MMBT5551-13P - MICRO COMMERCIAL COMPONENTS

GE

Data Sheet

June 10, 2015

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

Features

 -48V/10A Dual redundant input power distribution

 3.3Vdc/3.6A & 5.0Vdc/150mA of isolated Management Power

for IPM or other housekeeping functions

 Independent holdup capacitor charging voltage; trimmable

from 50 to 95Vdc for optimal real estate

 OR’ing functionality, Inrush protection & hot swap capability

 Integral EMI filter designed for the ATCA board to meet CISPR

Class B with minimal external filtering

 Protection: Reverse polarity, under voltage, input transient

over voltage/current and temperature

 I2C digital interface options

 Isolated A/B Feed Loss /Open Fuse Alarm

 High efficiency : 98%

 -40 to 85ºC ambient temperature operation

 Industry Standard Quarter brick size: 58.4 mm x 36.8 mm x

13.7 mm (2.3 in x 1.45 in x 0.54 in)

 MTBF : 2,308,563 hours per TELCORDIA

 ISO** 9001 & ISO 14001 certified manufacturing facilities

 Compliant to RoHS II EU “Directive 2011/65/EU”

 UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No. 60950 1-07

Certified, and VDE‡ (EN60950-1, 2nd Ed.) Licensed

 Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for Basic insulation

rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3¤ PoE

standards

 ISO**9001 and ISO 14001 certified manufacturing facilities

Applications

 ATCA Front Board / Blade

 Central Office Telecom equipment

 High availability server and storage applications

Options

 Choice of short pin lengths

 I2C Digital Interface

Description

The PIM400 series of Power Input Modules are designed to greatly simplify the task of implementing dual redundant, hot swap –

48Vdc power distribution with EMI filtering on an ATCA or other telecom boards. The PIM400 with optional I2C digital interface

capability, when used with a variety of GE’s series of Bus converters (BarracudaTM Series) /POLs (DLynxTM Series) provides for a

quick, simple and elegant power solution to a wide variety of demanding & intelligent power system architectures.

* UL is a registered trademark of Underwriters Laboratories, Inc.

† CSA is a registered trademark of Canadian Standards Association.

‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

** ISO is a registered trademark of the International Organization of Standards

¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 2

ATCA Board Typical Application

External Holdup Capacitor Selection

External Holdup Trim Resistor Selection

Suggested Bill of Materials

(Note: Customer is ultimately responsible for the final selection and verification of the suggested parts for the end application).

Ref Des

Description

(Values)

Comments

F1-F4

Fuses (15A)

Max fuse rating not to exceed 20A, fast acting

F5,F6

Fuses (15A)

0.5 to 1A rated

R1,R2

Pre-charge Resistors (15 Ohms)

High Surge Power Type e.g. KOA P/N SG73

R_TRIM

Resistor

See Design Consideration section for details

R_PULLUP

Resistor (3.3 kOhms)

Alarm pull-up resistor

C_FLTR

Capacitor(s) (100F)

300 F (max)

C_HLDP

Capacitor(s)

3300F (max); see Design Consideration section for details

C_OUT

Capacitor(s)

Consult data sheet for the applicable DC/DC Bus Converter

C_EMI

Capacitors

See Design Consideration section for details

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 3

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings

only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations

sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Input Voltage

Continuous

All

VI

-0.5

-75

Vdc

Transient (Pulse duration = 1ms, square wave)

All

Vtr

-100

Vdc

Additionally: Transient Input Undervoltage,

Overvoltage and Impulse per ANSI T1.315-2001(R2006)

All

Reverse Polarity Protection

+75V

Vdc

Holdup Capacitor Voltage

Voltage (with respect to -48V_OUT)

All

V_HLDP

100

Vdc

Capacitance

All

C_HLDP

3300

F

Temperature

Normal Operating Ambient Temperature

(See Thermal Considerations section)

All

TA

-40

85

oC

Storage Temperature

All

Tstg

-55

125

oC

Isolation Voltage

Input to MGMT_PWR Output Voltage & Alarm

All

2250

Vdc

Input to SHELF_GND Voltage

All

2250

Vdc

Input to LOGIC_GND Voltage

All

2250

Vdc

CAUTION:

1. This power module is not internally fused. Both A & B feeds and their corresponding returns must be

individually fused.

To preserve maximum flexibility, internal fusing is not included. However, to achieve maximum safety and system protection, the

safety agencies require a fast-acting fuse with a maximum rating of 20 Amps and Voltage Rating >/= 75Vdc for the –48AF, -48BF

VRTN_AF & VRTN_BF feeds. Consult Fusing and fault protection Section of PICMG 3.0 ATCA specifications for additional information.

