DS80C320/DS80C323 High-Speed/Low-Power Micro www.dalsemi.com FEATURES PIN ASSIGNMENT 80C32-Compatible - 8051 pin and instruction set compatible - Four 8-bit I/O ports - Three 16-bit timer/counters - 256 bytes scratchpad RAM - Addresses 64 kB ROM and 64 kB RAM High-speed architecture - 4 clocks/machine cycle (8032=12) - DC to 33 MHz (DS80C320) - DC to 18 MHz (DS80C323) - Single-cycle instruction in 121 ns - Uses less power for equivalent work - Dual data pointer - Optional variable length MOVX to access fast/slow RAM/peripherals High integration controller includes: - Power-fail reset - Programmable watchdog timer - Early-warning power-fail interrupt Two full-duplex hardware serial ports 13 total interrupt sources with six external Available in 40-pin DIP, 44-pin PLCC and TQFP 1 of 42 112299 DS80C320/DS80C323 DESCRIPTION The DS80C320/DS80C323 is a fast 80C31/80C32-compatible microcontroller. Wasted clock and memory cycles have been removed using a redesigned processor core. As a result, every 8051 instruction is executed between 1.5 and 3 times faster than the original for the same crystal speed. Typical applications will see a speed improvement of 2.5 times using the same code and same crystal. The DS80C320 offers a maximum crystal rate of 33 MHz, resulting in apparent execution speeds of 82.5 MHz (approximately 2.5X). The DS80C320/DS80C323 is pin-compatible with all three packages of the standard 80C32 and offers the same timer/counters, serial port, and I/O ports. In short, the device is extremely familiar to 8051 users but provides the speed of a 16-bit processor. The DS80C320 provides several extras in addition to greater speed. These include a second full hardware serial port, seven additional interrupts, programmable watchdog timer, power-fail interrupt and reset. The device also provides dual data pointers (DPTRs) to speed block data memory moves. It can also adjust the speed of off-chip data memory access to between two and nine machine cycles for flexibility in selecting memory and peripherals. The DS80C320 operating voltage ranges from 4.25V to 5.5V, making it ideal as a high-performance upgrade to existing 5V systems. For applications in which power consumption is critical, the DS80C323 offers the same feature set as the DS80C320, but with 2.7V to 5.5V operation. ORDERING INFORMATION PART NUMBER DS80C320-MCG DS80C320-QCG DS80C320-ECG DS80C320-MNG DS80C320-QNG DS80C320-ENG DS80C320-MCL DS80C320-QCL DS80C320-ECL DS80C320-MNL DS80C320-QNL DS80C320-ENL PACKAGE 40-pin plastic DIP 44-pin PLCC 44-pin TQFP 40-pin plastic DIP 44-pin PLCC 44-pin TQFP 40-pin plastic DIP 44-pin PLCC 44-pin TQFP 40-pin plastic DIP 44-pin PLCC 44-pin TQFP DS80C323-MCD DS80C323-QCD DS80C323-ECD 40-pin plastic DIP 44-pin PLCC 44-pin TQFP MAX CLOCK SPEED 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz 33 MHz TEMPERATURE RANGE 0C to +70C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C 0C to +70C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C 18 MHz 18 MHz 18 MHz 0C to +70C 0C to +70C 0C to +70C 2 of 42 DS80C320/DS80C323 DS80C320 BLOCK DIAGRAM Figure 1 3 of 42 DS80C320/DS80C323 PIN DESCRIPTION Table 1 DIP 40 20 9 PLCC 44 22, 23 10 TQFP 38 16, 17 4 SIGNAL NAME VCC GND RST 18 19 20 21 14 15 XTAL2 XTAL1 29 32 26 PSEN 30 33 27 ALE 39 38 37 36 35 34 33 32 1-8 43 42 41 40 39 38 37 36 2-9 37 36 35 34 33 32 31 30 40-44 1-3 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 P1.0-P1.7 1 2 3 4 5 6 2 3 4 5 6 7 40 41 42 43 44 1 7 8 8 9 2 3 DESCRIPTION VCC - +5V. (+3V DS80C323) GND - Digital circuit ground. RST - Input. The RST input pin contains a Schmitt voltage input to recognize external active high Reset inputs. The pin also employs an internal pulldown resistor to allow for a combination of wired OR external Reset sources. An RC is not required for power-up, as the device provides this function internally. XTAL1, XTAL2 - The crystal oscillator pins XTAL1 and XTAL2 provide support for parallel resonant, AT cut crystals. XTAL1 acts also as an input in the event that an external clock source is used in place of a crystal. XTAL2 serves as the output of the crystal amplifier. PSEN - Output. The Program Store Enable output. This signal is commonly connected to external ROM memory as a chip enable. PSEN will provide an active low pulse width of 2.25 XTAL1 cycles with a period of four XTAL1 cycles. PSEN is driven high when data memory (RAM) is being accessed through the bus and during a reset condition. ALE - Output. The Address Latch Enable output functions as a clock to latch the external address LSB from the multiplexed address/data bus. This signal is commonly connected to the latch enable of an external 373 family transparent latch. ALE has a pulse width of 1.5 XTAL1 cycles and a period of four XTAL1 cycles. ALE is forced high when the device is in a Reset condition. AD0-7 (Port 0) - I/O. Port 0 is the multiplexed address/data bus. During the time when ALE is high, the LSB of a memory address is presented. When ALE falls, the port transitions to a bi-directional data bus. This bus is used to read external ROM and read/write external RAM memory or peripherals. The Port 0 has no true port latch and can not be written directly by software. The reset condition of Port 0 is high. No pullup resistors are needed. Port 1 - I/O. Port 1 functions as both an 8-bit bi-directional I/O port and an alternate functional interface for Timer 2 I/O, new External Interrupts, and new Serial Port 1. The reset condition of Port 1 is with all bits at a logic 1. In this state, a weak pullup holds the port high. This condition also serves as an input mode, since any external circuit that writes to the port will overcome the weak pullup. When software writes a 0 to any port pin, the device will activate a strong pulldown that remains on until either a 1 is written or a reset occurs. Writing a 1 after the port has been at 0 will cause a strong transition driver to turn on, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output high (and input) state. The alternate modes of Port 1 are outlined as follows: Port Alternate Function P1.0 T2 External I/O for Timer/Counter 2 P1.1 T2EX Timer/Counter 2 Capture/Reload Trigger P1.2 RXD1 Serial Port 1 Input P1.3 TXD1 Serial Port 1 Output P1.4 INT2 External Interrupt 2 (Positive Edge Detect) P1.5 P1.6 INT4 External Interrupt 3 (Negative Edge Detect) External Interrupt 4 (Positive Edge Detect) P1.7 INT5 External Interrupt 5 (Negative Edge Detect) INT3 4 of 42 DIP 21 22 23 24 25 26 27 28 PLCC 24 25 26 27 28 29 30 31 TQFP 18 19 20 21 22 23 24 25 SIGNAL NAME A8 (P2.0) A9 (P2.1) A10 (P2.2) A11 (P2.3) A12 (P2.4) A13 (P2.5) A14 (P2.6) A15 (P2.7) 10-17 11, 13-19 5, 7-13 P3.0-P3.7 10 11 12 13 14 15 16 17 31 11 13 14 15 16 17 18 19 35 5 7 8 9 10 11 12 13 29 EA - 12 34 1 6 28 39 - NC DS80C320/DS80C323 DESCRIPTION A15-A8 (Port 2) - Output. Port 2 serves as the MSB for external addressing. P2.7 is A15 and P2.0 is A8. The device will automatically place the MSB of an address on P2 for external ROM and RAM access. Although Port 2 can be accessed like an ordinary I/O port, the value stored on the Port 2 latch will never be seen on the pins (due to memory access). Therefore writing to Port 2 in software is only useful for the instructions MOVX A, @Ri or MOVX @Ri, A. These instructions use the Port 2 internal latch to supply the external address MSB. In this case, the Port 2 latch value will be supplied as the address information. Port 3 - I/O. Port 3 functions as both an 8-bit bi-directional I/O port and an alternate functional interface for External Interrupts, Serial Port 0, Timer 0 & 1 Inputs, RD and WR strobes. The reset condition of Port 3 is with all bits at a logic 1. In this state, a weak pullup holds the port high. This condition also serves as an input mode, since any external circuit that writes to the port will overcome the weak pullup. When software writes a 0 to any port pin, the device will activate a strong pulldown that remains on until either a 1 is written or a reset occurs. Writing a 1 after the port has been at 0 will cause a strong transition driver to turn on, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes both the output high and input state. The alternate modes of Port 3 are outlined below: Port Alternate Mode P3.0 RXD0 Serial Port 0 Input P3.1 TXD0 Serial Port 0 Output P3.2 INT0 External Interrupt 0 P3.3 INT1 External Interrupt 1 P3.4 T0 Timer 0 External Input P3.5 T1 Timer 1 External Input P3.6 WR External Data Memory Write Strobe RD External Data Memory Read Strobe P3.7 EA - Input. This pin must be connected to ground for proper operation. NC - Reserved. These pins should not be connected. They are reserved for use with future devices in this family. NC - Reserved. These pins are reserved for additional ground pins on future products. 