Features
l Surface Mount Package Ideally Suited for Automatic Insertion
l 150oC Junction Temperature
l High Conductance
Mechanical Data
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Marking: D5
l Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25oC Unless Otherwise Specified
Characteristic Symbol Value Unit
Working Inverse Voltage VIV 75 V
DC Forward Current IFM 600 mA
Average Rectified Current IF(AV) 200 mA
Recurrent Peak Forward Current IFRM 700 mA
Peak Forward Surge Current@ t=1.0s
@ t=1.0us IFSM 1.0
2.0 A
Power Dissipation Pd350 mW
Thermal Resistance R357 oC/W
Operation & Storage Temp. Range Tj, TSTG -55 to +150 oC
Note:1) These ratings are based on a max. junction temperature of 150 degrees C
2) These are steady state limits. The factory should be consulted on applications
involving pulsed or low duty cycle operation
Electrical Characteristics @ 25oC Unless Otherwise Specified
Charateristic Symbol Min Max Unit Test Cond.
Breakdown Voltage VR75 VIR=100uA
Maximum
Instantaneous
Forward Voltage VF1.0 VIF=10mA
Maximum
Instantaneous Reverse
Current
IR
25
50
5.0
nA
uA
uA
V
R
=20V
VR=20V TA=150oC
V
R
=75V
Junction Capacitance C
j
4pF V
R
=0V, f=1.0MHz
Reverse Recovery
Time trr 4ns
I
F
=10mA, V
R
=6.0V,
IRR=1.0mA,
R
L
=100 OHM
MMBD4148CC
High Conductance
Ultra Fast Diode
350mW
Suggested Solder
Pad Layout
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A.110 .120 2.80 3.04
B.083 .098 2.10 2.64
C.047 .055 1.20 1.40
D.035 .041 .89 1.03
E.070 .081 1.78 2.05
F.018 .024 .45 .60
G.0005 .0039 .013 .100
H.035 .044 .89 1.12
J.003 .007 .085 .180
K.015 .020 .37 .51
A
B
C
D
E
F
G
H
J
K
SOT-23
www.mccsemi.com
omponents
21201 Itasca Street Chatsworth
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MCC
www.mccsemi.com
3
21
3
12
MMBD4148CC MCC
D5
