NCP698 150 mA CMOS Ultra Low Iq and IGND LDO Regulator with Enable This series of fixed output low-dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent and ground current. This series features an ultra-low quiescent current of 2.5 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP698 series provides an enable pin for ON/OFF control. The NCP698 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 F. The device is housed in the micro-miniature SC82-AB surface mount package. Standard voltage versions are 1.3, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, 3.5 and 5.0 V. Other voltages are available in 100 mV steps. http://onsemi.com 4 1 SC82-AB (SC70-4) SQ SUFFIX CASE 419C Features PIN CONNECTIONS & MARKING DIAGRAMS Ultra Low Quiescent Current of 2.5 A Typical Output Voltage Accuracy of 2.0% Operating Temperature Range of -40C to 85C Enable Function This is a Pb-Free Device GND 1 Vin 2 Typical Applications * Battery Powered Instruments * Hand-Held Instruments * Camcorders and Cameras xxx M G OFF C1 Output Vout + + = Specific Device Code = Month Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position and underbar may vary depending upon manufacturing location. GND Enable Vin 3 Vout Top View) ON Input 4 Enable xxxM G G * * * * * ORDERING INFORMATION C2 See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. This device contains 28 active transistors Figure 1. Typical Application Diagram (c) Semiconductor Components Industries, LLC, 2009 March, 2009 - Rev. 1 1 Publication Order Number: NCP698/D NCP698 AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAA AAAA AAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 GND Description 2 Vin Positive power supply input voltage. 3 Vout Regulated output voltage. 4 Enable - N/C Power supply ground. This input is used to place the device into low-power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. No internal connection. MAXIMUM RATINGS Rating Symbol Input Voltage Value Unit Vin 6.0 V Enable Voltage Enable -0.3 to Vin +0.3 V Output Voltage Vout -0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics (Note 1) Power Dissipation Thermal Resistance, Junction-to-Ambient (1 oz copper, 1 in2 copper area) PD RJA Internally Limited 235 W C/W Operating Junction Temperature TJ +150 C Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to Electrical Characteristics and Application Information for Safe Operating Area. 2. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015 Machine Model Method 200 V 3. Latch up capability (85C) "100 mA DC with trigger voltage. http://onsemi.com 2 NCP698 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25C, unless otherwise noted. Note 4) Characteristic Symbol Min Typ Max 1.261 1.455 1.746 2.425 2.744 2.940 3.234 3.430 4.900 1.3 1.5 1.8 2.5 2.8 3.0 3.3 3.5 5.0 1.339 1.545 1.854 2.575 2.856 3.060 3.366 3.570 5.100 1.261 1.455 1.746 2.425 2.716 2.910 3.201 3.430 4.900 1.3 1.5 1.8 2.5 2.8 3.0 3.3 3.5 5.0 1.339 1.545 1.854 2.575 2.884 3.090 3.399 3.570 5.100 - - 10 10 20 20 - 20 60 150 150 280 280 - - - - - - - - 750 550 400 250 200 140 1200 800 550 400 350 200 - - - - - - 1050 870 700 520 370 280 1500 1070 900 700 525 400 IDIS - 0.1 1.0 A IQ - 2.5 - A IGND - 2.5 6.0 Output Voltage (Iout = 1.0 mA) 1.3 V 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Vout Output Voltage (TA = -40 to +85C, Iout = 1.0 mA) 1.3 V 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Vout Line Regulation 1.5 V-4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V 4.5 V-5.0 V (Vin = 5.5 V to 6.0 V) Regline Load Regulation (Iout = 10 mA to 150 mA) Regload Output Current (Vout = (Vout at Iout = 150 mA) -3.0%) 1.3 V to 3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) Io(nom.) Dropout Voltage (TA = -40C to 85C, Iout = 80 mA, Measured at Vout -3.0%) 1.3 V 1.5 V 1.8 V 2.5 V-2.8 V 3.0 V-3.5 V 5.0 V Vin-Vout Dropout Voltage (TA = -40C to 85C, Iout = 150 mA, Measured at Vout -3.0%) 1.3 V 1.5 V 1.8 V 2.5 V-2.8 V 3.0 V-3.5 V 5.0 V Vin-Vout Disable Current (Enable Input = 0 V) Quiescent Current (Enable Input = Vin, Iout = 0 mA) Ground Current (Enable Input = Vin, Iout = 1.0 mA to 150 mA) Output Short Circuit Current 1.3 V to 3.9 V (Vin = Vnom + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) V V mV Vn http://onsemi.com 3 mV mA mV mV Iout(max) Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V) Unit A mA 150 150 300 300 600 600 - 100 - Vrms NCP698 ELECTRICAL CHARACTERISTICS (continued) (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25C, unless otherwise noted. Note 4) Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) Output Voltage Temperature Coefficient