○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
www.rohm.com
09.Feb.2016 Rev.001
Switching Regulator ICs
with Built-in FET (5V)
BD9639MWV
General Description
BD9639MWV is a 6-channel system switching
regulator IC with built-in FET and error amplifier phase
compensation for DSC/DVC applications. The built-in
regulators consisting of 2ch Buck-Boost, 2ch Buck and
2ch Boost circuits operate at high efficiency.
Features
6CH DC/DC converter
・CH1 Boost FET embedded Start-up ch,Motor
・CH2 Buck FET embedded Core
・CH3 Buck-Boost FET embedded CMOS
・CH4 Buck-Boost FET embedded Digital
・CH5 Buck FET embedded CMOS, Memory
・CH6 Boost FET embedded LED
Low voltage operation 2.5[V]
CH1 supply voltage output for internal circuit
CH1 PWM / PFM selectable
CH3-CH4 Boost-Buck auto switching
CH6 integrated Boost output shutdown
(Load switch embedded)
Soft-start correspondence to each channel
Built-in ground short protection function
(CH2 to CH6)
Built-in error amp phase compensation (CH1 to
CH6)
Operating frequency 1.5[MHz] (CH1 to CH6)
Applications
DSC/DVC
Key Specifications
Input Supply Voltage Range: 2.5V to 5.5V
Oscillating Frequency 1: 1.5 MHz(Typ)
ON-Resistance:
Refer to Electrical Characteristics
Shutdown Current Consumption: 0µA(Typ)
Operating Temperature Range: -20°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
UQFN056V7070
7.00mm x 7.00mm x 1.00mm
Datashee
t
Datashee
t
BD9639MWV
2/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Pin Configuration
Pin Descriptions
Terminal
No.
Name
Equivalent Circuit
Terminal
No.
Name
Equivalent Circuit
1
SW1
CH1 switching terminal
O
29
FB6
CH6 feed buck terminal
(Constant voltage side)
G
2
SW1
CH1 switching terminal
O
30
PGND6
CH6 DRIVER GND terminal
G
3
PGND1
CH1 DRIVER GND terminal
G
31
SW6
CH6 switching terminal
O
4
PGND1
CH1 DRIVER GND terminal
G
32
LSO6
CH6 Load switch output terminal
O
5
TEST1
Test terminal
O･G
33
VBAT6
CH6 Load switch input terminal
V
6
VBAT
Battery input terminal
V
34
XSHDN6
CH6 shutdown terminal
O･G
7
XSHDN1
CH1 shutdown terminal
G
35
RT
Triangle wave setting resistor
terminal
8
AGND1
Analog GND terminal
G
36
AGND2
Analog GND terminal
G
9
XSHDN24
CH2・4 shutdown terminal
O･G
37
VCC
Analog power supply terminal
V
10
FB5
CH5 feed buck terminal
G
38
PGND2
CH2 DRIVER GND terminal
G
11
PGND5
CH5 DRIVER GND terminal
G
39
PGND2
CH2 DRIVER GND terminal
G
12
SW5
CH5 switching terminal
O
40
SW2
CH2 switching terminal
O
13
VBAT5
CH5 DRIVER power supply
terminal
V
41
SW2
CH2 switching terminal
O
14
XSHDN5
CH5 shutdown terminal
O･G
42
VBAT2
CH2 DRIVER power supply
terminal
V
15
FB4
CH4 feed buck terminal
G
43
VBAT2
CH2 DRIVER power supply
terminal
V
16
OUT4
CH4 output terminal
O
44
FB2
CH2 feed buck terminal
G
17
OUT4
CH4 output terminal
O
45
TEST2
Test terminal
O･G
18
USW4
CH4 Boost side switching
terminal
O
46
XSHDN3
CH3 shutdown terminal
O･G
19
USW4
CH4 Boost side switching
terminal
O
47
VBAT3
CH3 DRIVER power supply
terminal
V
20
PGND4
CH4 DRIVER GND terminal
G
48
DSW3
CH3 Buck side switching terminal
O
21
PGND4
CH4 DRIVER GND terminal
G
49
DPG3
CH3 gate connecting terminal
O
22
DSW4
CH4 Buck side switching
terminal
O
50
PGND3
CH3 DRIVER GND terminal
G
23
DSW4
CH4 Buck side switching
terminal
O
51
USW3
CH3 Boost side switching
terminal
O
24
VBAT4
CH4 DRIVER power supply
terminal
V
52
OUT3
CH3 output terminal
O
25
VBAT4
CH4 DRIVER power supply
terminal
V
53
FB3
CH3 feed buck terminal
G
26
DPG4
CH4 gate connecting terminal
O
54
FB1
CH1 feed buck terminal
G
27
Reserve
Reserve terminal
O･G
55
OUT1
CH1 output terminal
O
28
FB61
CH6 feed buck terminal
(Constant current side)
G
56
OUT1
CH1 output terminal
O
The letter on the right side of each pin explanation indicates the reaction if the terminal are not used.
