information of the TC1762 package and reliability section.

5.1 Package Parameters

Table 5-1 provides the characteristics of the package parameters.

Table 5-1 Package Parameters (PG-LQFP-176-2)

Parameter Symbol Limit Values Unit Notes

Min. Max.

Thermal resistance junction

case top1)

1) The thermal resistances between the case top and the ambient (RTCAT), the leads and the ambient (RTLA) are

to be combined with the thermal resistances between the junction and the case top (RTJCT ), the junction and

the leads (RTJL) given above, in order to calculate the total thermal resistance between the junction and the

ambient (RTJA). The thermal resistances between the case top and the ambient (RTCAT ), the leads and the

ambient (RTLA) depend on the external system (PCB, case) characteristics, and are under user responsibility.

The junction temperat ure can be calculated using the following equation: TJ=TA+RTJA ×PD, where the RTJA is

the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA

can be obtained from the upper four partial thermal resistances.

RTJCT CC – 5.4 K/W –

Thermal resistance junction

leads1) RTJL CC – 21.5 K/W –

TC1762

PackagingPreliminary

Data Sheet 107 V1.0, 2008-04

5.2 Package Outline

Figure 5-1 shows the package outlines of the TC1762.

Figure 5-1 Package Outlines PG-LQFP-176-2

PG-LQFP-176-2

Plastic Low Profile Quad Flat Package

ou can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

SMD = Surface Mounted Device

TC1762

PackagingPreliminary

Data Sheet 108 V1.0, 2008-04

5.3 Flash Memory Parameters

The data retention time of the TC1762’s Flash memory (i.e. the time after which stored

data can still be retrieved) depends on the number of times the Flash memory has been

erased and programmed.

Table 5-2 Flash Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Program Flash

Retention Time,

Physical Sector1) 2)

1) Storage and inactive time included.

2) At average weighted junction temperature TJ= 100 °C, or

the retention time at average weighted temperature of TJ= 110 °C is minimum 10 years, or

the retention time at average weighted temperature of TJ= 150 °C is minimum 0.7 years.

tRET 20 – years Max. 1000

erase/program cycles

Program Flash

Retention Time,

Logical Sector1)2)

tRETL 20 – years Max. 50

erase/program cycles

Data Flash Endurance

(32 Kbyte) NE15 000 – – Max. data retention

time 5 years

Data Flash Endurance,

EEPROM Emulation

(8 ×4 Kbyte)

NE8 120 000 – – Max. data retention

time 5 years

Programming Time per

Page3)

3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The

reprogramming takes additional 5ms.

tPR –5ms–

Program Flash Erase

Time per 256-Kbyte

sector

tERP –5sfCPU =80 MHz

Data Flash Erase Time

per 16-Kbyte sector tERD –0.625sfCPU =80 MHz

Wake-up time tWU 4300 ×1/fCPU +40µs

TC1762

PackagingPreliminary

Data Sheet 109 V1.0, 2008-04

5.4 Quality Declaration

Table 5-3 shows the characteristics of the quality parameters in the TC1762.

Note: Information about soldering can be found on the “package” information page

under: http://www.infineon.com/products.

Table 5-3 Quality Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Operation Lifetime1)2)

1) This lifetime refers only to the time when the device is powered-on.

2) An example of a detailed temperature profile is as below:

2000 hours at TJ = 150oC

16000 hours at TJ = 125oC

6000 hours at TJ = 110oC

This example is equivalent to the operation lifetime and average temperatures given in Table 5-3.

tOP – 24000 hours At average

weighted junction

temperature

TJ= 127°C

– 66000 hours At average

weighted junction

temperature

TJ= 100°C

– 20 years At average

weighted junction

temperature

TJ= 85°C

ESD susceptibility

according to Human Body

Model (HBM)

VHBM – 2000 V Conforming to

EIA/JESD22-

A114-B

ESD susceptibility of the

LVDS pins VHBM1 –500V–

ESD susceptibility

according to Charged

Device Model (CDM) pins

VCDM – 500 V Conforming to

JESD22-C101-C

Moisture Sensitivity Level

(MSL) - – 3 V Conforming to

J-STD-020C for

240°C

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