Based on the information provided in this data sheet on inrush current and maximum dc input current, the same type of fuse with a

lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 4

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter

Device

Symbol

Min

Typ

Max

Unit

-48V Dual Feed Inputs (-48_AF,-48_BF,VRTN_AF,VRTN_BF)

Input Voltage Range

All

VI

-36

-48

-75

Vdc

Output Current

With the following maximum power limits

400W @ 40Vin, 480W @ 48Vin, 540W @ 54Vin

All

II

10

Adc

Disabled input current drain if input voltage falls below VUVLO

for > 2 seconds.

All

IUVLO

10

mA

Enabled No-load input current

All

Istdby

40

70

mA

Inrush Transient

(@ -48 VI, C_FLTR = 200F & EARLY_A, EARLY_B Pre-charge

resistors 15 ohms per leg as recommended in the “ ATCA

Board Typical Application” figure, p=2)

All

Duration: 0.1ms to 0.9ms

Ipk

40

Adc

Duration: 0.9ms to 3 ms

(Logarithmically declining)

Ipk

40 to 18

Adc

ENABLE A/B Signal Inputs (ENABLE_A, ENABLE_B)

Input Voltage Threshold (On/Off); Default Setting

All

VUVHI (On)

-33.5

-35.3

-36.0

Vdc

VUVLO (Off)

-32.4

-33.7

-34.1

Enable A / B Signals current drain (Vin = -48Vdc)

All

380

Adc

Main Output (-48V_OUT, VRTN_OUT)

Efficiency (Vin=-48V; 3,3V/5.0V @ no load)

400W Output Power

All

η

98.2

%

300W Output Power

All

η

98.5

%

Output Voltage Delay

All

Tdelay

100

ms

Input Current Limit

All

Ilimit

11

13

15

A

External Output Filter Capacitance (C_FLTR)

All

C_FLTR

80

100

300

F

Holdup Capacitor Output Voltage (V_HLDP)

Holdup Capacitor Voltage Trim Range

All

V_HLDP

50

90

95

V

Holdup Capacitor Output Voltage Tolerance @V_HLDP=90Vdc

+6

-6

%

-48V_OUT Threshold

To charge external holdup capacitors (C_HLDP)

40.0

To discharge external holdup capacitors (C_HLDP)

-34.5

-36.0

-37.5

dV/dt on Hold-up Connect

80

V/ms

Switching Frequency

f

330

kHz

A/B Feed Loss / Fuse Alarm Output (ALARM)

ALARM ON Input Voltage Threshold

All

-36.4

-37.2

-40.4

Vdc

ALARM OFF Input Voltage Threshold

-40.5

Vdc

External Pull-up Voltage

5.0

Vdc

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 5

Electrical Specifications (continued)

Parameter

Output

Voltage

Symbol

Min

Typ

Max

Unit

+3.3V Isolated Management Power Output (+3V3)

Input Under-Voltage Lockout

All

-32.4

-33.7

-34.1

V

Turn-On Voltage Threshold

-34.5

V

Total Output Voltage Range

All

+3V3

3.170

3.350

3.430

V

(Over all operating input voltage, resistive Load and

temperature conditions until end of life).

Output Current

All

I O

0

―

3.6

Adc

Output Ripple and Noise

All

Measured across 10F ceramic capacitor

VI = VI,nom TA = 25oC, Io = Io,max

RMS (500 MHz bandwidth)

―

16

50

mVrms

Peak-to-peak (500MHz bandwidth)

―

75

200

mVp-p

Output Current- Limit Inception

All

Io,lim

―

4

6

Arms

Output Short-circuit Current

All

Io,sc

―

3

―

Arms

External Load Capacitance

All

CO,max

0

―

1000

F

Switching Frequency

All

f

330

kHz

Dynamic Response

(di/dt =0.1A/μs, VIin= Vin,nom, TA=25°C)

Load change from IO = 50% to 75% of IO, max,

Peak Deviation

Settling Time (VO<10% of peak deviation)

All

Vpk

ts

7

800

%, VO, set

s

Turn-On Delay

(Io = 80% of Io,max, TA=25°C)

All

Tdelay

50

ms

Output voltage overshoot

(Io = 80% of Io,max, VI = 48Vdc TA=25°C)

All

3%

%, VO, set

Output Over Voltage Protection

All

Vo, limit

3.7

5.4

V

+5.0V Isolated Management Power Output (+5V0)

Total Output Voltage Range

All

+5V0

4.80

5.00

5.20

V

(Over all operating input voltage, resistive Load and

temperature conditions until end of life).