80C32 COMPATIBILITY The DS80C320/DS80C323 is a CMOS 80C32-compatible microcontroller designed for high performance. In most cases it will drop into an existing 80C32 design to significantly improve the operation. Every effort has been made to keep the device familiar to 8032 users, yet it has many new features. In general, software written for existing 80C32-based systems will work on the DS80C320/DS80C323. The exception is critical timing since the High-Speed Microcontroller performs its instructions much faster than the original. It may be necessary to use memories with faster access times if the same crystal frequency is used. Application note 57 "DS80C320 Memory Interface Timing" is a useful tool to help the embedded system designer select the proper memories for her or his application. The DS80C320/DS80C323 runs the standard 8051 instruction set and is pin-compatible with an 80C32 in any of three standard packages. It also provides the same timer/counter resources, full-duplex serial port, 256 bytes of scratchpad RAM and I/O ports as the standard 80C32. Timers will default to a 12 clock per 5 of 42 DS80C320/DS80C323 cycle operation to keep timing compatible with original 8051 systems. However, they can be programmed to run at the new 4 clocks per cycle if desired. New hardware features are accessed using Special Function Registers that do not overlap with standard 80C32 locations. A summary of these SFRs is provided below. The DS80C320/DS80C323 addresses memory in an identical fashion to the standard 80C32. Electrical timing will appear different due to the high-speed nature of the product. However, the signals are essentially the same. Detailed timing diagrams are provided below in the electrical specifications. This data sheet assumes the user is familiar with the basic features of the standard 80C32. In addition to these standard features, the DS80C320/DS80C323 includes many new functions. This data sheet provides only a summary and overview. Detailed descriptions are available in the User's Guide located in the front of the High-Speed Microcontroller data book. COMPARATIVE TIMING OF THE DS80C320/DS80C323 AND 80C32 Figure 2 DS80C320/DS80C323 TIMING STANDARD 80C32 TIMING 6 of 42 DS80C320/DS80C323 HIGH-SPEED OPERATION The DS80C320/DS80C323 is built around a high speed 80C32 compatible core. Higher speed comes not just from increasing the clock frequency, but from a newer, more efficient design. In this updated core, dummy memory cycles have been eliminated. In a conventional 80C32, machine cycles are generated by dividing the clock frequency by 12. In the DS80C320/DS80C323, the same machine cycle is performed in 4 clocks. Thus the fastest instruction, one machine cycle, is executed three times faster for the same crystal frequency. Note that these are identical instructions. A comparison of the timing differences is shown in Figure 2. The majority of instructions will see the full 3 to 1 speed improvement. Some instructions will get between 1.5 and 2.4 X improvement. Note that all instructions are faster than the original 80C51. Table 2 below shows a summary of the instruction set including the speed. The numerical average of all opcodes is approximately a 2.5 to 1 speed improvement. Individual programs will be affected differently, depending on the actual instructions used. Speed-sensitive applications would make the most use of instructions that are three times faster. However, the sheer number of 3 to 1 improved opcodes makes dramatic speed improvements likely for any code. The Dual Data Pointer feature also allows the user to eliminate wasted instructions when moving blocks of memory. INSTRUCTION SET SUMMARY All instructions in the DS80C320/DS80C323 perform the same functions as their 80C32 counterparts. Their effect on bits, flags, and other status functions is identical. However, the timing of each instruction is different. This applies both in absolute and relative number of clocks. For absolute timing of real-time events, the timing of software loops will need to be calculated using the table below. However, counter/timers default to run at the older 12 clocks per increment. Therefore, while software runs at higher speed, timer-based events need no modification to operate as before. Timers can be set to run at 4 clocks per increment cycle to take advantage of higher speed operation. The relative time of two instructions might be different in the new architecture than it was previously. For example, in the original architecture, the "MOVX A, @DPTR" instruction and the "MOV direct, direct" instruction used two machine cycles or 24 oscillator cycles. Therefore, they required the same amount of time. In the DS80C320/DS80C323, the MOVX instruction can be done in two machine cycles or eight oscillator cycles but the "MOV direct, direct" uses three machine cycles or 12 oscillator cycles. While both are faster than their original counterparts, they now have different execution times from each other. This is because in most cases, the DS80C320/DS80C323 uses one cycle for each byte. The user concerned with precise program timing should examine the timing of each instruction for familiarity with the changes. Note that a machine cycle now requires just four clocks, and provides one ALE pulse per cycle. Many instructions require only one cycle, but some require five. In the original architecture, all were one or two cycles except for MUL and DIV. 7 of 42 DS80C320/DS80C323 INSTRUCTION SET SUMMARY Table 2 Legends: A Rn direct @Ri rel bit #data #data 16 addr 16 addr 11 - Accumulator Register R7-R0 Internal Register address Internal Register pointed-to by R0 or R1 (except MOVX) 2's complement offset byte direct bit-address 8-bit constant 16-bit constant 16-bit destination address 11-bit destination address INSTRUCTION BYTE OSCILLATOR CYCLES Arithmatic Instructions: ADD A, Rn ADD A, direct ADD A, @Ri ADD A, #data ADDC A, Rn ADDC A, direct ADDC A, @Ri ADDC A, #data SUBB A, Rn SUBB A, direct SUBB A, @Ri SUBB A, #data 1 2 1 2 1 2 1 2 1 2 1 2 4 8 4 8 4 8 4 8 4 8 4 8 Logical Instructions: ANL A, Rn ANL A, direct ANL A, @Ri ANL A, #data ANL direct, A ANL direct, #data ORL A, Rn ORL A, direct ORL A, @Ri ORL A, #data ORL direct, A ORL direct, #data 1 2 1 2 2 3 1 2 1 2 2 3 4 8 4 8 8 12 4 8 4 8 8 12 BYTE OSCILLATOR CYCLES INC A INC Rn INC direct INC @Ri INC DPTR DEC A DEC Rn DEC direct DEC @Ri MUL AB DIV AB DA A 1 1 2 1 1 1 1 2 1 1 1 1 4 4 8 4 12 4 4 8 4 20 20 4 XRL A, Rn XRL A, direct XRL A, @Ri XRL A, #data XRL direct, A XRL direct, #data CLR A CPL A RL A RLC A RR A RRC A 1 2 1 2 2 3 1 1 1 1 1 1 4 8 4 8 8 12 4 4 4 4 4 4 INSTRUCTION 8 of 42 DS80C320/DS80C323 Data Transfer Instructions: MOV A, Rn MOV A, direct MOV A, @Ri MOV A, #data MOV Rn, A MOV Rn, direct MOV Rn, #data MOV