Device Selection Guide
Footprint AS AlGaAs Part per
(mm) HER Orange Yellow Green Red Reel
3.20 x 1.60 HSMS-C150 HSMD-C150 HSMY-C150 HSMG-C150 HSMH-C150 3000
2.00 x 1.25 HSMS-C170 HSMD-C170 HSMY-C170 HSMG-C170 HSMH-C170 4000
1.60 x 0.80 HSMS-C190 HSMD-C190 HSMY-C190 HSMG-C190 HSMH-C190 4000
3.20 x 1.00[1] HSMS-C110 HSMD-C110 HSMY-C110 HSMG-C110 HSMH-C110 3000
Surface Mount Chip LEDs
Technical Data
HSMx-C190/C170/
C150/C110
Features
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of -30°C to +85°C
Right Angle Package
Available
Five Colors Available
Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Applications
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
Description
These chip LEDs are designed
in an industry standard package
for ease of handling and use. Five
different LED colors are available
in four compact, single color
packages.
The HSMx-C150 has the industry
standard 3.2 x 1.6 mm footprint
that is excellent for all around use.
The HSMx-C170 has the widely
used 2.0 x 1.25 mm footprint.
The HSMx-C190 has the industry
standard 1.6 x 0.8 mm footprint,
its low 0.8 mm profile and wide
viewing angle make this LED
exceptional for backlighting
applications.
The HSMx-C110 is a right-
angle package with the univer-
sally accepted dimensions of
3.2 x 1.0 x 1.5 mm. This part is
ideal for LCD backlighting and
sidelighting applications.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel illumination especially
where space is a premium.
Note: Right-angle package
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Package Dimensions
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C150 HSMx-C170
HSMx-C190 HSMx-C110
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
[3]
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
(ANODE MARK FOR
HSMH-C150)
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
[3]
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
(ANODE MARK FOR
HSMH-C170)
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
[3]
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
(ANODE MARK FOR
HSMH-C190)
3.2 (0.126 )
0.5 (0.020)
1.0 (0.039)
POLARITY
[3]
CATHODE
MARK
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
(ANODE MARK FOR
HSMH-C110)
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Absolute Maximum Ratings at TA=25°C for HER, Orange, Yellow and Green
Parameter HSMx-C150 HSMx-C170 HSMx-C190 HSMx-C110 Units
DC Forward Current[1] 25 20 20 25 mA
Peak Pulsing Current[2] 100 100 100 100 mA
Power Dissipation 65 52 52 65 mW
Reverse Voltage (IR=100 µA)5555V
LED Junction Temperature 95 95 95 95 °C
Operating Temperature Range -30 to +85 -30 to +85 -30 to +85 -30 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 -40 to +85 -40 to +85 °C
Soldering Temperature See IR soldering profile (Figure 7)
Absolute Maximum Ratings at TA=25°C for AS AlGaAs Red
Parameter HSMx-C150 HSMx-C170 HSMx-C190 HSMx-C110 Units
DC Forward Current[1] 30 25 25 30 mA
Peak Pulsing Current[2] 100 100 100 100 mA
Power Dissipation 78 65 65 78 mW
Reverse Voltage (IR=100µA)5555V
LED Junction Temperature 95 95 95 95 °C
Operating Temperature Range -30 to +85 -30 to +85 -30 to +85 -30 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 -40 to +85 -40 to +85 °C
Soldering Temperature See IR soldering profile (Figure 7)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at TA=25°C
Reverse Capacitance
Forward Voltage Breakdown C(pF), Thermal
Part Number Color VF(Volts) VR(Volts) @ VF = 0 V, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ-P (°C/W)
Typ. Max. Min. Typ. Typ.
HSMS-C150/110 HER 2.1 2.6 5 5 400
HSMS-C170/190 250