Output Current

All

Io

0

―

150

mAdc

Output Current-Limit Inception

All

Io,lim

―

250

―

mA

Output Short-circuit Current

All

Io,sc

―

150

―

mARMS

External Load Capacitance

All

CO,max

0

―

1000

F

Switching Frequency

All

f

―

330

―

kHz

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 6

Digital Interface Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See

Feature Descriptions for additional information.

Parameter

Conditions

Symbol

Min

Typ

Max

Unit

Digital Signal Interface Characteristics

Clock frequency range

fCLK

100

400

kHz

Measurement Tolerance

Feed Voltage A/B (-48V_AF & -48V_BF)

+/-3

%

Holdup Voltage (V_HLDP)

+/-3

%

-48V_OUT current (-48V_IOUT)

% of Io,max

+/-3

%

Module Temperature (TEMP)

+/-3

0C

General Specifications

Parameter

Device

Min

Typ

Max

Unit

Calculated MTBF (PO=0.8PO, RATED, 48VIN, TA=40°C, Airflow=300LFM)

Telecordia Issue 2 Method 1 Case 3

All

2,308,563

Hours

Weight



28.3 (1.0)



g (oz.)

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 7

Characteristic Curves

The following figures provide typical characteristics for the PIM400X modules at 25ºC.

INPUT CURRENT, OUTPUT VOLTAGE

IIN (A) (2Adiv) VO (V) (20V/div)

TIME, t (2ms/div)

TIME, t (200s/div)

Figure 1. Inrush Current

CH2: VRTN_OUT wrt -48Vout (Vo)

CH4: Input current (IIN)

Test Conditions:

48Vin, 400W, C_FLTR = 100uF

Fig 2: Input Transient on one feed

CH1: Feed B step to 60V (20V/Div)

CH2: Feed A at 48V (20V/Div)

CH3: VRTN_OUT (20V/Div)

Test Conditions:

Full load

TIME, t (2ms/div)

Fig 3: Hold-up Event vs 3.3Vout

CH1: Feed A (20V/Div)

CH2: Hold-up Voltage (20V/Div)

CH3: VRTN_OUT (20V/Div)

CH4: 3.3Vout (2V/Div)

Test Conditions:

1. Payload Bus Converter: QBVW033A0B

2. Load: 12.0V Bus Converter Output @ 33A; 3.3V@3.6A

3. C_Hold-up = 2200 F

4. C_FLTR=220F

5. V_HLDP=90V

Fig 4: Hold-up Event vs 12.0Vout

CH1: Feed A (20V/Div)

CH2: Hold-up Voltage (20V/Div)

CH3: VRTN_OUT (20V/Div)

CH4: 12.0 Vout (5V/Div)

Test Conditions:

1. Payload Bus Converter: QBVW033A0B

2. Load: 12.0V Bus Converter Output @ 33A; 3.3V@3.6A

3. C_Hold-up = 2200 F

4. C_FLTR=220F

5. V_HLDP=90V

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 8

Characteristic Curves (continued)

The following figures provide typical characteristics for the PIM400X modules at 25ºC.

TIME, t (20ms/div)

TIME, t (10ms/div)

Fig 5: Turn-ON Threshold

CH1: Input Voltage (20V/Div)

CH2: VRTN_OUT voltage (20V/Div)

CH4: Input Current (5A/Div)

Fig 6: Turn-OFF Threshold

CH1: Input Voltage (20V/Div)

CH2: VRTN_OUT voltage (20V/Div)

CH4: Input Current (2A/Div)

-48VIN, +12.0V

(20Vdiv) (5V/div)

-48VIN, +3.3V

(20Vdiv) (5V/div)

TIME, t (10ms/div)

Fig 7a: Line Transient performance per ANSI T1.315-2001

standard vs +12.0V output

CH1: +12Voutput voltage (5V/Div)

CH3: -48V input Voltage (20V/Div)

Test Conditions:

1. PIM400 + QBDW033A0 (12V Bus Converter)

2. Load: +12Vout @ 30A; 3.3V @ 3.0A

3. C_HLDP = 2200 F

4. C_FLTR) = 220 F

Fig 7b: Line Transient performance per ANSI T1.315-2001

standard vs 3.3V output

CH2: +3V3 Output Voltage (1V/Div)

CH3: -48V input Voltage (20V/Div)

Test Conditions:

5. PIM400 + QBDW033A0 (12V Bus Converter)

6. Load: +12Vout @ 30A; 3.3V @ 3.0A

7. C_HLDP = 2200 F

8. C_FLTR) = 220 F

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 9

Characteristic Curves (continued)

The following figures provide typical characteristics for the PIM400X modules at 25ºC.