direct, A MOV direct, Rn MOV direct1, direct2 MOV direct, @Ri MOV direct, #data MOV @Ri, A MOV @Ri, direct MOV @Ri, #data MOV DPTR, #data 16 1 2 1 2 1 2 2 2 2 3 2 3 1 2 2 3 4 8 4 8 4 8 8 8 8 12 8 12 4 8 8 12 MOVC A, @A+DPTR MOVC A, @A+PC MOVX A, @Ri MOVX A, @DPTR MOVX @Ri, A MOVX @DPTR, A PUSH direct POP direct XCH A, Rn XCH A, direct XCH A, @Ri XCHD A, @Ri 1 1 1 1 1 1 2 2 1 2 1 1 12 12 8-36* 8-36* 8-36* 8-36* 8 8 4 8 4 4 Bit Manipulation Instructions: CLR C CLR bit SETB C SETB bit CPL C CPL bit 1 2 1 2 1 2 4 8 4 8 4 8 ANL C, bit ANL C, bit ORL C, bit ORL C, bit MOV C, bit MOV bit, C 2 2 2 2 2 2 8 8 8 8 8 8 Program Branching Instructions: ACALL addr 11 LCALL addr 16 RET RETI AJMP addr 11 LJMP addr 16 SJMP rel JMP @A+DPTR JZ rel JNZ rel DJNZ Rn, rel DJNZ direct, rel 2 3 1 1 2 3 2 1 2 2 2 3 12 16 16 16 12 16 12 12 12 12 12 16 CJNE A, direct, rel CJNE A, #data, rel CJNE Rn, #data, rel CJNE Ri, #data, rel NOP JC rel JNC rel JB bit, rel JNB bit, rel JBC bit, rel 3 3 3 3 1 2 2 3 3 3 16 16 16 16 4 12 12 16 16 16 *User Selectable The table above shows the speed for each class of instruction. Note that many of the instructions have multiple opcodes. There are 255 opcodes for 111 instructions. Of the 255 opcodes, 159 are three times faster than the original 80C32. While a system that emphasizes those instructions will see the most improvement, the large total number that receive a 3 to 1 improvement assure a dramatic speed increase for any system. The speed improvement summary is provided below. 9 of 42 DS80C320/DS80C323 SPEED ADVANTAGE SUMMARY #Opcodes 159 51 43 2 255 Speed Improvement 3.0 x 1.5 x 2.0 x 2.4 x Average: 2.5 MEMORY ACCESS The DS80C320/DS80C323 contains no on-chip ROM and 256 bytes of scratchpad RAM. Off-chip memory is accessed using the multiplexed address/data bus on P0 and the MSB address on P2. A typical memory connection is shown in Figure 3. Timing diagrams are provided in the Electrical Specifications. Program memory (ROM) is accessed at a fixed rate determined by the crystal frequency and the actual instructions. As mentioned above, an instruction cycle requires 4 clocks. Data memory (RAM) is accessed according to a variable speed MOVX instruction as described below. TYPICAL MEMORY CONNECTION Figure 3 STRETCH MEMORY CYCLE The DS80C320/DS80C323 allows the application software to adjust the speed of data memory access. The microcontroller is capable of performing the MOVX in as little as two instruction cycles. However, this value can be stretched as needed so that both fast memory and slow memory or peripherals can be accessed with no glue logic. Even in high-speed systems, it may not be necessary or desirable to perform data memory access at full speed. In addition, there are a variety of memory mapped peripherals such as LCD displays or UARTs that are not fast. The Stretch MOVX is controlled by the Clock Control Register at SFR location 8Eh as described below. This allows the user to select a stretch value between 0 and 7. A Stretch of 0 will result in a two-machine cycle MOVX. A Stretch of 7 will result in a MOVX of nine machine cycles. Software can dynamically change this value depending on the particular memory or peripheral. 10 of 42 DS80C320/DS80C323 On reset, the Stretch value will default to a 1, resulting in a three-cycle MOVX. Therefore, RAM access will not be performed at full speed. This is a convenience to existing designs that may not have fast RAM in place. When maximum speed is desired, the software should select a Stretch value of 0. When using very slow RAM or peripherals, a larger stretch value can be selected. Note that this affects data memory only and the only way to slow program memory (ROM) access is to use a slower crystal. Using a Stretch value between 1 and 7 causes the microcontroller to stretch the read/write strobe and all related timing. This results in a wider read/write strobe allowing more time for memory/peripherals to respond. The timing of the variable speed MOVX is shown in the Electrical Specifications. Note that full speed access is not the reset default case. Table 3 below shows the resulting strobe widths for each Stretch value. The memory stretch is implemented using the Clock Control Special Function Register at SFR location 8Eh. The stretch value is selected using bits CKCON.2-0. In the table, these bits are referred to as M2 through M0. The first stretch (default) allows the use of common 120 ns or 150 ns RAMs without dramatically lengthening the memory access. DATA MEMORY CYCLE STRETCH VALUES Table 3 CKCON.2-0 MD2 MD1 MD0 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 MEMORY CYCLES 2 3 (default) 4 5 6 7 8 9 or WR STROBE WIDTH IN CLOCKS 2 4 8 12 16 20 24 28 RD 11 of 42 STROBE WIDTH TIME @ 25 MHz 80 ns 160 ns 320 ns 480 ns 640 ns 800 ns 960 ns 1120 ns DS80C320/DS80C323 DUAL DATA POINTER Data memory block moves can be accelerated using the Dual Data Pointer (DPTR). The standard 8032 DPTR is a 16-bit value that is used to address off-chip data RAM or peripherals. In the DS80C320/DS80C323, the standard 16-bit data pointer is called DPTR0 and is located at SFR addresses 82h and 83h. These are the standard locations. The new DPTR is located at SFR 84h and 85h and is called DPTR1. The DPTR Select bit (DPS) chooses the active pointer and is located at the LSB of the SFR location 86h. No other bits in register 86h have any effect and are set to 0. The user switches between data pointers by toggling the LSB of register 86h. The increment (INC) instruction is the fastest way to accomplish this. All DPTR-related instructions use the currently selected DPTR for any activity. Therefore only one instruction is required to switch from a source to a destination address. Using the Dual-Data Pointer saves code from needing to save source and destination addresses when doing a block move. Once loaded, the software simply switches between DPTR and 1. The relevant register locations are as follows. DPL DPH DPL1 DPH1 DPS 82h 83h 84h 85h 86h Low byte original DPTR High byte original DPTR Low byte new DPTR High byte new DPTR DPTR Select (LSB) Sample code listed below illustrates the saving from using the dual DPTR. The example program was original code written for an 8051 and requires a total of 1869 DS80C320/DS80C323 machine cycles. This takes 299 s to execute at 25 MHz. The new code using the Dual DPTR requires only 1097 machine cycles taking 175.5 s. The Dual DPTR saves 772 machine cycles or 123.5 s for a 64-byte block move. Since each pass through the loop saves 12 machine cycles when compared to the single DPTR approach, larger blocks gain more efficiency using this feature. 64-BYTE BLOCK MOVE WITHOUT DUAL DATA POINTER ; SH and SL are high and low byte source address. ; DH and DL are high and low byte of destination address. MOV MOV MOV MOV MOV MOV R5, #64d DPTR, #SHSL R1, #SL R2, #SH R3, #DL R4, #DH ; ; ; ; ; ; NUMBER OF BYTES TO MOVE LOAD SOURCE ADDRESS SAVE LOW BYTE OF SOURCE SAVE HIGH BYTE OF SOURCE SAVE LOW BYTE OF DESTINATION SAVE HIGH BYTE OF DESTINATION # CYCLES 2 3 2 2 2 2 MOVE: ; THIS LOOP IS PERFORMED THE NUMBER OF TIMES LOADED INTO R5, IN THIS EXAMPLE 64 MOVX MOV MOV MOV MOV MOVX INC MOV MOV MOV MOV INC DJNZ A, @DPTR R1, DPL R2, DPH DPL, R3 DPH, R4 @DPTR, A DPTR R3, DPL R4, DPH DPL, R1 DPH, R2 DPTR R5, MOVE ; ; ; ; ; ; ; ; ; ; ; ; ; READ SOURCE DATA BYTE SAVE NEW SOURCE POINTER LOAD NEW DESTINATION WRITE DATA TO DESTINATION NEXT DESTINATION ADDRESS SAVE NEW DESTINATION POINTER GET NEW SOURCE POINTER NEXT SOURCE ADDRESS FINISHED WITH TABLE? 