CHIP
RESISTORS
www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61017
38 Revision: 12-Mar-08
SFM
Vishay Electro-Films
Thin Film Top-Contact Resistor
The SFM series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The SFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
•Wire bondable
•Small size: 0.020 inches square
•Resistance range: 1.0 Ω to 1 MΩ
•DC power rating: 250 mW
•Oxidized silicon substrate for good power dissipation
•Resistor material tantalum nitride, self passivating
•Moisture resistant
APPLICATIONS
Vishay EFI SFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages.
They are ideally suited for this purpose because of their small size.
Product may not
be to scale
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
PROCESS CODE
CLASS H* CLASS K*
050 123
051 122
045 121
040 120
*MIL-PRF-38534 inspection criteria
1 Ω30 Ω200 kΩ360 kΩ
0.1 %
Tightest Standard Tolerance Available
± 50 ppm/°C
± 250 ppm/°C
± 100 ppm/°C
± 25 ppm/°C
10 Ω100 Ω620 kΩ1 MΩ
1 % 0.5 %
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
- 35 dB typ.
- 20 dB typ.
Moisture Resistance, MIL-STD-202
Method 106 ± 0.5 % max. ΔR/R
Stability, 1000 h, + 125 °C, 125 mW ± 0.25 % max. ΔR/R
Operating Temperature Range- 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F ± 0.25 % max. ΔR/R
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 200 V
Insulation Resistance 1012 min.
Operating Voltage100 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 250 mW
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
CHIP
RESISTORS
Document Number: 61017 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 12-Mar-08 39
SFM
Thin Film Top-Contact Resistor Vishay Electro-Films
CONFIGURATIONS in inches
SCHEMATIC
Options: Gold backing for eutectic die attach
Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
0.020
0.004
TYPICAL RANGE
820 Ω - 1 MΩ
0.016
0.004
0.016
0.004
0.007
TYPICAL RANGE
1 Ω - 29 Ω
0.004
0.020
0.006
TYPICAL RANGE
30 Ω - 819 Ω
0.020
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.020 x 0.020 ± 0.003 (0.5 x 0.5 ± 0.076 mm)
Chip Thickness 0.010 ± 0.002 (0.254 ± 0.05 mm)
Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material Tantalum nitride, self-passivating
Bonding Pad Size 0.004 x 0.004 (0.10 x 0.10 mm)
Number of Pads 2
Pad Material 25 kÅ minimum aluminum
Backing None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PACK AGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample , commercial
visually inspected parts loaded
in matrix trays (4 % AQL)
SFM
PRODUCT
FAMILY
045
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits of
resistance
1
MULTIPLIER
CODE
D = 0.0001
C = 0.001
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
4 = 10 000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
*Coating standard
