24-Bit, 96kHz
BiCMOS Sign-Magnitude
DIGITAL-TO-ANALOG CONVERTER
49%
FPO
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
PCM1704
®
FEATURES
SAMPLING FREQUENCY (f
S
): 16kHz to 96kHz
8X OVERSAMPLING AT 96kHz
INPUT AUDIO DATA WORD: 20-, 24-Bit
HIGH PERFORMANCE:
Dynamic Range: K Grade = 112dB typ
SNR: 120dB typ
THD+N: K Grade = 0.0008% typ
FAST CURRENT OUTPUT: ±1.2mA/200ns
GLITCH-FREE OUTPUT
PIN-PROGRAMMABLE DATA INVERSION
POWER SUPPLY: ±5V
SMALL 20-LEAD SO PACKAGE
© 1998 Burr-Brown Corporation PDS-1454C Printed in U.S.A. February, 1999
TM
DESCRIPTION
The PCM1704 is a precision, 24-bit digital-to-analog
converter with exceptionally high dynamic perfor-
mance. The ultra-low distortion and excellent low-
level signal performance makes the PCM1704 an ideal
candidate for high-end consumer and professional
audio applications. When used with a digital interpo-
lation filter, the PCM1704 supports 8X oversampling
at 96kHz.
The PCM1704 incorporates a BiCMOS sign-magni-
tude architecture that eliminates glitches and other
nonlinearities around bipolar zero. The PCM1704 is
precision laser-trimmed at the factory to minimize
differential linearity and gain errors.
In addition to high performance audio systems, the
PCM1704 is well-suited to waveform synthesis appli-
cations requiring very low distortion and noise.
Serial Input
and
Control Logic
Reference and Servo
REF DC SERVO DC DGND +V
DD
–V
CC
AGND
23-Bit DAC A
23-Bit DAC B I
OUT
Bipolar Offset
INVERT
20-BIT
WCLK
DATA
BCLK
Power Supply
–V
DD
+V
CC
BPO DC
PCM1704
SBAS097
®
2
PCM1704
SPECIFICATIONS
All specifications at TA = +25°C, ±VCC = ±VDD = ±5V, fS = 768kHz (96kHz • 8), and 24-bit data, unless otherwise noted.
PCM1704U
PARAMETER CONDITIONS MIN TYP MAX UNITS
RESOLUTION 24 Bits
DATA FORMAT
Audio Data Interface Format 20-, 24-Bit, MSB-First
Audio Data Code Binary Two’s Complement
Sampling Frequency (fS)16 96 kHz
Input Clock Frequency 25 MHz
DIGITAL INPUT/OUTPUT
Input Logic Level:
VIH(1) +2.0 +5.0 V
VIL(1) 0 +0.8 V
VIH(2) –3.0 0 V
VIL(2) –5.0 –4.2 V
Input Logic Current:
IIH(1) VIH = +VDD ±10 µA
IIL(1) VIL = 0V ±10 µA
IIH(2) VIH = 0V ±10 µA
IIL(2) VIL = –VDD –100 µA
DYNAMIC PERFORMANCE(3)
THD+N VO = 0dB PCM1704U 0.0025 0.0030 %
PCM1704U-J 0.0015 0.0025 %
PCM1704U-K 0.0008 0.0015 %
VO =–20dB PCM1704U 0.008 0.020 %
PCM1704U-J 0.007 0.015 %
PCM1704U-K 0.006 0.01 %
Dynamic Range EIAJ, A-weighted
PCM1704U, U-J 102 110 dB
PCM1704U-K 106 112 dB
Signal-to-Noise Ratio EIAJ, A-weighted 112 120 dB
Low Level Linearity f = 1002Hz at –90dB ±0.5 dB
DC ACCURACY
Gain Error ±1.0 ±3.0 % of FSR
Bipolar Zero Error ±0.5 ±1.0 % of FSR
Gain Drift 0°C to 70°C±25 ppm of FSR/°C
Bipolar Zero Error Drift 0°C to 70°C±5 ppm of FSR/°C
ANALOG OUTPUT
Output Range ±1.2 mA
Output Impedance 1.0 k
Settling Time ±0.0003% of FSR, ±1.2mA Step 200 ns
POWER SUPPLY REQUIREMENTS
Voltage Range: +VCC = +VDD +4.75 +5.0 +5.25 VDC
–VCC = –VDD –4.75 –5.0 –5.25 VDC
Combined Supply Current: +ICC +VCC = +VDD = +5.0V 5 8 mA
–ICC –VCC = –VDD = –5.0V 30 45 mA
TEMPERATURE RANGE
Operation –25 +85 °C
Storage –55 +125 °C
NOTES: (1) BCLK, WCLK, DATA. (2) 20BIT, INVERT. (3) Dynamic performance data is tested with 5534 I/V amp with 7.5k feedback resistor. THD+N data is
tested by Shibasoku 725C with 30kHz external LPF, 400Hz HPF, average mode. Input signal frequency = 1.1kHz.