O・・・OPEN G・・・GND O･G・・・OPEN or GND V・・・Power supply (VBAT)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
42 41 40 39 38 37 36 35 34 33 32 31 30 29
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
SW1
SW1
PGND1
PGND1
TEST1
VBAT
XSHDN1
AGND1
XSHDN24
FB5
PGND5
SW5
VBAT5
XSHDN5
FB4
VOUT4
VOUT4
USW4
USW4
PGND4
PGND4
DSW4
VBAT4
DPG4
Reserve
FB61
FB6
PGND6
VBAT2
SW2
SW2
PGND2
PGND2
VCC
AGND2
RT
XSHDN6
LSO6
SW6
VOUT1
VOUT1
FB1
FB3
VOUT3
USW3
PGND3
DPG3
DSW3
VBAT3
XSHDN3
TEST2
FB2
VBAT2
VBAT6
VBAT4
DSW4
TOP VIEW
OUT3
OUT1
OUT1
OUT4
OUT4
FB4
USW4
USW4
PGND4
PGND4
DSW4
DSW4
VBAT4
VBAT4
DPG4
FB61
Reserve
FB1
FB3
USW3
PGND3
DPG3
DSW3
VBAT3
XSHDN
3
TEST2
FB2
VBAT2
SW1
SW1
PGND1
PGND1
TEST1
VBAT
XSHDN1
AGND1
XSHDN24
FB5
PGND5
SW5
VBAT5
XSHDN5
VCC
VBAT2
SW2
SW2
PGND2
PGND2
AGND2
RT
XSHDN6
VBAT6
LSO6
SW6
PGND6
FB6
BD9639MWV
3/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Block Diagram
[
CH
3
]
Buck
-
Boost
OUT3
DSW
3
USW
3
PGND
3
VBAT
3
Buck
-
Boost
PWMCOMP
OUT3
F
B
3
OUT3
MA
X
.
DUTY
PRE
DRIVER
[
CH
2
]
Buck
F
B
2
OUT2
SW
2
VBAT
2
PGND
2
PRE
DRIVER
F
B
1
OUT1
OUT1
PGND
1
OUT1
PFM
PWM
MA
X
.
DUTY
VBAT
[
CH
1
]
Boost
SW
1
PRE
DRIVER
OUT2
DPG
3
[
CH
4
]
OUT4
DSW
4
USW
4
PGND
4
VBAT
4
Buck
-
Boost
PWMCOMP
OUT4
PRE
DRIVER
MA
X
.
DUTY
F
B
4
OUT4
DPG
4
XSHDN
1
TSD
VCC
STAR
T
-
UP
CIRCUIT
VREF
XSHDN
5
XSHDN
6
XSHDN
24
XSHDN
3
CONTROL
OUT1
VBAT
AGN
D
To each block
VBAT
6
SW
6
PGND
6
[
CH
6
]
OUT6
F
B
6
LS
O
6
MA
X
.
DUTY
PRE
DRIVER
SA
W
1
.