HSMD-C150/110 Orange 2.2 2.6 5 7 400
HSMD-C170/190 250
HSMY-C150/110 Yellow 2.1 2.6 5 6 400
HSMY-C170/190 250
HSMG-C150/110 Green 2.2 2.6 5 9 400
HSMG-C170/190 250
HSMH-C150/110 AlGaAs 1.8 2.6 5 18 460
HSMH-C170/190 300
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Optical Characteristics at TA=25°C
Luminous Peak Dominant
Intensity[1] Wavelength Wavelength Viewing
Part Number Color Iv(mcd)@20mA lpeak(nm) ld(nm) Angle 2u1/2(°)[2]
Min. Typ. Typ. Typ. Typ.
HSMS-C150/170/190 HER 2.50 10.0 630 626 170
HSMD-C150/170/190 Orange 2.50 8.0 605 604 170
HSMY-C150/170/190 Yellow 2.50 8.0 589 586 170
HSMG-C150/170/190 Green 4.00 15.0 570 572 170
HSMH-C150/170/190 AlGaAs 6.30 17.0 660 639 170
HSMS-C110 HER 2.50 11.0 630 626 130
HSMD-C110 Orange 2.50 9.0 605 604 130
HSMY-C110 Yellow 2.50 9.0 589 586 130
HSMG-C110 Green 4.00 16.0 570 572 130
HSMH-C110 AlGaAs 6.30 19.0 660 639 130
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical
axis of the lamp package.
2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Figure 1. Relative Intensity vs. Wavelength.
WAVELENGTH – nm
HER
GREEN
RELATIVE INTENSITY
1.0
0.5
0500 550 600 650 700 750
YELLOW
ORANGE
AlGaAs
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Figure 2. Forward Current vs.
Forward Voltage. Figure 3. Luminous Intensity vs.
Forward Current. Figure 4. Maximum Forward Current
vs. Ambient Temperature.
Figure 5. Relative Intensity vs. Angle for HSMx-C110.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
100
10
1
0.11.5 1.7 1.9 2.1 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
GREEN
ORANGE
YELLOW
AlGaAs HER
01020 40
I
F
– FORWARD CURRENT – mA
0
0.4
1.2
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
30
GaP
AlGaAs
0.8
0
35
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
25
30
10 Rθ
J-A
=
800°C/W
Rθ
J-A
=
600°C/W
20
C150/C110
HER,
ORANGE,
YELLOW,
GREEN
C170/C190
AlGaAs
C170/C190
HER,
ORANGE,
YELLOW,
GREEN
C150/C110
AlGaAs
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Figure 6. Relative Intensity vs. Angle for HSMx-C150,
C170 and C190.
Note: All dimensions in millimeters (inches).
Figure 7. Recommended Reflow Soldering
Profile.
Figure 8. Recommended Soldering Pattern
for HSMx-C150. Figure 9. Recommended Soldering Pattern
for HSMx-C170.
Figure 10. Recommended Soldering Pattern
for HSMx-C190. Figure 11. Recommended Soldering Pattern
for HSMx-C110.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
5.0 (0.200)
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING BOARD
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Note: All dimensions in millimeters (inches).
Figure 12. Reeling Orientation.
Figure 13. Reel Dimensions.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS






178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
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Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise specified.
Figure 14. Tape Dimensions.
Figure 15. Tape Leader and Trailer Dimensions.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR 
COVER TAPE.






8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
HSMx-C150 SERIES 3.75 (0.148)  2.10 (0.083) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
HSMx-C170 SERIES 2.40 (0.094)  1.60 (0.063) 1.20 (0.047)
HSMx-C190 SERIES 1.85 (0.073)  1.00 (0.039) 1.20 (0.047)
HSMx-C110 SERIES 3.35 (0.132)  1.85 (0.073) 1.20 (0.047)


HSMx-C110
POSITION ON
CARRIER TAPE
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2000 Agilent Technologies, Inc.
Obsoletes 5968-7952E (11/99)
5980-1041E (5/00)
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