®
3PCM1704
PIN ASSIGNMENTS
PIN CONFIGURATION
TOP VIEW SOIC
PACKAGE INFORMATION
PACKAGE
TEMPERATURE DRAWING
PRODUCT PACKAGE RANGE NUMBER(1)
PCM1704U 20-Lead SOIC –25°C to +85°C 248
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VDD ,+VCC ............................................................. +6.5V
Supply Voltage Differences .............................................................. ±0.1V
GND Voltage Differences ................................................................. ±0.1V
Digital Input Voltage
(BCLK, WCLK, DATA) ............................ DGND –0.3V to (+VDD + 0.3V)
(20BIT, INVERT).................................... –VDD – 0.3V to (DGND + 0.3V)
Input Current (any pins except supply pins) ................................... ±10mA
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature...................................................... –55°C to +125°C
Lead Temperature (soldering, 5s) ................................................. +260°C
Package Temperature (reflow, 10s) .............................................. +235°C
PIN NAME I/O FUNCTION
1 DATA IN Serial Audio Data Input.
2 BCLK IN Bit Clock Input for Serial Audio Data.
3 NC No Connection.
4–V
DD Digital Power, –5V.
5 DGND Digital Ground.
6+V
DD Digital Power, +5V.
7 WCLK IN Data Latch Enable Input.
8 NC No Connection.
9 20BIT IN Input Data Word Selection(1).
10 INVERT IN Input Data Polarity Selection(1).
11 +VCC Analog Power, +5V.
12 BPO DC Bipolar Offset Decoupling Capacitor.
13 NC No Connection.
14 IOUT OUT Current Output for Audio Signal.
15 AGND Analog Ground.
16 AGND Analog Ground.
17 SERVO DC Servo Amplifier Decoupling Capacitor.
18 NC No Connection.
19 REF DC Band Gap Reference Decoupling Capacitor.
20 –VCC Analog Power, –5V.
NOTE: (1) Internal pull-up resistors. Input level must be a voltage from –VDD
to DGND.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PCM1704U
DATA
BCLK
NC
–V
DD
DGND
+V
DD
WCLK
NC
20BIT
INVERT
–V
CC
REF DC
NC
SERVO DC
AGND
AGND
I
OUT
NC
BPO DC
+V
CC
®
4
PCM1704
–90dB SIGNAL SPECTRUM
Output Frequency (Hz)
Amplitude (dB)
–80
–90
–100
–110
–120
–130
–140
–150
20.0 2.02k 4.02k 6.01k 8.01k 10.0k 12.0k 14.0k 16.0k 18.0k 20.0k
SPECIFICATIONS
All specifications at +25°C, ±VCC and ±VDD = ±5.0V, unless otherwise noted.
DAC OUTPUT
–110dB, 24-Bit, 96kHz DAC OUTPUT
–110dB, 20-Bit, 96kHz
DAC OUTPUT
–120dB, 24-Bit, 96kHz DAC OUTPUT
–120dB, 20-Bit, 96kHz
100
10
1
0.1
0.10
0.001
0.0001
0
–20
–40
–60
–80
–100
–120
–100 –90 –80 –70 –60 –40 –30 –10–20–50
Output Level (dBFS)
THD+N vs LEVEL
THD+N (%)
THD+N (dB)
0
16-Bit Data
24-Bit Data
®
5PCM1704
SPECIFICATIONS (CONT)
All specifications at +25°C, ±VCC and ±VDD = ±5.0V, unless otherwise noted.
–60
–70
–80
–90
–100
–110
–120 10 20 50 200 500100
Frequency (Hz)
POWER SUPPLY REJECTION RATIO vs FREQUENCY
Power Supply Rejection Ratio (dB)
1k
–V
CC
+V
CC
®
6
PCM1704
THEORY OF OPERATION
SIGN-MAGNITUDE ARCHITECTURE
Digital audio systems have traditionally used laser-trimmed,
current-source DACs in order to achieve sufficient accuracy.