5
[
MHz
]
RT
AGN
D
PGND
5
F
B
5
[
CH
5
]
PRE
DRIVER
SW
5
VBAT
5
OUT5
OUT5
F
B
61
Reserve
OUT6
Buck
-
Boost
Buck
Boost
BD9639MWV
4/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage Permissible Voltage
VVBAT
-0.3 to +7
V
VVBAT2
VVBAT3
VVBAT4
VVBAT5
VVBAT6
SW6 Permissible Voltage
VSW6
24.0
V
OUT1 Permissible Current Output
IOUT1
1.0
A
SW1 Permissible Current Output
ISW1
1.0
A
SW2 Permissible Current Output
ISW2
2.0
A
OUT3 Permissible Current Output
IOUT3
1.0
A
DSW3 Permissible Current Output
IDSW3
1.0
A
USW3 Permissible Current Output
IUSW3
1.0
A
OUT4 Permissible Current Output
IOUT4
1.0
A
DSW4 Permissible Current Output
IDSW4
1.0
A
USW4 Permissible Current Output
IUSW4
1.0
A
SW5 Permissible Current Output
ISW5
1.0
A
SW6 Permissible Current Output
ISW6
0.2
A
Power Dissipation
Pd
4.83 (Note 1)
W
Operating Temperature Range
Topr
-20 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Junction Temperature
Tjmax
+150
°C
(Note 1) Implemented on Glass epoxy board (ROHM standard board : 74.2 x 74.2 x 1.6[mm3] 4 layers(Copper foil : 5502 m2)
Power dissipation depends on the mounted wiring pattern.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Limit
Unit
Min
Typ
Max
VBAT Supply Voltage
VVBAT
2.5
3.7
5.5
V
VVBAT2
2.5
3.7
5.5
V
VVBAT3
2.5
3.7
5.5
V
VVBAT4
2.5
3.7
5.5
V
VVBAT5
2.5
3.7
5.5
V
VVBAT6
2.5
3.7
5.5
V
BD9639MWV
5/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Electrical Characteristics
(Unless otherwise specified, VVBAT=VVBAT2,3,4,5,6=3.7[V], VCC input terminal =3.7[V], Ta=25[°C])
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Current Consumption (PFM)
ICC1
-
72
150
μA
・XSHDN1=H, XSHDN24=L
・Without load on each channel
・VFB1=0.5[V]
・sum of VBAT terminal,
and OUT1 terminal
Current Consumption (PWM)
ICC2
1.57
2.35
3.53
mA
・XSHDN1=H, XSHDN24=H,
TEST1=H
・VFB1=0.5[V]
・Sum of VBAT terminal,
and OUT1 terminal
Shutdown Current Consumption
ICC3
-
0
10
μA
・All setting terminal=L
・Sum of VBAT terminal,
and OUT1 terminal
H Input Voltage 1
VIH1
VVBAT
-0.3
-
-
V
XSHDN1
L Input Voltage 1
VIL1
-
-
GND
+0.3
V
H Input Voltage 2
VIH3
2.5
-
-
V
XSHDN24, XSHDN3,
XSHDN5, XSHDN6
L Input Voltage 2
VIL3
-
-
GND
+0.3
V
H Input Current 1
IIH1
4.63
9.25
18.5
μA
Input voltage =3.7[V]
XSHDN24, XSHDN3,
XSHDN5, XSHDN6
Oscillating Frequency 1
fOSC1
1.2
1.5
1.8
MHz
RRT=10[kΩ]
Reduced-voltage Detection Voltage
VUVLO1
1.75
1.95
2.15
V
Reduced-voltage Return Voltage
VUVLO2
1.95
2.15
2.35
V
【CH1】
Soft-start Period 85%
tSS1
310
620
930
μs
Soft-start period 100% 730[µs](Typ)
XSHDN24=L
Error Amp Reference Voltage
VEREF1
0.388
0.400
0.412
V
XSHDN24=H
PMOS ON-Resistance
RONP1
-
0.24
0.38
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN1
-
0.14
0.23
Ω
Power supply 3.7[V]
Maximum Duty
DMAX1
76.5
85.0
93.5
%
XSHDN24=H
【CH2】
Error Amp Reference Voltage
VEREF2
0.390
0.400
0.410
V
Soft-start Period 85%
tSS2
0.43
0.85
1.27
ms
Soft-start period 100% 1.0[ms](Typ)