TC V 1.3 - - - - 0.3 - "100 - ppm/C 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RJA http://onsemi.com 4 NCP698 3 VIN = 4.0 V VOUT = 3.0 V IOUT = 0 mA 2.7 IQ, QUIESCENT CURRENT (A) IQ, QUIESCENT CURRENT (A) 2.9 2.5 2.3 2.1 1.9 1.7 -60 -40 VOUT = 3.0 V 2.5 2 1.5 1 0.5 0 -20 0 20 40 60 0 100 80 1 T, TEMPERATURE (C) 3 VIN = 6.0 V 3.010 3.005 3.000 VIN = 4.0 V IOUT = 30 mA 2 1.5 1 0.5 0 -40 0 -20 20 40 60 80 100 0 1 2 3 4 5 T, TEMPERATURE (C) VIN, INPUT VOLTAGE (V) Figure 4. Output Voltage versus Temperature Figure 5. Output Voltage versus Input Voltage 300 VOUT(nom) = 3.0 V 250 80 mA LOAD 200 150 6 4 2 VIN = 4.0 V CIN = 1.0 F 0 3 40 mA LOAD 100 50 0 6 2.5 ENABLE VOLTAGE (V) VIN - VOUT, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 3.015 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 3.5 2.990 -60 5 4 Figure 3. Quiescent Current versus Input Voltage 3.020 2.995 3 VIN, INPUT VOLTAGE (V) Figure 2. Quiescent Current versus Temperature VOUT(nom) = 3.0 V IOUT = 10 mA 2 10 mA LOAD -50 -25 0 25 50 75 100 1 0 125 COUT = 0.1 F IOUT = 10 mA 2 0 T, TEMPERATURE (C) 50 100 150 200 250 300 t, TIME (s) Figure 6. Dropout Voltage versus Temperature Figure 7. Turn-On Response http://onsemi.com 5 350 400 IOUT, OUTPUT CURRENT (mA) 6 5 4 3 1 OUTPUT VOLTAGE DEVIATION (V) OUTPUT VOLTAGE DEVIATION (V) VIN, INPUT VOLTAGE (V) NCP698 0.5 0 VOUT = 3.0 V COUT = 0.1 F IOUT = 10 mA -0.5 -1 0 100 150 200 250 300 350 400 t, TIME (s) 50 60 IOUT = 1 mA to 30 mA VIN = 4.0 V 30 0 -30 1 VOUT = 3.0 V COUT = 0.1 F 0.5 0 -0.5 450 500 -1 0 60 IOUT = 1 mA to 30 mA VIN = 4.0 V 30 0 -30 400 200 0 COUT = 1.0 F VOUT = 3.0 V -200 -400 0 100 200 100 150 200 250 300 350 400 t, TIME (s) 450 500 Figure 9. Load Transient Response 300 400 500 600 700 800 900 1000 t, TIME (s) Vn, OUTPUT VOLTAGE NOISE (mV/Hz) OUTPUT VOLTAGE DEVIATION (mV) IOUT, OUTPUT CURRENT (mA) Figure 8. Line Transient Response 50 3.5 VIN = 5.0 V VOUT = 3.0 V IOUT = 50 mA COUT = 0.1 F 3 2.5 2 1.5 1 0.5 0 0.01 Figure 10. Load Transient Response 0.1 1 10 f, FREQUENCY (kHz) 100 1000 Figure 11. Output Voltage Noise DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 6 NCP698 APPLICATIONS INFORMATION on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: A typical application circuit for the NCP698 is shown in Figure 1. Input Decoupling (C1) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP698 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K T *TA PD + J(max) RJA Output Decoupling (C2) If junction temperature is not allowed above the maximum 125C, then the NCP698 can dissipate up to 250 mW @ 25C. The power dissipated by the NCP698 can be calculated from the following equation: The NCP698 is a very stable regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 10 can thus safely be used. The minimum decoupling value is 0.1 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K Ptot + Vin * Ignd (Iout) ) [Vin * Vout] * Iout or P ) Vout * Iout VinMAX + tot Ignd ) Iout If an 80 mA output current is needed then the ground current from the data sheet is 2.5 A. For an NCP698 (3.0 V), the maximum input voltage will then be 6.0 V. Enable Operation The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used, then the pin should be connected to Vin. 350 330 310 290 JA (C/W) Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. 270 No pin connected to Cu Plane 250 230 210 190 Pin 2 connected to Cu Plane 170 150 0 Thermal 100 200 300 400 PCB COPPER AREA As power across the NCP698 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration 500 (mm2) Figure 12. RqJA vs. Pad Copper Area (1 oz Cu thickness) http://onsemi.com 7 600 700 NCP698 ORDERING INFORMATION Nominal Output Voltage Marking NCP698SQ13T1G 1.3 LJW NCP698SQ15T1G 1.5 LJX NCP698SQ18T1G 1.8 LJY NCP698SQ25T1G 2.5 LJZ NCP698SQ28T1G 2.8 LKD NCP698SQ30T1G 3.0 LKA NCP698SQ33T1G 3.3 LKB NCP698SQ35T1G 3.5 LKE NCP698SQ50T1G 5.0 LKC Device Package Shipping SC82-AB 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 NCP698 PACKAGE DIMENSIONS SC-82AB CASE 419C-02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C-01 OBSOLETE. NEW STANDARD IS 419C-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G C D 3 PL N K B S 1 2 H J F L MILLIMETERS MIN MAX 1.8 2.2 1.15 1.35 0.8 1.1 0.2 0.4 0.3 0.5 1.1 1.5 0.0 0.1 0.10 0.26 0.1 --- 0.05 BSC 0.2 REF 1.8 2.4 DIM A B C D F G H J K L N S 3 4 0.05 (0.002) INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 --- 0.002 BSC 0.008 REF 0.07 0.09 SOLDERING FOOTPRINT* 1.30 0.0512 0.65 0.026 1.90 0.95 0.075 0.037 0.90 0.035 0.70 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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