However, even the best of these suffer from potential low-
level nonlinearity due to errors in the major carry bipolar
zero transition. Current systems have turned to oversampling
data converters, such as the popular delta-sigma architec-
tures, to correct the linearity problems. This is done, how-
ever, at the expense of signal-to-noise performance, and the
noise shaping techniques utilized by these converters creates
a considerable amount of out-of-band noise. If the outputs
are not properly filtered, dynamic performance of the overall
system will be adversely effected.
The PCM1704 employs an innovative architecture which
combines the advantages of traditional DACs (e.g., excellent
full-scale performance, high signal-to-noise ratio, and ease
of use) with superior low-level performance. This architec-
ture is referred to as sign-magnitude. Two DACs are com-
bined in a complementary arrangement to produce an ex-
tremely linear output. The two DACs share a common
reference, and a common R-2R ladder for bit current sources.
The R-2R ladder utilizes dual balanced current segments to
ensure ideal tracking under all conditions. By interleaving
the individual bits of each DAC and employing precision
laser-trimming of resistors, a highly accurate match between
the two DACs is achieved.
The sign-magnitude architecture, which steps away from
zero with small steps in both directions, avoids any glitching
or large linearity errors, and provides an absolute current
output. The low-level performance of the PCM1704 is such
that true 24-bit resolution can be realized around the critical
bipolar zero point.
DISCUSSION OF KEY
SPECIFICATIONS
TOTAL HARMONIC DISTORTION + NOISE (THD+N)
This is the key specification for the PCM1704. Digital data
words are read into the PCM1704 at eight times the standard
DVD audio sampling frequency of 96kHz (e.g., 8 x 96kHz =
768kHz) to create a sinewave output of 1100Hz. The output
of the DAC is then passed through analog signal conditioning
circuitry before being input to a distortion analyzer.
For production testing, the output of the DAC is connected
to a current-to-voltage (I/V) converter. The output of the
I/V converter is then connected to a 40kHz, 3rd-order GIC
low-pass filter. The filter output is then passed on to a
programmable gain amplifier to provide gain for low-level
test signals before being fed into an analog distortion
analyzer (Shiba Soku Model 725 or equivalent).
For the audio bandwidth, the THD+N for the PCM1704 is
essentially flat for all frequencies.
DYNAMIC RANGE
Dynamic range in data converters is specified as the measure
of THD+N at an effective output signal level of –60dBFS
(conforms to EIAJ method with A-weighting applied). Reso-
lution is commonly used as a theoretical measure of dy-
namic range, but it does not take into account the effects of
distortion and noise at low signal levels. The sign-magnitude
architecture of the PCM1704, with its ideal performance
around bipolar zero, provides a more usable dynamic range
(even with the strict audio definition) than any other previ-
ously available D/A converter.
IDLE CHANNEL SIGNAL-TO-NOISE RATIO (SNR)
Another important specification for a digital audio converter
is idle channel signal-to-noise ratio (Idle Channel SNR).
This is the ratio of the noise on the DAC output at bipolar
zero compared to the full-scale range of the D/A converter.
To make this measurement, the digital input is continually
fed the code for bipolar zero, while the output of the DAC
is band limited from 20Hz to 20kHz and A-weighting is
applied. The ideal channel SNR for the PCM1704 is typi-
cally greater than 120dB, making it ideal for low noise
applications.
OFFSET GAIN AND TEMPERATURE DRIFT
Although the PCM1704’s primary application is in high
performance digital audio systems where dynamic specifica-
tions are most important, specifications are also given for
more traditional DC parameters. These include gain error,
bipolar zero offset, temperature gain and offset drift. These
specifications are important in test and measurement sys-
tems, which is the other main systems application for the
PCM1704.
®
7PCM1704
AUDIO DATA INTERFACE
BASIC OPERATION
The audio interface of the PCM1704 accepts TTL-compat-
ible input levels. The data format at the DATA input of the
PCM1704 is Binary Two’s Complement, with the most
significant bit (MSB) being first in the serial input bit steam.
Table I shows the relationship between the audio input data
and DAC output for the PCM1704. Any number of bits can
precede the 24 bits to be loaded since only the last 24 bits
will be transferred to the parallel DAC register after WCLK
(pin 7) has gone LOW (logic 0).