EFFICIENCY,  (%)

POWER DISSIPATION, (W)

OUTPUT CURRENT, IO (A)

Io1 = 0A

OUTPUT CURRENT, IO (A)

Io1 = 0A

Fig8a: Efficiency vs Output Current

Test Conditions:

No load on 3.3V output

Fig 8b: Power Dissipation vs Output Current

Test Conditions:

No load on 3.3V output

EFFICIENCY,  (%)

POWER DISSIPATION, (W)

OUTPUT CURRENT, IO (A)

Io1 = 3.6A

OUTPUT CURRENT, IO (A)

Io1 = 3.6A

Fig 9a: Efficiency

Test Conditions:

Full load on 3.3V output

Fig 9b: Power Dissipation

Test Conditions:

Full load on 3.3V output

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 10

Characteristic Curves (continued)

The following figures provide typical characteristics for the PIM400X modules at 25ºC.

IOUT, +3.3Vo

(2A/div) (1V/div)

IOUT, +3.3Vo (ac)

(1A/div) (500mV/div)

TIME, t (0.500ms/div)

TIME, t (500s/div)

Fig 10: 3.3V Turn-On

Test Conditions:

Cout=10F ceramic

Fig 11: 3.3V Load Transient

Test Conditions:

Cout =10F ceramic

Step Load Change = 50%-75%-50% of Iout,max

Slew Rate = 1 A/s

OUTPUT VOLTAGE

VO (AC) (20mV/div)

ALARM OUTPUT INPUT VOLTAGE

VALARM (2.0V/div) VIN (20V/div)

TIME, t (2s/div)

TIME, t (5ms/div)

Fig 12: 3.3V Ripple

Test Conditions:

Cout=10F ceramic

Iout=3.6A

Fig 13: ALARM Output change of state with input voltage

dropout

GE

Preliminary Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 11

PIM400 Internal Block Diagram

PIN FUNCTIONS

Pin No.

Signal Name

Description

1

-48V_AF

-48V_A Feed (Externally Fused)

2

-48V_BF

-48V_B Feed (Externally Fused)

3

VRTN_AF

VRTN_A Feed (Externally Fused)

4

VRTN_BF

VRTN_B Feed (Externally Fused)

5

ENABLE_AF

ENABLE_A Feed (Externally Fused)

(Short Pin, connected to VRTN_A on the back plane)

6

ENABLE_BF

ENABLE_B Feed (Externally Fused)

(Short Pin, connected to VRTN_B on the back plane)

7

SHELF_GND

Shelf / Chassis / Safety Ground

8

+5V0

Isolated 5.0Vdc (Blue LED Power) w.r.t. LOGIC_GND

9

+3V3

Isolated 3.3Vdc (Management Power) w.r.t. LOGIC_GND

10**

ADD

I2C Address w.r.t. LOGIC_GND

11**

DAT

I2C Data w.r.t. LOGIC_GND

12**

CLK

I2C Clock w.r.t. LOGIC_GND

13

LOGIC_GND

Logic / Secondary / Isolated Ground

14

ALARM

Opto-isolated -48V A/B Feed Loss or Open Fuse Alarm (w.r.t LOGIC_GND)

15

-48V_OUT

OR’d and Inrush protected –48V Output Bus

16

TRIM_HLDP

Holdup capacitor output voltage trim w.r.t. -48V_OUT

17

VRTN_OUT

OR’d and Inrush protected VRTN Output Bus

18

V_HLDP

+ve terminal connection point for Holdup capacitor

** Pins 10, 11 & 12 are present only on modules with I2C digital interface option (-K)

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 12

Feature Descriptions

Introduction

The PIM400X module is designed to support the Advanced

Telecommunications Computing Architecture (ATCA) power

entry distribution requirements for the Front Board / Blade per

the PICMG 3.0 specifications.

The PICMG 3.0 specification defines the Mechanical, Shelf

Management Interface, Power Distribution, Thermal, Data I/O

and Regulatory requirements for the next generation of

modular telecom architecture platform for use in Central Office

telecom environments.

Input Pin Connections

The ATCA board is specified to accept up to a maximum of

400W of input power via dual, redundant -48Vdc Feeds

through the Zone 1 (Power and Management) connector,

designated P10.

The power connector provides board to backplane

engagement via pins of varying lengths. Please consult the

PICMG 3.0 specifications for details.

The following are the design considerations of the input pin

connections of the PIM400X to the ATCA power connector.

