LM2937
500 mA Low Dropout Regulator
General Description
The LM2937 is a positive voltage regulator capable of sup-
plying up to 500 mAof load current. The use of a PNP power
transistor provides a low dropout voltage characteristic. With
a load current of 500 mAthe minimum input to output voltage
differential required for the output to remain in regulation is
typically 0.5V (1V guaranteed maximum over the full operat-
ing temperature range). Special circuitry has been incorpo-
rated to minimize the quiescent current to typically only
10 mA with a full 500 mA load current when the input to out-
put voltage differential is greater than 3V.
The LM2937 requires an output bypass capacitor for stabil-
ity. As with most low dropout regulators, the ESR of this ca-
pacitor remains a critical design parameter, but the LM2937
includes special compensation circuitry that relaxes ESR re-
quirements. The LM2937 is stable for all ESR below 3. This
allows the use of low ESR chip capacitors.
Ideally suited for automotive applications, the LM2937 will
protect itself and any load circuitry from reverse battery con-
nections, two-battery jumps and up to +60V/−50V load dump
transients. Familiar regulator features such as short circuit
and thermal shutdown protection are also built in.
Features
nFully specified for operation over −40˚C to +125˚C
nOutput current in excess of 500 mA
nOutput trimmed for 5%tolerance under all operating
conditions
nTypical dropout voltage of 0.5V at full rated load current
nWide output capacitor ESR range, up to 3
nInternal short circuit and thermal overload protection
nReverse battery protection
n60V input transient protection
nMirror image insertion protection
Connection Diagram and Ordering Information
TO-220 Plastic Package
DS011280-2
Front View
Order Number LM2937ET-5.0, LM2937ET-8.0,
LM2937ET-10, LM2937ET-12 or LM2937ET-15
See NS Package Number T03B
SOT-223 Plastic Package
DS011280-26
Front View
Order Number LM2937IMP-5.0,
LM2937IMP-8.0, LM2937IMP-10,
LM2937IMP-12 or LM2937IMP-15
See NS Package Number MA04A
TO-263 Surface-Mount Package
DS011280-5
Top View
DS011280-6
Side View
Order Number LM2937ES-5.0, LM2937ES-8.0,
LM2937ES-10, LM2937ES-12 or LM2937ES-15
See NS Package Number TS3B
December 1997
LM2937 500 mA Low Dropout Regulator
© 1999 National Semiconductor Corporation DS011280 www.national.com
Connection Diagram and Ordering Information (Continued)
Temperature
Range Output Voltage NSC Package
5.0 8.0 10 12 15 Package
Drawing
−40˚C TA125˚C LM2937ES-5.0 LM2937ES-8.0 LM2937ES-10 LM2937ES-12 LM2937ES-15 TS3B TO-263
LM2937ET-5.0 LM2937ET-8.0 LM2937ET-10 LM2937ET-12 LM2937ET-15 T03B TO-220
−40˚C TA85˚C LM2937IMP-5.0 LM2937IMP-8.0 LM2937IMP-10 LM2937IMP-12 LM2937IMP-15 MA04A SOT-223
SOT-223 Package
Markings L71B L72B L73B L74B L75B
The small physical size of the SOT-223 package does not allow sufficient space to provide the complete device part number. The actual devices will be labeled with
the package markings shown.
www.national.com 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage
Continuous 26V
Transient (t 100 ms) 60V
Internal Power Dissipation (Note 2) Internally Limited
Maximum Junction Temperature 150˚C
Storage Temperature Range −65˚C to +150˚C
TO-220 (10 seconds) 260˚C
TO-263 (10 seconds) 230˚C
SOT-223 (Vapor Phase, 60 seconds) 215˚C
SOT-223 (Infared, 15 seconds) 220˚C
ESD Susceptibility (Note 3) 2 kV
Operating Conditions (Note 1)
Temperature Range (Note 2)
Junction Temperature (T
J
) 125˚C
LM2937ET, LM2937ES −40˚C T
A
125˚C
LM2937IMP −40˚C T
A
85˚C
Maximum Input Voltage 26V
Electrical Characteristics
V
IN
=V
NOM
+ 5V, (Note 4) I
OUTmax
=500 mA for the TO-220 and TO-263 packages, I
OUTmax
=400mA for the SOT-223 pack-
age, C
OUT
=10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
indicated device., all other specifications are for T
A
=T
J
=25˚C.