12 of 42 2 2 2 2 2 2 3 2 2 2 2 3 3 DS80C320/DS80C323 64-BYTE BLOCK MOVE WITH DUAL DATA POINTER ; SH and SL are high and low byte source address. ; DH and DL are high and low byte of destination address. ; DPS is the data pointer select. Reset condition is DPS=0, DPTR0 is selected. # CYCLES EQU DPS, #86h ; TELL ASSEMBLER ABOUT DPS MOV MOV INC MOV R5, #64 DPTR, #DHDL DPS DPTR, #SHSL ; ; ; ; NUMBER OF BYTES TO MOVE LOAD DESTINATION ADDRESS CHANGE ACTIVE DPTR LOAD SOURCE ADDRESS 2 3 2 2 MOVE: ; THIS LOOP IS PERFORMED THE NUMBER OF TIMES LOADED INTO R5, IN THIS EXAMPLE 64 MOVX INC MOVX INC INC INC DJNZ A, @DPTR DPS @DPTR, A DPTR DPS DPTR R5, MOVE ; ; ; ; ; ; ; READ SOURCE DATA BYTE CHANGE DPTR TO DESTINATION WRITE DATA TO DESTINATION NEXT DESTINATION ADDRESS CHANGE DATA POINTER TO SOURCE NEXT SOURCE ADDRESS FINISHED WITH TABLE? 2 2 2 3 2 3 3 PERIPHERAL OVERVIEW Peripherals in the DS80C320/DS80C323 are accessed using Special Function Registers (SFRs). The device provides several of the most commonly needed peripheral functions in microcomputer-based systems. These functions are new to the 80C32 family and include a second serial port, Power-fail Reset, Power-fail Interrupt, and a programmable Watchdog Timer. These are described below, and more details are available in the High-Speed Microcontroller User's Guide. SERIAL PORTS The DS80C320/DS80C323 provides a serial port (UART) that is identical to the 80C32. Many applications require serial communication with multiple devices. Therefore a second hardware serial port is provided that is a full duplicate of the standard one. It optionally uses pins P1.2 (RXD1) and P1.3 (TXD1). This port has duplicate control functions included in new SFR locations. The second serial port operates in a comparable manner with the first. Both can operate simultaneously but can be at different baud rates. The second serial port has similar control registers (SCON1 at C0h, SBUF1 at C1h) to the original. One difference is that for timer-based baud rates, the original serial port can use Timer 1 or Timer 2 to generate baud rates. This is selected via SFR bits. The new serial port can only use Timer 1. TIMER RATE CONTROL One important difference exists between the DS80C320/DS80C323 and 80C32 regarding timers. The original 80C32 used a 12 clock per cycle scheme for timers and consequently for some serial baud rates (depending on the mode). The DS80C320/DS80C323 architecture normally runs using 4 clocks per cycle. However, in the area of timers, it will default to a 12-clock per cycle scheme on a reset. This allows existing code with real-time dependencies such as baud rates to operate properly. If an application needs higher speed timers or serial baud rates, the timers can be set to run at the 4-clock rate. The Clock Control register (CKCON - 8Eh) determines these timer speeds. When the relevant CKCON bit is a logic 1, the device uses 4 clocks per cycle to generate timer speeds. When the control bit is set to a 0, the device uses 12 clocks for timer speeds. The reset condition is a 0. CKCON.5 selects the speed of Timer 2. CKCON.4 selects Timer 1 and CKCON.3 selects Timer 0. Note that unless a user desires very fast timing, it is unnecessary to alter these bits. Note that the timer controls are independent. 13 of 42 DS80C320/DS80C323 POWER-FAIL RESET The DS80C320/DS80C323 incorporates a precision band-gap voltage reference to determine when VCC is out of tolerance. While powering up, internal circuits will hold the device in a reset state until VCC rises above the VRST reset threshold. Once VCC is above this level, the oscillator will begin running. An internal reset circuit will then count 65536 clocks to allow time for power and the oscillator to stabilize. The microcontroller will then exit the reset condition. No external components are needed to generate a power on reset. During power-down or during a severe power glitch, as VCC falls below VRST, the microcontroller will also generate its own reset. It will hold the reset condition as long as power remains below the threshold. This reset will occur automatically, needing no action from the user or from the software. Refer to the Electrical Specifications for the exact value of VRST. POWER-FAIL INTERRUPT The same reference that generates a precision reset threshold can also generate an optional early warning Power-fail Interrupt (PFI). When enabled by the application software, this interrupt always has the highest priority. On detecting that the VCC has dropped below VPFW and that the PFI is enabled, the processor will vector to ROM address 0033h. The PFI enable is located in the Watchdog Control SFR (WDCON - D8h). Setting WDCON.5 to a logic 1 will enable the PFI. The application software can also read a flag at WDCON.4. This bit is set when a PFI condition has occurred. The flag is independent of the interrupt enable and software must manually clear it. WATCHDOG TIMER For applications that can not afford to run out of control, the DS80C320/DS80C323 incorporates a programmable watchdog timer circuit. It resets the microcontroller if software fails to reset the watchdog before the selected time interval has elapsed. The user selects one of four timeout values. After enabling the watchdog, software must reset the timer prior to expiration of the interval, or the CPU will be reset. Both the Watchdog Enable and the Watchdog Reset bits are protected by a "Timed Access" circuit. This prevents accidentally clearing the watchdog. Timeout values are precise since they are related to the crystal frequency as shown below in Table 4. For reference, the time periods at 25 MHz are also shown. The watchdog timer also provides a useful option for systems that may not require a reset. If enabled, then 512 clocks before giving a reset, the watchdog will give an interrupt. The interrupt can also serve as a convenient time-base generator, or be used to wake-up the processor from Idle mode. The watchdog function is controlled in the Clock Control (CKCON - 8Eh), Watchdog Control (WDCON - D8h), and Extended Interrupt Enable (EIE - E8h) SFRs. CKCON.7 and CKCON.6 are called WD1 and WD0 respectively and are used to select the watchdog timeout period as shown in Table 4. WATCHDOG TIMEOUT VALUES Table 4 WD1 0 0 1 1 WD0 0 1 0 1 INTERRUPT TIMEOUT 217 clocks 220 clocks 223 clocks 226 clocks TIME (@25 MHz) 5.243 ms 41.94 ms 335.54 ms 2684.35 ms RESET TIMEOUT 217 + 512 clocks 220 + 512 clocks 223 + 512 clocks 226 + 512 clocks TIME (@25 MHz) 5.263 ms j 41.96 ms 335.56 ms 2684.38 ms As shown above, the watchdog timer uses the crystal frequency as a time base. A user selects one of four counter values to determine the timeout. These clock counter lengths are 217 = 131,072 clocks; 220= 1,048,576; 223= 8,388,608 clocks; or 226= 67,108,864 clocks. The times shown in Table 4 are with a 25 14 of 42 DS80C320/DS80C323 MHz crystal frequency. Note that once the counter chain has reached a conclusion, the optional interrupt is generated. Regardless of whether the user enables this interrupt, there are then 512 clocks left until a reset occurs. There are 5 control bits in special function registers that affect the Watchdog Timer and two status flags that report to the user. The Reset Watchdog Timer bit (WDCON.0) should be asserted prior to modifying the Watchdog Timer Mode Select bits (WD1, WD0) to avoid corruption of the watchdog count. WDIF (WDCON.3) is the interrupt flag that is set when there are 512 clocks remaining until a reset occurs. WTRF (WDCON.2) is the flag that is set when a Watchdog reset has occurred. This allows the application software to determine the source of a reset. Setting the EWT (WDCON.1) bit enables the Watchdog Timer. The bit is protected by Timed Access discussed below. Setting the RWT (WDCON.0) bit restarts the Watchdog Timer for another full interval. Application software must set this bit prior to the timeout. As mentioned previously, WD1 and 0 (CKCON .7 and 6) select the timeout. Finally, the Watchdog Interrupt is enabled using EWDI (EIE.4). INTERRUPTS The DS80C320/DS80C323 