From

ATCA

(P10 Connector)

Connection

Requirement

To

PIM400X

#

Designation

#

Signal

Designation

33

-48V_A

Via Fuse(F3)

1

-48V_AF

34

-48V_B

Via Fuse(F4)

2

-48V_BF

28

VRTN_A

Via Fuse(F1)

3

VRTN_AF

29

VRTN_B

Via Fuse(F2)

4

VRTN_BF

30

EARLY_A

Via Resistor(R1) *

-48V_A

31

EARLY_B

Via Resistor(R2) *

-48V_B

32

ENABLE_A

Via Fuse(F5)

5

ENABLE_AF

27

ENABLE_B

Via Fuse(F6)

6

ENABLE_BF

25

SHELF_GND

Direct

7

SHELF_GND

26

LOGIC_GND

Direct

11

LOGIC_GND

* Pre-charge resistors

The first pins to mate in the ATCA power connector are the

EARLY_A, EARLY_B, the two grounds (LOGIC_GND, SHELF_GND)

and the two returns (VRTN_A, VRTN_B); followed by staggered

connections of -48V_A and -48V_B power Feeds. The last pins

to engage are the two short pins, ENABLE_A & ENABLE_B. The

ATCA backplane connects the ENABLE_A to VRTN_A, ENABLE_B

to VRTN_B, EARLY_A to -48V_A and EARLY_B to -48V_B.

EARLY_A & EARLY_B Connections: During hot insertion of the

ATCA board, the Inrush Control circuit limits the surge current

to the C_FLTR capacitor. However, due to the presence of a

small amount of internal EMI filter capacitance (located before

the Inrush Control circuit), it is recommended that Precharge

resistors, R1 & R2 (100 Ohms, with appropriate surge capability)

be connected as shown in the Typical Application circuit.

Output Pin Connections (Standard Module: PIM400Z)

The output pin connections of the PIM400X to the system board

are described below:

From

PIM400X

To

ATCA Front Board

Notes

#

Designation

Terminal

Component

15

-48V_OUT

Vin(-)

DC/DC Converter

(1)

17

VRTN_OUT

Vin(+)

DC/DC Converter

18

V_HLDP

+ve

Holdup Capacitor

(2)

16

TRIM_HLDP

RTrim

Holdup Capacitor

8

+5V0

Management

Power

(3)

9

+3V3

14

ALARM

Rpull-up

IPM/System

Controller

(4)

Additional Output Pin Connections (Modules with

optional I2C Digital Interface: Option - K)

The following additional output pins of the PIM400KZ available

for I2C Digital Interface to the IMP/System Controller are

defined below:

From

PIM400KZ

To

ATCA Front Board

Notes

#

Designation

IPM/System Controller I2C

Interface

10

ADD

I2C Address w.r.t. LOGIC_GND

(5)

11

DAT

I2C Data w.r.t. LOGIC_GND

12

CLK

I2C Clock w.r.t. LOGIC_GND

Inrush Current Control / Hot Plug Functionality

The module provides inrush current control / hot plug

capability. The peak value of the inrush current and the

duration complies with the PICMG 3.0’s Inrush Transient

specifications. The specifications shall be met with the external

C_HLDP and C_FLTR capacitances as specified in the previous

sections.

The unique design of the module where the large energy

storage capacitors are segregated from the input filter

capacitors allows the module to meet the stringent PICMG’s

inrush transient specifications with minimal energy storage

capacitors.

Design Considerations

-48V Main Output Bus:

(Signal Names: -48V_OUT & VRTN_OUT)

This is the main -48V output bus that provides the payload

power to the downstream (one or more) DC/DC converters. The

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 13

PIM400X module does not regulate or provide isolation from

the input -48V A/B feeds.

The main functionality of the module is to provide -48V A/B

Feeds OR’ing, inrush protection for hot swap capability and EMI

filtering to attenuate the noise generated by the downstream

DC/DC converters.

 The -48V_OUT pin connects to the Vin(-) pin and the

VRTN_OUT pin connects to the Vin(+) pin of the DC/DC

converter(s).

 The -48V_OUT bus may require a fuse depending on

the power and fusing requirements of the DC/DC

converter.

 Input filtering of the DC/DC converter is provided by

C_FLTR close to the input pins of the DC/DC

converter(s); additional high frequency decoupling

ceramic capacitors (0.01 to 0.1μF are recommended

for improved EMI performance.

 The maximum C_FLTR capacitance across all the

downstream DC/DC converters should not exceed

300μF.

 The minimum C_FLTR capacitance (80μF)

recommendation is based on meeting the EMI

requirements.