Output Voltage (V
OUT
) 5V 8V 10V Units
Parameter Conditions Typ Limit Typ Limit Typ Limit
Output Voltage 5 mA I
OUT
I
OUTmax
4.85 7.76 9.70 V(Min)
5.00 4.75 8.00 7.60 10.00 9.50 V(Min)
5.15 8.24 10.30 V(Max)
5.25 8.40 10.50 V(Max)
Line Regulation (V
OUT
+ 2V) V
IN
26V, 15 50 24 80 30 100 mV(Max)
I
OUT
=5mA
Load Regulation 5 mA I
OUT
I
OUTmax
550 880 10 100 mV(Max)
Quiescent Current (V
OUT
+ 2V) V
IN
26V, 2 10 210 210 mA(Max)
I
OUT
=5mA
V
IN
=(V
OUT
+ 5V), 10 20 10 20 10 20 mA(Max)
I
OUT
=I
OUTmax
Output Noise 10 Hz–100 kHz 150 240 300 µVrms
Voltage I
OUT
=5mA
Long Term Stability 1000 Hrs. 20 32 40 mV
Dropout Voltage I
OUT
=I
OUTmax
0.5 1.0 0.5 1.0 0.5 1.0 V(Max)
I
OUT
=50 mA 110 250 110 250 110 250 mV(Max)
Short-Circuit Current 1.0 0.6 1.0 0.6 1.0 0.6 A(Min)
Peak Line Transient t
f
<100 ms, R
L
=10075 60 75 60 75 60 V(Min)
Voltage
Maximum Operational 26 26 26 V(Min)
Input Voltage
Reverse DC V
OUT
−0.6V, R
L
=100−30 −15 −30 −15 −30 −15 V(Min)
Input Voltage
Reverse Transient t
r
<1 ms, R
L
=100−75 −50 −75 −50 −75 −50 V(Min)
Input Voltage
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Electrical Characteristics
V
IN
=V
NOM
+ 5V, (Note 4) I
OUTmax
=500 mA for the TO-220 and TO-263 packages, I
OUTmax
=400mA for the SOT-223 pack-
age, C
OUT
=10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
indicted device., all other specifications are for T
A
=T
J
=25˚C.
Output Voltage (V
OUT
) 12V 15V Units
Parameter Conditions Typ Limit Typ Limit
Output Voltage 5 mA I
OUT
I
OUTmax
11.64 14.55 V (Min)
12.00 11.40 15.00 14.25 V(Min)
12.36 15.45 V(Max)
12.60 15.75 V(Max)
Line Regulation (V
OUT
+ 2V) V
IN
26V, 36 120 45 150 mV(Max)
I
OUT
=5mA
Load Regulation 5 mA I
OUT
I
OUTmax
12 120 15 150 mV(Max)
Quiescent Current (V
OUT
+ 2V) V
IN
26V, 2 10 210 mA(Max)
I
OUT
=5mA
V
IN
=(V
OUT
+ 5V), 10 20 10 20 mA(Max)
I
OUT
=I
OUTmax
Output Noise 10 Hz–100 kHz, 360 450 µVrms
Voltage I
OUT
=5mA
Long Term Stability 1000 Hrs. 44 56 mV
Dropout Voltage I
OUT
=I
OUTmax
0.5 1.0 0.5 1.0 V(Max)
I
OUT
=50 mA 110 250 110 250 mV(Max)
Short-Circuit Current 1.0 0.6 1.0 0.6 A(Min)
Peak Line Transient t
f
<100 ms, R
L
=10075 60 75 60 V(Min)
Voltage
Maximum Operational 26 26 V(Min)
Input Voltage
Reverse DC V
OUT
−0.6V, R
L
=100−30 −15 −30 −15 V(Min)
Input Voltage
Reverse Transient t
r
<1 ms, R
L
=100−75 −50 −75 −50 V(Min)
Input Voltage
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated Operating Conditions.