PMOS ON-Resistance
RONP2
-
0.13
0.21
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN2
-
0.08
0.14
Ω
Power supply 3.7[V]
BD9639MWV
6/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Electrical Characteristics –continued
(Unless otherwise specified, VVBAT=VVBAT2,3,4,5,6=3.7[V], VCC input terminal =3.7[V], Ta=25[°C])
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
【CH3】
Error Amp Reference Voltage
VEREF3
0.390
0.400
0.410
V
Soft-start Period 85%
tSS3
0.85
1.70
2.55
ms
Soft-start period 100% 2.0[ms](Typ)
PMOS ON-Resistance DOWN
Side
RONPD3
-
0.24
0.39
Ω
Power supply 3.7[V]
NMOS ON-Resistance DOWN
Side
RONND3
-
0.25
0.40
Ω
Power supply 3.7[V]
PMOS ON-Resistance UP Side
RONPU3
-
0.26
0.42
Ω
Power supply 3.7[V]
NMOS ON-Resistance UP Side
RONNU3
-
0.16
0.27
Ω
Power supply 3.7[V]
Maximum Duty
DMAX3
65
80
95
%
【CH4】
Error Amp Reference Voltage
VEREF4
0.390
0.400
0.410
V
Soft-start Period 85%
tSS4
1.28
2.55
3.83
ms
Soft-start period 100% 3.0[ms](Typ)
PMOS ON-Resistance DOWN
Side
RONPD4
-
0.16
0.26
Ω
Power supply 3.7[V]
NMOS ON-Resistance DOWN
Side
RONND4
-
0.21
0.33
Ω
Power supply 3.7[V]
PMOS ON-Resistance UP Side
RONPU4
-
0.24
0.38
Ω
Power supply 3.7[V]
NMOS ON-Resistance UP Side
RONNU4
-
0.16
0.26
Ω
Power supply 3.7[V]
Maximum Duty
DMAX4
65
80
95
%
【CH5】
Error Amp Reference Voltage
VEREF5
0.390
0.400
0.410
V
Soft-start Period 85%
tSS5
0.85
1.70
2.55
ms
Soft-start period 100% 2.0[ms](Typ)
PMOS ON-Resistance
RONP5
-
0.26
0.42
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN5
-
0.17
0.28
Ω
Power supply 3.7[V]
【CH6】
Error Amp Reference Voltage 1
VEREF6
0.380
0.400
0.420
V
Constant voltage control side
Error Amp Reference Voltage 2
VEREF6.1
0.380
0.400
0.420
V
Constant current control side
Soft-start Period 85%
tSS6
2.55
5.10
7.65
ms
Soft-start period 100% 6.0[ms](Typ)
Load Switching ON-Resistance
RONP6
-
0.23
0.37
Ω
Power supply 3.7[V]
NMOS ON-Resistance
RONN6
-
0.47
0.73
Ω
Power supply 3.7[V]
Maximum Duty
DMAX6
83
90
97
%
BD9639MWV
7/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
400[ kΩ]
AGND
30[kΩ]
VBAT VBAT
Application Information
1. Function Description
(1) Features Summary
CH
Function
Output voltage
Power output
Setting res.
USE
CH1
Boost converter
3.70[V] to 5.50[V]
Embedded
External
Start-up CH, Motor
CH2
Buck converter
1.05[V] to 1.80[V]
Embedded
External
Core
CH3
H-BRIDGE converter
1.80[V] to 3.30[V]
Embedded
External
CMOS
CH4
H-BRIDGE converter
3.25[V]
Embedded
Embedded
Digital
CH5
Buck converter
1.50[V] to 1.80[V]
Embedded
External
CMOS, Memory
CH6
Boost converter
2 LED to 6 LED
Embedded
External
LED
(2) CONTROL
(a) Stand-by function related terminals
Following table shows start-up condition of each block.
XSHDN1
XSHDN24
XSHDN3
XSHDN5
XSHDN6
CH1 PFM
CH1 PWM
Internal
supply
CH2
CH4
CH3
CH5
CH6
L
-
-
-
-
OFF
OFF
OFF
OFF
OFF
OFF
OFF
H
L
ON
H
L
L
L
OFF
ON
ON
ON
H
L
L
ON
L
H
OFF
ON
L
H
OFF
ON
(Note) - symbol mean without conditions.