Holdup Capacitor Output Voltage (V_HLDP)

This output provides the user settable high voltage to charge

the C_HLDP capacitor(s) to allow the ATCA board to meet the

5ms, 0Volts transient requirements.

 The V_HLDP pin connects to the +ve terminals of the

C_HLDP capacitors while the –ve terminals of the

C_HLDP connects to the -48V_OUT bus.

 The C_HLDP capacitance is dependent on the system

power and the holdup time requirements based on

the following formula

Where THU is the desired holdup time, PHU is the holdup power

drawn from the holdup capacitors (=input power of the

downstream DC/DC bus converter + Management Power),

V_HLDP is the trimmed holdup capacitor voltage and VUV is the

undervoltage lockout threshold of either the downstream bus

or the Management Power DC/DC converter (higher of the two).

Holdup Capacitor Trim Voltage (TRM_HLDP)

The resistor R_TRIM sets the external holdup capacitor voltage

to the desired setting. The output voltage is adjustable from 50

to 90V. The resistor, R_TRIM is selected by the following

equation:

High Voltage Discharge Mechanism:

Per the PICMG 3.0 specifications, the PIM400 provides an

internal discharge mechanism to discharge the holdup/bulk

capacitance to less than -60Vdc and less than 20 joules within

one second of disconnection from the backplane.

Management Power (+3V3, +5V0)

Two isolated secondary output voltages (+3V3 & +5V0) are

provided for ATCA Front Board’s IPM/System Controller (3.3V)

and for the Blue LED’s (5.0V) power requirements. Both the

outputs are referenced to LOGIC_GND.

 The management power is available even when the

input voltage is down to –36Vdc.

 No additional output capacitors are required, but a

22μF tantalum/ceramic and a 0.01 to 0.1μF ceramic

capacitors are highly recommended to contain the

switching ripple and noise.

Input Fault Alarm Signal (ALARM)

Both the input feeds, -48V_AF & -48_BF are monitored via the -

48V_ALARM signal. In the event of a loss of power from either

feeds (-48V_A or -48V_B) or the opening of their respective

fuses, the -48V_ALARM shall change its logical state indicating

a fault. During normal operation, the signal is Low. During fault

condition, the alarm signal shall assume a HI state when the

ALARM pin is pulled up to an external pull voltage (maximum

5.0V) via an external pullup resistor (RPullup). The ALARM output is

internally referenced to the LOGIC_GND. A 3.3K pull up resistor

to 3.3V Management Power should suffice.

EMI Filtering

The module incorporates an EMI filter that is designed for the

ATCA board to help meet the conducted emissions

requirements of CISPR 22 Class B when used in conjunction

with GE’s DC/DC bus converters recommended for ATCA

applications.

The following Figure 14 depicts the Class B EMI performance of

PIM400F when tested with GE’s bus converter, QBVW033A0B1

with both modules mounted on the PIM400 Evaluation Board

together with additional high frequency EMI capacitors (Fig 15).

Figure 14. Typical Class B EMC signature of PIM400F

as tested with GE’s bus converter, QBVW033A0B1

module.

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 14

Figure 15. PIM400 & QBVW033A0 Bus Converter Test

setup schematic

For Safety and noise considerations, copper traces must not be

routed directly under the power module (PWB top layer). C_EMI

capacitors must make direct connections (preferably without

vias) to the bus converter (DC/DC) module pins with as much

copper width as possible. In case vias are necessary, allow for

multiple connections to the inner plane with vias placed outside

the footprint of the module. For additional layout guide-lines,

refer to GE’s FLT012A0Z Input Filter Module data sheet.

Safety Considerations

For safety-agency approval of the system in which the power

module is used, the power module must be installed in

compliance with the spacing and separation requirements of

the end-use safety agency standard, i.e. UL* 60950-1, 2nd Ed.

Recognized, CSA† C22.2 No. 60950-1-07 Certified, and VDE‡

(EN60950-1, 2nd Ed.) Licensed.

The power input to these units is to be provided with a

maximum of fast acting 20A fuses with a voltage rating of at

least 75Vdc.

Refer to “Thermal Consideration” section for additional safety

considerations.

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be provided

to help ensure reliable operation.

Considerations include ambient temperature, airflow, module

power dissipation, and the need for increased reliability. A

reduction in the operating temperature of the module will result

in an increase in reliability. The thermal data presented here is

based on physical measurements taken in a wind tunnel.

The thermal reference point, Tref, used in the specifications is

shown in Figure 16. For reliable operation this temperature

should not exceed 130oC.