provides 13 sources of interrupt with three priority levels. The Power-fail Interrupt (PFI), if enabled, always has the highest priority. There are two remaining user selectable priorities: high and low. If two interrupts that have the same priority occur simultaneously, the natural precedence given below determines which is a acted upon. Except for the PFI, all interrupts that are new to the 8051 family have a lower natural priority than the originals. INTERRUPT PRIORITY Table 5 NAME PFI INT0 TF0 INT1 TF1 SCON0 TF2 SCON1 INT2 INT3 INT4 INT5 WDTI DESCRIPTION Power-fail Intterupt External Interrupt 0 Timer 0 External Interrupt 1 Timer 1 TI0 or RI0 from serial port 0 Timer 2 TI1 or RI1 from serial port 1 External Interrupt 2 External Interrupt 3 External Interrupt 4 External Interrupt 5 Watchdog Timeout Interrupt VECTOR 33h j 03h 0Bh 13h 1Bh 23h 2Bh 3Bh 43h 4Bh 53h 5Bh 63h 15 of 42 NATURAL PRIORITY 1 2 3 4 5 6 7 8 9 10 11 12 13 OLD/NEW NEW OLD OLD OLD OLD OLD OLD NEW NEW NEW NEW NEW NEW DS80C320/DS80C323 POWER MANAGEMENT The DS80C320/DS80C323 provides the standard Idle and power-down (Stop) that are available on the standard 80C32. However the device has enhancements that make these modes more useful, and allow more power saving. The Idle mode is invoked by setting the LSB of the Power Control register (PCON - 87h). Idle will leave internal clocks, serial port and timer running. No memory access will be performed so power is dramatically reduced. Since clocks are running, the Idle power consumption is related to crystal frequency. It should be approximately 1/2 of the operational power. The CPU can exit the Idle state with any interrupt or a reset. The power-down or Stop mode is invoked by setting the PCON.1 bit. Stop mode is a lower power state than Idle since it turns off all internal clocking. The ICC of a standard Stop mode is approximately 1 A but is specified in the Electrical Specifications. The CPU will exit Stop mode from an external interrupt or a reset condition. Note that internally generated interrupts (timer, serial port, watchdog) are not useful in Idle or Stop since they require clocking activity. IDLE MODE ENHANCEMENTS A simple enhancement to Idle mode makes it substantially more useful. The innovation involves not the Idle mode itself, but the watchdog timer. As mentioned above, the Watchdog Timer provides an optional interrupt capability. This interrupt can provide a periodic interval timer to bring the DS80C320/DS80C323 out of Idle mode. This can be useful even if the Watchdog is not normally used. By enabling the Watchdog Timer and its interrupt prior to invoking Idle, a user can periodically come out of Idle perform an operation, then return to Idle until the next operation. This will lower the overall power consumption. When using the Watchdog Interrupt to cancel the Idle state, make sure to restart the Watchdog Timer or it will cause a reset. STOP MODE ENHANCEMENTS The DS80C320/DS80C323 provides two enhancements to the Stop mode. As documented above, the device provides a band-gap reference to determine Power-fail Interrupt and Reset thresholds. The default state is that the band-gap reference is off when Stop mode is invoked. This allows the extremely low power state mentioned above. A user can optionally choose to have the band-gap enabled during Stop mode. This means that PFI and power-fail reset will be activated and are valid means for leaving Stop mode. In Stop mode with the band-gap on, ICC will be approximately 50 A compared with 1 A with the bandgap off. If a user does not require a Power-fail Reset or Interrupt while in Stop mode, the band-gap can remain turned off. Note that only the most power sensitive applications should turn off the band-gap, as this results in an uncontrolled power down condition. The control of the band-gap reference is located in the Extended Interrupt Flag register (EXIF - 91h). Setting BGS (EXIF.0) to a 1 will leave the band-gap reference enabled during Stop mode. The default or reset condition is with the bit at a logic 0. This results in the band-gap being turned off during Stop mode. Note that this bit has no control of the reference during full power or Idle modes. The second feature allows an additional power saving option. This is the ability to start instantly when exiting Stop mode. It is accomplished using an internal ring oscillator that can be used when exiting Stop mode in response to an interrupt. The benefit of the ring oscillator is as follows. 16 of 42 DS80C320/DS80C323 Using Stop mode turns off the crystal oscillator and all internal clocks to save power. This requires that the oscillator be restarted when exiting Stop mode. Actual start-up time is crystal dependent, but is normally at least 4 ms. A common recommendation is 10 ms. In an application that will wake-up, perform a short operation, then return to sleep, the crystal start-up can be longer than the real transaction. However, the ring oscillator will start instantly. The user can perform a simple operation and return to sleep before the crystal has even stabilized. If the ring is used to start and the processor remains running, hardware will automatically switch to the crystal once a power-on reset interval (65536 clocks) has expired. This value is used to guarantee stability even though power is not being cycled. If the user returns to Stop mode prior to switching of crystal, then all clocks will be turned off again. The ring oscillator runs at approximately 3 MHz (1.5 MHz at 3V) but will not be a precision value. No realtime precision operations (including serial communication) should be conducted during this ring period. Figure 7 shows how the operation would compare when using the ring, and when starting up normally. The default state is to come out of Stop mode without using the ring oscillator. This function is controlled using the RGSL - Ring Select bit at EXIF.1 (EXIF - 91h). When EXIF.1 is set, the ring oscillator will be used to come out of Stop mode quickly. As mentioned above, the processor will automatically switch from the ring (if enabled) to the crystal after a delay of 65536 crystal clocks. For a 3.57 MHz crystal, this is approximately 18 ms. The processor sets a flag called RGMD - Ring Mode to tell software that the ring is being used. This bit at EXIF.2 will be a logic 1 when the ring is in use. No serial communication or precision timing should be attempted while this bit is set, since the operating frequency is not precise. RING OSCILLATOR START-UP Figure 4 Diagram assumes that the operation following Stop requires less than 18 ms complete. 17 of 42 DS80C320/DS80C323 TIMED ACCESS PROTECTION Selected SFR bits are critical to operation, making it desirable to protect against an accidental write operation. The Timed Access procedure prevents an errant CPU from accidentally altering a bit that would cause difficulty. The Timed Access procedure requires that the write of a protected bit be preceded by the following instructions: MOV MOV 0C7h, #0AAh 0C7h, #55h By writing an AAh followed by a 55h to the Timed Access register (location C7h), the hardware opens a three-cycle window that allows software to modify one of the protected bits. If the instruction that seeks to modify the protected bit is not immediately proceeded by these instructions, the write will not take effect. The protected bits are: EXIF.0 WDCON.6 WDCON.1 WDCON.0 WDCON.3 BGS Band-gap Select POR Power-on Reset flag EWT Enable Watchdog RWT Reset Watchdog WDIF Watchdog Interrupt Flag SPECIAL FUNCTION REGISTERS Most special features of the DS80C320/DS80C323 or 80C32 are controlled by bits in special function registers (SFRs). This allows the device to add many features but use the same instruction set. When writing software to use a new feature, the