(b) Other setting terminals
(c) XSHDN24 to XSHDN6 terminal equivalent circuit
(3) Start-up Circuit
CH1 begins operating using PFM when XSHDN1 goes “HIGH”.
Afterwards, when XSHDN24 goes “HIGH” an internal power supply turns ON and CH1 starts operating using PWM.
From the time XSHDN24 goes “HIGH”, CH2 to CH6 enters standby mode for about 5 ms after which CH2 and CH4
begin a soft start. Similarly, when XSHDN24 to XSHDN6 goes High synchronously, CH2 to CH6 starts soft-start
after the normal wait time.
XSHDN1 terminal does not have a pull down.
it is necessary to process the VBAT input and the GND input.
BD9639MWV
8/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(4) CH1
(a) Function
Selectable PWM/PFM boost DC/DC converter.
Output voltage is ranges from 3.7[V] to 5.5[V].
Low voltage operation starts up from 2.5[V] and also provides supply voltage to VREF circuit.
(b) Recommended External Components (At the time of setting when VOUT1=5.0V)
Parts Name
Value
Maker
Part Number
R11
620[kΩ] +24[kΩ]
-
-
R12
56[kΩ]
-
-
R13
10[Ω]
-
-
C11
22[µF] (x2)
Taiyo Yuden
JMK212BJ226MG
C12
10[µF]
Taiyo Yuden
JMK212BJ106KG
C13
100[pF]
Taiyo Yuden
UMK1005CH101JV
C14
1[µF]
Taiyo Yuden
JMK105BJ105KV
L11
2.2[µH]
Taiyo Yuden
NR4018T2R2N
D11
-
ROHM
RB060M-30
(c) Start-up Sequence
(d) PWM/PFM
Select PWM/PFM (operation of XSHDN=HIGH and XSHDN24) with light load (10mA or less).
Electricity is discharged
XSHDN
1
0
[
V
]
H input voltage
OUT1
0
[
V
]
≈
VBAT
[
V
]
VBAT
2
.
5
[
V
]
to
5
.
5
[
V
]
Soft start period
according to the load
.
0
[
V
]
3
.
7
[
V
]
to
5
.
5
[
V
]
PFM operation
XSHDN
24
3
.
7
[
V
]
to
5
.
5
[
V
]
OUT1
（
Load
5
mA or less
)
PWM operation
（
Load
5
mA or less
)
PFM operation
0
[
V
]
H input voltage
FB1
VOUT1
VOUT1
PFM
PWM
C13
R11
R12
0.4[V]
PRE
DRIVER
Start up circuit
SW1
PGND1
VOUT1
C11
VBAT
L11
PWM/PFM VBAT
C14
VBAT
MAX.
DUTY
D11
R13
C12
OUT1
OUT1
OUT1
MAX
BD9639MWV
9/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(5) Internal Supply Voltage
(a) Function
Regulator input voltage is supplied by OUT1.
Output voltage is 2.5[V] is not available outside the chip and is used only to power up internal circuit.
This internal supply is used during PWM mode when both XSHDN1 and XSHDN24 are “HIGH”.
(b) Start-up Sequence
OUT1
Reference
Voltage
VCC
Internal
power
supply
XSHDN
24
0
[
V
]
2
.
5
[
V
]
VCC
3
.
7
[
V
]
to
5
.
5
[
V
]
0
[
V
]
H input voltage
Internal power supply
BD9639MWV
10/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(6) CH2
(a) Function
Synchronous rectification buck DC/DC converter with built in power MOS output stage.
Output voltage ranges from 1.05[V] to 1.80[V].
(b) Recommended External Components
Parts
name
Value
Maker
Part number
1.1[V]
1.2[V]
R21
Refer to right table
-
-
R21
100[kΩ]
100[kΩ]
R22
Refer to right table
-
-
R22
56[kΩ] + 1.1[kΩ]
20[kΩ] + 30[kΩ]
C21
22[µF]
Taiyo Yuden
JMK212BJ226MG
C22
10[µF]
Taiyo Yuden
JMK212BJ106KG
C23
33[pF]
Taiyo Yuden
UMK105CH330JV
L21
2.0[µH]
TOKO
A915AY-2R0M
(c) Start-up Sequence
Set external
OUT2
to
OUT2
0
[
V
]
1
.
