2011-07-20
1
BFS17P
1
2
3
NPN Silicon RF Transistor
• For broadband amplifiers up to 1 GHz at
collector currents from 1 mA to 20 mA
• Pb-free (RoHS compliant) package
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type Marking Pin Configuration Package
BFS17P MCs 1 = B 2 = E 3 = C SOT23
Maximum Ratings at T
A
= 25 °C, unless otherwise specified
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 15 V
Collector-base voltage VCBO 25
Emitter-base voltage VEBO 2.5
Collector current IC25 mA
Peak collector current ICM 50
Total power dissipation1)
TS ≤ 55 °C
Ptot 280 mW
Junction temperature TJ150 °C
Ambient temperature T
A
-65 ... 150
Storage temperature TSt
g
-65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point2) RthJS ≤ 340 K/W
1TS is measured on the collector lead at the soldering point to the pcb
2For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation)
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BFS17P
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0
V(BR)CEO 15 - - V
Collector-base cutoff current
VCB = 10 V, IE = 0
VCB = 25 V, IE = 0
ICBO
-
-
-
-
0.05
10
µA
Emitter-base cutoff current
VEB = 2.5 V, IC = 0
IEBO - - 100
DC current gain
IC = 2 mA, VCE = 1 V, pulse measured
IC = 25 mA, VCE = 1 V, pulse measured
hFE
40
20
-
70
150
-
-
Collector-emitter saturation voltage
IC = 10 mA, IB = 1 mA
VCEsat - 0.1 0.4 V
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BFS17P
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics (verified by random sampling)
Transition frequency
IC = 2 mA, VCE = 5 V, f = 200 MHz
IC = 25 mA, VCE = 5 V, f = 200 MHz
fT
1
1.3
1.4
2.5
-
-
GHz
Collector-base capacitance
VCB = 5 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Ccb - 0.55 0.8 pF
Collector emitter capacitance
VCE = 5 V, f = 1 MHz, VBE = 0 ,
base grounded
Cce - 0.27 -
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Ceb - 0.9 1.45
Minimum noise figure
IC = 2 mA, VCE = 5 V, ZS = 50 Ω,
f = 800 MHz
NFmin - 3.5 5 dB
Transducer gain
IC = 20 mA, VCE = 5 V, ZS = ZL = 50Ω,
f = 500 MHz
|S21e|2- 13 - dB
Third order intercept point at output
VCE = 5 V, IC = 20 mA, f = 800 MHz,
ZS = ZSopt, ZL = ZLopt
IP3- 21.5 - dBm
1dB compression point
IC = 20 mA, VCE = 5 V, ZS = ZL = 50Ω,
f = 800 MHz
P-1dB - 10 - -
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BFS17P
Total power dissipation Ptot = ƒ(TS)
0 15 30 45 60 75 90 105 120 °C 150
TS
0
40
80
120
160
200
240
mW
320
Ptot
Permissible Pulse Load RthJS = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
-
Ptotmax/PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Collector-base capacitance Ccb = ƒ(VCB)
Emitter-base capacitance Ceb = ƒ(VEB)
f = 1 MHz
0 2 4 6 8 10 12 14 16 V20
VCB, VEB
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
pF
1.2
CCB, CEB
CCB
CEB
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BFS17P
Transition frequency fT= ƒ(IC)
VCE = parameter
0 5 10 15 20 mA 30
IC
0
0.5
1
1.5
2
GHz
3
fT
10V
5V
3V
2V
1V
0.7V
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BFS17P
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25
M
BC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2011-07-20
7
BFS17P
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
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only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
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