Maximum Bit Clock (BCLK) Rate
The maximum BCLK rate is specified as 25MHz. This is
derived from the 8X oversampling of the PCM1704. Given
a 96kHz sampling rate, an 8X oversampling input and a
32-bit frame length, we get:
96kHz • 8 • 32 = 24.576MHz
“Stopped Clock” Operation
The PCM1704 is normally operated with a continuous
BCLK input. If BCLK is stopped between input data words,
the last 24 bits shifted in are not actually transferred from the
serial register to the parallel DAC register until WCLK goes
LOW. WCLK must remain LOW until after the first BCLK
cycle of the next data word to insure proper DAC operation.
The specified setup and hold times for DATA and WCLK
must be observed.
DATA FORMAT CONTROL
Data format is controlled by two pins on the PCM1704—the
20BIT and INVERT inputs. Their functions are described in
the following paragraphs and tables.
Input Word Length
20BIT (pin 9) is used to select the input data length. Table
II shows the available selections. Pin 9 is internally pulled
up to DGND and therefore, defaults to 24-bit data.
BINARY TWO’S COMPLEMENT
INPUT DATA (Hex) DAC OUTPUT
7FFFFF + Full Scale
000000 Bipolar Zero
FFFFFF Bipoar Zero – 1 LSB
800000 – Full Scale
TABLE I. Digital Input/DAC Output Relationships.
Audio data is supplied to the DATA (pin 1) input. The bit
clock is used to shift data into the PCM1704 and is supplied
to BCLK (pin 2). All DAC serial input data bits are latched
into the serial input register on the rising edge of BCLK. The
serial-to-parallel data transfer to the DAC occurs on the
falling edge of WCLK. The change in the output of the DAC
occurs at the rising edge of the 2nd BCLK after the falling
edge of WCLK. Figure 1 shows the audio data input format.
Figure 2 shows the input timing relationships.
FIGURE 1. Audio Input Data Format.
t
DS
t
BCH
t
BCY
t
DH
t
BCL
t
WCH
t
WCL
t
WH
t
WS
1.4V
1.4V
1.4V
WCLK
BCLK
DATA
FIGURE 2. Audio Input Data Timing.
BCLK Pulse Cycle Time tBCY 40ns (min)
BCLK Pulse Width HIGH tBCH 14ns (min)
BCLK Pulse Width LOW tBCL 14ns (min)
BCLK Rising Edge to WCLK Falling Edge tWH 10ns (min)
WCLK Falling Edge to BCLK Rising Edge tWS 10ns (min)
WCLK Pulse Width HIGH tWCH > tBCY
WCLK Pulse WIdth LOW tWCL > tBCY
DATA Set-up Time tDS 10ns (min)
DATA Hold Time tDH 10ns (min)
20BIT (Pin 9) DATA WORD LENGTH
20BIT = H (DGND) 24-Bit Data Word
20BIT = L (–VDD) 20-Bit Data Word
TABLE II. Input Word Length Selection.
B1 B2 B3 B22 B23
MSB LSB
B24
WCLK
DATA DAC Output
BCK
DATA (20-Bit)
DATA (24-Bit)
LSB
B1 B2 B3 B18 B19
MSB
B20
®
8
PCM1704
Input Data Inversion
INVERT (pin 10) is used to select the phase of the input data
presented to the DAC. Table III shows the two options. Pin
10 is internally pulled up to DGND, and therefore defaults
to normal, or non-inverting data.
APPLICATIONS INFORMATION
POWER SUPPLIES
For this discussion, please refer to the internal connection
diagram for the PCM1704 in Figure 3. The PCM1704 only
requires a ±5V supply for operation. Both positive supplies
(+VDD and +VCC) should be tied together at a single point
and connected to a single +5V analog power supply. Simi-
larly, both negative supplies (–VDD and –VCC) should be tied
at a single point and connected to a single –5V analog power
INVERT (Pin 10) PHASE
INVERT = H (DGND) Normal (non-inverted)
INVERT = L (–VDD) Inverted
TABLE III. Input Data Phase Selection.
supply. No advantage is gained by using separate analog and
digital power supplies. It is more important that the analog
supplies used to drive these pins are as noise and ripple free
as possible to reduce coupling of supply noise to the output.
Power supply decoupling capacitors should be used at each
supply pin to maximize power supply rejection, as shown in
Figure 3. All ground pins (AGND and DGND) should be
connected to an analog ground plane as close to the PCM1704
as possible. The PCM1704 should reside entirely over the
analog ground plane of the printed circuit board.