Note 2: The maximum allowable power dissipation at any ambient temperature is PMAX =(125 TA)/θJA, where 125 is the maximum junction temperature for op-
eration, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C
and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the
junction-to-ambient thermal resistance θJA is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used
with a heatsink, θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263
or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application
Hints for more information on heatsinking).
Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 k.
Note 4: Typicals are at TJ=25˚C and represent the most likely parametric norm.
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Typical Performance Characteristics
Dropout Voltage vs
Output Current
DS011280-7
Dropout Voltage vs
Temperature
DS011280-8
Output Voltage vs
Temperature
DS011280-9
Quiescent Current vs
Temperature
DS011280-10
Quiescent Current vs
Input Voltage
DS011280-11
Quiescent Current vs
Output Current
DS011280-12
Line Transient Response
DS011280-13
Load Transient Response
DS011280-14
Ripple Rejection
DS011280-15
Output Impedance
DS011280-16
Maximum Power
Dissipation (TO-220)
DS011280-17
Maximum Power Dissipation
(TO-263) (Note 2)
DS011280-18
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Typical Performance Characteristics (Continued)
Low Voltage Behavior
DS011280-19
Low Voltage Behavior
DS011280-20
Low Voltage Behavior
DS011280-21
Output at Voltage
Extremes
DS011280-22
Output at Voltage
Extremes
DS011280-23
Output Capacitor ESR
DS011280-24
Peak Output Current
DS011280-25
Typical Application
DS011280-1
* Required if the regulator is located more than 3 inches from the power supply filter capacitors.
**Required for stability. Cout must be at least 10 µF (over the full expected operating temperature range) and located as close as possible to the regulator. The
equivalent series resistance, ESR, of this capacitor may be as high as 3.
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Application Hints
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stabil-
ity, and must meet the required conditions for both ESR
(Equivalent Series Resistance) and minimum amount of ca-
pacitance.
MINIMUM CAPACITANCE:
The minimum output capacitance required to maintain stabil-
ity is 10 µF (this value may be increased without limit).
Larger values of output capacitance will give improved tran-
sient response.
ESR LIMITS:
The ESR of the output capacitor will cause loop instability if
it is too high or too low. The acceptable range of ESR plotted
versus load current is shown in the graph below.
It is essen-
tial that the output capacitor meet these requirements,
or oscillations can result.
It is important to note that for most capacitors, ESR is speci-
fied only at room temperature. However, the designer must
ensure that the ESR will stay inside the limits shown over the
entire operating temperature range for the design.
For aluminum electrolytic capacitors, ESR will increase by
about 30X as the temperature is reduced from 25˚C to
−40˚C. This type of capacitor is not well-suited for low tem-
perature operation.
Solid tantalum capacitors have a more stable ESR over tem-
perature, but are more expensive than aluminum electrolyt-
ics. A cost-effective approach sometimes used is to parallel
an aluminum electrolytic with a solid Tantalum, with the total
capacitance split about 75/25%with the Aluminum being the
larger value.
If two capacitors are paralleled, the effective ESR is the par-
allel of the two individual values. The “flatter” ESR of the Tan-
talum will keep the effective ESR from rising as quickly at low
temperatures.
HEATSINKING
A heatsink may be required depending on the maximum
power dissipation and maximum ambient temperature of the
application. Under all possible operating conditions, the junc-
tion temperature must be within the range specified under
Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated
by the regulator, P
D
, must be calculated.
The figure below shows the voltages and currents which are
present in the circuit, as well as the formula for calculating
the power dissipated in the regulator:
The next parameter which must be calculated is the maxi-
mum allowable temperature rise, T
R
(max). This is calcu-
lated by using the formula:
T
R
(max) =T
J
(max) T
A
(max)
where: T
J
(max) is the maximum allowable junction tem-
perature, which is 125˚C for commercial
grade parts.
T
A
(max) is the maximum ambient temperature
which will be encountered in the applica-
tion.
Using the calculated values for T
R
(max) and P
D
, the maxi-
mum allowable value for the junction-to-ambient thermal re-
sistance, θ
(J−A)
, can now be found:
θ
(J−A)
=T
R
(max)/P
D
IMPORTANT: If the maximum allowable value for θ
(J−A)
is
found to be 53˚C/W for the TO-220 package, 80˚C/W for
the TO-263 package, or 174˚C/W for the SOT-223 pack-
age, no heatsink is needed since the package alone will dis-
sipate enough heat to satisfy these requirements.
If the calculated value for θ
(J−A)
falls below these limits, a
heatsink is required.
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or se-
cured to a copper plane on a PC board. If a copper plane is
to be used, the values of θ
(J−A)
will be the same as shown in
the next section for the TO-263.
If a manufactured heatsink is to be selected, the value of
heatsink-to-ambient thermal resistance, θ
(H−A)
, must first be
calculated: θ
(H−A)
=θ
(J−A)
θ
(C−H)
θ
(J−C)
Where: θ
(J−C)
is defined as the thermal resistance from
the junction to the surface of the case. A
value of 3˚C/W can be assumed for θ
(J−C)
for this calculation.
θ
(C−H)
is defined as the thermal resistance be-
tween the case and the surface of the heat-
sink. The value of θ
(C−H)
will vary from
about 1.5˚C/W to about 2.5˚C/W (depend-
ing on method of attachment, insulator,
etc.). If the exact value is unknown, 2˚C/W
should be assumed for θ
(C−H)
.
When a value for θ
(H−A)
is found using the equation shown,
a heatsink must be selected that has a value that is less than
or equal to this number.
Output Capacitor ESR
DS011280-24
FIGURE 1. ESR Limits
DS011280-27
IIN =IL÷IG
PD=(VIN −V
OUT)I
L+(V
IN)I
G
FIGURE 2. Power Dissipation Diagram
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Application Hints (Continued)
θ
(H−A)
is specified numerically by the heatsink manufacturer
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the package to the plane.
Figure 3
shows for the TO-263 the measured values of θ
(J−A)
for different copper area sizes using a typical PCB with 1
ounce copper
and no solder mask over the copper area used
for heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
(J−A)
for the TO-263
package mounted to a PCB is 32˚C/W.
As a design aid,
Figure 4
shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
(J−A)
is 35˚C/W and the maxi-
mum junction temperature is 125˚C).
Figure 5
and
Figure 6
show the information for the SOT-223
package.
Figure 6
assumes a θ
(J−A)
of 74˚C/W for 1 ounce
copper and 51˚C/W for 2 ounce copper and a maximum
junction temperature of 125˚C.
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave solder-
ing to attach the small SOT-223 package to a printed circuit
board. The excessive temperatures involved may cause
package cracking.
Either vapor phase or infrared reflow techniques are pre-
ferred soldering attachment methods for the SOT-223 pack-
age.
DS011280-28
FIGURE 3. θ
(J−A)
vs Copper (1 ounce) Area for the
TO-263 Package
DS011280-29
FIGURE 4. Maximum Power Dissipation vs T
AMB
for
the TO-263 Package
DS011280-30
FIGURE 5. θ
(J−A)
vs Copper (2 ounce) Area for the
SOT-223 Package
DS011280-31
FIGURE 6. Maximum Power Dissipation vs T
AMB
for
the SOT-223 Package
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Physical Dimensions inches (millimeters) unless otherwise noted
Plastic Package
Order Number LM2937ET-5.0,
LM2937ET-8.0, LM2937ET-10, LM2937ET-12,
or LM2937ET-15
NS Package Number T03B
www.national.com9
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
TO-263 3-Lead Plastic Surface Mount Package
Order Number LM2937ES-5.0, LM2937ES-8.0, LM2937ES-10, LM2937ES-12 or LM2937ES-15
NS Package Number TS3B
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
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whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
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2. A critical component is any component of a life
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can be reasonably expected to cause the failure of
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SOT-223 3-Lead Plastic Surface Mount Package
Order Number LM2937IMP-5.0, LM2937IMP-8.0, LM2937IMP-10, LM2937IMP-12 or LM2937IMP-15
NS Package Number MA04A
LM2937 500 mA Low Dropout Regulator
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.