27
PRECISION
SEMICONDUCTOR
PRESSURE SENSOR
PF PRESSURE
SENSOR
PF (ADP1)
•A wide range of rated pressure,
including a minute pressure
There are 10 types of sensors covering a
wide range of rated pressure from a
minute pressure between 4.9 kPa {0.05
kgf/cm2}, to a maximum pressure of
980.7 kPa {10 kgf/cm2}.
•Realization of highly accurate, linear
characteristics
This sensor employs a semiconductor
strain gauge method, ensuring accurate
and linear detection characteristics. It
also has excellent repeatability of pres-
sure characteristics.
• Impressive line-up of models
•
Taking their place alongside the stan-
dard 5kΩbridge resistance models are
those with a 3.3kΩresistance which is
optimally suited to 5V drive circuits.
• Economy model (no glass base) gives
outstanding value for consumer appli-
ances
40 kPa (0.4 kgf/cm2) and 49 kPa (0.5
kgf/cm2) units are also available.
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm2}
Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F
0 {0}
0
50
100
49 {0.5} 98.1 {1}
Output voltage, mV
Pressure (gauge pressure), (kPa {kgf/cm2})
TYPICAL
APPLICATIONS
• Medical equipment: Electronic hemody-
namometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
<Cross-section of Sensor Chip>
Silicon Piezo resistance
strain gauge
Anode
junction
Glass
base
Pressure
Pressure
High reliability
die bonding
technology
Very strong,
heat resistant body
Highly reliable wire
bonding technology
1
Bridge resistance 5.0kΩ3.3kΩ
DIP terminal:
Direction opposite
the pressure inlet
direction
Terminal
Pressure
DIP terminal:
Pressure inlet
direction
DIP terminal:
Direction opposite
the pressure inlet
direction
DIP terminal:
Pressure inlet
direction
approx. 0.05kgf/cm2
approx. 0.15kgf/cm2
approx. 0.35kgf/cm2
approx. 0.5kgf/cm2
approx. 1.0kgf/cm2
approx. 2.0kgf/cm2
approx. 3.5kgf/cm2
approx. 5.0kgf/cm2
approx. 8.5kgf/cm2
approx. 10.0kgf/cm2
approx. 0.4kgf/cm2
approx. 0.5kgf/cm2
Standard
type
(With glass
base)
Economy type
(Without glass
base)
ADP1101
ADP1111
ADP1121
ADP1131
ADP1141
ADP1151
ADP1161
ADP1171
ADP1181
ADP1191
——
ADP1132
ADP1201
ADP1211
ADP1221
ADP1231
ADP1241
ADP1251
ADP1261
ADP1271
ADP1281
ADP1291
——
ADP1232
——
——
——
——
——
——
——
——
——
——
ADP11A23
——
——
——
——
——
——
——
——
——
——
——
ADP12A23
——
4.9kPa
14.7kPa
34.3kPa
49.0kPa
98.1kPa
196.1kPa
343.2kPa
490.3kPa
833.6kPa
980.7kPa
40.0kPa
49.0kPa
ADP1:
PF pressure sensor
Terminal profile and direction
1: DIP terminal: Dirtection opposite the
pressure inlet direction
2: DIP terminal: Pressure inlet direction
Rated pressure
0: 4.9 kPa {approx. 0.05 kgf/cm2}
1: 14.7 kPa {approx. 0.15 kgf/cm2}
2: 34.3 kPa {approx. 0.35 kgf/cm2}
3: 49.0 kPa {approx. 0.5 kgf/cm2}
4: 98.1 kPa {approx. 1.0 kgf/cm2}
5: 196.1 kPa {approx. 2.0 kgf/cm2}
6: 343.2 kPa {approx. 3.5 kgf/cm2}
7: 490.3 kPa {approx. 5.0 kgf/cm2}
8: 833.6 kPa {approx. 8.5 kgf/cm2}
9: 980.7 kPa {approx. 10.0 kgf/cm2}
A: 40.0 kPa {approx. 0.4 kgf/cm2}
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
ORDERING INFORMATION
Ex. ADP
Bridge resistance
Nil : 5.0kΩ
3 : 3.3kΩ
Part No.
PF PRESSURE SENSOR 2002.10.23 7:58 PM Page 27
28
PF (ADP1)
DATA
1. Characteristics data
1-<1> Output characteristics
ADP1141
Drive current: 1.5 mA; temperature: 25°C 77°F
1-<2> Offset voltage – temperature
characteristics
ADP1141
Drive current: 1.5 mA; rating ±5%FS
1-<3> Sensitivity – temperature
characteristics (%FS)
ADP1141
Drive current: 1.5 mA; rating ±2.5%FS
100
80
60
40
20
0
–20
–40 49 {0.5}0 98.1 {1}
kpa {kgf/cm2}
Output voltage (mV)
Rated pressure
4
3
2
1
0
–2
–1
25
47
0
32 50
122
Temperature (°C °F)
Offset voltage – temperature characteristics (%FS)
4
3
2
1
0
–2
–1
Sensitivity – temperature characteristics (%FS)
25
47
0
32 50
122
Temperature (°C °F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP1131, temperature: 25°C 77°F
–2
–1
0
0
1
2
1×1055×1051×106
Pressure cycle (cycle)
Offset voltage range (%FS)
Output span voltage range (%FS)
–2
–1
0
0
1
2
1×1055×1051×106
Pressure cycle (cycle)
Even after testing for 1 million times, the vari-
ations in the offset voltage and output span
voltage are minimal.