05
[
V
]
to
1
.
80
[
V
]
XSHDN
24
0
[
V
]
H input voltage
XSHDN
1
VBAT
2
VBAT
4
2
.
5
[
V
]
5
.
5
[
V
]
Soft start period
1
.
00
[
ms
]
H input voltage
5
.
00
[
ms
]
Discharge
FB2
0.4[V] SAW
SW2
VBAT2
PGND2
VBAT
C21
VOUT2
PRE
DRIVER L21
VOUT2
C23
R21
R22
C22
OUT2
OUT2
BD9639MWV
11/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(7) CH3
(a) Function
Synchronous rectification cross converter with built-in power MOS output stage.
Output voltage ranges from 1.80[V] to 2.80[V].
(b) Recommended External Components
Parts
Name
Value
Maker
Part Number
1.80[V]
2.80[V]
R31
Refer to right
table
-
-
R31
100[kΩ]
100[kΩ]
R32
Refer to right
table
-
-
R32
27[kΩ] + 1.6[kΩ]
12[kΩ] + 4.7[kΩ]
C31
22[µF]
Taiyo Yuden
JMK212BJ226MG
C32
10[µF]
Taiyo Yuden
JMK212BJ106KG
C33
100[pF]
Taiyo Yuden
UMK105CH101JV
L31
4.7[µH]
Taiyo Yuden
NR3015T4R7M
P31
-
ROHM
RW1A020ZP
(c) Start-up Sequence
(d) DPG3
The DPG3 output terminal is a gating signal to an external PMOS inserted between VBAT3 and DSW3.
If the VVBAT voltage becomes lower than 2.85[V], DPG3 becomes Low and an external PMOS turns ON.
The over-current can still electrify even if the voltage descend.
OUT3
(Note) When VOUT=1.8[V], if OUT3・USW3 are not used (These terminals are only for Buck condition),
Discharge function is not activated.
Set external
PRE
DRIVER
Buck
-
Boost
PWMCOMP
0
.
4
[
V
]
OUT3
DSW
3
USW
3
PGND
3
VBAT
3
VBAT
OUT3
C
31
L
31
SAW
MAX
.
DUTY
DPG
3
FB
3
OUT3
R
31
R
32
C
33
C
32
P
31
00
ms
XSHDN
3
0
[
V
]
H input voltage
OUT3
0
[
V
]
1
.
80
[
V
]
to
2
.
80
[
V
]
VBAT
3
2
.
5
[
V
]
to
5
.
5
[
V
]
XSHDN
1
XSHDN
24
Soft start period
2
.
[
]
H input voltage
Discharge
BD9639MWV
12/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(8) CH4
(a) Function
Synchronous rectification cross converter with built-in power MOS output stage.
The output voltage is fixed at 3.25V.
(b) Recommended External Components
Parts name
Value
Maker
Part number
C41
22[µF]
Taiyo Yuden
JMK212BJ226MG
C42
10[µF]
Taiyo Yuden
JMK212BJ106KG
L41
3.3[µH]
Taiyo Yuden
NR4018T3R3M
P41
-
ROHM
RW1A20ZP
(c) Start-up Sequence
(d) DPG4
The DPG4 output terminal is a gating signal to an external PMOS inserted between VBAT4 and DSW4.
If the VVBAT voltage becomes lower than 2.85[V], DPG4 becomes Low and an external PMOS turns ON.
The over-current can still electrify even if the voltage descend.
USW4
PRE
DRIVER
Buck
-
Boost
PWMCOMP
0
.
4
[
V
]
OUT4
DSW4
PGND
4
VBAT
4
VBAT
OUT4
C
41
L
41
FB
4
SAW
MAX
.
DUTY
DPG
4
OUT4
C
42
P
41
OUT2
0
[
V
]
1
.
05
[
V
]
to
1
.
80
[
V
]
70
[%]
OUT4
0
[
V
]
XSHDN
24
0
[
V
]
3
.
25
[
V
]
H input voltage
XSHDN
1
VBAT
2
VBAT
4
2
.
5
[
V
]
to
5
.
5
[
V
]
H input voltage
5
.
00
[
ms
]
UP side
PMOS
Control signal
UP side PMOS ON or Switching
Soft start period
3
.
00
[
ms
]
Discharge
Discharge
BD9639MWV
13/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(9) CH5
(a) Function
Synchronous rectification Buck DC/DC converter with integrated output stage power MOS.
Output voltage ranges from 1.50[V] to 1.80[V].
(b) Recommended External Components
Parts
name
Value
Maker
Part number
1.5[V]
1.8[V]
R51
Refer to right
table
-
-
R51
100[kΩ]
100[kΩ]
R52
Refer to right
table
-
-
R52
33[kΩ] + 3.3[kΩ]
27[kΩ] + 1.6[kΩ]
C51
10[µF]
Taiyo Yuden
JMK212BJ106KG
C52
1[µF]
Taiyo Yuden
JMK105BJ105KV
C53
100[pF]
Taiyo Yuden
UMK105CH101JV
L51
6.8[µH]
Taiyo Yuden
NR3015T6R8M
(c) Start-up Sequence
OUT5
Set external
00
ms
XSHDN
5
0
[
V
]
H input voltage
OUT5
0
[
V
]
1
.
50
[
V
]
to
1
.
80
[
V
]
VBAT
5
2
.
5
[
V
]
to
5
.
5
[
V
]
XSHDN
1
XSHDN
24
Soft start period
2
.
[
]
H input voltage
Discharge
FB5
0.4[V] SAW
SW5
VBAT5
PGND5
VBAT
C51
VOUT5
PRE
DRIVER L51
VOUT5
C53
R51
R52
C52
OUT5
OUT5
BD9639MWV
14/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(10) CH6
(a) Function
Boost DC/DC converter with built-in load switch.
This channel enables constant voltage operation and constant voltage operation for protection.
The constant voltage is available with output of 2 to 6 LEDs (typ).
The load switch turns OFF when XSHDN6 goes LOW (CH6 shutdown) and the timer latch.
(b) Recommended External Components
Parts
name
Value
Maker
Part number
R61
20[Ω]
-
-
C61
4.7[µF]
Taiyo Yuden
EMK212BJ475KG
C62
1[µF]
Taiyo Yuden
JMK105BJ105KV
L61
10[µH]
Taiyo Yuden
NR3015T100M
Di61
-
ROHM
RB551V-30
(c) Start-up Sequence
(d) Set Voltage when Fixed Voltage is Driven
When a fixed voltage is driven by internal resistance, it is set to 16V.
It is possible to return in a set voltage by adding external resistance between OUT6 and FB6.
When a fixed voltage is driven, it becomes 20.1V if 82kΩ is added.
When a fixed voltage is driven, it becomes 22.0V if 120kΩ is added.
However, note the resisting pressure of the capacitance of C61 when stepping up the voltage
applying external resistance.
XSHDN
XSHDN
6
0
[
V
]
H input voltage
OUT6
0
[
V
]
≈
VBAT
[
V
]
2
to
6
lights output voltage
ON
_
delay
XSHDN
1
24
H input voltage
VBAT
6
2
.
5
[
V
]
to
5
.
5
[
V
]
SOFT
Soft start period
6
.
0
[
ms
]
Electricity is discharged
according to the load
.
VBAT6
LSO6
PGND6
FB61
R61
L61
PRE
DRIVER
0.4[V]
0.4[V]
FB6
VOUT6
SAW
VBAT
MAX.
DUTY
SW6
Reserv
e
C62
VOUT6
C61
Di61
OUT6
OUT6
MAX
BD9639MWV
15/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
(11) Ground Short Protection Function
(a) CH2 to CH6 are monitoring error amp input voltage fed backed from output and enable timer circuit with falling
below the detection voltage of short protection circuit. Timer latch circuit will latch power MOS to OFF status of
CH2 to CH6 if such condition remained for 1.0[ms].
(b) All channel except CH1 will be latched with any other channels to be over-current and/or shorted.
(c) Latch will be released either setting XSHDN1=GND, XSHDN24=GND or restarting the device.
(d) Short detection comparator will be disabled by soft start.
(e) The timer latch circuit doesn't operate when an internal power supply is OFF.
.
(12) Thermal shutdown function
Thermal shutdown function is built in to prevent IC from heat distraction.