SFR must be defined to an assembler or compiler using an equate statement. This is the only change needed to access the new function. The DS80C320/DS80C323 duplicates the SFRs that are contained in the standard 80C32. Table 6 shows the register addresses and bit locations. Many are standard 80C32 registers. The High-Speed Microcontroller User's Guide describes all SFRs. 18 of 42 DS80C320/DS80C323 SPECIAL FUNCTION REGISTER LOCATIONS Table 6 REGISTER SP DPL DPH DPL1 DPH1 DPS PCON TCON TMOD TL0 TL1 TH0 TH1 CKCON P1 EXIF SCON0 SBUF0 P2 IE SADDR0 SADDR1 P3 IP SADEN0 SADEN1 SCON1 SBUF1 STATUS TA T2CON T2MOD RCAP2L RCAP2H TL2 TH2 PSW WDCON ACC EIE B EIP BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 0 SMOD_0 TF1 GATE 0 SMOD0 TR1 C/ T 0 TF0 M1 0 TR0 M0 0 GF1 IE1 GATE 0 GF0 IT1 C/ T 0 STOP IE0 M1 SEL IDLE IT0 M0 WD1 P1.7 IE5 SM0/FE_0 WD0 P1.6 IE4 SM1_0 T2M P1.5 IE3 SM2_0 T1M P1.4 IE2 REN_0 T0M P1.3 TB8_0 MD2 P1.2 RGMD RB8_0 MD1 P1.1 RGSL TI_0 MD0 P1.0 BGS RI_0 P2.0 EA P2.6 ES1 P2.5 ET2 P2.4 ES0 P2.3 ET1 P2.2 EX1 P2.1 ET0 P2.0 EX0 P3.7 - P3.6 PS1 P3.5 PT2 P3.4 PS0 P3.3 PT1 P3.2 PX1 P3.1 PT0 P3.0 PX0 SM0/FE_0 SM1_0 SM2_0 REN_0 TB8_0 RB8_0 TI_0 RI_0 PIP HIP LIP 1 1 1 1 1 TF2 - EXF2 - RCLK - TCLK - EXEN2 - TR2 - C/ T2 T2OE CP/ RL2 DCEN CY SMOD_1 AC POR F0 EPFI RS1 PFI RS0 WDIF OV WTRF FL EWT P RWT - - - EWDI EX5 EX4 EX3 EX2 - - - PWDI PX5 PX4 PX3 PX2 19 of 42 ADDRESS 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 90h 91h 98h 99h A0h A8h A9h AAh B0h B8h B9h BAh C0h C1h C5h C7h C8h C9h CAh CBh CCh CDh D0h D8h E0h E8h F0h F8h DS80C320/DS80C323 ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS* Voltage on Any Pin Relative to Ground Voltage on VCC Relative to Ground Operating Temperature Storage Temperature Soldering Temperature * -0.3V to (VCC + 0.5V) -0.3V to +6.0V -40C to +85C -55C to +125C 160C for 10 seconds This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. DS80C320 DC ELECTRICAL CHARACTERISTICS PARAMETER Operating Supply Voltage Power-fail Warning Minimum Operating Voltage Supply Current Active Mode @ 25 MHz Supply Current Idle Mode @ 25 MHz Supply Current Active Mode @ 33 MHz Supply Current Idle Mode @ 33 MHz Supply Current Stop Mode, Band-gap Reference Disabled Supply Current Stop Mode, Band-gap Reference Enabled Input Low Level Input High Level (Except XTAL1 and RST) Input High Level XTAL1 and RST Output Low Voltage Ports 1, 3, @ IOL = 1.6 mA Output Low Voltage Ports 0, 2, ALE, PSEN @ IOL = 3.2 mA Output High Voltage Ports 1, 3, ALE, PSEN @ IOH = -50 A Output High Voltage Ports 1, 3, @ IOH = -1.5 mA Output High Voltage Ports 0, 2, ALE, PSEN @ IOH = -8 mA Input Low Current Ports 1, 3 @ 0.45V Transition Current from 1 to 0 Ports 1, 3 @ 2V Input Leakage Port 0, Bus Mode RST Pulldown Resistance SYMBOL VCC VPFW VRST ICC MIN 4.5 4.25 4.0 TYP 5.0 4.38 4.1 30 MAX 5.5 4.55 4.25 45 UNITS V V V mA NOTES 1 1 1, 12 2 IIDLE 15 25 mA 3 ICC 35 mA 2 IIDLE 20 mA 3 ISTOP .01 1 A 4 ISPBG 50 80 A 4, 10 VIL VIH1 -0.3 2.0 +0.8 VCC+0.3 V V 1 1 VIH2 VOL1 3.5 VCC+0.3 0.45 V V 1 1 0.45 V 1, 5 VOL2 VOH1 2.4 V 1, 6 VOH2 2.4 V 1, 7 VOH3 2.4 V 1, 5 IIL -55 A 11 ITL -650 A 8 +300 170 A k 9 IL RRST -300 50 20 of 42 DS80C320/DS80C323 NOTES FOR DS80C320 DC ELECTRICAL CHARACTERISTICS: All parameters apply to both commercial and industrial temperature operation unless otherwise noted. 1. All voltages are referenced to ground. 2. Active current is measured with a 25 MHz clock source driving XTAL1, VCC=RST=5.5V, all other pins disconnected. 3. Idle mode current is measured with a 25 MHz clock source driving XTAL1, VCC=5.5V, RST at ground, all other pins disconnected. 4. Stop mode current measured with XTAL1 and RST grounded, VCC=5.5V, all other pins disconnected. when addressing external memory. 5. When addressing external memory. 6. RST=VCC. This condition mimics operation of pins in I/O mode. 7. During a 0 to 1 transition, a one-shot drives the ports hard for two clock cycles. This measurement reflects port in transition mode. 8. Ports 1, 2, and 3 source transition current when being pulled down externally. It reaches its maximum at approximately 2V. 9. 0.45<VIN<VCC. Not a high impedance input. This port is a weak address holding latch because Port 0 is dedicated as an address bus on the DS80C320. Peak current occurs near the input transition point of the latch, approximately 2V. 10. Over the industrial temperature range, this specification has a maximum value of 200 A. 11. This is the current required from an external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin will also have to overcome the transition current. 12. Device operating range is 4.5V to 5.5V; however, device is tested to 4.0V to ensure proper operation at minimum VRST. 21 of 42 DS80C320/DS80C323 TYPICAL ICC VERSUS FREQUENCY Figure 5 DS80C320 AC CHARACTERISTICS UP TO 25 MHz PARAMETER Oscillator Freq. (Ext. Osc.) (Ext. Crystal) ALE Pulse Width Port 0 Address Valid to ALE Low Address Hold After ALE Low Address Hold After ALE Low for MOVX SYMBOL 25 MHz MIN 25 MHz MAX VARIABLE CLOCK MIN VARIABLE CLOCK MAX UNITS 25 25 0 1 25 25 MHz tLHLL tAVLL 0 1 50 9 tLLAX1 5 note 5 tLLAX2 13 1/tCLCL 1.5tCLCL-10 0.5tCLCL-11 0.25tCLCL-5 ns ns note 5 0.5tCLCL-7 ns ns WR ALE Low to Valid Instruction In ALE Low to PSEN Low PSEN Pulse Width PSEN Low to Valid Instruction In Input Instruction Hold After PSEN Input Instruction Float After PSEN Port 0 Address to Valid Instruction In Port 2 Address to Valid Instruction In PSEN Low to Address Float tLLIV 73 tLLPL tPLPH tPLIV 3 83 tPXIX 0 2.5tCLCL-27 ns 2.25tCLCL-21 ns ns ns 0.25tCLCL-7 2.25tCLCL-7 69 0 ns tPXIZ 35 tCLCL-5 ns tAVIV1 93 3tCLCL-27 ns tAVIV2 107 3.5tCLCL-33 ns tPLAZ note 5 note 5 ns 22 of 42 DS80C320/DS80C323 NOTES FOR AC ELECTRICAL CHARACTERISTICS: All parameters apply to both commercial and industrial temperature range operation unless otherwise noted. AC timing characteristics valid for oscillator frequency > 16 MHz. 1. All signals rated over operating temperature at 25 MHz. 2. All signals characterized with load capacitance of 80 pF except Port 0, ALE, PSEN , RD and WR at 100 pF. Note that loading should be approximately equal for valid timing. 3. Interfacing to memory devices with float times (turn off times) over 35 ns may cause contention. This will not damage the parts, but will cause an increase in operating current. 4. Specifications assume a 50% duty cycle for the oscillator. Port 2 timing will change with the duty cycle variations. 5. Address is held in a weak latch until over-driven by external memory. 23 of 42 DS80C320/DS80C323 DS80C320 MOVX CHARACTERISTICS UP TO 25 MHz PARAMETER SYMBOL Pulse Width tRLRH WR Pulse Width tWLWH RD Low to Valid Data In tRLDV RD Data Hold After Read Data Float After Read tRHDX tRHDZ ALE Low to Valid Data In Port 0 Address to Valid Data In Port 2 Address to Valid Data In ALE Low to RD or WR Low Port 0 Address Valid to RD or WR Low Port 2 Address Valid to RD or WR Low Data Valid to WR Transition Data Hold After Write tLLDV VARIABLE CLOCK MIN 2tCLCL-11 tMCS-11 2tCLCL-11 tMCS-11 tAVWL2 tQVWX tWHQX ns ns 0 ns STRETCH tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 ns tAVDV2 tAVWL1 UNITS 2tCLCL-25 tMCS-25 tAVDV1 tLLWL VARIABLE CLOCK MAX 0.5tCLCL-5 1.5tCLCL-5 tCLCL-9 2tCLCL-10 1.5tCLCL-9 2.5tCLCL-13 -9 tCLCL-10 tCLCL-7 2tCLCL-5 tCLCL-5 2tCLCL-5 2.5tCLCL-26 1.5tCLCL-28+tMCS 3tCLCL-24 2tCLCL-31+tMCS 3.5tCLCL-32 2.5tCLCL-34+tMCS 0.5tCLCL+6 1.5tCLCL+8 ns ns ns ns ns ns ns ns ns tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tRLAZ note 5 ns Low to Address Float 0 10 tMCS=0 tWHLH RD or WR High to ns tCLCL-5 tCLCL+11 tMCS>0 ALE High NOTE: tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for each Stretch selection. RD M2 0 0 0 0 1 1 1 1 M1 0 0 1 1 0 0 1 1 M0 0 1 0 1 0 1 0 1 MOVX CYCLES 2 machine cycles 3 machine cycles (default) 4 machine cycles 5 machine cycles 6 machine cycles 7 machine cycles 8 machine cycles 9 machine cycles 24 of 42 tMCS 0 4 tCLCL 8 tCLCL 12 tCLCL 16 tCLCL 20 tCLCL 24 tCLCL 28 tCLCL DS80C320/DS80C323 DS80C320 AC CHARACTERISTICS UP TO 33 MHz PARAMETER Oscillator Frequency (Ext. Osc.) (Ext. Crystal) ALE Pulse Width Port 0 Address Valid to ALE Low Address Hold After ALE Low Address Hold After ALE Low for MOVX WR ALE Low to Valid Instruction In ALE Low to PSEN Low PSEN Pulse Width PSEN Low to Valid Instruction In Input Instruction Hold After PSEN Input Instruction Float After PSEN Port 0 Address to Valid Instruction In Port 2 Address to Valid Instruction In PSEN Low to Address Float SYMBOL 33 MHz MIN 33 MHz MAX VARIABLE CLOCK MIN VARIABLE CLOCK MAX UNITS 33 33 0 1 33 33 MHz tLHLL tAVLL 0 1 35 4 tLLAX1 2 note 5 tLLAX2 8 1/tCLCL 1.5tCLCL-10 0.5tCLCL-11 0.25tCLCL-5 ns ns note 5 0.5tCLCL-7 tLLIV 49 tLLPL tPLPH tPLIV 0.5 61 tPXIX 0 ns 2.5tCLCL-27 ns 2.25tCLCL-21 ns ns ns 0.25tCLCL-7 2.25tCLCL-7 48 ns 0 ns tPXIZ 25 tCLCL-5 ns tAVIV1 64 3tCLCL-27 ns tAVIV2 73 3.5tCLCL-33 ns tPLAZ note 5 note 5 ns NOTES FOR DS80C323 AC ELECTRICAL CHARACTERISTICS: All parameters apply to both commercial and industrial temperature range operation unless otherwise noted. AC timing characteristics valid for oscillator frequency > 16 MHz. 1. All signals rated over operating temperature at 33 MHz. 2. All signals characterized with load capacitance of 80 pF except Port 0, ALE, PSEN , RD and WR at 100 pF. Note that loading should be approximately equal for valid timing. 3. Interfacing to memory devices with float times (turn off times) over 30 ns may cause contention. This will not damage the parts but will cause an increase in operating current. 4. Specifications assume a 50% duty cycle for the oscillator. Port 2 timing will change with the duty cycle variations. 5. Address is held in a weak latch until over driven by external memory. 25 of 42 DS80C320/DS80C323 DS80C320 MOVX CHARACTERISTICS UP TO 33 MHz PARAMETER SYMBOL Pulse Width tRLRH WR Pulse Width tWLWH RD Low to Valid Data In tRLDV RD Data Hold After Read Data Float After Read tRHDX tRHDZ ALE Low to Valid Data In Port 0 Address to Valid Data In Port 2 Address to Valid Data In ALE Low to RD or WR Low Port 0 Address Valid to RD or WR Low Port 2 Address Valid to RD or WR Low Data Valid to WR Transition Data Hold After Write tLLDV VARIABLE CLOCK MIN 2tCLCL-11 tMCS-11 2tCLCL-11 tMCS-11 tAVWL2 tQVWX tWHQX ns ns 0 ns STRETCH tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 ns tAVDV2 tAVWL1 UNITS 2tCLCL-25 tMCS-25 tAVDV1 tLLWL VARIABLE CLOCK MAX 0.5tCLCL-5 1.5tCLCL-5 tCLCL-9 2tCLCL-10 1.5tCLCL-9 2.5tCLCL-13 -9 tCLCL-10 tCLCL-7 2tCLCL-5 tCLCL-5 2tCLCL-5 2.5tCLCL-26 1.5tCLCL-28+tMCS 3tCLCL-24 2tCLCL-31+tMCS 3.5tCLCL-32 2.5tCLCL-34+tMCS 0.5tCLCL+6 1.5tCLCL+8 ns ns ns ns ns ns ns ns ns tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tRLAZ note 5 ns Low to Address Float 0 10 tMCS=0 tWHLH RD or WR High to ns tCLCL-5 tCLCL+11 tMCS>0 ALE High NOTE: tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for each Stretch selection. RD M2 0 0 0 0 1 1 1 1 M1 0 0 1 1 0 0 1 1 M0 0 1 0 1 0 1 0 1 MOVX CYCLES 2 machine cycles 3 machine cycles (default) 4 machine cycles 5 machine cycles 6 machine cycles 7 machine cycles 8 machine cycles 9 machine cycles 26 of 42 tMCS 0 4 tCLCL 8 tCLCL 12 tCLCL 16 tCLCL 20 tCLCL 24 tCLCL 28 tCLCL DS80C320/DS80C323 DS80C323 DC ELECTRICAL CHARACTERISTICS PARAMETER Operating Supply Voltage Power-fail Warning Minimum Operating Voltage Supply Current Active Mode @ 18 MHz Supply Current Idle Mode @ 18 MHz Supply Current Stop Mode, Band-gap Reference Disabled Supply Current Stop Mode, Band-gap Reference Enabled Input Low Level Input High Level (Except XTAL1 and RST) Input High Level XTAL1 and RST SYMBOL VCC VPFW VRST ICC Output Low Voltage Ports 1, 3, @ IOL = 1.6 mA Output Low Voltage Ports 0, 2, PSEN /ALE @ IOL = 3.2 mA Output High Voltage Ports 1, 3, PSEN /ALE @ IOH = -15 A Output High Voltage Ports 1, 3, @ IOH = -1.5 mA Output High Voltage Ports 0, 2, PSEN /ALE @ IOH = -2 mA Input Low Current Ports 1, 3, @ 0.45V Transition Current from 1 0, Ports 1, 3 @ 2V Input Leakage Port 0, Bus Mode RST Pulldown Resistance MIN 2.7 2.6 2.5 TYP 3.0 2.7 2.6 10 MAX 5.5 2.8 2.7 UNITS V V V mA NOTES 1 1 1, 12 2 IIDLE 6 mA 3 ISTOP 0.1 A 2 ISPBG 40 A 4, 10 0.2 VCC VCC+0.3 V V 1 1 VCC+0.3 V 1 VOL1 0.4 V 1 VOL2 0.4 V 1, 5 V 1, 6 V 1, 7 V 1, 5 VIL VIH1 VIH2 VOH1 VOH2 VOH3 -0.3 0.7 VCC 0.7 VCC +0.25V VDD -0.4V VDD -0.4V VDD -0.4V IIL -30 A 11 ITL -400 A 8 +300 170 A k 9 IL RRST -300 50 NOTES FOR DS80C323 DC ELECTRICAL CHARACTERISTICS: All parameters apply to both commercial and industrial temperature operation unless otherwise noted. Device operating range is 2.7V - 5.5V. DC Electrical specifications are for operation 2.7V - 3.3V. 1. All voltages are referenced to ground. 2. Active mode current is measured with an 18 MHz clock source driving XTAL1, VCC=RST=3.3V, all other pins disconnected. 3. Idle mode current is measured with an 18 MHz clock source driving XTAL1, VCC=3.3V, all other pins disconnected. 4. Stop mode current measured with XTAL1 and RST grounded, VCC=3.3V, all other pins disconnected. 27 of 42 DS80C320/DS80C323 5. When addressing external memory. 6. RST= VCC. This condition mimics operation of pins in I/O mode. 7. During a 0 to 1 transition, a one-shot drives the ports hard for two clock cycles. This measurement reflects port in transition mode. 8. Ports 1, 2, and 3 source transition current when being pulled down externally. It reaches its maximum at approximately 2V. 9. VIN between ground and VCC - 0.3V. Not a high impedance input. This port is a weak address latch because Port 0 is dedicated as an address bus on the DS80C323. Peak current occurs near the input transition point of the latch, approximately 2V. 10. Over the industrial temperature range, this specification has a maximum value of 200 A. 11. This is the current from an external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin will also have to overcome the transition current. 12. Device operating range is 2.7V to 5.5V, however device is tested to 2.5V to ensure proper operation at minimum VRST. 28 of 42 DS80C320/DS80C323 DS80C323 AC ELECTRICAL CHARACTERISTICS PARAMETER Oscillator Frequency (Ext. Osc.) (Ext. Crystal) ALE Pulse Width Port 0 Address Valid to ALE Low Address Hold After ALE Low Address Hold After ALE Low for MOVX WR ALE Low to Valid Instruction In ALE Low to PSEN Low PSEN Pulse Width PSEN Low to Valid Instruction In Input Instruction Hold After PSEN Input Instruction Float After PSEN Port 0 Address to Valid Instruction In Port 2 Address to Valid Instruction In PSEN Low to Address Float SYMBOL 18 MHz MIN 18 MHz MAX VARIABLE CLOCK MIN VARIABLE CLOCK MAX 18 18 0 1 18 18 tLHLL tAVLL 0 1 73 16 tLLAX1 8 note 5 tLLAX2 20 1/tCLCL UNITS MHz 1.5tCLCL-10 0.5tCLCL-11 0.25tCLCL-5 ns ns note 5 0.5tCLCL-7 tLLIV 112 tLLPL tPLPH tPLIV 6 118 tPXIX 0 ns 2.5tCLCL-27 ns 2.25tCLCL-21 ns ns ns 0.25tCLCL-7 2.25tCLCL-7 104 ns 0 ns tPXIZ 51 tCLCL-5 ns tAVIV1 140 3tCLCL-27 ns tAVIV2 162 3.5tCLCL-33 ns tPLAZ note 5 note 5 ns NOTES FOR DS80C323 AC ELECTRICAL CHARACTERISTICS: All parameters apply to both commercial and industrial temperature range operation unless otherwise noted. AC timing characteristics valid for oscillator frequency > 16 MHz. 1. All signals rated over operating temperature at 18 MHz. 2. All signals characterized with load capacitance of 80 pF except Port 0, ALE, PSEN , RD and WR at 100 pF. Note that loading should be approximately equal for valid timing. 3. Interfacing to memory devices with float times (turn off times) over 35 ns may cause contention. This will not damage the parts, but will cause an increase in operating current. 