Figure 16. Tref Temperature Measurement Location.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating curves showing the

maximum output current that can be delivered by

each module versus local ambient temperature (TA)

for natural convection and up to 2 m/s (400 lfm) forced airflow

are shown in Figures 17 & 18.

Please refer to the Application Note “Thermal Characterization

Process For Open-Frame Board-Mounted Power Modules” for a

detailed discussion of thermal aspects including maximum

device temperatures.

- 48V OUTPUT CURRENT (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 17. -48V Output Current Derating for the Module;

Airflow in the Transverse Direction from Pin7 to Pin1; Vin

=48V & 3.3V @ 1.5A.

3.3V OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, TA (oC)

Figure 18. 3.3V Output Current Derating for the Module;

Airflow in the Transverse Direction from Pin7 to Pin1; Vin

=48V & -48V Output current = 4A.

AIRFLOW

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 15

Layout Considerations

The power modules are low profile in order to be used in fine

pitch system card architectures. As such, component

clearance between the bottom of the power module and the

mounting board is limited. Avoid placing copper areas on the

outer layer directly underneath the power module. Also avoid

placing via interconnects underneath the power module.

Particular attention should be paid to the clearance area as

noted in the Bottom View of the Mechanical Outline drawing.

For additional layout guidelines, refer to FLT012A0Z Data Sheet.

Process Considerations

Through-Hole Lead-Free Soldering Information

The RoHS-compliant, Z version, through-hole products use the

SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. The module is designed to be processed through

single or dual wave soldering machines. The pins have a RoHS-

compliant, pure tin finish that is compatible with both Pb and

Pb-free wave soldering processes. A maximum preheat rate of

3C/s is suggested. The wave preheat process should be such

that the temperature of the power module board is kept below

210C. For Pb solder, the recommended pot temperature is

260C, while the Pb-free solder pot is 270C max.

Reflow Lead-Free Soldering Information

The RoHS-compliant through-hole products can be processed

with paste-through-hole Pb or Pb-free reflow process.

Max. sustain temperature :

245C (J-STD-020C Table 4-2: Packaging Thickness>=2.5mm /

Volume > 2000mm3),

Peak temperature over 245C is not suggested due to the

potential reliability risk of components under continuous high-

temperature.

Min. sustain duration above 217C : 90 seconds

Min. sustain duration above 180C : 150 seconds

Max. heat up rate: 3C/sec

Max. cool down rate: 4C/sec

In compliance with JEDEC J-STD-020C spec for 2 times reflow

requirement.

Pb-free Reflow Profile

BMP module will comply with J-STD-020 Rev. C

(Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices) for both Pb-

free solder profiles and MSL classification

procedures. BMP will comply with JEDEC J-STD-020C

specification for 3 times reflow requirement. The suggested Pb-

free solder paste is Sn/Ag/Cu (SAC). The recommended linear

reflow profile using Sn/Ag/Cu solder is shown in Figure 19.

MSL Rating

The modules have a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling

procedures for moisture-sensitive surface mount packages is

detailed in J-STD-033 Rev. A (Handling,

Packing, Shipping and Use of Moisture/Reflow Sensitive Surface

Mount Devices). Moisture barrier bags (MBB) with desiccant are

required for MSL ratings of 2 or greater. These sealed

packages should not be broken until time of use. Once the

original package is broken, the floor life of the product at

conditions of 30°C and 60% relative humidity varies according

to the MSL rating (see J-STD-033A). The shelf life for dry packed

SMT packages will be a minimum of 12 months from the bag

seal date, when stored at the following conditions: < 40° C, <

90% relative humidity.

Time

Temp

Ramp up

max. 3°C/Sec

Ramp down

max. 4°C/Sec

Time Limited 90 Sec.

above 217°C

Preheat time

100-150 Sec.

Peak Temp. 240-245°C

25°C

150°C

200°C

217°C

Figure 19. Recommended linear reflow profile using

Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly

process prior to electrical board testing. The result of

inadequate cleaning and drying can affect both the reliability of

a power module and the testability of the finished circuit-board

assembly. For guidance on appropriate soldering, cleaning and

drying procedures, refer to GE Board Mounted Power Modules:

Soldering and Cleaning Application Note (AP01-056EPS).

For additional information, please contact your Sales

representative for more details.

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 16

Digital Feature Descriptions

Full featured modules are available with I2C Digital Interface

(Option -K).

Modules with I2C capability monitor up to five analog

parameters and six status bits identified below in Tables 1and 2

respectively.