Thermal circuit will be disabled by PFM.
FB
3
OUT3
0
.
2
[
V
]
FB
6
0
.
4
[
V
]
Timer latch circuit
OUT6
FB
2
OUT2
0
.
2
[
V
]
FB
4
OUT4
0
.
2
[
V
]
FB
5
OUT5
0
.
2
[
V
]
Latch with follow conditions CH
2
to
CH
6
.
CH
2
：
SW
2
=
Hiz
CH
3
：
DSW
3
=
Hiz
USW
3
=
Hiz
CH
4
：
DSW
4
=
Hiz
USW
4
=
Hiz
CH
5
：
SW
5
=
Hiz
CH
6
：
Load Switch OFF
NMOS
=
OFF
BD9639MWV
17/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Equivalent Circuit
Terminal
No.
Terminal
Name
Equivalent Circuit
7
9
14
15
34
37
46
XSHDN1
XSHDN24
XSHDN5
FB4
XSHDN6
VCC
XSHDN3
1
2
16
17
18
19
51
52
55
56
SW1
SW1
OUT4
OUT4
USW4
USW4
USW3
OUT3
OUT1
OUT1
Terminal
No.
Terminal
Name
Equivalent Circuit
Terminal
No.
Terminal
Name
Equivalent Circuit
5
10
28
35
44
45
53
54
TEST1
FB5
FB61
RT
FB2
TEST2
FB3
FB1
12
22
23
26
32
40
41
48
49
SW5
DSW4
DSW4
DPG4
LSO6
SW2
SW2
DSW3
DPG3
Terminal
No.
Terminal
Name
Equivalent Circuit
Terminal
No.
Terminal
Name
Equivalent Circuit
29
31
FB6
SW6
6
13
24
25
33
42
43
47
VBAT
VBAT5
VBAT4
VBAT4
VBAT6
VBAT2
VBAT2
VBAT3
Terminal
No.
Terminal
Name
Equivalent Circuit
Terminal
No.
Terminal
Name
Equivalent Circuit
3
4
8
11
20
21
30
36
38
39
50
PGND1
PGND1
AGND1
PGND5
PGND4
PGND4
PGND6
AGND2
PGND2
PGND2
PGND3
27
Reserve
AGND
PGND
VBAT
AGND
VBAT
PGND
AGND
High resisting
pressure
PGND
VBAT
AGND
VBAT2
VBAT3
VBAT4
VBAT5
VBAT6
AGND
PGND
AGND
BD9639MWV
18/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating. (Refer page 16)
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
BD9639MWV
19/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 1. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Board Patterning
・VBAT,VBAT2,VBAT3,VBAT4,VBAT5, VBAT6 must be connected to the power supply on the board.
・VCC must be connected to OUT1 output on the board.
・ALL PGND and AGND must be connected to GND on the board.
・ALL power supply line and GND terminals must be wired with wide/short pattern in order to achieve the lowest
impedance possible.
15. Peripheral Circuitry
・Use low ESR ceramic capacitor for bypass capacitor and place them as close as possible between power supply and
GND terminals.
・Place external components such as L and C by IC using wide and short PCB trace patterns.
・Draw output voltage from each end of capacitor.
・Causing short circuit at CH1 output will overload the external diode and may breakdown the component.
・Prepare physical countermeasures by adding poli-switches and fuses to avoid excess current flow.
16. Start-up
・Keep light load condition when starting up the device.
・Switch to PWM mode (XSHDN24=L to H) after CH1 has started up in PFM mode (XSHDN1=L to H),
and the OUT1 output voltage is stable.
CH3・CH5・CH6 should starts after or simultaneously with PWM mode.
17. Usage of this Product
This IC is designed to be used in DSC/DVD application. When using in other applications, please be sure to consult with
our sales representative in advance.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
BD9639MWV
20/22
TSZ02201-0313AA400630-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
09.Feb.2016 Rev.001
Ordering Information
B
D
9
6
3
9
M
W
V
-
E 2
Package Name
Package
MWV : UQFN056V7070
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UQFN056V7070 (TOP VIEW)
BD9639MW
Part Number Marking
LOT Number
1PIN MARK
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