4. Specifications assume a 50% duty cycle for the oscillator. Port 2 timing will change with the duty cycle variations. 5. Address is held in a weak latch until over-driven by external memory. 29 of 42 DS80C320/DS80C323 DS80C323 MOVX CHARACTERISTICS PARAMETER SYMBOL Pulse Width tRLRH WR Pulse Width tWLWH RD Low to Valid Data In tRLDV RD Data Hold After Read Data Float After Read tRHDX tRHDZ ALE Low to Valid Data In Port 0 Address to Valid Data In Port 2 Address to Valid Data In ALE Low to RD or WR Low Port 0 Address Valid to RD or WR Low Port 2 Address Valid to RD or WR Low Data Valid to WR Transition Data Hold After Write tLLDV VARIABLE CLOCK MIN 2tCLCL-11 tMCS-11 2tCLCL-11 tMCS-11 tAVWL2 tQVWX tWHQX ns ns 0 ns STRETCH tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 ns tAVDV2 tAVWL1 UNITS 2tCLCL-25 tMCS-25 tAVDV1 tLLWL VARIABLE CLOCK MAX 0.5tCLCL-5 1.5tCLCL-5 tCLCL-9 2tCLCL-10 1.5tCLCL-9 2.5tCLCL-13 -9 tCLCL-10 tCLCL-7 2tCLCL-5 tCLCL-5 2tCLCL-5 2.5tCLCL-26 1.5tCLCL-28+tMCS 3tCLCL-24 2tCLCL-31+tMCS 3.5tCLCL-32 2.5tCLCL-34+tMCS 0.5tCLCL+6 1.5tCLCL+8 ns ns ns ns ns ns ns ns ns tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tRLAZ note 5 ns Low to Address Float 0 10 tMCS=0 tWHLH RD or WR High to ns tCLCL-5 tCLCL+11 tMCS>0 ALE High NOTE: tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for each Stretch selection. RD M2 0 0 0 0 1 1 1 1 M1 0 0 1 1 0 0 1 1 M0 0 1 0 1 0 1 0 1 MOVX CYCLES 2 machine cycles 3 machine cycles (default) 4 machine cycles 5 machine cycles 6 machine cycles 7 machine cycles 8 machine cycles 9 machine cycles 30 of 42 tMCS 0 4 tCLCL 8 tCLCL 12 tCLCL 16 tCLCL 20 tCLCL 24 tCLCL 28 tCLCL DS80C320/DS80C323 DS80C320/DS80C323 EXTERNAL CLOCK CHARACTERISTICS PARAMETER Clock High Time Clock Low Time Clock Rise Time Clock Fall Time SYMBOL tCHCX tCLCX tCLCH tCHCL MIN 10 10 TYP MAX 5 5 UNITS ns ns ns ns NOTES DS80C320/DS80C323 SERIAL PORT MODE 0 TIMING CHARACTERISTICS PARAMETER Serial Port Clock Cycle Time SM2=0 12 clocks per cycle SM2=1 4 clocks per cycle SYMBOL tXLXL Output Data Setup to Clock Rising Edge MIN ns tXHQX 2tCLCL tCLCL ns tXHDX tCLCL tCLCL ns tXHDV 11tCLCL 2tCLCL ns SM2=0 12 clocks per cycle SM2=1 4 clocks per cycle Clock Rising Edge to Input Data Valid UNITS ns 10tCLCL 3tCLCL SM2=0 12 clocks per cycle SM2=1 4 clocks per cycle Input Data Hold after Clock Rising MAX tQVXH SM2=0 12 clocks per cycle SM2=1 4 clocks per cycle Output Data Hold from Clock Rising TYP 12tCLCL 4tCLCL SM2=0 12 clocks per cycle SM2=1 4 clocks per cycle NOTES EXPLANATION OF AC SYMBOLS In an effort to remain compatible with the original 8051 family, this device specifies the same parameter as such devices, using the same symbols. For completeness, the following is an explanation of the symbols. t A C D H L I P Q R V W X Z Time Address Clock Input data Logic level high Logic level low Instruction PSEN Output data RD signal Valid WR signal No longer a valid logic level Tristate 31 of 42 DS80C320/DS80C323 DS80C320/DS80C323 POWER CYCLE TIMING CHARACTERISTICS PARAMETER Crystal Start-up Time Power-on Reset Delay SYMBOL tCSU tPOR MIN TYP 1.8 MAX 65536 UNITS ms tCLCL NOTES 1 2 NOTES FOR POWER CYCLE TIMING CHARACTERISTICS: 1. Start-up time for crystals varies with load capacitance and manufacturer. Time shown is for an 11.0592 MHz crystal manufactured by Fox crystal. 2. Reset delay is a synchronous counter of crystal oscillations after crystal start-up. Counting begins when the level on the XTAL1 input meets the VIH2 criteria. At 25 MHz, this time is 2.62 ms. PROGRAM MEMORY READ CYCLE 32 of 42 DS80C320/DS80C323 DATA MEMORY READ CYCLE DATA MEMORY WRITE CYCLE 33 of 42 DS80C320/DS80C323 DATA MEMORY WRITE WITH STRETCH=1 34 of 42 DS80C320/DS80C323 DATA MEMORY WRITE WITH STRETCH=2 FOUR CYCLE DATA MEMORY WRITE STRETCH VALUE=2 EXTERNAL CLOCK DRIVE 35 of 42 DS80C320/DS80C323 SERIAL PORT MODE 0 TIMING SERIAL PORT 0 (SYNCHRONOUS MODE) HIGH SPEED OPERATION SM2=1=> TXD CLOCK=XTAL/4 SERIAL PORT 0 (SYNCHRONOUS MODE) SM2=0=> TXD CLOCK=XTAL/12 36 of 42 DS80C320/DS80C323 POWER CYCLE TIMING 37 of 42 DS80C320/DS80C323 40-PIN PDIP (600-MIL) ALL DIMENSIONS ARE IN INCHES. PKG DIM A A1 A2 b c D E E1 e L eB 40-PIN MIN MAX 0.200 0.015 0.140 0.160 0.014 0.022 0.008 0.012 1.980 2.085 0.600 0.625 0.530 0.555 0.090 0.110 0.115 0.145 0.600 0.700 56-G5000-000 38 of 42 DS80C320/DS80C323 44-PIN TQFP NOTES: 1. 2. 3. 4. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH, BUT DO NOT INCLUDE MOLD PROTRUSION; ALLOWABLE PROTRUSION IS 0.25 MM PER SIDE. DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. ALLOWABLE DAMBAR PROTRUSION IS 0.08 MM TOTAL IN EXCESS OF THE B DIMENSION; AT MAXIMUM MATERIAL CONDITION. PROTRUSION NOT TO BE LOCATED ON LOWER RADIUS OR FOOT OF LEAD. CONTROLLING DIMENSIONS: MILLIMETERS. PKG 44-PIN DIM MIN MAX 1.20 A 0.05 0.15 A1 0.95 1.05 A2 11.80 12.20 D 10.00 BSC D1 11.80 12.20 E 10.00 BSC E1 0.45 0.75 L 0.80 BSC e 0.30 0.45 B 0.09 0.20 C 56-G4012-001 39 of 42 DS80C320/DS80C323 44-PIN PLCC NOTES: 1. 2. PIN-1 IDENTIFIER TO BE LOCATED IN ZONE INDICATED. CONTROLLING DIMENSIONS ARE IN INCHES. PKG 44-PIN DIM MIN MAX A 0.165 0.180 A1 0.090 0.120 A2 0.020 B 0.026 0.033 B1 0.013 0.021 c 0.009 0.012 CH1 0.042 0.048 D 0.685 0.695 D1 0.650 0.656 D2 0.590 0.630 E 0.685 0.695 E1 0.650 0.656 E2 0.590 0.630 e1 0.050 BSC N 0.44 56-G4003-001 40 of 42 DS80C320/DS80C323 DATA SHEET REVISION SUMMARY The following represent the key differences between the 041896 and the 052799 version of the DS80C320 data sheet. Please review this summary carefully. 1. Corrected VCC pin description to show DS80C323 operation at +3V. 2. Corrected Timed Access description to show three cycle window. 3. Modified absolute Maximum Ratings for any pin relative to around, VCC relative to ground. 4. Changed minimum oscillator frequency to 1 MHz when using external crystal. 5. Clarified that tPOR begins when XTAL1 reaches VIH2. The following represent the key differences between the 103196 and the 041896 version of the DS80C320 data sheet. Please review this summary carefully. 1. Update DS80C320 25 MHz AC Characteristics. The following represent the key differences between the 041895 and the 031096 version of the DS80C320 data sheet. Please review this summary carefully. 1. 2. 3. 4. 5. Remove Port 0, Port 2 from VOH1 specification (PCN B60802). VOH1 test specification clarified (RST = VCC). Add tAVWL2 marking to External Memory Read Cycle figure. Correct TQFP drawing to read 44-pin TQFP. Rotate page 1 TQFP illustration to match assembly specifications. The following represent the key differences between the 031096 and the 052296 version of the DS80C320 data sheet. Please review this summary carefully. 1. Add Data Sheet Revision Summary. The following represent the key differences between 05/23/96 and 05/22/96 version of the DS80C320 data sheet and between 05/23/96 and 03/27/95 version of the DS80C323 data sheet. Please review this summary carefully. DS80C320: 1. Add DS80C323 Characteristics. 2. Change DS80C320 VPFW specification from 4.5V to 4.55V (PCN E62802). 3. Update DS80C320 33 MHz AC Characteristics. DS80C323: 1. Delete Data Sheet. Contents moved to DS80C320/DS80C323. The following represent the key differences between the 05/22/96 and the 10/21/97 version of the DS80C320 data sheet. Please review this summary carefully. DS80C320 1. Added note to clarify IIL specification. 41 of 42 DS80C320/DS80C323 2. Added note to clarify AC timing conditions. 3. Corrected erroneous tQVXL label on figure "Serial Port Mode 0 Timing" to read tQVXH. 4. Added note to prevent accidental corruption of Watchdog Timer count while changing counter length. DS80C323 1. Added note to clarify IIL specification. 2. Remove port 2 from VOH1 specification, add port 3. 3. IOH for VOH3 specification changed from -3 mA to -2 mA. 4. Added note to clarify AC timing conditions. 42 of 42