Modules with I2C Option Features:

Table 1: Internal register memory map

Table 2: Digital signals

Note: Bit 0=LSB, Bit 7=MSB

I2C Command Structure:

The I2C is a 2-wire interface supporting multiple devices and

masters on a single bus. The connected devices can only pull

the bus wires low and they never drive the bus high. The bus

wires should be externally connected to a positive supply

voltage via a pull-up resistor. When the bus is idle, both DAT

and CLK are high. The max sink current supported on the I2C

bus is 3.5mA.

Each device on the I2C bus is recognized by a unique address

stored in that device. Devices can be classified as masters or

slaves when performing data transfers. A master is a device

which initiates a data transfer on the bus and generates clock

signals to permit that transfer. At the same time, any device

addressed is considered slave. The PIM400 always acts as a

slave.

In PIM400 module, I2C interface is used for reporting critical

parameters like input voltage, output current, holdup capacitor

voltage and temperature data. The read protocol is shown in

the Fig 20 below.

Fig 20: Typical I2C Read protocol

Address Structure:

7 bit Address + R/W bit

Four bits are fixed (0101), three bits (xyz) are variable, and the

least-significant bit is the read/write bit.

8 bit Address

0101

xyz*

R/W

Table 3: Address structure

Address Selection:

The three bits (xyz) of the address are set with a single external

resistor from the ADD (pin10) to LOGIC_GND (pin 13). The 8

possible addresses are shown in Table 4 with the respective

resistance values.

Table 4: I2C Addressing

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 17

Mechanical Outline

Dimensions are in millimeters and (inches).

Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]

x.xx mm  0.25 mm (x.xxx in  0.010 in.)

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 18

Recommended Pad Layout

Dimensions are in millimeters and (inches).

Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]

x.xx mm  0.25 mm (x.xxx in  0.010 in.)

NOTES:

1. FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE

Pin No.

Signal Name

Pin No.

Signal Name

1

-48V_AF

10**

ADD

2

-48V_BF

11**

DAT

3

VRTN_AF

12**

CLK

4

VRTN_BF

13

LOGIC_GND

5

ENABLE_AF

14

ALARM

6

ENABLE_BF

15

-48V_OUT

7

SHELF_GND

16

TRIM_HLDP

8

+5V0

17

VRTN_OUT

9

+3V3

18

V_HLDP

* * Pins 10, 11 & 12 are present only on modules with I2C digital interface option (-K).

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

June 10, 2015

Page 19

Packaging Details

The modules are supplied as standard in the plastic trays shown in Figure below.

Tray Specification

Material Antistatic coated PVC

Max surface resistivity 1012/sq

Color Clear

Capacity 12 power modules

Min order quantity 24 pcs (1 box of 2 full trays + 1 empty top tray)

Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the modules

will contain 2 full trays plus 1 empty hold down tray giving a total number of 24 power modules.

Notes:

1. All radius unspecified are R2.0mm

2. All angle unspecified are 50

3. Dimension unit: mm(L); A0(A).

GE

Data Sheet

PIM400 Series; ATCA Board Power Input Modules

-36 to -75 Vdc; 400W/10A

Contact Us

For more information, call us at

USA/Canada:

+1 877 546 3243, or +1 972 244 9288

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

www.gecriticalpower.com

GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no

liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)

or information.

June 10, 2015

Version 1.07

Ordering Information

Please contact GE’s Sales Representative for pricing, availability and optional features.

Table 1. Device Code

Input Voltage

Current

Rating

Auxiliary

Output #1

Auxiliary

Output #2

Options

Product codes

Comcodes

-36 to -75 Vdc

10A

3.3V/3.6A

5.0V/0.15A

-

PIM400Z

150019196

-36 to -75 Vdc

10A

3.3V/3.6A

5.0V/0.15A

I2C Digital Interface

PIM400KZ

150019197

-36 to -75 Vdc

10A

3.3V/3.6A

5.0V/0.15A

I2C Digital Interface & Short

pins (3.68mm)

PIM400K6Z

150033384

Table 2. Device Options

Option

Device Code Suffix

Short pins: 3.68mm ± 0.25mm (0.145 in. ± 0.010 in.)

6

Short pins: 2.79mm ± 0.25mm (0.110 in. ± 0.010 in.)

8

I2C Digital Interface

K

Table 3. Related Products

Description

Product Code

Comcode

PIM400 Evaluation Board

EVAL_PIM400

150030502

QBDW033A0B Series Power Modules; DC-DC Converters

36-75Vdc Input; 8.1-13.2Vdc Output; 33A Output Current

QBDW033A0B41Z

CC109159307

QBVW033A0B Series Power Modules; DC-DC Converters

36-75Vdc Input; 8.1-13.2Vdc Output; 33A Output Current

QBVW033A0B41Z

CC109165247