2-<1> Offset voltage range 2-<2> Output span voltage range
SPECIFICATIONS
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA ±0.01 mA at a temperature of 25°C 77°F and humidity ranging from 25% to
85%.
2. Please consult us if a pressure medium other than air is to be used.
3. This is the regulation which applies within the compensation temperature range.
4. Please consult us if the intended use involves a negative pressure.
PF PRESSURE SENSOR 2002.10.23 7:58 PM Page 28
29
PF (ADP1)
DIMENTIONS
1. Terminal direction: Direction opposite the pressure inlet
derection ADP11mm (m)2. Terminal direction: Pressure inlet direction
ADP12mm (m)
General tolerance: ±0.3 ±.012 mm inch
10.0
.394
Atmospheric
pressure
inlet hole
0.5 dia.
.020 dia.
Pressure
inlet hole
0.8 dia.
.031 dia.
0.6
.024
8.6
.339
6.0
.236
4.9
.193
3.3 .130
2.54±0.25
.100±.010 2.54±0.25
.100±.010
0.5±0.1 .020±.004
1.2±0.1 .047±.004
1.1
.043
10.16
.400 ±0.25
±.010
0.25
.010
+0.1
−0.05
+.004
−.002
0 to 15˚
C0.5
.020
R0.5
.020
10.16
.400
2.54 .100
5.08 .200 2.54
.100
6-0.9 dia.
6-.035 dia.
3.0 dia.
.118 dia.
+0
−0.1
+0
−.004
10.0
.394
Atmospheric
pressure
inlet hole
0.5 dia.
.020 dia.
Pressure
inlet hole
0.8 dia.
.031 dia.
0.6
.024
0.25
.010
8.6
.339
4.0
.157
3.3 .130
0.5±0.1 .020±.004
1.2±0.1 .047±.004 C0.5
.020
R0.5
.020
10.16
.400
2.54 .100
5.08 .200 2.54
.100
6-0.9 dia.
6-.035 dia.
6.0
.236
2.54±0.25
.100±.010 2.54±0.25
.100±.010
0 to 15˚
10.16
.400 ±0.25
±.010
3.0 dia.
.118 dia.
+0
−0.1
+0
−.004
0.25
.010
+0.1
−0.05
+.004
−.002
6 dia.
.236 dia.
3. Terminal connection diagram
+Output −Output
−Input
+Input
R2R1
R4R3
Terminal No. Name
1Output (−)
2Power supply (+)
3Output (+)
4No connection
5Power supply (−)
6Output (−)
Note: Leave terminal 4 unconnected.
Tolerance: ±0.1 .004Tolerance: ±0.1 .004
Recommended PC board pattern
(BOTTOM VIEW) Recommended PC board pattern
(BOTTOM VIEW)
Tested item Tested condition Result
Environmental
characteristics
Endurance
characteristics
Storage at high
temperature Left in a 120°C 248°F constant temperature bath
1,000 hrs. Passed
Temperature:
Time:
High temperature/high
humidity operation 40°C 104°F, 90% RH
106, rated voltage applied Passed
Temperature/humidity:
Operation times:
Dropping resistance 75 cm 29.528 inch
2 times Passed
Dropping height:
Times:
Terminal strength 9.8 N {1 kgf}, 10 sec.
4.9 N {0.5 kgf}, left and right 90° 1 time Passed
Pulling strength:
Bending strength:
Mechanical
characteristics
Vibration resistance
1.5 mm .059 inch
10 to 55 Hz
X, Y, Z 3 directions
2 hrs each Passed
Double amplitude:
Vibration:
Applied vibration direction:
Times:
Storage at low
temperature Left in a –40°C –40°F constant temperature bath
1,000 hrs. Passed
Temperature:
Time:
Humidity Left at 40°C 104°F, 90% RH
1,000 hrs. Passed
Temperature/humidity:
Time:
Temperature cycle –40°C to 120°C –40°F to 248°F
30 min.
100 Passed
Temperature:
1 cycle:
Times of cycle:
Soldering
Resistance
Soldered in
DIP soldering bath 230°C 446°F
5 sec. Passed
Temperature:
Time:
Temperature 260°C 500°F
10 sec. Passed
Temperature:
Time:
3. Evaluation test
Note: For details other than listed above, please consult us.
PF PRESSURE SENSOR 2002.10.23 7:58 PM Page 29
PF (ADP1)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C 500°F, 5
sec.
Soldering iron: 260 to 300°C 500 to
572°F (30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sul-
fites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in acci-
dents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is posi-
tioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pres-
sure inlet is blocked.
4) Leave pin No. 4 unconnected since
the pressure sensor chip may be dam-
aged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, con-
sult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
8) The pressure sensor chip is construct-
ed in such a way that its output will fluc-
tuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sen-
sor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
•When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
•When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
The pressure sensor is designed to con-
vert a voltage by means of constant cur-
rent drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
OP
AMP
OP
AMP
OP
AMP
Constant current
circuit unit Pressure
sensor
Amplifier circuit unit
MOUNTING METHOD
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
Methods of transmitting air pressures
When the pressure
is low When the pressure
is high
(4.9 to 98.1 kPa) (196.1 to 980.7 kPa)
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
Tube
Printed-
circuit
board
Printed-
circuit
board
O-ring
Pressure
inlet pipe
PF PRESSURE SENSOR 2002.10.23 7:58 PM Page 30
12/1/2002 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.