Bypass and Decoupling Capacitor Requirements
Various-sized decoupling capacitors can be used, with no
special tolerances being required. Figure 5 shows typical
values used by Burr-Brown on our evaluation fixture, which
designers can use as recommended values. All capacitors
should be located as close to the appropriate pins of the
PCM1704 as possible to reduce noise pickup from sur-
rounding circuitry. Aluminum electrolytic capacitors are
recommended for larger values, while metal-film or mono-
lithic ceramic capacitors are used for smaller values.
FIGURE 3. PCM1704 Internal Connection Diagram.
Interface
Logic
and
Logic Bias
23-Bit
Segment
Switches
Reference,
Servo
and
Bipolar
Offset
Analog
Bias
Logic
Bias
23-Bit
Current
Segments
BPO
DGND
–V
CC
AGND
I
OUT
BCLK
WCLK
DATA
–V
DD
+V
DD
+V
CC
+5V Supply
BPO DC
SERVO DC
REF DC
+
++
+
+
+
+
–5V Supply
2mA 3mA
20mA 10mA
®
9PCM1704
FIGURE 4. Audio Interface Connections for Stereo Audio
Application.
FIGURE 5. Typical Application Circuit (one channel shown).
DOR
WCKO
BCKO
DOL
DATA
WCLK
BCLK
DATA
WCLK
BCLK
DF1704 or Other
Digital Filter PCM1704
PCM1704
24-Bit
96kHz
Data
TYPICAL APPLICATION
EXAMPLES
The audio interface connections for a stereo audio applica-
tion is shown in Figure 4. The audio data is input to the
digital filter, which then oversampleS the data by a factor of
8. The audio data is then filtered digitally and output to the
PCM1704 DACs.
Figure 5 shows single channel circuit connections for a
typical PCM1704 application. It shows the PCM1704 inter-
face to the digital filter, the I/V converter, and the DAC post
filter. Selection of an appropriate op amp for the I/V con-
verter is critical for obtaining optimum dynamic perfor-
mance from the PCM1704. The OPA627 is recommended
for this application. Op amps with similar characteristics and
faster settling times may also be used.
The suggested DAC post filter is a second-order lowpass
active filter, using the multiple feedback (MFB) circuit
technique. The OPA2134 is an excellent choice for the op
amp in this circuit, since it is designed for high performance
audio applications. The post filter is used to reconstruct and
band limit the DAC output signal.
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
C
1
C
2
C
4
C
3
C
5
+
Digital
Controls
Aluminum
Electrolytics
–5V
100µF
0.1µF
+
C
7
+
+
+
4.7µF
OPA627
1/2
OPA2134
47pF
+
4.7µF
+
C
6
+
+
100µF
0.1µF
+
100µF
0.1µF
+
+5V –15V
Audio
Output
+15V
100µF
0.1µF
+
PCM1704U
DATA
BCLK
NC
–V
DD
DGND
+V
DD
WCLK
NC
20BIT
INVERT
–V
CC
REF DC
NC
SERVO DC
AGND
AGND
I
OUT
NC
BPO DC
+V
CC
8X
Oversampling
Interpolation
Filter
2.5k
U1 U2
4.7k
4.7k
2k
4.7µF
560pF
2200pF
+
4.7µF
+
DAC I/V Post Filter
24-Bit
96kHz Data
C
1
= 4.7µF
C
2
= 4.7µF
C
3
= 4.7µF
C
4
= 47µF
C
5
= 47µF
C
6
= 100µF
C
7
= 4.7
PACKAGE OPTION ADDENDUM
www.ti.com 30-Nov-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
PCM1704U NRND SO NS 20 38 Pb-Free (RoHS) CU SNBI Level-2-260C-1 YEAR
PCM1704U-J NRND SO NS 20 38 Pb-Free (RoHS) CU SNBI Level-2-260C-1 YEAR
PCM1704U-K NRND SO NS 20 38 Pb-Free (RoHS) CU SNBI Level-2-260C-1 YEAR
PCM1704U-K/2K NRND SO NS 20 2000 Pb-Free (RoHS) CU SNBI Level-2-260C-1 YEAR
PCM1704U/2K NRND SO NS 20 2000 Pb-Free (RoHS) CU SNBI Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
PCM1704U-K/2K SO NS 20 2000 330.0 25.4 8.8 13.1 2.8 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
PCM1704U-K/2K SO NS 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated